JPH0478191A - Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereof - Google Patents
Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereofInfo
- Publication number
- JPH0478191A JPH0478191A JP2192374A JP19237490A JPH0478191A JP H0478191 A JPH0478191 A JP H0478191A JP 2192374 A JP2192374 A JP 2192374A JP 19237490 A JP19237490 A JP 19237490A JP H0478191 A JPH0478191 A JP H0478191A
- Authority
- JP
- Japan
- Prior art keywords
- conductive metal
- metal particles
- forming
- resin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 239000000843 powder Substances 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 16
- 239000011162 core material Substances 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 239000002923 metal particle Substances 0.000 claims description 26
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 239000011882 ultra-fine particle Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract description 6
- 239000004926 polymethyl methacrylate Substances 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 108091008695 photoreceptors Proteins 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Developing Agents For Electrophotography (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、配線基板の回路形成方法ならびに配線基板の
回路形成方法用の荷電性粉末およびその製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming a circuit on a wiring board, a charged powder for use in the method for forming a circuit on a wiring board, and a method for manufacturing the same.
従来の電子写真方式を用いた配線基板の回路形成方法に
おいては、特願平１−８００８３号で提案されているよ
うに、電界を利用して導電性金属粒子と熱溶融性樹脂と
荷電制御剤とからなる荷電粉末を用いて、絶縁性基板上
に所要の配線パターンを形成している。In a conventional method for forming a circuit on a wiring board using an electrophotographic method, as proposed in Japanese Patent Application No. 1-80083, conductive metal particles, a hot melt resin, and a charge control agent are formed using an electric field. A required wiring pattern is formed on an insulating substrate using charged powder consisting of.
第３図は、この方法でセラミックグリーンシート１０ａ
上に配線パターンを形成する原理を示す模式図である。FIG. 3 shows a ceramic green sheet 10a obtained using this method.
FIG. 3 is a schematic diagram showing the principle of forming a wiring pattern thereon.
感光体ドラム１１は、矢印２３の方向に回転する。消去
ランプ１２は、感光体ドラムｌｌ上の表面電位を均一に
下げる。帯電電極１３は、感光体ドラム１１上に均一に
電荷を帯びさせる。潜像形成部１４は、レーザー１５を
ミラー１６で走査することによって、帯電電極１３によ
り均一に帯電された感光体ドラム１１上の電荷を一部消
去し潜像を形成する。現像器１７は、潜像をキャリア１
つを用いて、帯電させた荷電性粉末１８で現像する。転
写電極２０は、現像器１７で現像された感光体ドラム１
１上の潜像をセラミ・Ｉフグリーンシート１０ａ上に転
写する。フラッシュランプ２１は、転写電極２０で転写
されたセラミックグリーンシート上の転写像を定着させ
る。クリーナー２２は、感光体ドラム１１上の転写残の
潜像をかき取る。Photosensitive drum 11 rotates in the direction of arrow 23. The erase lamp 12 uniformly lowers the surface potential on the photoreceptor drum ll. The charging electrode 13 charges the photosensitive drum 11 uniformly. The latent image forming section 14 forms a latent image by scanning a laser 15 with a mirror 16 to partially erase the charge on the photoreceptor drum 11 that has been uniformly charged by the charging electrode 13. The developing device 17 converts the latent image into a carrier 1.
The image is developed with a charged powder 18 using an electric charger. The transfer electrode 20 is connected to the photosensitive drum 1 developed by the developing device 17.
The latent image on 1 is transferred onto a ceramic I green sheet 10a. The flash lamp 21 fixes the transferred image on the ceramic green sheet transferred by the transfer electrode 20. The cleaner 22 scrapes off the latent image remaining on the photoreceptor drum 11 after transfer.
このようにして得られた配線パターンの形成されたセラ
ミックグリーンシートは、切断、積層され、４５０°Ｃ
の酸化性雰囲気中でセラミ・ンクグリーンシート中の有
機バインダーおよび導電性金属粒子を保護していた熱溶
融性樹脂を完全Ｇ２分解、飛散させた後、９００℃で焼
結されて、荷電性粉末の導電性金属粉末によって回路形
成されたセラミック基板となる。The thus obtained ceramic green sheets with the wiring patterns formed thereon were cut, laminated, and heated to 450°C.
The heat-melting resin that protected the organic binder and conductive metal particles in the ceramic green sheet was completely decomposed and scattered in an oxidizing atmosphere of This is a ceramic substrate on which a circuit is formed using conductive metal powder.
荷電性粉末は、通常の電子写真方式で用０られるトナー
と同様の製造方法で、導電性金属粒子と熱溶融性樹脂と
荷電制御剤とを混合、溶融混練、粗粉砕、微粉砕、分級
することにより製造されている。The charged powder is produced by mixing conductive metal particles, a hot-melt resin, and a charge control agent, melt-kneading, coarsely pulverizing, finely pulverizing, and classifying the same method as toner used in ordinary electrophotography. It is manufactured by
従来の荷電性粉末の製造力では、第４図に示すように、
導電性金属微粒子３０と熱溶融性樹脂２ｂと荷電制御剤
３１とを均一に分散させることは難しく、それぞれの含
有量か不均等な粉末となる６したかつて、導電性金属微
粒子が均一に含まれる配線パターンを得ることは困難で
ある。As shown in Figure 4, with the conventional production capacity of charged powder,
It is difficult to uniformly disperse the conductive metal particles 30, the heat-melting resin 2b, and the charge control agent 31, resulting in uneven powder contents. It is difficult to obtain wiring patterns.
さらに、荷電性粉末の表面に導電性金属微粒子が析出す
ると、均一な帯電量を持つ荷電性粉末は得られない。そ
のため、印刷性が悪く低抵抗の回路が得られなかった。Furthermore, if conductive metal fine particles are deposited on the surface of the charged powder, a charged powder having a uniform charge amount cannot be obtained. Therefore, printability was poor and a low resistance circuit could not be obtained.
本発明による配線基板の回路形成方法においては、導電
性金属粒子を含む芯物質と前記芯物質の周囲に形成され
た熱溶融性樹脂を含む外壁とから構成される配線基板用
の荷電粉末を用い、電子写真方式により絶縁性基板上に
配線パターンを形成する。In the method for forming a circuit on a wiring board according to the present invention, a charged powder for a wiring board, which is composed of a core material containing conductive metal particles and an outer wall containing a heat-melting resin formed around the core material, is used. , a wiring pattern is formed on an insulating substrate using an electrophotographic method.
本発明による配線基板の回路形成用の荷電性粉末は、導
電性金属粒子を含む芯物質と、前記芯物質の周囲に形成
された熱溶融性樹脂を含む外壁とから構成される。The charged powder for forming a circuit of a wiring board according to the present invention is composed of a core material containing conductive metal particles and an outer wall containing a heat-melting resin formed around the core material.
本発明による配線基板の回路形成用の荷電性粉末の製造
方法は、導電性金属粒子と熱溶融性樹脂の超微粒子とを
混合して、前記導電性金属粒子に前記超微粒子を静電力
により付着させる工程と。The method for producing a charged powder for forming a circuit of a wiring board according to the present invention includes mixing conductive metal particles and ultrafine particles of a heat-melting resin, and adhering the ultrafine particles to the conductive metal particles by electrostatic force. and the process of
しかる後に機械的衝撃力を加える二とにより、前記超微
粒子を変形させ、前記導電性金属粒子に熱溶融性樹脂の
外壁を形成する工程とを有する。Thereafter, the ultrafine particles are deformed by applying a mechanical impact force to form an outer wall of a thermofusible resin on the conductive metal particles.
次に、本発明の実施例を示した図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図を参照すると、本発明の第一の実施例においては
、導電性金属粒子１と熱溶融性樹脂２ａとからなる配線
基板の回路形成用の荷電性粉末を使用し、セラミック基
板を得る。Referring to FIG. 1, in the first embodiment of the present invention, a ceramic board is obtained by using a charged powder for forming a circuit of a wiring board, which is made of conductive metal particles 1 and a hot-melt resin 2a. .
配線基板の回路形成用の荷電性粉末の製造方法としては
、まず、導電性金属粒子と熱溶融性樹脂の微粒子とを混
合し、第２図に示すように、導電性金属粒子１に熱溶融
性樹脂の超微粒子５を静電力により付着させる。次に、
これに機械的衝撃力を加え、衝撃力と衝撃力とによって
生じる熱によって、熱溶融性樹脂の超微粒子を変形させ
、導電性金属粒子に熱溶融性樹脂の外壁を形成する。As a method for producing charged powder for forming circuits on wiring boards, first, conductive metal particles and fine particles of hot-melt resin are mixed, and as shown in FIG. The ultrafine particles 5 of a synthetic resin are attached by electrostatic force. next,
A mechanical impact force is applied to this, and the ultrafine particles of the thermofusible resin are deformed by the impact force and the heat generated by the impact force, thereby forming an outer wall of the thermofusible resin on the conductive metal particles.
導電性金属粒子として平均粒径が８．３μｍの球状の銀
粒子と、熱溶融性樹脂として平均粒径か０．１５μｍの
ポリメチルメタクリレート樹脂とを、重量比で１００対
２で３分間混合し、銀粒子の周囲にポリメチルメタクリ
レート樹脂を付着させる。Spherical silver particles with an average particle size of 8.3 μm as conductive metal particles and polymethyl methacrylate resin with an average particle size of 0.15 μm as a heat-melting resin were mixed for 3 minutes at a weight ratio of 100:2. , a polymethyl methacrylate resin is attached around the silver particles.
ついで、銀粒子の周囲にポリメチルメタクリレート樹脂
を付着させたものを、ハイブリダイゼーションシステム
（奈良機械製作断裂）を用いて、最外周速９０ ｍ ／
ｓで５分間機械的衝撃力を加えて処理を行ない平均粒
径が８．４μｍの配線基板の回路形成用の荷電性粉末を
得た。Next, polymethyl methacrylate resin was attached around the silver particles, and the outermost peripheral speed was 90 m/min using a hybridization system (Nara Kikai Seisaku Seisaku).
A mechanical impact force was applied for 5 minutes to obtain a charged powder for forming circuits on wiring boards having an average particle size of 8.4 μm.
この配線基板の経路形成用の荷電性粉末を、フェライト
系キャリアを用いて、電子写真方式でセラミックグリー
ンシート上に印刷したところ、従来の荷電性粉末と比べ
て充分密な配線が得られた。この配線パターンの形成さ
れたセラミ・ツクグリーンシートを切断、積層し、焼結
させることにより、荷電性粉末の導電性金属粒子によっ
て回路形成されたセラミ・ツク基板とした。このセラミ
ック基板の配線回路のシート抵抗値は２〜２０ｍΩ／二
であった。When this charged powder for forming routes on wiring boards was printed on ceramic green sheets by electrophotography using a ferrite carrier, sufficiently dense wiring was obtained compared to conventional charged powders. The ceramic green sheets on which the wiring patterns were formed were cut, laminated, and sintered to obtain a ceramic substrate on which a circuit was formed using conductive metal particles of charged powder. The sheet resistance value of the wiring circuit of this ceramic substrate was 2 to 20 mΩ/2.
配線基板の回路形成用の荷電性粉末の芯物質としては、
銀以外に、金、白金、パラジウム、銅、タンスステン、
モリブデンの単体もしくは２種以上を用いても同様な効
果が得られた。なお、銅の場合には、還元性雰囲気で焼
結する必要がある。The core material of charged powder for forming circuits on wiring boards is:
In addition to silver, gold, platinum, palladium, copper, tungsten,
Similar effects were obtained when molybdenum was used alone or when two or more types of molybdenum were used. In addition, in the case of copper, it is necessary to sinter in a reducing atmosphere.
配線基板の回路形成用の荷電性粉末の外壁としては、ポ
リメチルメタクリレート樹脂以外に、平均粒径が０，０
５〜０．５μｍであり、好ましい定着性と帯電性とを示
す熱溶融性樹脂の超微粒子を用いても同様な効果が得ら
れる。このような熱溶融性樹脂の超微粒子としては、架
橋アクリル樹脂、ポリスチレン樹脂、ポリエチレン樹脂
、フッ素樹脂、フッ化ビニリデン樹脂、ベンゾグアナミ
ン樹脂などがあり、これを単体または組み合わせて用い
ることができる。さらに、この熱溶融性樹脂の超微粒子
の種類、平均粒径により配線基板の回路形成用荷電性粉
末の外壁の状態を任意に制御することかできる。それに
ともなって、帯電量も任意に制御することができる。In addition to polymethyl methacrylate resin, materials with an average particle size of 0.0
A similar effect can be obtained by using ultrafine particles of a heat-melting resin having a diameter of 5 to 0.5 μm and exhibiting preferable fixing properties and charging properties. Examples of such ultrafine particles of heat-melting resins include crosslinked acrylic resins, polystyrene resins, polyethylene resins, fluororesins, vinylidene fluoride resins, and benzoguanamine resins, which can be used alone or in combination. Furthermore, the state of the outer wall of the electrically charged powder for forming a circuit of a wiring board can be arbitrarily controlled by the type and average particle size of the ultrafine particles of the heat-melting resin. Along with this, the amount of charge can also be controlled arbitrarily.
第二の実施例においては、第一の実施例に記載の方法で
配線基板形成用の荷電性粉末を得る工程において、導電
性金属粒子として平均粒径が１２．５μｍの銀とパラジ
ウムが重量比；８０対２０の合金粒子を、熱溶融性樹脂
として平均粒径が０３μｍのベゾクアナミン樹脂を用い
ることにより、平均粒径が１２．７μｍの配線基板の回
路形成用の荷電性粉末を得た。この配線基板の回路形成
用の荷電性粉末を用いたセラミック基板の配線回路のシ
ート抵抗値が５〜５０ｍΩ７／！であった。In the second example, in the process of obtaining a charged powder for forming a wiring board by the method described in the first example, silver and palladium having an average particle size of 12.5 μm were used as conductive metal particles in a weight ratio. By using bezoquanamine resin with an average particle size of 0.3 μm as a heat-melting resin and a ratio of 80:20 alloy particles, a charged powder for forming a circuit of a wiring board with an average particle size of 12.7 μm was obtained. The sheet resistance value of the wiring circuit of the ceramic substrate using the charged powder for circuit formation of this wiring board is 5 to 50 mΩ7/! Met.
以上説明したように、本発明によれば、導電性金属粒子
の含有量が一定で、均一な帯電量を持つ導電性金属粒子
からなる芯物質と、芯物質の周囲に形成された熱溶融性
樹脂からなる外壁とから構成されろ配線基板の回路形成
用の荷電性粉末を用いることにより、印刷性が向上し、
狭ピ・・ｌチの配線回路の形成に対応可能である。また
、低抵抗な配線回路の形成も可能である。As explained above, according to the present invention, there is provided a core material made of conductive metal particles having a constant content of conductive metal particles and a uniform charge amount, and a heat-fusible core material formed around the core material. Printability is improved by using charged powder for forming circuits on wiring boards, which consist of an outer wall made of resin.
It is possible to form wiring circuits with narrow pitches. Furthermore, it is also possible to form a wiring circuit with low resistance.
第１図は本発明の第一の実施例に用いる配線基板の回路
形成用の荷電性粉末の断面図、第２図は第一の実施例に
おける荷電性粉末をの製造工程中の導電性金属粒子に熱
溶融性樹脂を超微粒子が静電力により付着した状態を説
明する断面図、第３図は、従来の電子写真方式を用いた
配線基板の経路形成方法の模式図、第４図は従来の荷電
性粉末の断面図である。
１・・・導電性金属粒子、２ａ、２ｂ・・・熱溶融性樹
脂、５・・・熱溶融性樹脂の超微粒子、１０ａ。
１０ｂ・・セラミックグリーンシート、１１・・・感光
体ドラム、１２・・・消去ランプ、１３・・・帯電電極
、１４・・・潜像形成部、１５・・・レーザー、１６・
・・ミラー、１７・・・現像器、１８・・・荷電性粉末
、１つ・・・キャリア、２０・・・転写電極、２１・・
・フラ・ｌシュランプ、２２・・・クリーナー、３０・
・・導電性金属微粒子、３１・・・荷電制御部。
代理人 弁理士 内 原 晋
刀
肥
」１FIG. 1 is a cross-sectional view of a charged powder for forming a circuit of a wiring board used in a first embodiment of the present invention, and FIG. A cross-sectional view illustrating the state in which ultrafine particles of hot-melt resin are attached to particles by electrostatic force. Figure 3 is a schematic diagram of a method for forming paths on a wiring board using a conventional electrophotographic method. Figure 4 is a conventional method. FIG. 2 is a cross-sectional view of charged powder. DESCRIPTION OF SYMBOLS 1... Conductive metal particles, 2a, 2b... Thermofusible resin, 5... Ultrafine particles of thermofusible resin, 10a. 10b...Ceramic green sheet, 11...Photosensitive drum, 12...Erasing lamp, 13...Charging electrode, 14...Latent image forming section, 15...Laser, 16...
...Mirror, 17...Developer, 18...Charged powder, one...Carrier, 20...Transfer electrode, 21...
・Fura L Schlump, 22...Cleaner, 30・
... Conductive metal fine particles, 31... Charge control section. Agent: Patent Attorney Shintohi Uchihara” 1
Claims (1)
形成された熱溶融性樹脂を含む外壁とから構成される配
線基板用の荷電粉末を用い、電子写真方式により絶縁性
基板上に配線パターンを形成することを特徴とする配線
基板の回路形成方法。 ２．前記導電性金属粒子の主成分が、金、銀、白金、パ
ラジウム、銅、タングステン、モリブデンの単体、もし
くは２種以上からなることを特徴とする請求項１記載の
配線基板の回路形成方法。 ３．前記導電性金属粒子の平均粒径が、５〜１５μｍで
あることを特徴とする請求項１または２記載の配線基板
の回路形成方法。 ４．前記絶縁性基板が、セラミック粉末と有機バインダ
ーとを含むセラミックグリーンシートであることを特徴
とする請求項１または２または３記載の配線基板の回路
形成方法。５．導電性金属粒子を含む芯物質と、前記芯
物質の周囲に形成された熱溶融性樹脂を含む外壁とから
構成されることを特徴とする配線基板用の荷電粉末。 ６．導電性金属粒子と熱溶融性樹脂の超微粒子とを混合
して、前記導電性金属粒子に前記超微粒子を静電力によ
り付着させる工程と、 しかる後に機械的衝撃力を加えることにより、前記超微
粒子を変形させ、前記導電性金属粒子に熱溶融性樹脂の
外壁を形成する工程とを有することを特徴とする荷電性
粉末の製造方法。[Claims] 1. A wiring pattern is formed on an insulating substrate by electrophotography using a charged powder for a wiring board, which is composed of a core material containing conductive metal particles and an outer wall containing a hot-melt resin formed around the core material. A method for forming a circuit on a wiring board, the method comprising: forming a circuit on a wiring board; 2. 2. The method for forming a circuit on a wiring board according to claim 1, wherein the main component of the conductive metal particles is one or more of gold, silver, platinum, palladium, copper, tungsten, and molybdenum. 3. 3. The method for forming a circuit on a wiring board according to claim 1, wherein the conductive metal particles have an average particle size of 5 to 15 μm. 4. 4. The method for forming a circuit on a wiring board according to claim 1, wherein the insulating substrate is a ceramic green sheet containing ceramic powder and an organic binder. 5. 1. A charged powder for a wiring board, comprising a core material containing conductive metal particles, and an outer wall formed around the core material and containing a heat-melting resin. 6. A step of mixing conductive metal particles and ultrafine particles of a thermofusible resin and adhering the ultrafine particles to the conductive metal particles by electrostatic force, and then applying a mechanical impact force to the ultrafine particles. A method for producing a charged powder, comprising the step of deforming the conductive metal particles to form an outer wall of a thermofusible resin on the conductive metal particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2192374A JPH0478191A (en) | 1990-07-20 | 1990-07-20 | Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2192374A JPH0478191A (en) | 1990-07-20 | 1990-07-20 | Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0478191A true JPH0478191A (en) | 1992-03-12 |
Family
ID=16290229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2192374A Pending JPH0478191A (en) | 1990-07-20 | 1990-07-20 | Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0478191A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000098655A (en) * | 1998-09-28 | 2000-04-07 | Kyocera Corp | Metal toner for formation of conductive pattern, production of metal toner for formation of conductive pattern and use method of metal toner for formation of conductive pattern |
| JP2010019890A (en) * | 2008-07-08 | 2010-01-28 | Konica Minolta Business Technologies Inc | Electrostatic latent image developing toner and image forming method |
-
1990
- 1990-07-20 JP JP2192374A patent/JPH0478191A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000098655A (en) * | 1998-09-28 | 2000-04-07 | Kyocera Corp | Metal toner for formation of conductive pattern, production of metal toner for formation of conductive pattern and use method of metal toner for formation of conductive pattern |
| JP2010019890A (en) * | 2008-07-08 | 2010-01-28 | Konica Minolta Business Technologies Inc | Electrostatic latent image developing toner and image forming method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3505993B2 (en) | Chargeable powder for circuit formation and multilayer wiring board using the same | |
| JP2009244573A (en) | Carrier particles for forming wiring circuit and developer | |
| JP3418555B2 (en) | Coated metal particles and toner for electrophotography using the same | |
| JP4543490B2 (en) | Circuit pattern forming method and wiring board formed thereby | |
| JP4207241B2 (en) | Chargeable powder for circuit formation and multilayer wiring board using the same | |
| JPH0478191A (en) | Formation of wiring substrate, charged powder for forming wiring substrate and manufacture thereof | |
| JP4134372B2 (en) | Chargeable powder for circuit formation, circuit pattern forming method using the same, and multilayer wiring board formed thereby | |
| JPS5940597A (en) | Method of producing printed wired circuit board | |
| JPH0653634A (en) | Circuit forming method for wiring board | |
| JPH11177213A (en) | Method and apparatus for manufacturing printed wiring board | |
| JP4363487B2 (en) | Chargeable powder for circuit formation and multilayer wiring board using the same | |
| JP3903590B2 (en) | Circuit pattern forming method and multilayer wiring board formed thereby | |
| JPH04346359A (en) | Charging powder for forming circuit on printed circuit board and its manufacture | |
| JPH0669618A (en) | Electrostatic particle for circuit printing | |
| JPH04237062A (en) | Chargeable powder for circuit formation of wiring board and production thereof | |
| JP2008203883A (en) | Charged powder for circuit formation and multilayer wiring board using the same | |
| JPH11312859A (en) | Formation of circuit pattern and multilayer wiring board formed the method | |
| JP4457459B2 (en) | Circuit pattern forming method and wiring board formed thereby | |
| JPH04237064A (en) | Electrifiable particle for circuit printing | |
| JPS59150493A (en) | Method of forming circuit pattern of circuit board | |
| JPS60160690A (en) | Method of producing printed circuit board | |
| JP2001265066A (en) | Wet developer for circuit formation and circuit forming method using the developer | |
| JPS59220994A (en) | Method of producing printed wiring circuit board | |
| JPS59112688A (en) | Electronic device | |
| JP2001284770A (en) | Circuit-patten formation method and wiring board formed thereby |