JP5025625B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP5025625B2
JP5025625B2 JP2008312640A JP2008312640A JP5025625B2 JP 5025625 B2 JP5025625 B2 JP 5025625B2 JP 2008312640 A JP2008312640 A JP 2008312640A JP 2008312640 A JP2008312640 A JP 2008312640A JP 5025625 B2 JP5025625 B2 JP 5025625B2
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JP
Japan
Prior art keywords
light
mixed
chromaticity
mixed resin
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008312640A
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English (en)
Japanese (ja)
Other versions
JP2009260244A (ja
JP2009260244A5 (enExample
Inventor
邦明 紺野
英男 田村
博明 押尾
哲郎 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008312640A priority Critical patent/JP5025625B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to US12/867,145 priority patent/US8268644B2/en
Priority to PCT/JP2009/000544 priority patent/WO2009118985A2/en
Priority to KR1020107018221A priority patent/KR101226777B1/ko
Priority to EP09723886.9A priority patent/EP2257999B1/en
Priority to TW098108070A priority patent/TWI445202B/zh
Publication of JP2009260244A publication Critical patent/JP2009260244A/ja
Publication of JP2009260244A5 publication Critical patent/JP2009260244A5/ja
Application granted granted Critical
Publication of JP5025625B2 publication Critical patent/JP5025625B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)
JP2008312640A 2008-03-25 2008-12-08 発光装置の製造方法 Expired - Fee Related JP5025625B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008312640A JP5025625B2 (ja) 2008-03-25 2008-12-08 発光装置の製造方法
PCT/JP2009/000544 WO2009118985A2 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
KR1020107018221A KR101226777B1 (ko) 2008-03-25 2009-02-10 발광 장치와, 그 제조 방법 및 장치
EP09723886.9A EP2257999B1 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
US12/867,145 US8268644B2 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
TW098108070A TWI445202B (zh) 2008-03-25 2009-03-12 製造發光裝置之方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008077810 2008-03-25
JP2008077810 2008-03-25
JP2008312640A JP5025625B2 (ja) 2008-03-25 2008-12-08 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009260244A JP2009260244A (ja) 2009-11-05
JP2009260244A5 JP2009260244A5 (enExample) 2011-09-29
JP5025625B2 true JP5025625B2 (ja) 2012-09-12

Family

ID=41387250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008312640A Expired - Fee Related JP5025625B2 (ja) 2008-03-25 2008-12-08 発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP5025625B2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101650375B1 (ko) * 2009-11-17 2016-08-24 주식회사 탑 엔지니어링 양자점 코팅을 이용한 발광 다이오드의 리페어 방법 및 장치
US7998526B2 (en) 2009-12-01 2011-08-16 Bridgelux, Inc. Method and system for dynamic in-situ phosphor mixing and jetting
KR101679759B1 (ko) * 2010-08-24 2016-11-25 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
WO2012036486A2 (ko) * 2010-09-15 2012-03-22 (주)라이타이저코리아 발광다이오드 및 그 제조방법
JP5762044B2 (ja) * 2011-02-23 2015-08-12 三菱電機株式会社 発光装置及び発光装置群及び製造方法
JP2012191144A (ja) * 2011-03-14 2012-10-04 Ns Materials Kk Ｌｅｄ素子、その製造方法、及びｌｅｄ素子の色調補正方法
JP2012227413A (ja) * 2011-04-21 2012-11-15 Mitsubishi Electric Corp 封止樹脂の塗布装置及び発光装置の製造方法
JP2012248553A (ja) 2011-05-25 2012-12-13 Panasonic Corp 発光装置及びそれを用いた照明装置
JP5861032B2 (ja) * 2011-08-11 2016-02-16 パナソニックＩｐマネジメント株式会社 樹脂塗布装置および樹脂塗布方法
CN106475289B (zh) * 2011-09-14 2019-09-06 玛太克司马特股份有限公司 Led制造方法、led制造设备和led
JP2013062393A (ja) * 2011-09-14 2013-04-04 Sharp Corp 発光装置
WO2013157310A1 (ja) * 2012-04-17 2013-10-24 シャープ株式会社 発光装置及びその製造方法
EP2875532B1 (en) * 2012-07-20 2019-02-27 Lumileds Holding B.V. Led with ceramic green phosphor and protected red phosphor layer
JP5261742B1 (ja) * 2012-08-13 2013-08-14 株式会社昭和真空 発光装置の製造方法及び発光装置の色度調整方法
KR101412012B1 (ko) 2012-10-23 2014-06-26 주식회사 루멘스 발광소자 패키지 제조방법
KR101957701B1 (ko) * 2012-11-14 2019-03-14 삼성전자주식회사 발광소자 패키지 및 그 제조방법
KR20150002197A (ko) * 2013-06-28 2015-01-07 서울반도체 주식회사 발광 디바이스 및 이의 제조방법
KR20150002196A (ko) * 2013-06-28 2015-01-07 서울반도체 주식회사 발광 디바이스 및 이의 제조방법
JP2015012299A (ja) 2013-06-28 2015-01-19 ソウル セミコンダクター カンパニー リミテッド 発光デバイス及びその製造方法
JP6107510B2 (ja) 2013-07-25 2017-04-05 日亜化学工業株式会社 発光装置及びその製造方法
JP6435705B2 (ja) 2013-12-27 2018-12-12 日亜化学工業株式会社 集合基板、発光装置及び発光素子の検査方法
US9972752B2 (en) 2015-04-08 2018-05-15 Nichia Corporation Light-emitting device manufacturing method
JP2016040842A (ja) * 2015-11-04 2016-03-24 Ｎｓマテリアルズ株式会社 Ｌｅｄ素子、その製造方法、及びｌｅｄ素子の色調補正方法
JP6743630B2 (ja) * 2016-09-30 2020-08-19 日亜化学工業株式会社 発光装置およびその製造方法
US10461231B2 (en) * 2018-02-27 2019-10-29 Lumens Co., Ltd. Method for fabricating LED package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4739805B2 (ja) * 2005-04-22 2011-08-03 スタンレー電気株式会社 光学特性制御ｌｅｄデバイス及びその製造方法
JP2009130301A (ja) * 2007-11-27 2009-06-11 Sharp Corp 発光素子および発光素子の製造方法
JP2009193994A (ja) * 2008-02-12 2009-08-27 Citizen Holdings Co Ltd Ｌｅｄ光源およびその色度調整方法
JP2009193995A (ja) * 2008-02-12 2009-08-27 Citizen Holdings Co Ltd Ｌｅｄ光源およびその色度調整方法

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Publication number Publication date
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