JP5061475B2 - Display device - Google Patents

Description

The present invention, two insulating substrates are laminated via an adhesive, relates to a display equipment for display device between these two insulating substrates is formed.

  Conventionally, for example, an EL (electroluminescence) display device is known as a display device in which a display element is formed between a pair of insulating substrates bonded together with an adhesive.

  In this EL display device, layers such as a first electrode, a first insulating layer, a light emitting layer including a light emission center, a second insulating layer, and a second electrode are sequentially laminated on a first insulating substrate. Are stacked to form an EL display element. In this display element, the light emitting layer emits light by applying a voltage between the first electrode and the second electrode.

  Then, the display device can be obtained by bonding the first insulating substrate and the second insulating substrate on which the thin display elements are formed in this way with an adhesive so that the display elements are sandwiched between the two insulating substrates. It is configured.

  Here, conventionally, when both such insulating substrates are bonded together via an adhesive, there has been proposed a method for bonding a substrate that prevents the distortion of the substrate and the generation of bubbles in the adhesive (for example, , See Patent Document 1).

  This is a display device in which the first insulating substrate and the second insulating substrate are bonded with an adhesive, and the adhesive is dropped only on one insulating substrate, and the one insulating substrate on which the adhesive is dropped is inverted. Then, it is brought into close contact with the other insulating substrate from above, and the adhesive is stretched between the two insulating substrates by a capillary phenomenon between the two insulating substrates, filled, and cured.

Further, in this method, a spacer is interposed between the two insulating substrates, and the amount of the adhesive inserted between the two insulating substrates is set to an appropriate amount, whereby the difference in unevenness existing on the bonding surface of the insulating substrates is determined. To prevent residual bubbles by making the spread of the adhesive uniform.
JP 2000-133444 A

  However, according to the study by the present inventors, it has been found that bubbles are generated in the adhesive between the two insulating substrates even by the conventional bonding method described above.

  When pasting together this type of insulating substrate, conventionally, the adhesive is dropped and interposed on the center side between the bonding surface of the first insulating substrate and the bonding surface of the second insulating substrate, By using the capillary phenomenon of the adhesive, the adhesive is stretched from the inner side to the peripheral side of the both bonded surfaces, thereby filling the adhesive between the bonded surfaces.

  At this time, as the stretching of the adhesive proceeds toward the peripheral portion of the bonding surface, for example, the following phenomenon occurs at the corner having the longest stretching distance from the dropped portion.

  That is, compared with the stretching speed of the adhesive that linearly stretches from the dropped portion toward the corner, the adhesive that has reached the outer edge of the bonding surface first loses the balance of the surface tension and the outer edge. The effect | action which extends | stretches along a part works and the extending | stretching speed toward a corner | angular part becomes quick.

  For this reason, the adhesives that have been stretched from the portions near the outer edge portions toward the corners come into contact with each other first, and the shape of the adhesive is disturbed. As a result, bubbles are involved. Furthermore, due to the difference in the stretching speed due to the pattern of the bonding surface on which the adhesive stretches, unevenness, wettability, and the like, the shape of the adhesive is similarly disturbed and bubbles are involved.

  Moreover, in order to suppress the entrainment of bubbles due to the difference in the stretching speed of the adhesive in the peripheral portion, the adhesive is dropped not only on the central portion of the bonding surface of the insulating substrate but also in the vicinity of the peripheral portion. It is possible to keep it.

  However, in this case, it is sufficient that the adhesive dropped on the peripheral portion maintains the initial shape immediately after dropping, that is, the circular shape, but time has elapsed until the bonding of both insulating substrates is started. At the same time, the shape of the dropped adhesive is disturbed due to a difference in the state of the bonding surface such as wettability.

  And after bonding, when the adhesive agent extended from the center part, ie, the inside to the peripheral part side, and the adhesive agent of the peripheral part in a disordered state contact, it will arise that a bubble will be involved.

  As described above, conventionally, when bonding both insulating substrates, there is a problem that the shape of the adhesive is disturbed due to a difference in stretching speed or the shape is not maintained at the time of dropping. Bubbles are generated in the agent. And such a bubble has the malfunction of deteriorating display quality as a residual bubble.

  The present invention has been made in view of the above problems, and in a display device in which two insulating substrates each having a display element formed on at least one bonding surface are bonded via an adhesive, It is an object to suppress entrainment of bubbles due to disorder of the shape of the adhesive at the time of bonding the substrates.

  In order to achieve the above-mentioned object, the present inventor, as described above, a portion having a high stretching speed in the adhesive filling region between the bonding surfaces of both insulating substrates is the outer edge portion of both bonding surfaces. As a result of studying the uniformity of the stretching speed difference, the present invention was created.

That is, according to the present invention, both bonded surfaces (10a, 30a) of the region filled with the adhesive (50) stretched between the bonded surfaces (10a, 30a) of both insulating substrates (10, 30). Protrusion (60) is provided on at least one of the bonding surfaces (10a, 30a) at a portion near the outer edge of the protrusion , and the protrusion (60) is along the outer edge of both bonding surfaces (10a, 30a) The first feature is that at least one or a plurality of right and left sides are provided in a direction that prevents the direction of the adhesive (50) from being stretched, and the progress of the adhesive is prevented .

  According to this, by providing the projection (60) in the region near the outer edge portion where the stretching speed is fast in the filling region of the adhesive (50), the distance between the two insulating substrates (10, 30) by the projection (60). Since the action of the capillary action of the adhesive (50) becomes dull and the stretching speed of the adhesive (50) is suppressed at a site where the adhesive once narrows and spreads again, the stretched shape of the adhesive (50) is balanced. It becomes possible.

  Therefore, according to the present invention, it is possible to suppress the entrainment of bubbles due to the irregular shape of the adhesive at the time of bonding.

Further, the present invention provides both bonded surfaces (10a, 30a) in a region where the adhesive (50) is stretched and filled between the bonded surfaces (10a, 30a) of both insulating substrates (10, 30). In the part near the outer edge part, a concave part (70) is provided in at least one of the bonding surfaces (10a, 30a) , and the concave part (70) is along the outer edge part of the bonding surfaces (10a, 30a). A second feature is that at least one each of the right and left sides is provided in a direction that prevents the adhesive (50) from extending in the direction, and the progress of the adhesive is prevented .

  According to this, by providing the concave portion (70) in a portion near the outer edge portion where the stretching speed is fast in the filling region of the adhesive (50), the distance between the both insulating substrates (10, 30) is reduced to that of the concave portion (70). It spreads in the part, and the action of the capillary action of the adhesive (50) becomes dull in the recess (70), and the stretching speed of the adhesive (50) is suppressed.

  Furthermore, in the site | part which provided the recessed part (70), since the capacity | capacitance for this recessed part (70) is made, it is necessary for the extending | stretching adhesive agent (50) to advance, satisfy | filling the capacity | capacitance. The stretching speed is reduced compared to the surroundings.

  Therefore, the action of the recess (70) makes it possible to balance the stretched shape of the adhesive (50), so that the entrainment of bubbles due to the disorder of the shape of the adhesive during bonding can be suppressed.

  Here, the protrusions (60) and the recesses (70) in the first feature and the second feature can be formed by the thin film (12) provided on the bonding surface (10a) of the insulating substrate (10). it can.

  Specifically, when the EL element (11) is provided as the display element (11) on the bonding surface (10a) of the insulating substrate (10), the thin film constituting the protrusion (60) and the recess (70). As (12), those selected from the layers (12 to 16) constituting the EL element (11) can be adopted.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
1A is a diagram showing a schematic plan configuration of an inorganic EL (electroluminescence) display device as a display device according to the first embodiment of the present invention, and FIG. 1B is a diagram showing an A in FIG. -A is a diagram showing a schematic cross-sectional configuration along the one-dot chain line.

  2A is an enlarged plan view showing a circled portion B of the inorganic EL display device shown in FIG. 1A, and FIG. 2B is a plan view of FIG. FIG.

  This display device is obtained by forming an EL element 11 as a display element formed by sequentially laminating layers 12 to 16 described below on a first glass substrate 10 which is a first insulating substrate. is there. The EL element 11 as the display element is a very thin film having a total film thickness of about 2 μm, for example.

  The present display device further includes a bonding surface 10a of the first glass substrate 10 and a second glass which is a second insulating substrate in such a manner as to sandwich the EL element 11 as a laminate of the layers 12 to 16. The glass substrates 10 and 30 are bonded together with an adhesive 50 in a state where the bonding surface 30a of the substrate 30 is opposed.

  In addition, the bonding surfaces 10a and 30a of both the glass substrates 10 and 30 are surfaces where the two glass substrates 10 and 30 face each other and overlap each other. That is, in FIG. 1, a portion of the first glass substrate 10 that does not overlap the second glass substrate 30 is configured as an external connection surface 17 described later, not the bonding surface 10 a of the first glass substrate 10. ing.

  In the present embodiment, among the bonding surface 10a of the first glass substrate 10 and the bonding surface 30a of the second glass substrate 30, the EL element 11 that is a display element on the bonding surface 10a of the first glass substrate 10. Is formed. First, the EL element 11 will be described.

  On the first glass substrate 10, an optically transparent first electrode 12 made of, for example, an ITO (indium tin oxide) film or zinc oxide is formed. In this example, the first electrode 12 is made of an ITO film.

On the upper surface of the first electrode 12, for example, an ATO film (Al ₂ O ₃ / TiO ₂ laminated structure film) which is a laminated film of alumina and titania, a first insulating layer 13 made of tantalum pentoxide (Ta ₂ O ₅ ), or the like. Is formed. In this example, the first insulating layer 13 is composed of an Al ₂ O ₃ / TiO ₂ laminated structure film.

  A light emitting layer 14 including a light emission center is formed on the first insulating layer 13. Here, as the light emitting layer 14, for example, a II-VI group compound semiconductor to which a light emission center such as a rare earth element is added is used.

  Here, II-VI group compound semiconductors are group IIA (current group 2) and group IIB (current group 12) such as Ca, Sr, Zn, and Cd in the old periodic table, and group VIB (currently grouped) such as O and S. And a compound semiconductor.

  Specifically, the light emitting layer 14 of the present embodiment has at least one of ZnS, SrS, and CaS as a base material, and a rare earth element such as manganese (Mn), terbium (Tb), and samarium (Sm) as a light emission center. Is used. In this example, the light emitting layer 14 is made of a zinc sulfide: manganese (ZnS: Mn) film using ZnS as a base material and Mn added as a light emission center.

A second insulating layer 15 made of, for example, the ATO film or tantalum pentoxide is formed on the light emitting layer 14. In this example, the second insulating layer 15 is composed of an Al ₂ O ₃ / TiO ₂ laminated structure film.

  On the second insulating layer 15, an optically transparent second electrode 16 made of, for example, an ITO film or zinc oxide is formed. In this example, the second electrode 16 is composed of an ITO film.

  Further, as shown in FIGS. 1 and 2, in order to protect the layers 12 to 16 on the first glass substrate 10, an adhesive 50 made of a transparent resin such as an epoxy resin or a silicone resin is used. A transparent second glass substrate 30 is bonded. Thus, the inorganic EL display device of this embodiment is configured.

  In the inorganic EL display device of this example, as shown in FIG. 1, the first electrode 12 and the second electrode 16 are striped and orthogonal to each other.

  A portion where the first electrode 12 and the second electrode 16 are orthogonal to each other constitutes a pixel together with the first insulating layer 13, the second insulating layer 15 and the light emitting layer 14 sandwiched between the films of the electrodes 12 and 16. The pixel can emit light by applying a voltage between the first electrode 12 and the second electrode 16.

  In the inorganic EL display device of this example, since the first electrode 12 and the second electrode 16 are optically transparent, light can be extracted from both the first glass substrate 10 side and the second glass substrate 30 side. It is possible.

  Further, in the present inorganic EL display device, as shown in FIG. 1, the first glass substrate 10 having a relatively large size in the bonded glass substrates 10 and 30 protrudes from the second glass substrate 30. ing.

  A portion of the first glass substrate 10 that protrudes from the end of the second glass substrate 30 is configured as the external connection surface 17 for electrically connecting the inorganic EL display device and the outside. ing.

  The external connection surface 17 is a surface to which an external wiring member such as a flexible printed circuit board or a wire is connected. The terminal 12a of the first electrode 12 and the terminal 16a of the second electrode 16 extending from the EL element 11 as a display element are provided. It is a formed surface.

  An external wiring member such as a flexible printed circuit board is electrically connected to the terminal 12a of the first electrode 12 and the terminal 16a of the second electrode 16 so that the first circuit 12 can be connected to the second circuit 16 from the external circuit. A voltage can be applied to the first electrode 12 and the second electrode 16.

  The EL element 11 and the terminals 12a and 16a formed on the bonding surface 10a of the first glass substrate 10 are formed by a conventional general EL using a film forming method such as a photolithographic method, sputtering, or vapor deposition. It is formed by applying an element formation method.

  Here, as described above, the present display device is formed by bonding the bonding surface 10 a of the first glass substrate 10 and the bonding surface 30 a of the second glass substrate 30 through the adhesive 50. .

  The bonding with the adhesive 50 is performed in the same manner as the conventional method. That is, first, the first glass substrate 10 and the second glass substrate 30 on which the above-described EL elements 11 and the like are formed are prepared, and either or both of the bonding surfaces 10a and 30a of the glass substrates 10 and 30 are prepared. An adhesive 50 is dropped on one central portion.

  Then, the bonding surfaces 10 a and 30 a of both glass substrates 10 and 30 are brought into contact with each other through the adhesive 50 and are brought into contact with each other. Thereby, the adhesive 50 is filled between both the bonding surfaces 10a and 30a by extending the adhesive 50 from the center side, that is, the inner side to the peripheral side of the both bonding surfaces 10a and 30a. Thereafter, the adhesive 50 is cured to complete the inorganic EL display device.

  Here, as described above, according to the examination result of the present inventors, the outer edges of both the bonding surfaces 10a and 30a in the region where the adhesive 50 is stretched and filled between the both bonding surfaces 10a and 30a. The stretch rate of the adhesive 50 is higher in the part closer to the part than in the part away from the outer edge.

  In view of this, the present embodiment adopts a configuration as shown in FIG. FIG. 2 shows a peripheral portion of the bonding surfaces 10a and 30a of the glass substrates 10 and 30, that is, a region where the adhesive 50 is stretched and filled between the bonding surfaces 10a and 30a. Yes.

  In FIG. 2A, the glass substrates 10 and 30, the adhesive 50 and the protrusion 60 are shown, and the other portions are omitted. Further, in FIG. 2A, the protrusion 60 and the adhesive 50 are hatched and dotted for the sake of convenience for easy identification, and the adhesive 50 is shown in the middle of filling. It is.

  In the example shown in FIG. 2 (a), the corners of both bonding surfaces 10a and 30a are used as regions filled with the adhesive 50 stretched between the bonding surfaces 10a and 30a of both glass substrates 10 and 30, respectively. The neighborhood is shown.

  Then, as shown in FIG. 2 (a), when the two glass substrates 10 and 30 are bonded together, the adhesive 50 includes a portion 51 having a relatively low stretching speed that linearly extends toward the corner portion. In addition, there is a portion 52 that stretches along the outer edges of the bonding surfaces 10a and 30a and has a relatively high stretching speed.

  Conventionally, the portion 52 having a relatively high stretching speed in the adhesive 50 proceeds faster than the portion 51 having a relatively low stretching speed and reaches the corner portion. When the adhesives 50 come into contact with each other, bubbles are involved.

  Therefore, in the present embodiment, as shown in FIG. 2, the first glass substrate 10 is located in a region near the outer edge portions of the bonding surfaces 10 a and 30 a in the region where the adhesive 50 is stretched and filled. A protrusion 60 is provided on the bonding surface 10a.

  In this example, the protrusion 60 is provided on the bonding surface 10 a on the first glass substrate 10 side having the EL element 11 on the bonding surface 10 a, and is formed by the thin film 12 constituting the EL element 11.

  That is, in this example, as shown in FIG. 2B, the thin film 12 constituting the protrusion 60 is the first electrode 12 selected from the layers 12 to 16 constituting the EL element 11. The protrusion 60 of this example is formed of the first electrode 12, that is, an ITO film in this example, and is formed of a remaining portion 12b left when the first electrode 12 is patterned by photolithography or the like.

  The first insulating layer 13 and the second insulating layer 15 are laminated on the remaining portion 12b, and the first insulating layer 13 and the second insulating layer 15 are inherited from the convex shape of the remaining portion 12b. The protrusion 60 of this example is configured.

  As described above, by providing the protrusion 60 at a portion near the outer edge portion where the stretching speed is fast in the filling region of the adhesive 50, the stretching speed of the adhesive 50 is increased when the two glass substrates 10 and 30 are bonded. The fast portion 52 passes through the protrusion 60 provided in a direction that hinders its progress.

  In the portion 52 having a high stretching speed, the action of the capillary phenomenon that stretches the adhesive 50 is blunted at the portion where the distance between the insulating substrates 10 and 30 is once narrowed and widened again by the protrusion 60, and the stretching speed is suppressed. The

  As a result, the stretching speed difference of the adhesive 50 is made uniform as a whole, and the stretching shape of the adhesive 50 can be balanced. Therefore, according to this embodiment, the entrainment of bubbles due to the disorder of the shape of the adhesive 50 at the time of bonding can be suppressed.

  In the present embodiment, the thin film 12 constituting the protrusion 60 may be selected from the layers 12 to 16 constituting the EL element 11, and the layer constituting the first electrode 12 as in the above example. Other layers may be used.

  For example, if the structure of the device cannot be configured by the first electrode 12, the protrusion 60 is formed by the second electrode 16 or a layer configuring the first insulating layer 13, the second insulating layer 15, and the light emitting layer 14. However, the same effect can be obtained.

  Further, the protrusion 60 may be formed by a single layer of the layers 12 to 16 constituting the EL element 11, but if it is formed by a plurality of layers, the height of the protrusion 60 can be increased, and a greater effect can be obtained. Is obtained.

  Thus, if the protrusion 60 is formed from the layers 12 to 16 constituting the EL element 11, the protrusion 60 can be formed in the formation process of the EL element 11, and the protrusion 60 can be formed without increasing the number of processes. .

  Moreover, since the adhesive 50 advances along the outer edge part of the bonding surfaces 10a and 30a, when the protrusion 60 is provided perpendicular to the traveling direction of the adhesive 50, the adhesive 50 is bonded to the bonding surfaces 10a and 30a. There is a possibility of spilling out.

  Therefore, as shown in FIG. 2A, the projection 60 is preferably arranged so that the adhesive 50 is planarly guided to the inside of the bonding surfaces 10a and 30a. In the example shown in FIG. 2A, only one protrusion 60 is provided on each of the left and right, but a plurality of protrusions 60 may be provided.

  In the present embodiment, as shown in the above example, the protrusion 60 is provided on the bonding surface 10a of the first glass substrate 10, but the protrusion is formed on the bonding surface 30a of the second glass substrate 30. 60 may be provided, or the protrusions 60 may be provided on both the bonding surfaces 10a and 30a.

  For example, when providing on the bonding surface 30a of the 2nd glass substrate 30, if the processus | protrusion which consists of an insulator with respect to this bonding surface 30a is formed into a film, the effect by the above-mentioned processus | protrusion 60 will be acquired.

  In other words, in the present embodiment, the two bonding surfaces are disposed in a region near the outer edge portion of the bonding surfaces 10a and 30a in the region where the adhesive 50 is stretched and filled between the bonding surfaces 10a and 30a. What is necessary is just to provide the protrusion 60 in at least one of 10a and 30a.

  Further, the shape of the protrusion 60 is not limited to the shape shown in FIG. 2 as long as the function of suppressing the speed of the adhesive 50 that stretches the outer edge portions of the target bonding surfaces 10a and 30a can be obtained. .

(Second Embodiment)
FIG. 3 is a diagram showing a main part of an inorganic EL display device according to the second embodiment of the present invention. The display device of the present embodiment is obtained by modifying the portion B in the inorganic EL display device shown in FIG. 1, and the portions not shown in FIG. 3 are the same as those in FIG.

  3A is an enlarged plan view showing a circled portion B of the inorganic EL display device shown in FIG. 1A, and FIG. 3B is a plan view of FIG. It is a figure which shows a general | schematic cross-section structure.

  In FIG. 3A, the glass substrates 10 and 30, the adhesive 50 and the recess 70 are shown, and the other portions are omitted. In FIG. 3A, the concave portion 70 and the adhesive 50 are hatched and hatched for the sake of convenience in order to facilitate identification, and the adhesive 50 is shown in the middle of filling. It is.

  3 also shows the vicinity of the corner as a region in which the adhesive 50 is stretched and filled between the bonding surfaces 10a and 30a of the glass substrates 10 and 30, as in FIG. Has been.

  In the inorganic EL display device according to the present embodiment, in the region where the adhesive 50 is stretched and filled between both the bonding surfaces 10a and 30a, both the bonding surfaces 10a and 30a are disposed near the outer edge portions. A recess 70 is provided on at least one of the bonding surfaces 10a and 30a. That is, in place of the protrusion 60 of the first embodiment, a recess 70 is provided for the same purpose as the first embodiment.

  In this example, as shown in FIG. 3, the first glass substrate 10 is bonded at a portion near the outer edges of the bonding surfaces 10 a and 30 a in the region where the adhesive 50 is stretched and filled. A recess 70 is provided in the surface 10a.

  In this example, the recess 70 is provided on the bonding surface 10 a on the first glass substrate 10 side and is formed by the thin film 12 constituting the EL element 11. That is, in this example, as shown in FIG. 3B, the thin film 12 constituting the recess 70 is the first electrode 12 selected from the layers 12 to 16 constituting the EL element 11.

  The recess 70 in this example is formed by the first electrode 12, that is, in this example, by an ITO film, and is formed by a hole 12c when the first electrode 12 is patterned by photolithography or the like.

  The first insulating layer 13 and the second insulating layer 15 are laminated on the hole 12c of the first electrode 12, and the concave shape of the hole 12c is formed in the first insulating layer 13 and the second insulating layer 15. The recess 70 of this example is configured by inheriting the above.

  Thus, by providing the concave portion 70 in the region close to the outer edge portion where the stretching speed is fast in the filling region of the adhesive 50, the stretching speed of the adhesive 50 is increased when the two glass substrates 10 and 30 are bonded. The fast portion 52 will pass through the recess 70 provided in a direction that hinders its progress.

  Since the distance between the two insulating substrates 10 and 30 is widened by the concave portion 70, the portion 52 having a high stretching speed passes through the concave portion 70, so that the action of the capillary phenomenon that stretches the adhesive 50 becomes dull and the stretching speed is suppressed. The

  Further, since the concave portion 70 has a capacity corresponding to the concave portion 70 as compared with the periphery thereof, the stretching of the adhesive 50 proceeds while satisfying the capacity of the concave portion 70 as compared with the peripheral portion. Also, it serves to reduce the stretching speed of the adhesive 50.

  By the action of these recesses 70, the stretching speed of the portion 52 having a high stretching speed in the adhesive 50 is decelerated, the stretching speed difference of the adhesive 50 is made uniform as a whole, and the stretched shape of the adhesive 50 is balanced. It is possible to take. As a result, according to the present embodiment, the entrainment of bubbles due to the disorder of the shape of the adhesive 50 at the time of bonding can be suppressed.

  In the present embodiment, the thin film 12 constituting the recess 70 may be selected from the layers 12 to 16 constituting the EL element 11, and the layer constituting the first electrode 12 as in the above example. Other layers may be used.

  For example, the hole 70 as shown in FIG. 3B is formed in the second electrode 16 or the layers constituting the first insulating layer 13, the second insulating layer 15, and the light emitting layer 14. Even if formed, the same effect can be obtained.

  Furthermore, not only the single layer of the layers 12 to 16 constituting the EL element 11, but if the concave portion 70 is constituted by a plurality of layers, the depth of the concave portion 70 can be increased, and a greater effect can be expected.

  Thus, if the recessed part 70 is formed from the layers 12-16 which comprise the EL element 11, the recessed part 70 can be formed in the formation process of the EL element 11, and the recessed part 70 can be formed without increasing a process. .

  Moreover, since the adhesive 50 advances along the outer edge part of the bonding surfaces 10a and 30a, in the recessed part 70, as FIG.3 (b) shows, the site | part close | similar to the said outer edge part is shown. It is good to make it the shape where the recessed part 70 becomes long with respect to the advancing direction.

  In the example shown in FIG. 3A, only one recess 70 is provided on each of the left and right sides, but a plurality of recesses 70 may be provided. Moreover, about the shape of the recessed part 70, the function which suppresses the speed | velocity | rate of the adhesive agent 50 which extends | stretches the outer edge part of both target bonding surfaces 10a and 30a should just be obtained, and it is not restricted to the shape shown by FIG. .

  Further, in the present embodiment, as shown in the above example, the concave portion 70 is provided on the bonding surface 10a of the first glass substrate 10, but the concave portion is provided on the bonding surface 30a of the second glass substrate 30. 70 may be provided, or the recesses 70 may be provided on both the bonding surfaces 10a and 30a.

  For example, when providing in the bonding surface 30a of the 2nd glass substrate 30, if a hollow is formed with respect to this bonding surface 30a by an etching etc., this hollow turns into a recessed part and is the same as what was mentioned above. The effect is obtained.

  In other words, in the present embodiment, the two bonding surfaces are disposed in a region near the outer edge portion of the bonding surfaces 10a and 30a in the region where the adhesive 50 is stretched and filled between the bonding surfaces 10a and 30a. What is necessary is just to provide the recessed part 70 in at least one of 10a, 30a.

(Third embodiment)
FIG. 4 is a diagram showing a main part of an inorganic EL display device according to the third embodiment of the present invention. The display device of the present embodiment is also obtained by modifying the portion B in the inorganic EL display device shown in FIG. 1, and the portions not shown in FIG. 4 are the same as those in FIG.

  That is, FIG. 4 is an enlarged plan view showing a circled portion B in the inorganic EL display device shown in FIG. In addition, in FIG. 4, both the glass substrates 10 and 30, the adhesive agent 50, and the wettability fall part 80 are shown, and the other part is abbreviate | omitted. Further, in FIG. 4, the wettability-decreasing portion 80 and the adhesive 50 are hatched and hatched for the sake of convenience for easy identification, and the adhesive 50 is shown in the middle of filling. It is.

  3 also shows the vicinity of the corner as a region in which the adhesive 50 is stretched and filled between the bonding surfaces 10a and 30a of the glass substrates 10 and 30, as in FIG. Has been.

  In the inorganic EL display device of this embodiment, both the bonding surfaces 10a and 30a are bonded to a portion near the outer edge of the bonding surfaces 10a and 30a in the region filled with the adhesive 50 between the bonding surfaces 10a and 30a. A wettability reducing portion 80 is provided on at least one of the mating surfaces 10a and 30a. That is, in place of the protrusion 60 of the first embodiment, the wettability lowering portion 80 is provided for the same purpose as the first embodiment.

  In this example, as shown in FIG. 4, the first glass substrate 10 is bonded at a portion near the outer edges of the bonding surfaces 10 a and 30 a in the region where the adhesive 50 is stretched and filled. A wettability reducing portion 80 is provided on the surface 10a.

  This wettability reduction part 80 is wettability with respect to the adhesive 50 rather than the site | part except the said wettability reduction part 80 among the area | regions which extended | stretched and filled the adhesive 50 in the bonding surface 10a of the 1st glass substrate 10. FIG. Is a small part.

  Specifically, ultraviolet irradiation, plasma treatment, sandblasting, or the like is performed on a portion excluding the wettability reduction portion 80 in a region where the adhesive 50 is stretched and filled in the bonding surface 10a of the first glass substrate 10. The organic material on the surface is removed by performing the surface treatment.

  As a result, the wettability with respect to the adhesive 50 becomes larger than the wettability reduced portion 80 in the portion subjected to the surface treatment. That is, in the bonding surface 10a located in the region where the adhesive 50 is stretched and filled, except for the part 80 located near the outer edge portion of both the bonding surfaces 10a and 30a, from the removed portion 80. Also, a portion with improved wettability with respect to the adhesive 50 is formed.

  According to this, at the portion near the outer edge portion where the stretching speed of the adhesive 50 tends to be high, the wet speed is relatively reduced by reducing the wettability by the wettability lowering portion 80, and the outer edge which tends to be slowed. In the part away from the part, the stretching speed is relatively increased by the surface treatment.

  Therefore, the stretching speed difference of the adhesive 50 is made uniform as a whole, and the stretching shape of the adhesive 50 can be balanced. As a result, according to the present embodiment, the entrainment of bubbles due to the disorder of the shape of the adhesive 50 at the time of bonding can be suppressed.

  Further, in the example shown in FIG. 4, only one wettability reducing portion 80 is provided on each of the left and right sides, but a plurality of wettability lowering portions 80 may be provided. Moreover, about the shape of the wettability reduction | decrease part 80, the function to suppress the speed | velocity | rate of the adhesive agent 50 which extends | stretches the outer edge part of both target bonding surfaces 10a and 30a should just be obtained, and the shape shown by FIG. Not as long.

  In the present embodiment, as shown in the above example, the wettability reducing portion 80 is provided on the bonding surface 10a of the first glass substrate 10, but the bonding surface of the second glass substrate 30 is also provided. The surface treatment may be performed on 30a to provide the wettability reduction portion 80, or the wettability reduction portion 80 may be provided on both the bonding surfaces 10a and 30a.

  In other words, in the present embodiment, in the region where the adhesive 50 is stretched and filled between both the bonding surfaces 10a and 30a, at least one of the both bonding surfaces 10a and 30a, the both bonding surfaces 10a and 30a. It suffices that the wettability with respect to the adhesive 50 is smaller in the part closer to the outer edge than the part.

(Fourth embodiment)
FIG. 5 is a diagram showing a main part of an inorganic EL display device according to the fourth embodiment of the present invention. The display device of the present embodiment is obtained by modifying the portion B in the inorganic EL display device shown in FIG. 1, and the portions not shown in FIG. 5 are the same as those in FIG.

  5A is an enlarged plan view showing a circled portion B of the inorganic EL display device shown in FIG. 1A, and FIG. 5B is a plan view of FIG. It is a figure which shows CC schematic sectional structure.

  In FIG. 5A, both glass substrates 10 and 30 and the annular protrusion 90 are shown, and the other portions are omitted. The annular protrusion 90 is shown for convenience in order to facilitate identification. It is hatched with diagonal lines.

  As described above, the inorganic EL display device prepares the first glass substrate 10 and the second glass substrate 30 on which the inorganic EL elements 11 are formed, and the bonding surface 10a of both the glass substrates 10 and 30; After the adhesive 50 is dropped onto at least one central portion of 30a, the glass substrates 10 and 30 are bonded together via the adhesive 50.

  Here, the adhesive 50 is filled between the bonded surfaces 10a and 30a by extending the adhesive 50 from the center side to the peripheral side of the bonded surfaces 10a and 30a. As described above, the adhesive 50 may be dropped not only in the central part of the bonding surfaces 10a and 30a but also in the vicinity of the peripheral part.

  However, in this case, as described above, the shape of the adhesive dropped on the peripheral portion is disturbed due to the lapse of time before the start of bonding, and bubbles are formed by contact with the adhesive 50 extending from the inside at the time of bonding. Entrainment may occur. Note that the same thing can be said for the adhesive 50 dropped on the peripheral portion.

  Therefore, in the present embodiment, as shown in FIG. 5, a circular annular projection 90 is provided in advance on a portion of the bonding surfaces 10 a and 30 a of the glass substrates 10 and 30 where the adhesive 50 is dropped. A method of dropping the adhesive 50 onto a portion surrounded by the annular protrusion 90 is adopted.

  Such a ring-shaped protrusion 90 may be formed at the central portion or the peripheral portion of the bonding surfaces 10a and 30a, and the patterning of the layers 12 to 16 constituting the EL element 11 or the formation of various insulating films. And it can form easily by using a patterning means.

  In FIG. 5, the vicinity of the corners of the bonding surfaces 10a and 30a of the glass substrates 10 and 30 is shown, and the adhesive 50 dropped on the vicinity of the corners, that is, the periphery of the bonding surfaces 10a and 30a. As an object, an example in which an annular protrusion 90 is provided is shown.

  In the present embodiment, the adhesive 50 is dropped on the bonding surface 10 a of the first glass substrate 10, and the annular protrusion 90 is provided on the bonding surface 10 a of the first glass substrate 10.

  In this example, as shown in FIG. 5, the annular protrusion 90 is provided on the bonding surface 10 a on the first glass substrate 10 side, and is formed by a layer constituting the first electrode 12 in the EL element 11. Yes. Specifically, the annular protrusion 90 is formed by an annular remaining portion 12d when the first electrode 12 is patterned by photolithography or the like.

  A first insulating layer 13 and a second insulating layer 15 are stacked on the remaining portion 12d of the first electrode 12, and the first insulating layer 13 and the second insulating layer 15 have an annular shape of the remaining portion 12d. By inheriting the shape, the annular protrusion 90 of this example is configured.

  As described above, in the manufacturing method of the present embodiment, the circular annular protrusion 90 is provided in a portion of the bonding surface 10a of the first glass substrate 10 where the adhesive 50 is dropped, and the adhesive 50 is dropped. This is performed on a portion surrounded by the annular protrusion 90.

  In this way, by dropping the adhesive 50 onto the circular protrusion 90 covered with the circular outer wall, even if the dropped adhesive 50 is disturbed over time, the adhesive 50 spreads uniformly inside the outer wall. A shape close to a perfect circle can be maintained.

  For this reason, it is possible to suppress the shape disorder of the adhesive 50 at the time of bonding, and even if the adhesive 50 in the annular protrusion 90 and the adhesive 50 proceeding against the adhesive 50 come into contact with each other, bubbles are generated. Can be prevented.

  In the above example, the annular protrusion 90 is formed by the first electrode 12. However, the annular protrusion 90 may be formed by patterning other layers constituting the EL element 11 into a circular ring shape. Furthermore, not only a single layer but also the annular protrusion 90 is formed by stacking a plurality of layers having a circular ring shape, the height of the annular protrusion 90 can be increased, and a greater effect can be expected.

  Further, the annular protrusion 90 may be provided not at the peripheral portion of the bonding 10a but at the central portion, and moreover, a plurality of annular protrusions 90 may be provided at various positions on the bonding surface 10a. Further, the shape of the annular protrusion 90 is circular, but is not limited to a perfect circle and includes a flat circle such as an ellipse.

  In the present embodiment, as shown in the above example, the annular protrusion 90 is provided on the bonding surface 10a of the first glass substrate 10. However, if the adhesive 50 is a portion to be dropped, Further, it may be provided on the bonding surface 30a of the second glass substrate 30, or may be provided on both the bonding surfaces 10a and 30a.

  In addition, the manufacturing method of the present embodiment can be applied in combination with the first to third embodiments described above.

(Fifth embodiment)
FIG. 6 is a diagram showing a main part of an inorganic EL display device according to the fifth embodiment of the present invention. The display device of the present embodiment is obtained by modifying the portion B in the inorganic EL display device shown in FIG. 1, and the portions not shown in FIG. 6 are the same as those in FIG.

  That is, in FIG. 6, (a) is an enlarged plan view showing a circled portion B in the inorganic EL display device shown in FIG. 1 (a), and (b) is a plan view of (a). It is a figure which shows DD schematic sectional structure.

  In FIG. 6A, both glass substrates 10 and 30 and the circular concave portion 91 are shown, and other portions are omitted. In addition, the circular concave portion 91 is shown for convenience in order to facilitate identification. It is hatched with diagonal lines.

  In this embodiment, in the manufacturing method shown in the fourth embodiment, a circular recess 91 is provided in place of the annular protrusion 90. That is, in the present embodiment, as shown in FIG. 6, a circular recess 91 that is recessed in advance in a circular shape is provided in a portion of the bonding surfaces 10 a and 30 a of both glass substrates 10 and 30 where the adhesive 50 is dropped. A method of dropping the adhesive 50 into the circular recess 91 is employed.

  Such a circular recess 91 may be formed at the central portion or the peripheral portion of the bonding surfaces 10a and 30a, and patterning of the layers 12 to 16 constituting the EL element 11 or formation of various insulating films. And it can form easily by using a patterning means.

  In FIG. 6, the vicinity of the corners of the bonding surfaces 10a and 30a of both glass substrates 10 and 30 is shown, and the adhesive 50 dropped on the vicinity of the corners, that is, the periphery of both bonding surfaces 10a and 30a. The example which provided the circular recessed part 91 as object is shown.

  And also in this embodiment, the adhesive agent 50 shall be dripped at the bonding surface 10a of the 1st glass substrate 10 similarly to the said FIG. 5, and the circular recessed part 91 bonded the 1st glass substrate 10 together. It is provided on the surface 10a.

  In this example, as shown in FIG. 6, the circular recess 91 is provided on the bonding surface 10 a on the first glass substrate 10 side, and is formed by a layer constituting the first electrode 12 in the EL element 11. Yes. Specifically, the circular recess 91 is formed by a circular hole 12e when the first electrode 12 is patterned by photolithography or the like.

  A first insulating layer 13 and a second insulating layer 15 are stacked on the hole 12e of the first electrode 12, and the first insulating layer 13 and the second insulating layer 15 have a circular shape of the hole 12e. By inheriting the hole shape, the circular recess 91 of this example is configured.

  Thus, in the manufacturing method of this embodiment, the circular recessed part 91 which makes circular hole shape is provided in the site | part which drops the adhesive 50 among the bonding surfaces 10a of the 1st glass substrate 10, and the adhesive 50 of The dropping is performed in the circular recess 91.

  By dropping the adhesive 50 into the inside of the circular recess 91, that is, the area covered with the circular inner wall, even if the dropped adhesive 50 is disturbed over time, it spreads uniformly on the inner side of the outer wall. A shape close to a perfect circle can be maintained. Therefore, also in this embodiment, entrainment of bubbles due to the disorder of the shape of the adhesive 50 at the time of bonding can be suppressed.

  In the above example, the circular recess 91 is formed by the first electrode 12, but it may be formed by patterning the other layers constituting the EL element 11 into a circular hole.

  Furthermore, if the circular recessed part 91 is comprised not only by a single layer but by the lamination | stacking of the several layer which makes circular hole shape, the depth of the circular recessed part 91 can be increased and the bigger effect can be anticipated.

  Moreover, the circular recessed part 91 may be provided in the center part instead of the peripheral part of the bonding 10a, and more than one may be provided in each part of the bonding surface 10a. The circular recess 91 has a circular shape, but is not limited to a perfect circle and includes a flat circle such as an ellipse.

  In the present embodiment, as shown in the above example, the circular recess 91 is provided on the bonding surface 10a of the first glass substrate 10. However, if the adhesive 50 is a portion to be dropped, Further, it may be provided on the bonding surface 30a of the second glass substrate 30, or may be provided on both the bonding surfaces 10a and 30a.

  In addition, the manufacturing method of the present embodiment can be applied in combination with the first to third embodiments described above.

(Sixth embodiment)
FIG. 7 is a schematic cross-sectional view showing the main part of the method for manufacturing an inorganic EL display device according to the sixth embodiment of the present invention. In FIG. 7, only the glass substrates 10 and 30 and the adhesive 50 are shown, and other parts such as EL elements are omitted, but the parts not shown are the same as those in FIG.

  The manufacturing method of the present embodiment can be applied to the first to fifth embodiments. That is, the manufacturing method of the present embodiment also prepares the first glass substrate 10 and the second glass substrate 30 on which the inorganic EL elements 11 are formed, and the bonding surfaces 10a and 30a of both the glass substrates 10 and 30. After the adhesive 50 is dropped onto at least one of the glass substrates 10, the two glass substrates 10 and 30 are bonded together via the adhesive 50.

  Here, in the present embodiment, as shown in FIG. 7, the adhesive 50 is dropped on the bonding surface 10 a of the first glass substrate 10 on which the EL element is formed, of both the glass substrates 10 and 30. Shall.

  At this time, in this embodiment, the bonding surface 10a of the first glass substrate 10 is directed to the top side, and the adhesive 50 is dropped onto the bonding surface 10a to form a convex shape. .

  And as FIG. 7 shows, with respect to the bonding surface 10a of the 1st glass substrate 10 in which this adhesive agent 50 was dripped, the bonding surface 30a of the other 2nd glass substrate 30 is made into a ground side. The bonding surface 30 a of the second glass substrate 30 is brought into contact with the top of the convex portion of the convex adhesive 50.

  Then, the adhesive 50 is filled between the bonded surfaces 10a and 30a of the glass substrates 10 and 30 by stretching the adhesive 50 so as to push it over the outer peripheral region. Then, the display device is completed by curing the adhesive 50.

  According to the manufacturing method of this embodiment, since the bonding surface 30a of the second glass substrate 30 is brought into contact with the top of the adhesive 50 that is dropped and has a convex shape, this contact is close to point contact. It is possible to prevent entrainment of bubbles generated at the time of contact.

  In addition, in the manufacturing method described in Patent Document 1, the insulating substrate on which the adhesive is dropped is reversed and the adhesive shape is bonded by its own weight so that the adhesive is dropped. If the amount is too large, it will drop due to its own weight, and there will be a problem that the amount of adhesive necessary for filling between the two substrates is insufficient. In that respect, such a problem is avoided in the manufacturing method of the present embodiment.

(Seventh embodiment)
FIG. 8 is a schematic cross-sectional view showing the main part of the method for manufacturing an inorganic EL display device according to the seventh embodiment of the present invention. In FIG. 8, only the glass substrates 10 and 30 and the adhesive 50 are shown, and other parts such as EL elements are omitted, but the parts not shown are the same as those in FIG. .

  The manufacturing method of this embodiment can also be applied to the first to fifth embodiments. That is, also in the manufacturing method of the present embodiment, the adhesive 50 is dropped on at least one of the bonding surfaces 10a and 30a of the both glass substrates 10 and 30, and then the both glass substrates 10 and 30 are pasted via the adhesive 50. Manufactured by combining.

  Here, as shown in FIG. 8, when the adhesive 50 is dropped on the bonding surface 10a of the first glass substrate 10, the bonding surface 10a of the first glass substrate 10 is directed to the top side. As a state, the adhesive 50 is dropped on the bonding surface 10a.

  Then, as shown in FIG. 8, the bonding surface 30a of the second glass substrate 30 is directed to the ground side and horizontal with respect to the bonding surface 10a of the first glass substrate 10 onto which the adhesive 50 has been dropped. It is made to oppose in the state inclined rather than.

  Then, the bonding surface 30 a of the second glass substrate 30 is brought into contact with the adhesive 50. Then, the adhesive 50 is filled between the bonding surfaces 10a and 30a of the glass substrates 10 and 30 by stretching the adhesive 50 so as to spread it over the outer peripheral region. Then, the display device is completed by curing the adhesive 50.

  According to the manufacturing method of the present embodiment, in the adhesive 50 dropped onto the bonding surface 10a of the first glass substrate 10, the vicinity of the periphery of the adhesive 50 has a portion having a curvature due to surface tension, that is, a convexity. The focus is on the shape.

  And since it becomes possible to make it contact with the top part of the outer peripheral part used as the convex shape of the dripped adhesive 50 by inclining the bonding surface 30a of the 2nd glass substrate 30 from horizontal, this contact is made. It can be in a state close to point contact, and entrainment of bubbles generated at the time of contact can be prevented.

  In the manufacturing method of the present embodiment, the amount of the adhesive 50 to be dropped is large, and the outer periphery of the dropped adhesive 50 becomes higher than the center portion, that is, the shape of the dropped adhesive 50 is the center. This is effective when the raised convex shape cannot be achieved.

(Eighth embodiment)
FIG. 9 is a schematic cross-sectional view showing the main part of the method for manufacturing an inorganic EL display device according to the eighth embodiment of the present invention. In FIG. 9, only the glass substrates 10 and 30 and the adhesive 50 are shown, and other parts such as an EL element are omitted, but the parts not shown are the same as those in FIG. .

  The manufacturing method of this embodiment can also be applied to the first to fifth embodiments. That is, in the manufacturing method of the present embodiment, in the seventh embodiment, the first glass substrate 10 positioned on the lower side is also inclined from the horizontal direction.

  In this embodiment, as shown in FIG. 9, when the adhesive 50 is dropped on the bonding surface 10 a of the first glass substrate 10, the bonding surface 10 a of the first glass substrate 10 is on the top side. As the state of being directed, the adhesive 50 is dropped on the bonding surface 10a. At the same time, the bonding surface 10a of the first glass substrate 10 is inclined from the horizontal.

  Accordingly, as shown in FIG. 9, the dropped adhesive 50 is offset by its own weight to form a convex shape convex toward the top side. Thereafter, the bonding surface 30a of the second glass substrate 30 is opposed to the bonding surface 10a of the first glass substrate 10 in a state in which the bonding surface 30a is directed to the ground side.

  Thereafter, the bonding surface 30a of the second glass substrate 30 is brought into contact with the top of the convex portion of the adhesive 50 that is convex. Here, as shown in FIG. 9, the bonding surface 30 a of the second glass substrate 30 is also inclined with respect to the horizontal to facilitate contact with the top of the convex portion of the adhesive 50.

  And after this contact, the adhesive 50 is filled between the bonding surfaces 10a and 30a so as to spread the adhesive 50 to the outer peripheral region. Then, the display device is completed by curing the adhesive 50.

  As described above, according to the manufacturing method of the present embodiment, the first glass substrate 10 onto which the adhesive 50 has been dropped is provided with an inclination so that the adhesive 50 is displaced in one direction by its own weight, and the adhesive 50 Convex shape can be made.

  Therefore, the adhesive 50 is used when it is difficult to make the adhesive 50 convex due to the viscosity of the adhesive 50 or the wettability of the surface of the glass substrate, or when the size of the glass substrate to be bonded is large. Can be easily formed into a convex shape.

  And by making the top part of the convex part of the adhesive 50 that forms this convex shape and the bonding surface 30a of the second glass substrate 30, this contact can be brought into a state close to a point contact, It is possible to prevent entrainment of bubbles generated at the time of contact.

(Other embodiments)
In each of the above-described embodiments, of the bonding surface 10a of the first glass substrate 10 and the bonding surface 30a of the second glass substrate 30, the bonding surface 10a of the first glass substrate 10 is a display element. Although an EL element 11 is formed, this EL element may be formed on the bonding surface 30a of the second glass substrate 30 or may be formed on both bonding surfaces.

  In each of the sixth to eighth embodiments, the adhesive 50 is dropped on the bonding surface 10a of the first glass substrate 10 on which the EL element 11 is formed. However, the adhesive 50 may be dropped on the second glass substrate 30 side, and the application of each embodiment in that case can be easily performed according to the above procedure.

  In addition to the above, the above embodiments may be used in combination within the possible range. In addition to the glass substrates 10 and 30 described above, the insulating substrate may be a substrate such as a resin.

  In addition, the first electrode 12, the first insulating layer 13, the light emitting layer 14, the second insulating layer 15, and the second electrode 16 in the EL element 11 described in each of the above embodiments are specific examples. Yes, it is not limited to these. The adhesive 50 may contain a spacer.

  Further, the present invention is not limited to the above-described inorganic EL display device. That is, the display element provided between the pair of insulating substrates is not limited to the inorganic EL element 11 described above.

  For example, as a display element interposed between two insulating substrates, for example, an organic EL in which a thin film in which an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and a cathode are sequentially stacked is employed. The present invention can be applied even to a display device. Further, it can be applied to a liquid crystal display device or the like.

(A) is a schematic plan view of the inorganic EL display device which concerns on 1st Embodiment of this invention, (b) is AA schematic sectional drawing in (a). (A) is a schematic plan view of the B section expansion in the inorganic EL display device shown in FIG. 1 (a), and (b) is a schematic cross-sectional view of (a). It is a figure which shows the principal part of the inorganic electroluminescent display apparatus which concerns on 2nd Embodiment of this invention, (a) is a schematic plan view, (b) is a schematic sectional drawing. It is a schematic plan view which shows the principal part of the inorganic EL display device which concerns on 3rd Embodiment of this invention. It is a figure which shows the principal part of the inorganic electroluminescent display apparatus which concerns on 4th Embodiment of this invention, (a) is a schematic plan view, (b) is a schematic sectional drawing. It is a figure which shows the principal part of the inorganic electroluminescence display which concerns on 5th Embodiment of this invention, (a) is a schematic plan view, (b) is a schematic sectional drawing. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the inorganic EL display apparatus which concerns on 6th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the inorganic EL display apparatus which concerns on 7th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the manufacturing method of the inorganic EL display apparatus which concerns on 8th Embodiment of this invention.

Explanation of symbols

10: a first glass substrate as a first insulating substrate,
10a: bonding surface of the first glass substrate,
11 ... Inorganic EL element as a display element, 12 ... First electrode as a thin film,
13 ... 1st insulating layer, 14 ... Light emitting layer, 15 ... 2nd insulating layer, 16 ... 2nd electrode,
30 ... Second glass substrate as a second insulating substrate,
30a ... Bonding surface of second glass substrate, 50 ... Adhesive,
60 ... projection, 70 ... recess, 90 ... annular projection, 91 ... circular recess.

Claims (6)

A first insulating substrate (10) and a second insulating substrate (30) each having a display element (11) formed on at least one bonding surface (10a, 30a);
The bonding surface (10a) of the first insulating substrate (10) and the bonding surface (30a) of the second insulating substrate (30) are bonded via an adhesive (50), and the both bonding The adhesive (50) is filled between the bonding surfaces (10a, 30a) by extending the adhesive (50) from the inner side to the peripheral side of the mating surfaces (10a, 30a). In the display device
Of the region where the adhesive (50) is stretched and filled between the two bonding surfaces (10a, 30a), in the region near the outer edge of the bonding surfaces (10a, 30a), the both bonding A protrusion (60) is provided on at least one of the mating surfaces (10a, 30a) ,
The protrusion (60) is provided at least one or more on the left and right sides in a direction that prevents the adhesive (50) from extending in the direction along the outer edge of the bonding surfaces (10a, 30a). A display device characterized in that it prevents the progress of the agent .   The insulating substrate (10) provided with the protrusion (60) is provided with a thin film (12) on the bonding surface (10a), and the protrusion (60) is formed of the thin film (12). The display device according to claim 1. A first electrode (12), a first insulating layer (13), and a light emission center as the display element (11) are formed on the bonding surface (10a) of the insulating substrate (10) provided with the protrusion (60). An EL element (11) formed by sequentially laminating each of the light emitting layer (14), the second insulating layer (15), and the second electrode (16),
The display device according to claim 2, wherein the thin film (12) constituting the protrusion (60) is selected from layers (12 to 16) constituting the EL element (11). . A first insulating substrate (10) and a second insulating substrate (30) each having a display element (11) formed on at least one bonding surface (10a, 30a);
The bonding surface (10a) of the first insulating substrate (10) and the bonding surface (30a) of the second insulating substrate (30) are bonded via an adhesive (50), and the both bonding The adhesive (50) is filled between the bonding surfaces (10a, 30a) by extending the adhesive (50) from the inner side to the peripheral side of the mating surfaces (10a, 30a). In the display device
Of the region where the adhesive (50) is stretched and filled between the two bonding surfaces (10a, 30a), in the region near the outer edge of the bonding surfaces (10a, 30a), the both bonding A recess (70) is provided on at least one of the mating surfaces (10a, 30a) ,
The recess (70) is provided at least one on each of the left and right sides in a direction that prevents the adhesive (50) from extending in the direction along the outer edge of the bonding surfaces (10a, 30a). A display device characterized by being obstructed .   The insulating substrate (10) provided with the recess (70) is provided with a thin film (12) on the bonding surface (10a), and the recess (70) is formed by the thin film (12). The display device according to claim 4. The bonded surface (10a) of the insulating substrate (10) provided with the recess (70) has a first electrode (12), a first insulating layer (13), and a light emission center as the display element (11). An EL element (11) formed by sequentially laminating each of the light emitting layer (14), the second insulating layer (15), and the second electrode (16),
The display device according to claim 5, wherein the thin film (12) constituting the recess (70) is selected from the layers (12 to 16) constituting the EL element (11).

Images