JP5013567B2 - Fluid supply system - Google Patents

Description

  The present invention supplies a predetermined fluid (for example, a supercritical fluid) to an apparatus (for example, a cleaning apparatus, a drying apparatus, a peeling apparatus, etc.) at a use point for processing an object to be processed having a fine structure (surface). In particular, the present invention relates to a supercritical fluid supply system suitable for a case where high cleanliness is required (precision cleaning is required) such as a semiconductor device, a liquid crystal display, and a MEMS (Micro Electro Mechanical Systems) manufacturing process.

  In a manufacturing process of a semiconductor device, a liquid crystal display, etc., a process of processing a target object having a fine structure (surface) is repeated. Since it is important to remove contaminants such as wafers and substrates and achieve and maintain a high degree of cleanliness in order to maintain product quality and improve yield, the number of cleaning processes is indispensable. There are many. Conventionally, the most common cleaning apparatus used in the cleaning process is a wet cleaning apparatus that uses (ultra) pure water, an acid / alkali aqueous solution, an organic solvent, or the like as a cleaning medium. Moreover, high purity is required for (ultra) pure water and chemicals supplied to the cleaning device. Examples of the required water quality of ultrapure water supplied to semiconductor device manufacturing factories include resistivity of 18.2 MΩ · cm or more, number of fine particles of 0.05 μm or more, 1 mL / mL, TOC 1 μg / L or less, metal 5 ng / L or less High purity ultrapure water is required (for example, Patent Document 1). Furthermore, as the device becomes more sophisticated, highly integrated, and miniaturized, the required water quality tends to become stricter. Similarly, high purity is required for chemical solutions.

  In recent years, the advancement, high integration, and miniaturization of objects to be processed such as semiconductor devices have further pointed out the limitations of conventional wet cleaning processes such as cleaning with (ultra) pure water or chemicals, and drying. In order to overcome this problem, a cleaning apparatus using supercritical fluid having characteristics such as low viscosity and low surface tension, particularly supercritical carbon dioxide, has attracted attention. A supercritical fluid refers to a fluid in a region exceeding the critical temperature and critical pressure inherent to a substance. This supercritical fluid has a density close to that of a liquid, but exhibits low viscosity, high diffusibility, gas-like behavior, excellent immersion power, and easily diffuses dirt components, and has a fine structure (surface). It is suitable for cleaning an object to be processed. In addition, drying is performed instantaneously by returning the temperature and pressure to normal temperature and pressure after washing.

Such employed substances as the medium of the supercritical fluid (material), carbon dioxide, nitrous oxide, sulfur, ethane, propane, there are CFCs such as carbon dioxide, non-flammable, nontoxic, critical Since the temperature is 31 ° C. and the critical pressure is 7.4 MPa, handling is easy (for example, Patent Documents 2 and 3).

  However, the purity and cleanliness of conventional supercritical fluids (for example, supercritical carbon dioxide) are not adequately controlled or not fully considered, so impurities in the supercritical fluid that is the cleaning medium are treated. There is a concern that it will adhere to the body surface and become contaminated. In particular, when performing precise cleaning where the trace amount of contaminants and cleanliness on the surface of the object to be processed such as semiconductor devices greatly affect product quality maintenance and yield, it is possible to suppress / prevent back-contamination associated with the cleaning process. It becomes important.

  With recent advances in device sophistication, high integration, and miniaturization, impurities at levels that were not considered a problem in the past have become a problem, and it is increasingly important to reduce impurities and improve cleanliness. It has become. This is the reason why the required water quality of ultrapure water used in conventional wet cleaning apparatuses is becoming strict.

  A processing apparatus such as cleaning using a supercritical fluid is used as a processing apparatus for an object to be processed (for example, the latest or next generation device) that is difficult to apply with a conventional wet cleaning processing apparatus. The purity and cleanliness of supercritical fluids must be maintained and managed at a very high level.

Particulate contamination greatly affects the product yield (for example, short circuit, disconnection, etc.). Therefore, it is an important item in maintaining and managing cleanliness. Contamination sources are those derived from raw materials (liquefied CO ₂ or CO ₂ gas filled in cylinders or tanks if carbon dioxide), those derived from supply devices, those derived from cleaning devices or cleaning processes (operations) And so on.

  For example, in the technique described in Patent Document 4, carbon dioxide, which is a cleaning medium supplied from a liquefied carbon dioxide tank, is pressurized with a booster pump and heated with a heater to form supercritical carbon dioxide, which is used as a cleaning chamber. The supplied object is cleaned. The carbon dioxide used in the cleaning is filtered through a filter in a supercritical fluid state, cooled by a cooler, and then supplied again to a booster pump and a heater for reuse.

  On the other hand, in Patent Document 5, after the cleaning chamber, carbon dioxide used in cleaning is changed from a supercritical state to a gaseous state in the vaporizing chamber, and the gaseous carbon dioxide is filtered by a filter to be liquefied. A cleaning method and a cleaning apparatus have been proposed in which a gas state is changed to a liquid state in a chamber, and the pressure is increased and heated to be reused as supercritical carbon dioxide.

  Patent Document 3 proposes a cleaning device that provides a circulation path in a cleaning tank and circulates a supercritical fluid that is a cleaning medium during cleaning. It has also been proposed to install a filtration filter in this circulation path.

  The above three publications are common in that a circulation system including a cleaning chamber and a filter on the circulation path have a filter, and there is an effect of reducing particulates by filter filtration. However, since all of them include a cleaning chamber in the circulation path, it is necessary to frequently turn on / off the booster pump when the workpiece is taken in and out. There is a lot of dust generation (fine particles are generated) due to large vibrations and shocks when the pump is ON / OFF. When a filter is installed at the rear stage of the pump, trapping with the filter is possible, but the probability that fine particles will leak is higher than in steady operation. In addition, vibrations and shocks generated by the pump are transmitted through the piping, and dust is likely to be generated on the piping and valve inner surfaces, filters, and the inside of the cleaning chamber. Even when a filter is installed after the pump, The potential for contamination is high.

On the other hand, in Patent Document 2 and Patent Document 6, a bypass line of the cleaning chamber (container / tank) is installed, and the cleaning container is being opened (while the object to be cleaned is being put in and out), the cleaning device is being started up, or is being completely stopped In addition, it has been proposed to circulate a supercritical fluid through a bypass line. This has the advantage that the next start-up time can be shortened and the supercritical fluid supply side can be operated independently of the cleaning device. However, when starting or stopping the supply of supercritical fluid to the cleaning chamber, the operation status (pressure, flow rate, etc.) of the supercritical fluid production supply unit (including the recovery unit) is instantaneous when the bypass line is switched (valve opening / closing). Changes easily and is likely to generate dust. The reason is due to the occurrence of vibrations and shocks as described above. In addition, the washing chamber bypass line is connected to a carbon dioxide recovery unit such as a separation tank or a filter in the subsequent stage. The recovery unit is installed for the purpose of introducing carbon dioxide containing impurities (contaminants) removed from the object to be cleaned (surface), separating and purifying the impurities and carbon dioxide, and reusing them. That is, the recovery part contains at least impurities removed from the object to be cleaned (surface). On the other hand, carbon dioxide passing through the bypass line does not contain impurities to be removed from the object to be cleaned (surface), and is higher in cleanliness than carbon dioxide passing through the cleaning chamber. However, carbon dioxide having a relatively high cleanliness passing through the bypass line has a low cleanliness when it enters the recovery section, and is reused after being reprocessed. That is, there is a problem that clean carbon dioxide in the bypass line is troublesome and costly, and it is bothered to be introduced into a recovery section that is at risk of contamination for reprocessing. Further, when the bypass line is switched (valve opening / closing), the operation state (pressure, flow rate, etc.) of the recovery unit also changes instantaneously, which causes a problem of separation failure and dust generation in the separation tank.
JP 2004-267864 A JP-A 63-179530 JP-A-8-206485 JP-A-5-47732 Japanese Patent Laid-Open No. 7-284739 Japanese Patent Laid-Open No. 5-226611

  The present invention can produce a fluid (for example, supercritical carbon dioxide) containing a supercritical fluid whose purity and cleanliness are highly maintained and controlled, and can stably supply the fluid to a processing apparatus having a use point. An object is to provide a fluid supply system, particularly a supercritical fluid supply system. In particular, an object is to provide a fluid supply system suitable for manufacturing and supplying a supercritical fluid with high cleanliness to a precision cleaning apparatus that requires high cleanliness such as a semiconductor device, a liquid crystal display, and a MEMS manufacturing process. To do.

In order to solve the above problems, a fluid supply system according to the present invention, possess a constant circulation of fluid, a supply system for supplying fluid to the point of use as required from the constant circulation, the,
In the constant circulation system, and a pressure means for the pressure of the fluid above the critical pressure, that has a pressure regulating valve is provided in the pressure of the residual fluid that is not supplied to the use point as a pressure reducing means for reducing the pressure It consists of a system characterized by this. Examples of the fluid include a gas phase, a liquid phase, a gas-liquid mixed phase, and a supercritical phase.

  In this fluid supply system, the fluid reservoir can be provided in the constantly circulating system.

The constant circulation system can be configured as a circulation system that returns the remaining fluid that has not been supplied to the use point to the storage tank. Further, in the continuously circulating system may also be configured to heating means you the temperature of the fluid above the critical temperature is provided.

Furthermore, the constantly circulating system, in addition to the heating means, cooling means for cooling the residual that is not supplied to the use point fluid may also be a configuration provided. For example, the fluid can be configured to be returned to the storage tank in the gas phase and / or liquid phase after passing through the pressure reducing means and cooling means.

  When both the pressurizing means and the heating means are provided, it is preferable to provide the pressurizing means and the heating means in this order. When both the pressure reducing means and the cooling means are provided, the cooling means and the pressure reducing means are provided in this order. preferable.

  In the fluid supply system according to the present invention, it is preferable that a valve for controlling the supply of the fluid is provided in the supply system to the use point of the fluid.

  Further, the fluid purifying means may be provided in at least one of the position of the continuous circulation system and the supply system to the use point. The purification means can include at least a filtration means, and for example, a membrane filtration means can be used as the filtration means.

Furthermore, in the fluid supply system according to the present invention, a recovery system may be provided in which at least a part of the fluid supplied to the use point is processed and returned to the constant circulation system. This treatment is preferably at least one of membrane filtration treatment , distillation treatment , molecular sieve, adsorbent treatment using silica gel or porous beads , or carbon dioxide separation membrane treatment .

  As the fluid in such a fluid supply system according to the present invention, for example, a fluid whose main component is carbon dioxide can be used, which can be used for cleaning of an object to be processed.

  In the fluid supply system according to the present invention, the fluid supply system is provided with a circulation path that does not involve a cleaning device (cleaning tank) or the like, and the circulation system is configured as a constant circulation system that can always allow fluid to flow. . And, “Supplying capacity of the specified fluid = Supply amount to the point of use such as a cleaning device (usage amount) + Remaining circulation amount (return amount)”. In this way, a predetermined fluid having a high cleanliness, for example, a supercritical fluid can be always supplied. Changes in usage over time are basically absorbed by changes in return. The return amount of the fluid may increase or decrease with time according to the increase or decrease of the usage amount, but there is almost no influence on the fluid supply system. Furthermore, by adding a refining treatment in the circulation system, a predetermined fluid that is always clean is circulated in the circulation system at all times, and a fluid that is supplied from the circulation system to the use point as much as necessary is always desirable. It will be kept clean.

  In the case of a configuration in which a valve for controlling the supply of fluid to a use point such as a cleaning device is provided on a line branched from the continuous circulation system of a fluid supply system such as a supercritical fluid, The supply will be as open as necessary when necessary. Regardless of the opening / closing operation of the valve or the use situation in other cleaning devices, a pressure regulating valve or a heater (as shown in the embodiment described later) can be supplied so that a fluid such as a supercritical fluid having a constant pressure and a constant temperature can be supplied. Or the combined use of a cooler) is preferably controlled. In particular, it is preferable to supply and control the fluid by the pressure difference (ΔP) from the circulation system. For example, secondary pressure adjustment valve → work tank (chamber) → needle valve (flow rate adjustment valve) → primary pressure adjustment valve And a flow rate of ΔP can be supplied (supplied to the chamber). There is an advantage of preventing generation of impurities such as fine particles (dust generation) (from the pump) by supplying and controlling the fluid with a pressure difference without arranging a pump in the supply system. In the present invention, as described above, the valve opening / closing operation itself does not affect the cleanliness of the fluid such as the supercritical fluid in the production supply system. In addition, it is easy to devise to improve the cleanliness of the fluid such as supercritical fluid supplied to the cleaning device by making the valve clean, slowing the valve opening / closing speed, reducing vibration and shock, etc. Can be.

In addition, it is preferable to provide a purification means (for example, a filtration membrane) somewhere in the always circulating system of the fluid supply system or the supply system to the use point. Unless impurities derived from the raw materials, impurities generated in the system apparatus, and the like are removed, fluid such as supercritical fluid containing impurities is supplied to a use point such as a cleaning apparatus. The reduction of impurities derived from raw materials is largely due to the efforts of raw material manufacturers, but it is important that impurities from system devices are not generated as much as possible, and if they are generated, they are removed. Preferably, a refining means is provided in each of a replenishment system, a circulation system, and a supply system for raw materials (for example, carbon dioxide). In the replenishment system, impurities derived from containers (cylinders and lorries) carried from raw material manufacturers are removed. Regarding the removal of the fine particles, since gas can be more effectively performed, vaporization → purification (filtration) → liquefaction is preferable. As for the circulation system, when returning from the vicinity of a use point such as a cleaning device , there is an advantage that the supply to the use point is stabilized . It is desirable to install the purification means near the supply system use point and / or the circulation system branch point on the supply line, and before the storage tank on the return line. Further, in the return line of the circulation system, from the viewpoint of the effect of removing the fine particles, it is preferable to carry out the treatment after making it into a gas state (for example, in the case of carbon dioxide: the order of vaporization → purification (filtration) → liquefaction). Always circulate in the circulatory system and purify it.

  It is also preferable to provide a means for separating and purifying the used fluid (for example, carbon dioxide) and recovering and reusing it. However, it is preferable to provide it separately from the purification means installed in the above-mentioned circulation system. In other words, collection and reuse are preferable for the global environment, but it is difficult to maintain and manage high purity and cleanliness, so they are prepared separately from the above-mentioned circulation system. If there is a problem with the quality of the recovered carbon dioxide or the like, it is preferable to dispose of it immediately in the exhaust system.

Regarding the above purification operation, the management of fine particles has been described focusing on filtration membranes, but the same applies to impurities such as moisture, organic matter, metal, O ₂ gas, N ₂ gas and other noncondensable gases. Can think about it. The unit operation of the treatment (purification) may be selected according to the impurity to be removed.

  As a treatment (purification) means, for example, in the case of carbon dioxide, carbon dioxide can be purified by leaving and removing moisture, metal, and an organic substance having a low vapor pressure on the liquid side by distillation. Organic substances with high vapor pressure and non-condensable gases can be removed on the vapor side (gas side) to purify carbon dioxide. Depending on the combination of distillation, both the vapor side and the liquid side can be purified in multiple stages. Further, carbon dioxide can be purified by using an adsorbent such as activated carbon, molecular sieve, silica gel, porous beads, etc. (the adsorbent is selected according to the substance to be removed, processing conditions, etc.). Furthermore, carbon dioxide can be purified using a separation membrane (facilitated transport membrane) such as a carbon dioxide separation membrane (for example, Japanese Patent No. 2086581). Furthermore, impurities such as non-condensable gas can be removed and carbon dioxide can be purified by deaeration operation or extraction operation.

  As described above, according to the present invention, a predetermined fluid whose purity and cleanliness are highly maintained and controlled, in particular, a supercritical fluid (for example, supercritical carbon dioxide) is always prepared while maintaining its high cleanliness. In addition, since it can be supplied to the use point as required, the fluid in a desired state can be stably supplied to the use point processing apparatus. In particular, it is possible to stably produce and supply a supercritical fluid with high cleanliness to a precision cleaning apparatus that requires high cleanliness such as a semiconductor device, a liquid crystal display, and a MEMS manufacturing process.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to these embodiments.
FIG. 1 shows a fluid supply system according to an embodiment of the present invention, particularly a supercritical fluid supply system that supplies carbon dioxide (CO ₂ ) as a cleaning fluid to each use point in a supercritical state. In FIG. 1, reference numeral 1 denotes a CO ₂ source composed of a cylinder or a storage tank. The CO ₂ source 1 is generally stored as liquid CO ₂ . CO ₂ from the CO ₂ source 1, after being vaporized in the evaporator (evaporator) 2, through the filter 3, it is sent to a constantly circulating system 4 of the present invention. In constant circulation 4, CO ₂ which is supplied from a CO ₂ source 1 is condensed in the condenser 5, is the state of liquefied or gas-liquid two-phase, are stored in the CO ₂ storage tank 6.

In this embodiment, the CO ₂ stored in the CO ₂ storage tank 6 is circulated through the circulation system 4 by a pump 8 after being cooled by a cooler 7 as a cooling means. The pump 8 also serves as a pressurizing means referred to in the present invention. In this embodiment, the CO ₂ from the pump 8 is filtered by a fluid purification means, particularly a filter 9 as a filtering means, and then heated by a heater 10 as a heating means. The filter 9 as the filtering means is preferably composed of a membrane filtering means. The pressurization by the pump 8 as the pressurizing means and the heating by the heater 10 make it possible to bring the CO ₂ in the system into a supercritical state.

The CO _{2 that} has been brought into the supercritical state is filtered again by a fluid purification means, in particular, a filter 11 as a filtration means, and then, as needed, by a fluid supply system 12 connected to a branch portion of the circulation system 4. Only a necessary amount is supplied to the chamber 13 such as a cleaning device at each use point. The supply system 12 is provided with a valve 14 for controlling the supply of fluid, and the fluid is supplied to each chamber 13 through a filter 15 as a fluid purification means, particularly a filtration means. In the illustrated example, only two fluid supply systems 12 are shown, but any number can be provided.

In the continuous circulation system 4, the remaining supercritical CO _{2 that} has not been supplied to each use point is returned to the CO ₂ storage tank 6 through the return line of the continuous circulation system 4 and is circulated constantly. In the case of a gas phase state and a gas-liquid mixed phase state, it is preferable to return to the CO ₂ storage tank 6 through the line shown in the figure via the condenser 5, and in the case of the liquid phase state, without passing through the condenser 5, It is preferable to return directly to the CO ₂ storage tank 6 through a line not shown.

In order to return to the initial supply state for producing supercritical CO ₂ , in the present embodiment, the following fluid temperature / pressure control system 16 is interposed. That is, the supercritical CO ₂ that has been circulated is cooled by the cooler 17, the pressure is adjusted by the pressure regulating valve 18, and then once evaporated by the evaporator / separator 19. Further, unnecessary fluid is discharged out of the system as a drain 20 and an exhaust 21 as needed. The gas phase of the fluid that has been brought into the gas-liquid two-phase state by the evaporator / separator 19 is filtered by the filter 22 and the liquid phase is filtered by the filter 23, respectively, and then the pressure is adjusted by the pressure regulating valve 24. Thereafter, as described above, it is returned to the CO ₂ storage tank 6. In the case where high purification is not required, the evaporator / separator 19 and / or the filters 22 and 23 of the fluid temperature / pressure control system 16 as a purification means may be omitted.

The return line in the continuous circulation system 4 may be returned and circulated before the branch for supplying to each use point, as indicated by the broken line. In the illustrated example, the fluid is returned to the CO ₂ storage tank 6 from the position in front of the post-heater 10 of the filter 9 via the pressure control system 25 (line L). In this way , circulation energy can be kept small. That is, it is possible to suppress the pressure loss loss by shortening the piping distance and to reduce the energy loss by returning from the front side of the heater 10. The pressure control system 25 is preferably returned directly to the CO ₂ storage tank 6 via a pressure regulating valve, and is shown in a state where the specific configuration is omitted, but the device equivalent to the fluid temperature / pressure control system 16 is shown. May be configured in a system in which is arranged.

FIG. 2 shows a supercritical CO ₂ supply system according to another embodiment of the present invention. In this embodiment, compared to the embodiment shown in FIG. 1, a configuration in which CO ₂ that has been used or has not been used from each chamber 13 is recovered through the recovery line 31 is added. Has been. The recovered CO ₂ is returned to the CO ₂ storage tank 6 as described above, and a fluid temperature / pressure control system 32 similar to the above is interposed in the recovery line 31. That is, the recovered CO ₂ is cooled by the cooler 33, the pressure is adjusted by the pressure regulating valve 34, and then once evaporated by the evaporator / separator 35, and unnecessary fluid is discharged to the drain 36 and exhaust as necessary. 37 is discharged out of the system. The CO ₂ in the recovery system (part) contains impurities removed from the object to be cleaned (surface). If the impurity has a low vapor pressure, it accumulates on the liquid side of the evaporator / separator 35 and is discharged from the drain 36 to the outside of the system. If it is an impurity with a high vapor pressure, it accumulates on the gas side of the evaporator / separator 35 and is therefore discharged out of the system from the exhaust 37. When the gas phase is recovered, it is filtered and recovered by the filter 38, and when the liquid phase is recovered, it is recovered by the filter 39. The gas phase of the fluid separated into a gas-liquid two-phase state by evaporation is filtered by the filter 38, the liquid phase is filtered by the filter 39, and then the pressure is adjusted by the pressure regulating valve 40. It is returned to the CO ₂ storage tank 6 for recovery. If there is a problem with the recovered CO _2, it is discharged out of the system through the drain 36 and / or the exhaust 37.

In any of the embodiments shown in FIG. 1 and FIG. 2, since the CO ₂ fluid is constantly circulated in the constant circulation system 4 and always clean supercritical CO ₂ is produced, this clean supercritical CO ₂ is By opening / closing the valve 14, a necessary amount is supplied to a desired use point while maintaining a clean state as necessary.

The fluid supply system according to the present invention can be applied to any application that requires supplying a necessary amount of a clean fluid in a predetermined state as needed. In particular, a supercritical fluid such as supercritical CO ₂ is used. It is suitable for application to a supercritical fluid production / supply system that requires high-precision cleaning such as semiconductor devices, liquid crystal displays, and MEMS production processes supplied to each use point.

It is a schematic diagram of supercritical CO ₂ supply system as a fluid supply system according to an embodiment of the present invention. Is a schematic diagram of supercritical CO ₂ supply system as a fluid supply system according to another embodiment of the present invention.

Explanation of symbols

1 CO ₂ source 2 Evaporator (vaporizer)
3 Filter 4 Constant circulation system 5 Condenser 6 CO ₂ storage tank 7 Cooler 8 Pump 9 Filter 10 Heater 11 Filter 12 Fluid supply system 13 Chamber 14 Valve 15 Filter 16 Fluid temperature / pressure control system 17 Cooler 18 Pressure adjustment valve 19 Evaporator / separator 20 Drain 21 Exhaust 22 Filter 23 Filter 24 Pressure adjustment valve 25 Pressure control system 31 Recovery line 32 Fluid temperature / pressure control system 33 Cooler 34 Pressure adjustment valve 35 Evaporator / separator 36 Drain 37 Exhaust 38 Filter 39 Filter 40 Pressure regulating valve

Claims (12)

A fluid continuous circulation system, and a supply system for supplying fluid from the constant circulation system to a use point as needed,
In the constant circulation system, there are provided a pressurizing means for setting the pressure of the fluid to a critical pressure or higher and a pressure adjusting valve as a pressure reducing means for reducing the pressure of the remaining fluid that has not been supplied to the use point. A fluid supply system.   The fluid supply system according to claim 1, wherein the fluid circulation tank is provided in the constantly circulating system.   The fluid supply system according to claim 2, wherein the always-on circulation system is configured as a circulation system that returns the remaining fluid that has not been supplied to the use point to the storage tank.   The fluid supply system according to any one of claims 1 to 3, wherein heating means for setting the temperature of the fluid to a critical temperature or higher is provided in the constantly circulating system.   The fluid supply system according to any one of claims 1 to 4, wherein a cooling means for cooling the remaining fluid that has not been supplied to the use point is provided in the constantly circulating system.   The fluid supply system according to any one of claims 1 to 5, wherein a valve for controlling supply of fluid is provided in a supply system to the fluid use point.   The fluid supply system according to any one of claims 1 to 6, wherein a means for purifying the fluid is provided in at least one position of the continuous circulation system and the supply system to the use point.   The fluid supply system according to claim 7, wherein the purification means includes at least a filtration means.   The fluid supply system according to claim 8, wherein the filtration means comprises a membrane filtration means.   The fluid supply system according to any one of claims 1 to 9, further comprising a recovery system that processes at least a part of the fluid supplied to the use point and returns the fluid to the continuous circulation system. The fluid supply system according to claim 10, wherein the treatment is at least one of a membrane filtration treatment , a distillation treatment , a molecular sieve, an adsorbent treatment using silica gel or porous beads , or a carbon dioxide separation membrane treatment .   The fluid supply system according to claim 1, wherein a main component of the fluid is carbon dioxide.

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