JP5034342B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5034342B2
JP5034342B2 JP2006185140A JP2006185140A JP5034342B2 JP 5034342 B2 JP5034342 B2 JP 5034342B2 JP 2006185140 A JP2006185140 A JP 2006185140A JP 2006185140 A JP2006185140 A JP 2006185140A JP 5034342 B2 JP5034342 B2 JP 5034342B2
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JP
Japan
Prior art keywords
light
light emitting
emitting element
emitting device
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006185140A
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English (en)
Japanese (ja)
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JP2008016583A (ja
JP2008016583A5 (enExample
Inventor
忠雄 林
敏昭 森脇
真也 園部
陽一 住友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006185140A priority Critical patent/JP5034342B2/ja
Publication of JP2008016583A publication Critical patent/JP2008016583A/ja
Publication of JP2008016583A5 publication Critical patent/JP2008016583A5/ja
Application granted granted Critical
Publication of JP5034342B2 publication Critical patent/JP5034342B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006185140A 2006-07-05 2006-07-05 発光装置 Active JP5034342B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006185140A JP5034342B2 (ja) 2006-07-05 2006-07-05 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006185140A JP5034342B2 (ja) 2006-07-05 2006-07-05 発光装置

Publications (3)

Publication Number Publication Date
JP2008016583A JP2008016583A (ja) 2008-01-24
JP2008016583A5 JP2008016583A5 (enExample) 2009-08-06
JP5034342B2 true JP5034342B2 (ja) 2012-09-26

Family

ID=39073332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006185140A Active JP5034342B2 (ja) 2006-07-05 2006-07-05 発光装置

Country Status (1)

Country Link
JP (1) JP5034342B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231440A (ja) * 2008-03-21 2009-10-08 Nippon Carbide Ind Co Inc 発光素子搭載用配線基板及び発光装置
WO2011016282A1 (ja) * 2009-08-05 2011-02-10 コニカミノルタオプト株式会社 発光装置及び発光装置の製造方法
KR101858254B1 (ko) 2011-08-22 2018-05-15 엘지이노텍 주식회사 발광소자, 발광 모듈 및 발광 소자 제조방법
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057373A (ja) * 2000-08-08 2002-02-22 Matsushita Electric Ind Co Ltd 半導体発光装置
JP4114557B2 (ja) * 2003-06-25 2008-07-09 松下電工株式会社 発光装置
JP4539235B2 (ja) * 2004-08-27 2010-09-08 日亜化学工業株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP2008016583A (ja) 2008-01-24

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