JP5041917B2 - Method for manufacturing carrier tape and apparatus for manufacturing the same - Google Patents

Description

The present invention relates to a method for manufacturing a carrier tape used for storing, transporting, storing, and the like of semiconductor chips and electronic components, and a manufacturing apparatus therefor.

  Various packaging materials are used for storing, transporting, and storing semiconductor chips, one of which is a carrier tape. This type of carrier tape can be peeled off from the tape body wound around a reel (not shown), a plurality of pocket holes formed side by side on the tape body for storing diced sharp-edged semiconductor chips, and the tape body. A cover tape that is adhered and covers a plurality of pocket holes is formed (see Patent Documents 1, 2, 3, and 4).

By the way, a sharp edge semiconductor chip is stored in the pocket hole of the carrier tape. However, when the semiconductor chip is simply stored, the sharp edge semiconductor chip moves up and down, front, back, left and right due to vibration and shock during transportation and transportation. This causes a problem that it collides with or rubs against the peripheral wall and the cover tape, resulting in generation of foreign matters, chipping and cracking of the semiconductor chip. Therefore, conventionally, in order to solve the above problems, a method of providing a rib structure or storing a semiconductor chip in a pocket hole with an adhesive material has been proposed.
JP-A-2005-170511 Japanese Utility Model Publication No. 5-77075 JP-A-5-21510 JP 2005-320037 A

However, in the method of providing the rib structure, there is a possibility that a sharp-edged semiconductor chip collides with the rib structure or is cut by rubbing to generate foreign matter, chipping or cracking of the semiconductor chip. In addition, the method of storing the semiconductor chip with the adhesive material in the pocket hole can eliminate the generation of foreign matter, chipping or cracking of the semiconductor chip, but the adhesive material is transferred / adhered to the semiconductor chip. There will be a new problem of disturbing the process.
The present invention has been made in view of the above, and a carrier tape manufacturing method capable of preventing the occurrence of foreign matters and damage to stored articles, and reducing the risk of adhesive material being transferred and adhered to the stored articles, and the manufacture thereof. The object is to provide a device .

In the present invention, in order to solve the above-mentioned problems, an adhesive layer for removably adhering the article to be stored is formed in the pocket hole of the tape main body for storing the small article to be stored, and this adhesive layer is attached to the article to be stored. It is a size that does not protrude from the article to be stored at the time of adhesion, and is a manufacturing method of the sum of the thickness of the adhesive layer and the thickness of the article to be stored, which is a value equal to or less than the depth of the pocket hole,
An adhesive is supplied to the pocket hole of the tape body, and a convex layer is brought into contact with the adhesive from above by driving a cylinder, thereby forming an adhesive layer in a shape that allows the article to be stored to be stably and stably adhered. It is characterized by that.
Incidentally, with the adhesive and ultraviolet curing, to impart transparency to the convex, it may be irradiated with ultraviolet rays to cure the adhesive when contacting the convex pressure-sensitive adhesive.

In the present invention, in order to solve the above-mentioned problem, an adhesive layer for detachably adhering the article to be stored is formed in the pocket hole of the tape main body for storing the small article to be stored. A size that does not protrude from the stored article when the article is adhered, and the total value of the thickness of the adhesive layer and the thickness of the stored article is set to a value equal to or less than the depth of the pocket hole,
This convex type includes a supply device for supplying an adhesive to the pocket hole of the tape body, and a convex type that contacts the adhesive supplied to the pocket hole from above by driving the cylinder and forms the adhesive in the adhesive layer. The adhesive layer is formed in such a manner that the article to be stored can be stably and stably adhered substantially horizontally by this contact.

In addition, while making an adhesive into an ultraviolet curable type , transparency can be provided to a convex type .
Moreover, when a convex mold | type contacts an adhesive, the ultraviolet irradiation device which irradiates and cures an ultraviolet-ray to an adhesive can be included.

Here, the pocket hole in the claims may have any shape such as a plane rectangle, a polygon, a circle, and an ellipse, and there is no particular requirement for a plurality. This pocket hole may be transparent or translucent when irradiated with ultraviolet rays. The small articles to be stored include at least a semiconductor chip, a semiconductor package (BGA, QFP, SOJ, etc.), various electronic components (capacitor, transistor, etc.), surface mounting components, and the like.

The adhesive layer may have any shape such as a planar rectangle, a polygon, a circle, and an ellipse, and a single or a plurality of adhesive layers may be used. The pressure-sensitive adhesive layer is not particularly limited as long as it adheres weakly when sticking to the article to be stored, and may have strong adhesiveness when not sticking to the article to be stored. Adhesive layer is sometimes formed in a substantially horizontally and stably adhesive can form an object to be stored articles, formed in this case, for example, a substantially M-shaped, trapezoidal, Ryakubashirakatachi, substantially donut like Is done.

According to the present invention, when manufacturing a carrier tape having an adhesive layer, first, the supply device supplies the adhesive to an arbitrary pocket hole of the carrier tape, and the adhesive becomes spherical or substantially hemispherical. When the supply device supplies an adhesive, to face the pocket holes carrier tape is supplied in a predetermined pitch unwound with adhesive on the convex, convex contacts from above adhesive pocket holes, adhesive The adhesive layer, that is, a small article to be stored is formed in a shape that can be stably and stably adhered substantially horizontally. When the convex mold is in contact with the pressure-sensitive adhesive, if the pressure-sensitive adhesive is of an ultraviolet curable type, at least the pressure-sensitive adhesive is irradiated with ultraviolet rays by the ultraviolet irradiation device, and the pressure-sensitive adhesive layer is cured by the ultraviolet irradiation.

ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that generation | occurrence | production of a foreign material and damage to a to-be-stored article can be prevented, and also the possibility that an adhesive material may be transferred and adhered to the to-be-stored article .

In addition, the adhesive layer is formed in a shape that allows the article to be stored to be stably and stably adhered substantially horizontally, so that the article to be stored made of a semiconductor chip or the like is tilted up, down, front, back, left, or right, or is covered with a pocket hole that is adhered later. There is little touch to tapes. Furthermore, if the pressure sensitive adhesive is of an ultraviolet curable type, the speed of adhesion, safety and pot life can be increased, and space saving and cost saving can be realized.

  Hereinafter, a preferred embodiment of a storage body according to the present invention will be described with reference to the drawings. The storage body in this embodiment includes a flexible tape body 1 and the tape as shown in FIGS. A plurality of pocket holes 20 that accommodate the sharp-edged semiconductor chips 10 arrayed on the main body 1 and separated by dicing, and a cover tape 30 that adheres to the tape main body 1 and covers the plurality of pocket holes 20 are provided. A small adhesive layer 40 for the semiconductor chip 10 is provided in each pocket hole 20.

  The tape body 1 is formed into an elongated strip having a thickness of about 0.3 mm by, for example, extrusion molding or vacuum forming of a sheet made of PS, PC, PET, or PVC, and is supplied to one side of the longitudinal direction. For example, a small semiconductor chip 10 called a bare chip is accommodated in each pocket hole 20, and a plurality of pocket holes 20 are covered with a cover tape 30. After that, it is wound around a reel (not shown). An antistatic agent is appropriately added to the molding material of the tape body 1 in order to avoid inconveniences such as dust adhesion due to static electricity.

  The plurality of pocket holes 20 are formed in a recess in a line in the longitudinal direction of the tape body 1, and each pocket hole 20 is formed in a shallow flat rectangular shape with a bottom and a substantially hat-shaped cross section. A sharp-edged semiconductor chip 10 is inserted and stored from above.

  The cover tape 30 is formed in, for example, an elongated transparent strip shape corresponding to the tape body 1 and is detachably adhered to the surface of the tape body 1. The cover tape 30 covers the plurality of pocket holes 20 and covers the semiconductor chip 10 therein. Functions to protect (see FIG. 2).

  The adhesive layer 40 is made of, for example, a substantially spherical or hemispherical acrylic adhesive that is dropped, and the semiconductor chip 10 prevents the adhesive material from being transferred or adhered to the sharp peripheral edge or the like of the semiconductor chip 10. The semiconductor chip 10 is detachably adhered to the bottom surface of each pocket hole 20 by being partially adhered to the bottom surface of each pocket hole 20.

  The total value S of the thickness of the adhesive layer 40 and the thickness of the semiconductor chip 10 is set to a value equal to or smaller than the depth D of the pocket hole 20 in order to appropriately protect the semiconductor chip 10 (see FIG. 3). In addition, the adhesive force of the adhesive layer 40 is not strong adhesive and is initially less than 0.1 MPa, which is weak adhesive, so that the vacuum suction and removal of the semiconductor chip 10 can be facilitated.

  According to the above, since the semiconductor chip 10 is not directly stored in the pocket hole 20 of the tape body 1 but is adhesively stored through the adhesive layer 40, the semiconductor chip 10 having a sharp edge due to vibration and impact during transportation and transportation. Does not collide with or rub against the peripheral wall of the pocket hole 20 or the cover tape 30. Therefore, the generation of foreign matter and chipping or cracking of the semiconductor chip 10 are not caused.

  Moreover, since the area of the substantially hemispherical adhesive layer 40 is smaller than the area of the semiconductor chip 10 and the adhesive layer 40 does not protrude from the semiconductor chip 10, the adhesive is transferred and adhered to the sharp edge of the semiconductor chip 10. Or hindering subsequent processes. In addition, since the adhesive force of the adhesive layer 40 is less than 0.1 MPa, which is weak adhesive, there is no hindrance to the vacuum suction of the semiconductor chip 10 in the pocket hole 20. Furthermore, since the total value S of the thickness of the adhesive layer 40 and the thickness of the semiconductor chip 10 is a value equal to or smaller than the depth D of the pocket hole 20, the inconvenience of the semiconductor chip 10 sticking to the adhesive surface of the cover tape 30 can be easily avoided. be able to.

  Next, FIG. 4 shows a second embodiment of the present invention. In this case, the tape body 1 and a plurality of pocket holes 20 are formed transparently, and an adhesive layer 40A is formed on the bottom surface of the pocket holes 20. While being partially adhered, the adhesive force of the adhesive layer 40A is not weakly adhesive from the beginning, but is reduced by irradiation with ultraviolet rays 50.

  The tape body 1 and the plurality of pocket holes 20 are transparent, but the term “transparency” as used herein includes translucency as long as transmission of the ultraviolet ray 50 is not hindered. The adhesive layer 40A is, for example, a blend product of an acrylic copolymer adhesive and an ultraviolet curable urethane acrylate oligomer, and the elastic modulus is improved by irradiation from below the ultraviolet ray 50 from the ultraviolet irradiation device, thereby reducing the adhesiveness and peeling. The type that makes it easy. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effects as those of the above embodiment can be expected, and it is obvious that the weakly adhesive layer 40 cannot be used from the beginning.

  Next, preferred embodiments of the second and third inventions of the present invention will be described. The carrier tape manufacturing apparatus 60 in this embodiment is a carrier for housing a semiconductor chip 10 as shown in FIGS. An adhesive layer 40 for detachably adhering the semiconductor chip 10 is formed in the pocket hole 20 of the tape. The adhesive layer 40 is sized so as not to protrude from the semiconductor chip 10 when the semiconductor chip 10 is adhered. A manufacturing apparatus in which the total value of the thickness and the thickness of the semiconductor chip 10 is equal to or less than the depth of the pocket hole 20, and includes a positioning device 68 that can be moved up and down, a supply device 74, and a convex mold 75 that is a mold that can be moved up and down. , And an ultraviolet irradiation device 76.

  As shown in FIGS. 5 to 8, the carrier tape includes an elongated strip-shaped tape body 1 having flexibility, and a plurality of pocket holes 20 that are shallowly recessed in the longitudinal direction of the tape body 1 are arrayed. In addition, at the four corners of each pocket hole 20, a planar semi-circular chamfer groove 21 that avoids interference with the semiconductor chip 10 is selectively bulged outwardly. The tape main body 1 of this carrier tape is wound around a pair of reels facing each other at an interval, and the pair of reels is upstream of a pedestal 61 constituting the manufacturing apparatus 60 (left side in FIGS. 5 and 9). The shaft is rotatably supported by the vertical surface and the vertical surface (right side in FIGS. 5 and 9).

  In such a tape body 1 of the carrier tape, the pair of reels are pivotally supported on the gantry 61 of the manufacturing apparatus 60, and a plurality of rotatable pin roll drive units 62 on the downstream side of the gantry 61 and a tension roll unit 64 on the upstream side are rotatable. Are stretched between the upstream side and the downstream side of the gantry 61 by being wound around a plurality of dancers 66 and rolls 67 that are respectively held by the rolls 63 and 65 and maintain a constant tension. It is fed out horizontally at the midstream portion of 61 (see FIGS. 5 and 9).

  As shown in FIGS. 5, 9, and 10, the positioning device 68 includes a positioning unit 69 that fits into the plurality of pocket holes 20 of the tape body 1 from below, and the positioning unit 69 is a piston that moves up and down the cylinder 70. The cylinder 70 is installed in a state where it is erected via a mounting bracket in the middle stream portion of the gantry 61, that is, substantially below the center portion.

  The positioning unit 69 has a plurality of concave portions 71 corresponding to the shape of the pocket hole 20 formed on the surface, and a cooling water flow passage 72 and a plurality of exhaust passages 73 are bored therein, respectively. The exhaust passage 73 is connected to a vacuum device outside the manufacturing device 60, and the pocket device 20 is vacuum-adsorbed and fixed to the plurality of recesses 71 by driving the vacuum device. The cylinder 70 is not particularly limited, and for example, a clean air cylinder or a highly reliable hydraulic cylinder is appropriately used.

  As shown in FIG. 5 and FIG. 9, the supply device 74 is composed of, for example, a dispenser device, and is installed on the middle flow portion of the gantry 61, that is, substantially above the center portion, and faces the lower positioning device 68 from above. The ultraviolet curable pressure-sensitive adhesive 41 functions in such a manner as to be sequentially dropped from above at a substantially central portion of the plurality of pocket holes 20 positioned in the device 68. The ultraviolet curable adhesive 41 is not particularly limited to acrylate, thiol, epoxy, silicone, and the like.

  As shown in FIG. 5 and FIG. 9, the convex mold 75 is transparently formed using a material such as lightweight PMMA that is excellent in transparency, durability, and impact resistance. The cylinder is horizontally connected to the middle portion of the pedestal 61, that is, substantially vertically above the center portion, and is opposed to the lower positioning device 68 as a molding die from above. Such a convex mold 75 is located adjacent to the downstream of the supply device 74, presses the adhesive 41 dripped at the substantially central portion of the pocket hole 20 from above, and forms the adhesive 41 into the adhesive layer 40. To function.

  As the cylinder, for example, a clean air cylinder or a highly reliable hydraulic cylinder is appropriately used. Further, the pressure-sensitive adhesive 41 is formed into a substantially M-shape by which the semiconductor chip 10 can be stably adhered in a substantially horizontal manner from a dropped spherical or substantially hemispherical state by pressing the convex mold 75.

  As shown in FIG. 5, the ultraviolet irradiation device 76 is installed in the middle portion of the gantry 61, that is, approximately at the center and is positioned above the convex mold 75, and when the convex mold 75 is in pressure contact with the adhesive 41, When the convex mold 75 comes into pressure contact with the adhesive 41 or after the convex mold 75 comes into pressure contact with the adhesive 41, the adhesive 41 is irradiated and cured with ultraviolet rays 50 using a mercury xenon lamp or an optical fiber.

  In the above, when manufacturing the carrier tape provided with the adhesive layer 40, the tensioned carrier tape may be continuously fed out sequentially from the upstream reel to the downstream reel. Then, the positioning unit 69 of the positioning device 68 rises while being guided by the guide from the reference position, and is fitted and positioned in the plurality of pocket holes 20 of the tape body 1 from below. In the plurality of pocket holes 20 positioned, The supply device 74 facing the upstream pocket hole 20 drops the adhesive 41 from above, and the adhesive 41 exhibits a spherical shape or a substantially hemispherical shape due to its surface tension.

  When the supply device 74 drops the adhesive 41 in this manner, the positioning unit 69 of the positioning device 68 descends while being guided to the original reference position by the guide, and allows the tape body 1 to be fed out. The pocket hole 20 fed out by a predetermined pitch and dropped with the adhesive 41 is made to face the convex mold 75, and the positioning unit 69 is raised again to fit and position the plurality of pocket holes 20 of the tape body 1 from below.

  Then, the convex mold 75 descends and comes into pressure contact with the adhesive 41 in the positioned pocket hole 10 so that the adhesive 41 can adhere to the adhesive layer 40, that is, the semiconductor chip 10 in a substantially horizontal and stable manner. Then, the semiconductor chip 10 is adhered to the flat surface of the adhesive layer 40 in a substantially horizontal and stable manner, and the plurality of pocket holes 20 of the tape body 1 are covered with the cover tape 30.

  When the convex mold 75 is pressed against the pressure-sensitive adhesive 41, the ultraviolet irradiation device 76 irradiates the ultraviolet light 50 in the wavelength range of 200 to 400 nm to the pressure-sensitive adhesive 41 or the convex mold 75, and the pressure-sensitive adhesive layer 40 is three-dimensionally crosslinked in a short time. Harden. Other parts are the same as those in the first embodiment of the present invention and will not be described.

  According to the above configuration, the semiconductor chip 10 is not unstablely mounted and supported on the round surface of the adhesive layer 40, but the semiconductor chip 10 is attached to the adhesive layer 40 on the surface capable of stably adhering the semiconductor chip 10 substantially horizontally. Since 10 is mounted and supported in a line contact state, the semiconductor chip 10 is not tilted up and down, front and rear, and left and right, and does not touch the cover tape 30 to be adhered later. Accordingly, the sharp-edged semiconductor chip 10 moves up, down, front, back, left and right due to vibration and impact during transportation and transportation, and does not collide with or rub against the peripheral wall of the pocket hole 20 or the cover tape 30. Chipping and cracking of the chip 10 can be suppressed and prevented.

  Further, since the area of the adhesive layer 40 is smaller than the area of the semiconductor chip 10 and the adhesive layer 40 does not protrude from the semiconductor chip 10, the adhesive 41 is transferred and adhered to the sharp edge of the semiconductor chip 10, It is possible to prevent the subsequent process from being hindered. In addition, since the adhesive force of the adhesive layer 40 is less than 0.1 MPa, which is weak adhesive, there is no hindrance to the vacuum suction of the semiconductor chip 10 in the pocket hole 20. Furthermore, since the total value S of the thickness of the adhesive layer 40 and the thickness of the semiconductor chip 10 is a value equal to or smaller than the depth D of the pocket hole 20, the inconvenience of the semiconductor chip 10 sticking to the adhesive surface of the cover tape 30 can be easily avoided. It becomes possible.

  In addition, the storage body which concerns on this invention is not limited to the said embodiment at all. For example, in the above embodiment, the plurality of locking holes 2 are arranged at a predetermined pitch on one side in the longitudinal direction of the tape body 1, but the supply locking holes 2 are provided on both sides in the longitudinal direction of the tape body 1 with a predetermined length. Each may be formed with a pitch. Further, the chamfer groove 21 of the pocket hole 20 may be omitted. An opaque cover tape 30 may be used.

  Moreover, if it is the magnitude | size which does not protrude from the semiconductor chip 10, you may provide the single adhesion layer 40 * 40A in each pocket hole 20, and may provide the some adhesion layer 40 * 40A. Further, instead of the carrier tape, the small adhesive layers 40 and 40A for the semiconductor chip 10 can be adhered to a plurality of pocket holes in the tray. In addition, if the ultraviolet ray 50 is transmitted, the convex mold 75 of the carrier tape manufacturing apparatus 60 can be formed to be translucent as well as transparent. Furthermore, although the ultraviolet irradiation device 76 may be integrally provided immediately above the convex mold 75, it may be provided obliquely upward or separately.

It is a perspective explanatory view showing an embodiment of a storage object concerning the present invention typically. It is a perspective explanatory view showing typically the partial peeling state of a cover tape in an embodiment of a storage object concerning the present invention. It is principal part sectional explanatory drawing which shows typically embodiment of the storage body which concerns on this invention. It is principal part cross-sectional explanatory drawing which shows typically 2nd Embodiment of the storage body which concerns on this invention. It is principal part explanatory drawing which shows typically the manufacturing method of the carrier tape which concerns on this invention, and embodiment of the manufacturing apparatus. It is sectional explanatory drawing which shows typically the carrier tape in embodiment of the manufacturing method of the carrier tape which concerns on this invention, and its manufacturing apparatus. It is plane explanatory drawing which shows typically the carrier tape in embodiment of the manufacturing method of the carrier tape which concerns on this invention, and its manufacturing apparatus. It is sectional explanatory drawing which shows typically the carrier tape in embodiment of the manufacturing method of the carrier tape which concerns on this invention, and its manufacturing apparatus. It is front explanatory drawing which shows typically embodiment of the manufacturing apparatus of the carrier tape which concerns on this invention. It is side explanatory drawing which shows typically embodiment of the manufacturing apparatus of the carrier tape which concerns on this invention.

Explanation of symbols

1 Tape body 10 Semiconductor chip (object to be stored)
20 Pocket hole 30 Cover tape 40 Adhesive layer 40A Adhesive layer 41 Adhesive 50 UV 60 Production device 61 Mounting base 62 Pin roll drive unit 64 Tension roll unit 68 Positioning device 69 Positioning unit 74 Supply device 75 Convex 76 Ultraviolet irradiation device D Pocket hole Depth S Total value of adhesive layer thickness and semiconductor chip thickness

Claims (5)

An adhesive layer is formed in the pocket hole of the tape main body that stores a small article to be stored so that the article to be stored is detachably attached, and this adhesive layer does not protrude from the article to be stored when the article to be stored is adhered. And a method for producing a carrier tape in which the total value of the thickness of the adhesive layer and the thickness of the article to be stored is equal to or less than the depth of the pocket hole,
An adhesive is supplied to the pocket hole of the tape body, and a convex layer is brought into contact with the adhesive from above by driving a cylinder, thereby forming an adhesive layer in a shape that allows the article to be stored to be stably and stably adhered. A method for producing a carrier tape. The method for producing a carrier tape according to claim 1, wherein the pressure-sensitive adhesive is made of an ultraviolet curable type , the transparency is imparted to the convex type, and the pressure-sensitive adhesive is cured by irradiating the pressure-sensitive adhesive with ultraviolet rays. An adhesive layer is formed in the pocket hole of the tape main body that stores a small article to be stored so that the article to be stored is detachably attached, and this adhesive layer does not protrude from the article to be stored when the article to be stored is adhered. And a carrier tape manufacturing apparatus in which the total value of the thickness of the adhesive layer and the thickness of the article to be stored is a value equal to or less than the depth of the pocket hole,
This convex type includes a supply device for supplying an adhesive to the pocket hole of the tape body, and a convex type that contacts the adhesive supplied to the pocket hole from above by driving the cylinder and forms the adhesive in the adhesive layer. The carrier tape manufacturing apparatus is characterized in that the adhesive layer is formed in such a manner that the article to be stored can be stably adhered substantially horizontally by the contact. 4. The carrier tape manufacturing apparatus according to claim 3, wherein the pressure-sensitive adhesive is an ultraviolet curable type, and the convex shape is imparted with transparency. The carrier tape manufacturing apparatus according to claim 4, further comprising an ultraviolet irradiation device that cures the adhesive by irradiating the adhesive with ultraviolet rays when the convex mold contacts the adhesive.

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