JP5038755B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5038755B2 JP5038755B2 JP2007079629A JP2007079629A JP5038755B2 JP 5038755 B2 JP5038755 B2 JP 5038755B2 JP 2007079629 A JP2007079629 A JP 2007079629A JP 2007079629 A JP2007079629 A JP 2007079629A JP 5038755 B2 JP5038755 B2 JP 5038755B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led chips
- emitting device
- led
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000009792 diffusion process Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 239000003086 colorant Substances 0.000 claims description 12
- 238000000605 extraction Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 description 20
- 238000007789 sealing Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000004035 construction material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000037431 insertion Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Images
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Description
21 LEDチップ(赤色LEDチップ)
22 LEDチップ(緑色LEDチップ)
23 LEDチップ(青色LEDチップ)
24 実装基板
25 封止部
26 レンズ部
27 凹凸構造部
28 V溝
Claims (3)
- 発光色の異なる複数種のLEDチップと、前記複数種のLEDチップが一表面側に実装された矩形板状の実装基板と、前記実装基板の前記一表面側において前記複数種のLEDチップを覆う形で配置されたドーム状もしくは半球状のレンズ部とを備え、前記レンズ部は、前記レンズ部の光出射面側において前記レンズ部の外周方向に凹凸が繰り返され前記各LEDチップの光取り出し面に平行な面内で前記各LEDチップそれぞれからの放射光の進行方向を屈折により変え前記各LEDチップからの放射光の拡散範囲を広げる凹凸構造部が形成されてなることを特徴とする発光装置。
- 前記レンズ部は、少なくとも前記各LEDチップそれぞれの放射光強度が均等となる球状領域が重複しない周部に前記凹凸構造部が形成されてなることを特徴とする請求項1記載の発光装置。
- 前記レンズ部は、前記レンズ部の外周縁部から頂部に向かって走るV溝を前記外周方向に並設することにより前記凹凸構造部が形成されてなり、前記各LEDチップの光取り出し面に平行な断面において当該V溝の深さ寸法が幅寸法の2分の1よりも小さいことを特徴とする請求項1または請求項2記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007079629A JP5038755B2 (ja) | 2007-03-26 | 2007-03-26 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007079629A JP5038755B2 (ja) | 2007-03-26 | 2007-03-26 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008243959A JP2008243959A (ja) | 2008-10-09 |
JP5038755B2 true JP5038755B2 (ja) | 2012-10-03 |
Family
ID=39914972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007079629A Expired - Fee Related JP5038755B2 (ja) | 2007-03-26 | 2007-03-26 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5038755B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2254396A1 (en) * | 2009-05-20 | 2010-11-24 | Koninklijke Philips Electronics N.V. | Printed circuit board for providing ambient light |
US9029887B2 (en) * | 2011-04-22 | 2015-05-12 | Micron Technology, Inc. | Solid state lighting devices having improved color uniformity and associated methods |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5640681U (ja) * | 1979-09-07 | 1981-04-15 | ||
JPS58196067A (ja) * | 1982-05-11 | 1983-11-15 | Colpo Co Ltd | 発光ダイオ−ドを光源とする発光体 |
JP2598338B2 (ja) * | 1990-11-19 | 1997-04-09 | シャープ株式会社 | Led発光表示素子 |
JP2994800B2 (ja) * | 1991-07-05 | 1999-12-27 | シャープ株式会社 | 表面実装型発光ダイオード及びその製造方法 |
JPH11312827A (ja) * | 1998-04-28 | 1999-11-09 | Matsushita Electric Works Ltd | 発光ダイオード |
JP2003110149A (ja) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | 発光ユニット及び当該発光ユニットを用いた照明装置 |
JP4442216B2 (ja) * | 2003-12-19 | 2010-03-31 | 豊田合成株式会社 | Ledランプ装置 |
-
2007
- 2007-03-26 JP JP2007079629A patent/JP5038755B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008243959A (ja) | 2008-10-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101203133B1 (ko) | 엘이디 조명 장치 | |
US9551465B2 (en) | LED lamp and LED lighting assembly | |
JP5808910B2 (ja) | 適応性がある色を有する照明装置 | |
US9429296B2 (en) | Modular optic for changing light emitting surface | |
JP4720904B2 (ja) | Led照明器具 | |
US20120236572A1 (en) | Composite lens with diffusion | |
JP5245545B2 (ja) | 光源装置および照明器具 | |
US9441819B2 (en) | Modular optic for changing light emitting surface | |
JP6549595B2 (ja) | 照明デバイス | |
JP6217972B2 (ja) | 照明器具 | |
JP5796198B2 (ja) | 照明装置 | |
KR20160072166A (ko) | 밀폐형 도광체 및 통합형 열 안내체를 갖는 고체 조명 장치 | |
JP6311856B2 (ja) | 照明器具 | |
JP5738309B2 (ja) | 発光モジュール | |
JP5816850B2 (ja) | 照明装置 | |
KR20120100304A (ko) | 광확산렌즈와 이를 구비한 조명장치 | |
KR20130022606A (ko) | 조명 장치 | |
JP4720665B2 (ja) | Led照明器具 | |
JP5038755B2 (ja) | 発光装置 | |
JP6331193B2 (ja) | Ledユニットおよびそれを用いた照明器具 | |
JP6526131B2 (ja) | 照明装置 | |
JP6238199B2 (ja) | 照明器具 | |
KR101071727B1 (ko) | 조명장치 | |
JP5853208B2 (ja) | 照明器具 | |
JP6575620B2 (ja) | 照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091023 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101005 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111207 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111220 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120220 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120612 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120706 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150713 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5038755 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |