JP5053958B2 - 高い機械的安定性を備えたガスイオン源 - Google Patents
高い機械的安定性を備えたガスイオン源 Download PDFInfo
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- JP5053958B2 JP5053958B2 JP2008218495A JP2008218495A JP5053958B2 JP 5053958 B2 JP5053958 B2 JP 5053958B2 JP 2008218495 A JP2008218495 A JP 2008218495A JP 2008218495 A JP2008218495 A JP 2008218495A JP 5053958 B2 JP5053958 B2 JP 5053958B2
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- 239000002245 particle Substances 0.000 claims description 82
- 238000012546 transfer Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000002470 thermal conductor Substances 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010951 brass Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 76
- 150000002500 ions Chemical class 0.000 description 46
- 238000010884 ion-beam technique Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/26—Ion sources; Ion guns using surface ionisation, e.g. field effect ion sources, thermionic ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/13—Vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0216—Means for avoiding or correcting vibration effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/061—Construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0802—Field ionization sources
- H01J2237/0807—Gas field ion sources [GFIS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Electron Sources, Ion Sources (AREA)
Description
Claims (15)
- 荷電粒子ビームカラムを有する荷電粒子ビーム装置のガス電界イオン源であって、
エミッタユニット(150)と、
冷却ユニット(146)と、
前記冷却ユニットから前記エミッタユニットへの熱伝導のための熱伝導ユニット(164,364,464,564,664,764)と、
振動に関して前記冷却ユニット(146)を前記エミッタユニット(150)から機械的に分離する、前記冷却ユニットを前記荷電粒子ビームカラムと接続する機械的分離手段(162)と、
を備え、
前記熱伝導ユニットが、前記冷却ユニットから前記エミッタユニットへの振動の伝達を低減するよう構成されている、電界イオン源。 - 前記エミッタユニットを前記荷電粒子ビームカラムの一部分と接続するエミッタユニットサポート(155)をさらに備える請求項1に記載のガス電界イオン源。
- 接続が前記冷却ユニットとの接続又は前記冷却ユニットを介した接続を含まない形で、前記エミッタユニットサポート(155)が前記エミッタユニットを前記荷電粒子ビームカラムの前記一部分に接続している、請求項2に記載のガス電界イオン源。
- エミッタユニットサポートが、前記冷却ユニットから前記荷電粒子カラムへの振動の伝達を低減するように構成されている、請求項1〜3のいずれか一項に記載のガス電界イオン源。
- 前記熱伝導ユニットが、可撓性のワイヤ、ストライプ又は紐を含む、請求項1〜4のいずれか一項に記載のガス電界イオン源。
- 前記可撓性のワイヤ又は紐が、100W/(m・K)以上の熱伝導率を有する材料で作られている、請求項5に記載のガス電界イオン源。
- 前記可撓性のワイヤ又は紐が、銅、アルミニウム、真鍮、銀、及び、これらの組み合わせよりなる群から選択された材料を少なくとも1つ含む、請求項5又は6に記載のガス電界イオン源。
- 前記熱伝導ユニットの前記ワイヤ又は紐が、前記冷却ユニットの突出部と前記エミッタユニットの突出部との間に延在している、請求項5〜7のいずれか一項に記載のガス電界イオン源。
- 前記熱伝導ユニットが、ガスで満たされた空間を含む、請求項1〜8のいずれか一項に記載のガス電界イオン源。
- エミッタモジュール(110)と、サプライモジュール(140)とをさらに備え、
前記エミッタモジュールが、
エミッタホルダ(112)と、
エミッタ構造体(12,13,115)と、
前記エミッタモジュールの着脱式に接続可能な電気接続アセンブリ(131)と、
前記エミッタモジュールの着脱式に接続可能なガス供給接続アセンブリ(132)と、
を備え、
前記サプライモジュールが、
電圧及び/又は電流を供給する少なくとも1個の電気導体(137)と、
ガス供給導管(145)と、
熱導体(144)と、
前記サプライモジュールの着脱式に接続可能な電気接続アセンブリ(131)と、
前記サプライモジュールの着脱式に接続可能なガス供給接続アセンブリ(132)と、
を備え、
前記エミッタモジュールと前記サプライモジュールとが、前記エミッタモジュールの前記着脱式に接続可能な接続アセンブリと、前記サプライモジュールの前記着脱式に接続可能な接続アセンブリとによって着脱式に接続可能である、請求項1〜9のいずれか一項に記載のガス電界イオン源。 - 前記エミッタモジュールが、前記エミッタモジュールの着脱式に接続可能な熱伝導接続アセンブリ(133)をさらに備え、
前記サプライモジュールが、前記サプライモジュールの着脱式に接続可能な熱伝導接続アセンブリ(133)をさらに備える、請求項10に記載のガス電界イオン源。 - 前記エミッタユニットが、
基部と、
前記基部に接続された支持用ワイヤと、
前記支持用ワイヤに接続されたエミッタチップと、
を備える、請求項1〜11のいずれか一項に記載のガス電界イオン源。 - 請求項1〜12のいずれか一項に記載のガス電界イオン源と、
前記エミッタユニットを前記荷電粒子ビームカラムの一部分と接続するエミッタユニットサポート(155)と、
を備える荷電粒子ビーム装置。 - 荷電粒子ビームカラムと、エミッタユニット及び冷却ユニット付きのガス電界イオン源とを有する荷電粒子ビーム装置を製造する方法であって、
互いに機械的に分離された前記エミッタユニット及び前記冷却ユニットを前記荷電粒子ビームカラムに搭載するステップと、
機械的な分離を行う熱伝導ユニットを前記エミッタユニットと前記冷却ユニットとの間に設けるステップと、
を備え、
前記冷却ユニットは、機械的分離手段を介して前記荷電粒子ビームカラムに接続され、それによって、振動に関して前記冷却ユニットは前記エミッタユニットから機械的に分離される方法。 - 前記冷却ユニットから前記荷電粒子ビームカラムへの振動伝達を低減するステップをさらに備える、請求項14に記載の荷電粒子ビーム装置を製造する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07016766.3 | 2007-08-27 | ||
EP07016766A EP2031633B1 (en) | 2007-08-27 | 2007-08-27 | Charged particle device with a gas ion source with high mechanical stability |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009054589A JP2009054589A (ja) | 2009-03-12 |
JP5053958B2 true JP5053958B2 (ja) | 2012-10-24 |
Family
ID=38938538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008218495A Active JP5053958B2 (ja) | 2007-08-27 | 2008-08-27 | 高い機械的安定性を備えたガスイオン源 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8044370B2 (ja) |
EP (1) | EP2031633B1 (ja) |
JP (1) | JP5053958B2 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557360B2 (en) | 2003-10-16 | 2009-07-07 | Alis Corporation | Ion sources, systems and methods |
US7554097B2 (en) | 2003-10-16 | 2009-06-30 | Alis Corporation | Ion sources, systems and methods |
US7557361B2 (en) | 2003-10-16 | 2009-07-07 | Alis Corporation | Ion sources, systems and methods |
US7557359B2 (en) | 2003-10-16 | 2009-07-07 | Alis Corporation | Ion sources, systems and methods |
US7557358B2 (en) | 2003-10-16 | 2009-07-07 | Alis Corporation | Ion sources, systems and methods |
US8110814B2 (en) | 2003-10-16 | 2012-02-07 | Alis Corporation | Ion sources, systems and methods |
US7786451B2 (en) | 2003-10-16 | 2010-08-31 | Alis Corporation | Ion sources, systems and methods |
US7554096B2 (en) | 2003-10-16 | 2009-06-30 | Alis Corporation | Ion sources, systems and methods |
US9159527B2 (en) | 2003-10-16 | 2015-10-13 | Carl Zeiss Microscopy, Llc | Systems and methods for a gas field ionization source |
US7786452B2 (en) | 2003-10-16 | 2010-08-31 | Alis Corporation | Ion sources, systems and methods |
US7804068B2 (en) | 2006-11-15 | 2010-09-28 | Alis Corporation | Determining dopant information |
EP1936653B1 (en) * | 2006-12-18 | 2014-01-15 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Gas field ion source for multiple applications |
EP2012341B1 (en) * | 2007-07-06 | 2012-05-02 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Modular gas ion source |
EP2031633B1 (en) * | 2007-08-27 | 2012-09-19 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle device with a gas ion source with high mechanical stability |
JP5097823B2 (ja) | 2008-06-05 | 2012-12-12 | 株式会社日立ハイテクノロジーズ | イオンビーム装置 |
WO2009154631A1 (en) * | 2008-06-20 | 2009-12-23 | Carl Zeiss Smt, Inc. | Ion sources, systems and methods |
US8263943B2 (en) * | 2009-01-15 | 2012-09-11 | Hitachi High-Technologies Corporation | Ion beam device |
WO2010135444A2 (en) * | 2009-05-20 | 2010-11-25 | Carl Zeiss Nts, Llc | Simultaneous sample modification and monitoring |
JP5674774B2 (ja) * | 2009-06-18 | 2015-02-25 | カール ツァイス マイクロスコーピー エルエルシー | 冷却式荷電粒子システム及び方法 |
JP5033844B2 (ja) * | 2009-06-30 | 2012-09-26 | 株式会社日立ハイテクノロジーズ | イオン顕微鏡 |
JP5383419B2 (ja) | 2009-10-14 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | イオンビーム装置 |
JP6116307B2 (ja) * | 2013-03-25 | 2017-04-19 | 株式会社日立ハイテクサイエンス | 集束イオンビーム装置 |
JP6112930B2 (ja) * | 2013-03-26 | 2017-04-12 | 株式会社日立ハイテクサイエンス | ガスイオン源、及び集束イオンビーム装置 |
JP5969586B2 (ja) * | 2014-12-26 | 2016-08-17 | 株式会社日立ハイテクノロジーズ | イオンビーム装置 |
JP6560871B2 (ja) * | 2015-02-03 | 2019-08-14 | 株式会社日立ハイテクサイエンス | 集束イオンビーム装置 |
JP6633986B2 (ja) * | 2016-07-20 | 2020-01-22 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
KR102120946B1 (ko) * | 2018-11-16 | 2020-06-10 | (주)엠크래프츠 | 전자빔 자동정렬구조가 구비된 전자현미경 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4133121A1 (de) * | 1991-10-05 | 1993-04-08 | Inst Festkoerperphysik Und Ele | Anordnung zur erzeugung einer feinfokussierten niederenergetischen ionensonde |
JP2000505944A (ja) * | 1996-12-23 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 低温試料ホルダを含む粒子光学装置 |
US9159527B2 (en) * | 2003-10-16 | 2015-10-13 | Carl Zeiss Microscopy, Llc | Systems and methods for a gas field ionization source |
US7554096B2 (en) * | 2003-10-16 | 2009-06-30 | Alis Corporation | Ion sources, systems and methods |
US7601953B2 (en) * | 2006-03-20 | 2009-10-13 | Alis Corporation | Systems and methods for a gas field ion microscope |
US7939800B2 (en) * | 2005-10-19 | 2011-05-10 | ICT, Integrated Circuit Testing, Gesellschaft fur Halbleiterpruftechnik mbH | Arrangement and method for compensating emitter tip vibrations |
EP2031633B1 (en) * | 2007-08-27 | 2012-09-19 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle device with a gas ion source with high mechanical stability |
-
2007
- 2007-08-27 EP EP07016766A patent/EP2031633B1/en not_active Expired - Fee Related
-
2008
- 2008-08-27 US US12/199,574 patent/US8044370B2/en active Active
- 2008-08-27 JP JP2008218495A patent/JP5053958B2/ja active Active
-
2011
- 2011-09-07 US US13/226,931 patent/US20110315890A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2031633A1 (en) | 2009-03-04 |
US20110315890A1 (en) | 2011-12-29 |
US20090057566A1 (en) | 2009-03-05 |
JP2009054589A (ja) | 2009-03-12 |
US8044370B2 (en) | 2011-10-25 |
EP2031633B1 (en) | 2012-09-19 |
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