JP5061010B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP5061010B2
JP5061010B2 JP2008091664A JP2008091664A JP5061010B2 JP 5061010 B2 JP5061010 B2 JP 5061010B2 JP 2008091664 A JP2008091664 A JP 2008091664A JP 2008091664 A JP2008091664 A JP 2008091664A JP 5061010 B2 JP5061010 B2 JP 5061010B2
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JP
Japan
Prior art keywords
insulating resin
resin layer
electrode
protruding
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008091664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009246175A (ja
JP2009246175A5 (https=
Inventor
浩一 齋藤
真弓 中里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2008091664A priority Critical patent/JP5061010B2/ja
Priority to US12/345,019 priority patent/US20090168391A1/en
Publication of JP2009246175A publication Critical patent/JP2009246175A/ja
Priority to US12/900,175 priority patent/US8438724B2/en
Publication of JP2009246175A5 publication Critical patent/JP2009246175A5/ja
Application granted granted Critical
Publication of JP5061010B2 publication Critical patent/JP5061010B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Wire Bonding (AREA)
JP2008091664A 2007-12-27 2008-03-31 半導体モジュール Expired - Fee Related JP5061010B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008091664A JP5061010B2 (ja) 2008-03-31 2008-03-31 半導体モジュール
US12/345,019 US20090168391A1 (en) 2007-12-27 2008-12-29 Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
US12/900,175 US8438724B2 (en) 2007-12-27 2010-10-07 Method for producing substrate for mounting device and method for producing a semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008091664A JP5061010B2 (ja) 2008-03-31 2008-03-31 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2009246175A JP2009246175A (ja) 2009-10-22
JP2009246175A5 JP2009246175A5 (https=) 2011-05-12
JP5061010B2 true JP5061010B2 (ja) 2012-10-31

Family

ID=41307734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008091664A Expired - Fee Related JP5061010B2 (ja) 2007-12-27 2008-03-31 半導体モジュール

Country Status (1)

Country Link
JP (1) JP5061010B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3935507B2 (ja) 1996-02-28 2007-06-27 松下電器産業株式会社 高解像度および立体映像記録用光ディスク、光ディスク再生装置、光ディスク記録装置
JP5431232B2 (ja) * 2010-03-31 2014-03-05 三洋電機株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118210A (ja) * 2000-10-10 2002-04-19 Hitachi Cable Ltd 半導体装置用インタポーザ及びこれを用いた半導体装置
JP2007173749A (ja) * 2005-12-26 2007-07-05 Sony Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2009246175A (ja) 2009-10-22

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