JP5056950B2 - Chargeable powder for conductor pattern formation and multilayer ceramic electronic component using the same - Google Patents

Description

  The present invention relates to a conductive powder for forming a conductive pattern and a multilayer ceramic electronic component, and more particularly to a conductive powder for forming a conductive pattern used when printing a conductive pattern on a substrate by electrophotography and a laminate using the same. The present invention relates to ceramic electronic components.

  In a ceramic multilayer substrate or the like, as a method for forming an inner conductor disposed between the ceramic layers and an outer conductor disposed on the outer surface, a conductive powder for forming a conductive pattern is printed by electrophotography, There is a method of baking a charged powder and a ceramic layer simultaneously.

  By the way, the conductive particles (for example, copper particles) used for the chargeable powder and the ceramic layer have different sintering temperatures, resulting in different shrinkage start temperatures (usually conductive particles have a lower sintering temperature). ). Due to this difference in sintering temperature, normally, the sintering shrinkage of the conductor pattern having a low sintering temperature starts before the sintering shrinkage of the ceramic layer.

  For example, when a conductor pattern having a relatively large area such as a ground electrode is formed, the influence of the difference in sintering temperature is particularly large, and the conductor pattern is peeled off or the substrate is cracked due to this shrinkage. There is a problem that it will be lost.

Under such circumstances, in order to improve the bonding strength between the conductor pattern and the ceramic layer, a method has been proposed in which silica, which is an adhesion reinforcing agent, is contained inside the chargeable powder (Patent Document 1).
According to this method, it is possible to improve the bonding strength of the conductor pattern to the ceramic layer and suppress the peeling of the conductor pattern. However, problems such as cracking of the substrate and partial peeling of the conductor pattern due to the influence of the deviation of the sintering start temperature between the conductor pattern and the ceramic layer remain.

In order to improve the chargeability of the chargeable powder, a method of coating conductive particles with an easily chargeable insulating resin has been proposed (see Patent Document 2).
According to this method, it is possible to improve the chargeability and improve the fixability at the time of printing the chargeable powder, but the insulating resin does not affect the sintering start temperature at all, In reality, problems such as cracking of the substrate and partial peeling of the conductor pattern due to the influence of the difference in the sintering start temperature between the conductor pattern and the ceramic layer cannot be solved.
Japanese Patent Laid-Open No. 11-251718 JP 2006-136611 A

  The present invention solves the above-mentioned problem, and laminates ceramic green sheets on which conductive patterns to be electrodes and circuits are formed by printing a conductive pattern forming chargeable powder, and then fires the laminated ceramic. When manufacturing electronic parts, a conductive pattern forming charged powder that can suppress the occurrence of peeling of the conductor and cracking of the ceramic layer due to the difference in sintering temperature between the conductor pattern and the ceramic layer, It is an object of the present invention to provide a multilayer ceramic electronic component that is manufactured with good yield.

In order to solve the above problems, the first conductive pattern forming charged powder of the present invention comprises:
A conductive powder for forming a conductor pattern used when a conductor pattern is printed on a substrate by electrophotography,
Conductive metal particles;
A ceramic coating layer disposed to cover the conductive metal particles;
A thermoplastic resin in which a plurality of the conductive metal particles covered with the ceramic coating layer are dispersed;
And a silica fine particle layer disposed so as to cover the thermoplastic resin.
In the first charged powder for forming a conductor pattern of the present invention, it is desirable that a plurality of ceramic particles are dispersed in the thermoplastic resin.
In the first conductive pattern forming charged powder of the present invention, the conductive metal particles are preferably copper particles.
Moreover, it is preferable that the printed material on which the conductive pattern forming chargeable powder is printed is a ceramic green sheet.

In addition, the second conductive pattern forming powder of the present invention,
A conductive powder for forming a conductor pattern used when a conductor pattern is printed on a substrate by electrophotography,
Conductive metal particles;
A ceramic coating layer disposed to cover the conductive metal particles;
A thermoplastic resin layer disposed to cover the ceramic coating layer;
And a silica fine particle layer disposed so as to cover the thermoplastic resin.
In the second conductive pattern forming powder of the present invention, the conductive metal particles are preferably copper particles.
Moreover, it is preferable that the printed material on which the second conductive pattern forming charged powder is printed is also a ceramic green sheet.

The multilayer ceramic electronic component of the present invention is
A multilayer ceramic electronic component comprising a ceramic laminate formed by laminating and firing a ceramic green sheet printed with the conductive powder for forming a conductor pattern according to any one of claims 1 to 7,
A conductor obtained by sintering the conductive powder for forming a conductor pattern according to any one of claims 1 to 7 is provided on a surface and / or inside of the ceramic laminate.

  Moreover, the conductor of the surface of the said ceramic laminated body is what sintered the conductive powder for conductor pattern formation in any one of Claims 1-4, It is characterized by the above-mentioned.

  Further, the conductor inside the ceramic laminate is characterized in that the conductive pattern forming chargeable powder according to any one of claims 5 to 7 is sintered.

In the first charged powder for forming a conductor pattern of the present invention, a plurality of conductive metal particles covered with a ceramic coating layer are dispersed in a thermoplastic resin, and the thermoplastic resin is covered with a silica fine particle layer. Therefore, it is possible to increase the sintering temperature of the conductive metal particles to delay the start of sintering, reduce the difference between the sintering temperature of the conductor pattern and the ceramic layer, and the behavior of the sintering shrinkage of both It is possible to suppress or prevent the substrate from being cracked or the conductor pattern from being peeled off due to the difference.
That is, by conducting ceramic coating on the conductive metal particles, it becomes possible to increase the sintering temperature of the conductive metal particles and bring the sintering shrinkage start temperature closer to the sintering shrinkage start temperature of the ceramic layer. It becomes possible to suppress and prevent cracks and peeling of the conductor pattern.

In general, the allowable sintering temperature difference between the conductor pattern and the ceramic layer is preferably within a range of ± 150 ° C. However, according to the present invention in which the ceramic coating is applied to the conductive metal particles, the conductor pattern and the ceramic layer The difference in sintering temperature with the layer can be within a range of ± 150 ° C.
It should be noted that the ceramic material cannot be fully exerted the function of raising the sintering temperature of the conductive metal particles by simply coexisting the ceramic material without performing ceramic coating on the conductive metal particles. It is not preferable because the temperature is distributed.

  Further, the thermoplastic resin functions to fix the conductive pattern forming chargeable powder on the substrate.

Furthermore, by covering the thermoplastic resin with the silica fine particle layer, it is possible to ensure the fluidity of the conductive pattern forming chargeable powder.
In addition, the use of hydrophobized silica fine particles can improve the electric resistance.

  Therefore, by using the first conductive pattern forming powder of the present invention, it is possible to efficiently form a conductor constituting an electrode or a circuit to be disposed on the surface or inside of the multilayer ceramic electronic component. become.

  Further, by dispersing the ceramic particles in the thermoplastic resin, it is possible to improve the bonding strength due to the anchor effect of the ceramic particles.

In the conductive pattern forming charged powder, it is desirable to use copper powder excellent in electrical characteristics such as conductivity and economy as the conductive metal particles.
When copper particles are used as the conductive metal particles, it is possible to raise the sintering temperature of the copper particles and bring the sintering start temperature closer to the sintering start temperature of the ceramic layer. Then, by manufacturing laminated ceramic electronic components using conductive powder for forming conductive patterns with copper particles as conductive metal particles, substrate cracking and peeling of conductive patterns due to differences in sintering shrinkage between copper particles and ceramic layers It is possible to suppress and prevent the above and to manufacture a multilayer ceramic electronic component having high characteristics and high reliability with a high yield.

  Also, by printing this conductive pattern forming chargeable powder on a ceramic green sheet (printed material), it is possible to obtain a ceramic green sheet on which a conductor pattern is disposed, which is suitable for the production of multilayer ceramic electronic components. become.

  Also, like the second conductive pattern forming powder of the present invention, the conductive metal particles, the ceramic coating layer disposed so as to cover the conductive metal particles, and the ceramic coating layer are disposed. Similarly to the case of the charged powder for forming a first conductor pattern, when the thermoplastic resin layer is provided and the silica fine particle layer disposed so as to cover the thermoplastic resin is used. By increasing the sintering temperature of the conductive metal particles, it becomes possible to approach the sintering temperature of the ceramic layer, and it is possible to suppress and prevent cracking of the substrate and peeling of the conductor pattern due to the sintering temperature difference between the two. It becomes possible.

  In the case of the second conductive pattern forming charged powder, the content of the thermoplastic resin can be reduced as compared with the first conductive pattern forming charged powder. And since it becomes possible to reduce the quantity of the thermoplastic resin contained in the conductive powder for conductor pattern formation, the amount of gas generated by decomposition | disassembly and combustion of a thermoplastic resin at a baking process can be reduced.

  Also in this second conductive pattern forming charged powder, it is desirable to use copper particles as the conductive metal particles.

  In addition, by printing the second conductive pattern forming powder on a ceramic green sheet (printed material), a ceramic green sheet on which a conductor pattern is disposed, which is suitable for manufacturing a multilayer ceramic electronic component, is obtained. It becomes possible.

  Moreover, the multilayer ceramic electronic component of the present invention has the conductive pattern forming chargeable powder of the present invention (the conductive pattern forming chargeable powder according to any one of claims 1 to 7) on the surface and / or inside of the ceramic laminate. When equipped with a sintered conductor, and using the conductive powder for forming a conductor pattern of the present invention, the sintering temperature of the conductive metal particles can be raised to approach the sintering temperature of the ceramic layer, It becomes possible to provide a highly reliable monolithic ceramic electronic component that is free from cracking of the substrate and peeling of the conductor pattern due to a difference in sintering shrinkage between the two.

  Further, in the case of the conductive powder for forming a conductor pattern (first conductive pattern forming powder) according to claims 1 to 4, the ratio of the thermoplastic resin and the ratio of the ceramic particles dispersed in the thermoplastic resin are increased. It becomes possible. Therefore, in the case of producing a multilayer ceramic electronic component, in forming the outer conductor on the surface of the ceramic laminate, when using the conductive powder for forming a conductor pattern according to any one of claims 1 to 4, It becomes possible to form a conductor having excellent fixing property to the ceramic layer and having high bonding strength to the ceramic layer after firing.

  In addition, when the conductive powder for forming a conductor pattern according to claims 1 to 4 is used, the amount of gas generated by decomposition or combustion of the thermoplastic resin increases, but in the case of an outer conductor formed on the surface of the ceramic laminate Even if the amount of gas generated due to decomposition or combustion of the thermoplastic resin increases, the gas easily escapes from the conductor surface, so there is no separation between the conductor and the ceramic layer, high bonding strength, and high reliability An outer conductor can be formed.

  Further, when the conductor inside the ceramic laminate is formed using the conductive powder for forming a conductive pattern according to any one of claims 5 to 7 (second conductive pattern forming charged powder), Since the ratio of the thermoplastic resin in the conductive powder for forming the conductor pattern 2 is smaller than that in the first conductive pattern forming powder, the amount of gas generated by the decomposition and combustion of the thermoplastic resin in the heat treatment step Will be less.

  Therefore, in the case of producing a multilayer ceramic electronic component, when the second conductive pattern forming charged powder is used in forming the conductor inside the ceramic laminate, it is caused by decomposition or combustion of the thermoplastic resin in the firing step. Since the amount of gas generated is small, it is possible to suppress and prevent the separation between the conductor and the ceramic layer, and to manufacture the multilayer ceramic electronic component including the internal conductor with a high yield.

  Further, in the case of the conductive powder for forming a conductor pattern according to any one of claims 5 to 7, since the ratio of the thermoplastic resin contained is reduced, the fixability of the conductor pattern in the firing process tends to be reduced accordingly. However, the inner conductor is not particularly problematic because it is held between the ceramic layers. Similarly, after firing, there is no need for such a large bonding strength as required for the outer conductor, so that it is sufficiently good using the conductive pattern forming charged powder according to any one of claims 5 to 7. An inner conductor can be formed.

It is sectional drawing which shows the structure of the conductive powder for conductor pattern formation concerning one Example (Example 1) of this invention. It is sectional drawing which shows the structure of the charged powder for conductor pattern formation concerning the other Example (Example 2) of this invention. It is a figure which shows typically an example of the electrophotographic system used for fixing the charged powder for conductor pattern formation of this invention on to-be-printed material, and forming a conductor pattern. It is sectional drawing which shows the structure of the multilayer substrate main body formed using the electrically conductive powder for conductor pattern formation of this invention.

  Examples of the present invention will be described below to describe the features of the present invention in more detail.

  In the first embodiment, the first conductive pattern forming chargeable powder of the present invention will be described as an example.

(1) To 70 parts by weight of copper particles having an average particle diameter of 3.5 μm, which are conductive metal particles, ceramic particles having a particle diameter of 0.01 to 0.1 μm for the ceramic coating layer (in this example, 1 part by weight of alumina particles) is mechanically coated to obtain conductive metal particles (hereinafter also referred to as “alumina-coated copper particles”) covered with a ceramic coating layer.
In addition, as a copper particle, it is desirable to use a thing with an average particle diameter of 0.8-4.0 micrometers. In addition to the copper particles, silver particles, palladium particles, nickel particles, and the like can be used as the conductive metal particles.
In addition to the above-mentioned alumina (Al ₂ O ₃ ), silica (SiO ₂ ), titania (TiO ₂ ), zirconia (ZrO ₂ ), etc. are used as the ceramic used for coating the conductive metal particles. It is possible.

(2) Next, 71 parts by weight of alumina-coated copper particles, 5 parts by weight of alumina particles having a particle size of 0.1 to 1.0 μm, which are ceramic particles for exhibiting the anchor effect, and a thermoplastic resin. 24 parts by weight of a polyester resin (in this Example 1, a granular polyester resin having a particle diameter of 1 to 2 mm) is kneaded using a kneader to disperse the alumina-coated copper particles and alumina particles in the polyester resin. The ceramic particles to be dispersed in the thermoplastic resin to exert the anchor effect are the same as the constituent components of the ceramic raw material that is the main component of the ceramic green sheet on which the conductive pattern forming charged powder is to be printed. It is desirable to use ceramic particles made of a material (co-material). In Example 1, alumina particles are used as ceramic particles in consideration of using a ceramic green sheet mainly composed of a BaO—Al ₂ O ₃ —SiO ₂ based ceramic material in Example 3 described later. Used.
As the thermoplastic resin, in addition to the above polyester resin, a styrene acrylic copolymer, a polypropylene resin, or the like can be used.

  (3) Then, the polyester resin in which the alumina-coated copper particles and the alumina particles obtained in (2) are dispersed is roughly pulverized using a pulverizer and then further pulverized using a mill.

  (4) Next, the pulverized raw material obtained in (3) is finely pulverized using a fine pulverizer to obtain a finely pulverized raw material.

  (5) Then, fine powder and coarse powder are cut from the finely pulverized raw material using a classifier to obtain composite particles having a particle size of 5 to 20 μm.

  (6) Next, 300 g of the composite particles obtained in (5) and 1.5 g of silica fine particles hydrophobized to improve fluidity and chargeability are mixed and treated at 5000 rpm for 10 minutes using a mixer. Then, silica fine particles are uniformly attached to the surface of the composite particles.

  As a result, as shown in FIG. 1, the thermoplastic resin 4 in which the conductive metal particles 1 covered with the ceramic coating layer (alumina coating layer) 2 and the ceramic particles (alumina particles) 3 are dispersed becomes silica fine particles. The first conductive pattern forming powder 10 (10a) of the present invention having a structure covered with the layer 5 is obtained.

In addition, the ratio of each component in the said chargeable powder for conductor pattern formation is as follows. A preferred range is shown in parentheses.
(a) 70% by weight of conductive metal particles (preferable range: 65 to 85% by weight)
(b) Thermoplastic resin
24% by weight (preferable range: 12 to 25% by weight)
(c) 1% by weight of ceramic particles for coating conductive metal particles (preferable range: 1 to 3% by weight)
(d) 5% by weight of ceramic particles dispersed in a thermoplastic resin (preferable range: 2 to 10% by weight)
(e) Silica fine particles (outer)
0.5% by weight (preferable range: 0.1 to 1.0% by weight)

  In this second embodiment, the second conductive pattern forming charged powder of the present invention will be described as an example.

(1) Conductive metal particles, 94 parts by weight of copper particles having an average particle size of 5 μm, ceramic particles having a particle size of 0.01 to 0.1 μm for the ceramic coating layer (in this example, alumina particles) ) 1 part by weight is mechanically coated to obtain conductive metal particles (hereinafter also referred to as “alumina-coated copper particles”) covered with a ceramic coating layer.
In the second conductive pattern forming powder of the present invention, it is desirable to use copper particles having an average particle size of 3.0 to 6.0 μm. In addition to the copper particles, silver particles, palladium particles, nickel particles, and the like can be used as the conductive metal particles.
In addition to the above alumina (Al ₂ O ₃ ), silica (SiO ₂ ), titania (TiO ₂ ), zirconia (ZrO ₂ ), etc. may be used as the ceramic for coating the conductive metal particles. Is possible.

(2) Next, 95 parts by weight of alumina-coated copper particles and 5 parts by weight of a polyester resin which is a thermoplastic resin (in this Example 2, a granular polyester resin having a particle diameter of 0.01 to 0.1 mm), It processes using a stirring processing apparatus and coats a polyester resin to an alumina coat copper particle.
As the thermoplastic resin, in addition to the above polyester resin, a styrene acrylic copolymer, a polypropylene resin, or the like can be used.

  (3) Then, fine particles and coarse particles of the particles obtained by coating the alumina-coated copper particles with the polyester resin are cut using a classifier to obtain composite particles of 3 to 10 μm.

  (4) Next, 300 g of the composite particles obtained in (3) and 1.5 g of silica fine particles hydrophobized to improve fluidity and chargeability are mixed and treated at 5000 rpm for 10 minutes using a mixer. Silica fine particles are uniformly attached to the surface of the composite particles.

  Thus, as shown in FIG. 2, the conductive metal particles 1 covered with the ceramic coating layer 2 are covered with the polyester resin 4 which is a thermoplastic resin, and the polyester resin 4 is further covered with the silica fine particle layer 5. The second conductive pattern forming powder 10 (10b) of the present invention having a structure is obtained.

In addition, the ratio of each component in the said chargeable powder for conductor pattern formation is as follows. A preferred range is shown in parentheses.
(a) 94% by weight of conductive metal particles (preferable range: 90 to 94% by weight)
(b) Thermoplastic resin
5% by weight (preferable range: 5 to 9% by weight)
(c) 1% by weight of ceramic particles for coating conductive metal particles (preferable range: 1 to 3% by weight)
(e) Silica fine particles (outer)
0.5% by weight (preferable range: 0.1 to 1.0% by weight)

  Using the conductive pattern forming chargeable powders of Examples 1 and 2, a ceramic multilayer substrate was produced by the method described below.

(1) The conductive powder for forming a conductor pattern of Example 1 is placed on a ceramic green sheet mainly composed of a BaO—Al ₂ O ₃ —SiO ₂ based ceramic raw material with a predetermined external conductor pattern (mounting land). The external ground electrode layer is fixed.
Also, the conductive powder for forming a conductor pattern of Example 2 is fixed on a ceramic green sheet so as to be a predetermined internal conductor pattern (wiring layer, internal ground electrode layer, capacitor electrode layer).
FIG. 3 is a diagram schematically showing an example of an electrophotographic system used for forming a conductor pattern by fixing the conductive powder for forming a conductor pattern of the present invention on a ceramic green sheet.

In this electrophotographic system, the formation of the conductor pattern on the ceramic green sheet
(a) a charging step in which the surface of the photoreceptor 11 is charged by the corona charger 12;
(b) an exposure process of forming a desired latent image pattern (not shown) by irradiating the surface of the photoreceptor 11 rotating in the direction of arrow A with the laser beam 13;
(c) a developing step of electrostatically adsorbing the conductive pattern forming chargeable powder 10 to the latent image pattern on the surface of the photoreceptor 11 by the supply means 14;
(d) a transfer step in which the photosensitive member 11 is rotated to transfer the conductive pattern forming charged powder 10 developed on the latent image pattern onto the ceramic green sheet 15 that is the printing object;
(e) The conductive pattern forming chargeable powder 10 transferred onto the ceramic green sheet 15 by the irradiation of the flash lamp 16 is fixed to perform a fixing step of forming a predetermined conductor pattern.

This electrophotographic system is merely an example, and various known electrophotographic systems can be applied as a specific method for fixing the conductive pattern forming chargeable powder.
It is also possible to form the conductor pattern using a developer containing the conductive powder for forming a conductor pattern of Examples 1 and 2 and a ferrite carrier.

  (2) After a through hole for a via hole is formed with a laser at a predetermined position of the ceramic green sheet, a via hole conductor is filled in the through hole ((1) and (2) are in no particular order).

  (3) A plurality of ceramic green sheets formed with a conductor pattern and filled with via-hole conductors are stacked and pressed to produce an unfired ceramic laminate.

(4) The unfired ceramic laminate is fired at 950 ° C., and the ceramic layer and the conductor pattern are simultaneously fired to obtain a multilayer substrate body.
FIG. 4 is a diagram showing the configuration of the multilayer substrate body. In the multilayer substrate body 26, internal conductors (wiring layers, internal ground electrode layers, capacitive electrode layers, etc.) 23 are disposed between ceramic layers 22 constituting the ceramic laminate 21, and the predetermined internal conductors 23 are via-hole conductors. 24, and an external conductor (mounting land, external ground electrode layer, etc.) 25 that is electrically connected to a predetermined internal conductor 23 through a via-hole conductor 24 is disposed on the surface of the ceramic laminate 21. Have a structure.

  (5) Then, although not particularly shown, a ceramic multilayer substrate can be obtained by mounting predetermined mounting parts on the multilayer substrate body.

[Characteristic evaluation]
(1) Bonding strength of external conductor to ceramic layer The bonding strength of the external conductor formed using the conductive pattern forming chargeable powder of Example 1 above to the ceramic layer is measured by the following method to evaluate the characteristics. did.
<Measuring method of bonding strength>
After gold plating is performed on the outer conductor of the multilayer substrate body after firing, a solder absorption line is soldered and a tensile test is performed to measure the strength at the time when the failure mode occurs. This measurement is performed 15 times, and the average value of the obtained strength is defined as the bonding strength.

(2) Presence or absence of peeling between internal conductor and ceramic layer The following method was used to measure the presence or absence of peeling between the internal conductor formed using the conductive pattern forming charged powder of Example 2 and the ceramic layer. Then, the characteristics were evaluated.
<Measurement method of presence or absence of peeling between inner conductor and ceramic layer>
After solidifying the multilayer substrate body, the cross section in the direction along the stacking direction is polished with a polishing machine, and the presence or absence of peeling is confirmed using a metal microscope.
Tables 1 and 2 show the bonding strength of the outer conductor to the ceramic layer and the occurrence rate of peeling between the inner conductor and the ceramic layer.

For comparison,
(a) The conductive pattern forming chargeability of Comparative Example 1 under the same conditions as the conductive pattern forming chargeable powder of Example 1 except that conductive metal particles not coated with a ceramic coating layer were used. Powder,
(b) Conductive pattern forming charge of Comparative Example 2 under the same conditions as the conductive pattern forming chargeable powder of Example 2 except that conductive metal particles not coated with a ceramic coating layer were used. The external conductor formed using the conductive pattern forming chargeable powder of Comparative Example 1 and the conductive pattern formation chargeable powder of Comparative Example 2 were prepared in the same manner as in Example 3. A multilayer substrate body with an inner conductor formed using the same was manufactured.

  And while examining the joint strength to the ceramic layer of the external conductor formed using the conductive powder for conductive pattern formation of this comparative example 1, and the internal conductor formed using the conductive powder for conductive pattern formation of the comparative example 2 Table 1 and Table 2 show the results of examining the occurrence of peeling between the ceramic layer and the ceramic layer.

As shown in Table 1, by forming the external conductor using the conductive pattern forming charged powder of Example 1, the ceramic layer compared to the case of using the conductive pattern forming charged powder of Comparative Example 1 It was confirmed that a ceramic multilayer substrate having a highly reliable outer conductor having a high bonding strength to the substrate can be obtained.
When the conductive powder for forming a conductor pattern of Example 1 is used, an external conductor having a high bonding strength to the ceramic layer can be obtained because the conductive powder for forming a conductor pattern of Example 1 is electrically conductive. This is because the metal particles are covered with the ceramic coating layer, the sintering temperature rises and the difference in the sintering temperature with the ceramic layer is reduced, and the ceramic particles containing the anchor effect are contained.

In addition, as shown in Table 2, by forming the inner conductor using the conductive pattern forming chargeable powder of Example 2, the occurrence of peeling between the inner conductor and the ceramic layer is suppressed, and the reliability is improved. It was confirmed that high ceramic multilayer substrates can be manufactured with high yield. On the other hand, when the conductive powder for forming a conductor pattern of Comparative Example 2 was used, it was confirmed that the occurrence rate of peeling was as extremely high as 90%.
In the case of using the conductive powder for forming a conductor pattern of Example 2, it is possible to suppress the occurrence of peeling in the charged powder for forming a conductor pattern of Example 2,
The thermoplastic resin content is low, the amount of gas generated by decomposition and combustion of the thermoplastic resin in the firing process is small, the conductive metal particles are covered with the ceramic coating layer, the sintering temperature rises, and the ceramic This is because the difference in sintering temperature with the layer is reduced.

  Here, the outer conductor is formed using the conductive pattern forming chargeable powder of Example 1, and the inner conductor is formed using the conductor pattern forming chargeable powder of Example 2, An internal conductor is formed using the conductive powder for forming a conductive pattern of the type of Example 1 by appropriately adjusting the ratio of components constituting the conductive powder for forming a conductive pattern, firing conditions, and the like. It is also possible to form an outer conductor using a conductive powder for forming a conductive pattern of this type.

  Further, in Example 3 described above, the case where the ceramic multilayer substrate is manufactured using the conductive pattern forming charged powder of the present invention has been described. However, the conductive pattern forming charged powder of the present invention is not limited to an inner conductor or an outer conductor. It can be widely used in the production of various multilayer ceramic electronic components equipped with.

  Also, the conductive powder for forming a conductor pattern of the present invention is a ground electrode having a relatively large area, which tends to cause peeling of the conductor pattern and cracking of the substrate due to shrinkage of the conductor pattern in the baking process. By applying to the formation, it becomes possible to efficiently prevent the peeling of the conductor pattern and the crack of the substrate, which is particularly significant.

  The present invention is not limited to the above-described embodiment in other points as well, and the types and blending ratios of the components constituting the conductive pattern-forming charged powder, the types and properties of the printed material, and the conductive pattern of the present invention. Various types of applications and modifications can be made within the scope of the invention with respect to the types of multilayer ceramic electronic parts manufactured using the chargeable powder for forming.

As described above, by using the conductive powder for forming a conductor pattern of the present invention, a ceramic green sheet on which a conductor pattern to be an electrode or a circuit is formed is laminated and fired to produce a multilayer ceramic electronic component. In this case, it is possible to suppress and prevent the occurrence of peeling of the conductor pattern and cracking of the ceramic layer due to the difference in the sintering temperature between the conductor pattern and the ceramic layer, and to efficiently manufacture the multilayer ceramic electronic component Become.
Therefore, the conductive powder for forming a conductor pattern of the present invention can be widely applied when manufacturing various multilayer ceramic electronic components having an outer conductor and / or an inner conductor.

1 Conductive metal particles (copper particles)
2 Ceramic coating layer 3 Ceramic particles (alumina particles)
4 Thermoplastic resin (polyester resin)
5 Silica Fine Particle Layer 10 (10a, 10b) Conductive pattern forming chargeable powder 11 Photoconductor 12 Corona charger 13 Laser light 14 Supply means 15 Ceramic green sheet 16 Flash lamp 21 Ceramic laminate 22 Ceramic layer 23 Internal conductor (wiring layer) , Internal ground electrode layer, capacitive electrode layer, etc.)
24 via hole conductor 25 external conductor (land for mounting, external ground electrode layer, etc.)
26 Multilayer board body

Claims (10)

A conductive powder for forming a conductor pattern used when a conductor pattern is printed on a substrate by electrophotography,
Conductive metal particles;
A ceramic coating layer disposed to cover the conductive metal particles;
A thermoplastic resin in which a plurality of the conductive metal particles covered with the ceramic coating layer are dispersed;
A conductive powder for forming a conductive pattern, comprising: a silica fine particle layer disposed so as to cover the thermoplastic resin.   The charged powder for forming a conductor pattern according to claim 1, wherein a plurality of ceramic particles are dispersed in the thermoplastic resin.   3. The conductive powder for forming a conductive pattern according to claim 1, wherein the conductive metal particles are copper particles.   The charged powder for forming a conductor pattern according to claim 1, wherein the printed material on which the charged powder for forming a conductor pattern is printed is a ceramic green sheet. A conductive powder for forming a conductor pattern used when a conductor pattern is printed on a substrate by electrophotography,
Conductive metal particles;
A ceramic coating layer disposed to cover the conductive metal particles;
A thermoplastic resin layer disposed to cover the ceramic coating layer;
A conductive powder for forming a conductor pattern, comprising: a silica fine particle layer disposed so as to cover the thermoplastic resin.   6. The conductive powder for forming a conductor pattern according to claim 5, wherein the conductive metal particles are copper particles.   The charged powder for forming a conductor pattern according to claim 5 or 6, wherein the printed material on which the charged powder for forming a conductor pattern is printed is a ceramic green sheet. A multilayer ceramic electronic component comprising a ceramic laminate formed by laminating and firing a ceramic green sheet printed with the conductive powder for forming a conductor pattern according to any one of claims 1 to 7,
A multilayer ceramic electronic component comprising a conductor obtained by sintering the conductive powder for forming a conductor pattern according to claim 1 on the surface and / or inside of the ceramic laminate.   The multilayer ceramic electronic component according to claim 8, wherein the conductor on the surface of the ceramic laminate is obtained by sintering the conductive pattern forming chargeable powder according to claim 1.   9. The multilayer ceramic electronic component according to claim 8, wherein the conductor inside the ceramic laminate is obtained by sintering the conductive powder for forming a conductor pattern according to any one of claims 5 to 7.

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