JP5032803B2 - 電子部品 - Google Patents

電子部品 Download PDF

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Publication number
JP5032803B2
JP5032803B2 JP2006189298A JP2006189298A JP5032803B2 JP 5032803 B2 JP5032803 B2 JP 5032803B2 JP 2006189298 A JP2006189298 A JP 2006189298A JP 2006189298 A JP2006189298 A JP 2006189298A JP 5032803 B2 JP5032803 B2 JP 5032803B2
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JP
Japan
Prior art keywords
wireless communication
electronic component
communication module
power supply
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006189298A
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English (en)
Japanese (ja)
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JP2008016776A5 (enExample
JP2008016776A (ja
Inventor
由香里 丑山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006189298A priority Critical patent/JP5032803B2/ja
Publication of JP2008016776A publication Critical patent/JP2008016776A/ja
Publication of JP2008016776A5 publication Critical patent/JP2008016776A5/ja
Application granted granted Critical
Publication of JP5032803B2 publication Critical patent/JP5032803B2/ja
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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2006189298A 2006-07-10 2006-07-10 電子部品 Active JP5032803B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006189298A JP5032803B2 (ja) 2006-07-10 2006-07-10 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006189298A JP5032803B2 (ja) 2006-07-10 2006-07-10 電子部品

Publications (3)

Publication Number Publication Date
JP2008016776A JP2008016776A (ja) 2008-01-24
JP2008016776A5 JP2008016776A5 (enExample) 2009-07-30
JP5032803B2 true JP5032803B2 (ja) 2012-09-26

Family

ID=39073483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006189298A Active JP5032803B2 (ja) 2006-07-10 2006-07-10 電子部品

Country Status (1)

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JP (1) JP5032803B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7760219B2 (en) 2008-01-28 2010-07-20 Fujifilm Corporation Method of forming image by thermal transfer
JP5027751B2 (ja) * 2008-07-25 2012-09-19 株式会社クボタ 作業機用モジュール
CN107278029A (zh) 2012-12-21 2017-10-20 华为终端有限公司 电子装置和栅格阵列模块
JP6357759B2 (ja) * 2013-11-25 2018-07-18 セイコーエプソン株式会社 パッケージ、物理量センサー、電子機器および移動体
CN109429421B (zh) * 2017-08-24 2023-01-20 中兴通讯股份有限公司 一种pcb和电子设备
JP7267054B2 (ja) * 2019-03-25 2023-05-01 三菱重工業株式会社 パルサレシーバ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996022008A1 (en) * 1995-01-10 1996-07-18 Hitachi, Ltd. Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board

Also Published As

Publication number Publication date
JP2008016776A (ja) 2008-01-24

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