JP4992234B2 - 積層圧電セラミック素子及びその製造方法 - Google Patents
積層圧電セラミック素子及びその製造方法 Download PDFInfo
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- JP4992234B2 JP4992234B2 JP2005349292A JP2005349292A JP4992234B2 JP 4992234 B2 JP4992234 B2 JP 4992234B2 JP 2005349292 A JP2005349292 A JP 2005349292A JP 2005349292 A JP2005349292 A JP 2005349292A JP 4992234 B2 JP4992234 B2 JP 4992234B2
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- piezoelectric ceramic
- temperature
- ceramic element
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- tetragonal
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- 239000000919 ceramic Substances 0.000 title claims description 135
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000010304 firing Methods 0.000 claims description 56
- 239000013078 crystal Substances 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 35
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 34
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 25
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 19
- 239000002003 electrode paste Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 18
- 238000002441 X-ray diffraction Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 15
- 238000005238 degreasing Methods 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 11
- 239000000446 fuel Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 40
- 238000006073 displacement reaction Methods 0.000 description 30
- 238000005259 measurement Methods 0.000 description 7
- 239000007858 starting material Substances 0.000 description 6
- 238000002788 crimping Methods 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
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- C01G25/006—Compounds containing, besides zirconium, two or more other elements, with the exception of oxygen or hydrogen
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- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
- C04B35/491—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
- C04B35/493—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT containing also other lead compounds
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
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- Chemical & Material Sciences (AREA)
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- Compositions Of Oxide Ceramics (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005349292A JP4992234B2 (ja) | 2005-12-02 | 2005-12-02 | 積層圧電セラミック素子及びその製造方法 |
DE200610056808 DE102006056808B4 (de) | 2005-12-02 | 2006-12-01 | Piezoelektrische Keramik, geschichtetes piezoelektrisches Keramikelement, Verfahren zum Herstellen dieses Elements und Einspritzvorrichtung mit dem Element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005349292A JP4992234B2 (ja) | 2005-12-02 | 2005-12-02 | 積層圧電セラミック素子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007157910A JP2007157910A (ja) | 2007-06-21 |
JP4992234B2 true JP4992234B2 (ja) | 2012-08-08 |
Family
ID=38047838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005349292A Expired - Fee Related JP4992234B2 (ja) | 2005-12-02 | 2005-12-02 | 積層圧電セラミック素子及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4992234B2 (de) |
DE (1) | DE102006056808B4 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011181764A (ja) * | 2010-03-02 | 2011-09-15 | Tdk Corp | 圧電体素子及びその製造方法 |
JP2014072329A (ja) * | 2012-09-28 | 2014-04-21 | Taiheiyo Cement Corp | 圧電素子の製造方法 |
JP6193725B2 (ja) * | 2013-10-30 | 2017-09-06 | 京セラ株式会社 | 圧電セラミック基体、およびそれを用いた圧電アクチュエータ基板、液体吐出ヘッドならびに記録装置 |
CN111344876B (zh) * | 2017-11-13 | 2023-10-17 | 日商爱伯压电对策股份有限公司 | 膜结构体及其制造方法 |
JP7167626B2 (ja) * | 2018-03-09 | 2022-11-09 | 株式会社リコー | アクチュエータ、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60123079A (ja) * | 1983-12-06 | 1985-07-01 | Nippon Soken Inc | セラミック圧電材料 |
JP2841911B2 (ja) * | 1991-03-25 | 1998-12-24 | 三菱マテリアル株式会社 | Pzt系セラミックス組成物 |
JPH08268756A (ja) * | 1995-03-30 | 1996-10-15 | Toyota Central Res & Dev Lab Inc | 強誘電性セラミックスの製造方法 |
JP3791614B2 (ja) * | 2002-10-24 | 2006-06-28 | セイコーエプソン株式会社 | 強誘電体膜、強誘電体メモリ装置、圧電素子、半導体素子、圧電アクチュエータ、液体噴射ヘッド及びプリンタ |
JP4822664B2 (ja) * | 2003-12-24 | 2011-11-24 | 京セラ株式会社 | 積層型圧電素子およびその製法、並びに噴射装置 |
JP2005056940A (ja) * | 2003-08-07 | 2005-03-03 | Tdk Corp | 電子デバイス用基板、電子デバイスおよびそれらの製造方法 |
JP4535721B2 (ja) * | 2003-11-26 | 2010-09-01 | 京セラ株式会社 | 圧電磁器および積層型圧電素子並びに噴射装置 |
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2005
- 2005-12-02 JP JP2005349292A patent/JP4992234B2/ja not_active Expired - Fee Related
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2006
- 2006-12-01 DE DE200610056808 patent/DE102006056808B4/de not_active Expired - Fee Related
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