JP4990160B2 - 基板を処理するクラスタツールアーキテクチャ - Google Patents

基板を処理するクラスタツールアーキテクチャ Download PDF

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Publication number
JP4990160B2
JP4990160B2 JP2007548551A JP2007548551A JP4990160B2 JP 4990160 B2 JP4990160 B2 JP 4990160B2 JP 2007548551 A JP2007548551 A JP 2007548551A JP 2007548551 A JP2007548551 A JP 2007548551A JP 4990160 B2 JP4990160 B2 JP 4990160B2
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JP
Japan
Prior art keywords
substrate
robot
processing chamber
assembly
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007548551A
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English (en)
Japanese (ja)
Other versions
JP2008526032A5 (de
JP2008526032A (ja
Inventor
哲也 石川
リック， ジェイ． ロバーツ，
ヘレン， アール． アーマー，
レオン ヴォルフォヴスキー，
ジェイ， ディー． ピンソン，
マイケル ライス，
デイヴィッド， エイチ． コーク，
モフセン， エス． サレク，
ロバート ローレンス，
ジョン， エー． バッカー，
ウィリアム， テイラー ウィーヴァー，
チャールズ カールソン，
チョンヤン ワン，
ジェフリー ハドゲンス，
ハラルド ハーチェン，
ブライアン ルー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Semiconductor Solutions Co Ltd
Applied Materials Inc
Original Assignee
Screen Semiconductor Solutions Co Ltd
Applied Materials Inc
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Priority claimed from US11/112,281 external-priority patent/US7357842B2/en
Application filed by Screen Semiconductor Solutions Co Ltd, Applied Materials Inc filed Critical Screen Semiconductor Solutions Co Ltd
Publication of JP2008526032A publication Critical patent/JP2008526032A/ja
Publication of JP2008526032A5 publication Critical patent/JP2008526032A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007548551A 2004-12-22 2005-12-21 基板を処理するクラスタツールアーキテクチャ Expired - Fee Related JP4990160B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US63910904P 2004-12-22 2004-12-22
US60/639,109 2004-12-22
US11/112,281 US7357842B2 (en) 2004-12-22 2005-04-22 Cluster tool architecture for processing a substrate
US11/112,932 2005-04-22
US11/112,932 US20060134330A1 (en) 2004-12-22 2005-04-22 Cluster tool architecture for processing a substrate
US11/112,281 2005-04-22
PCT/US2005/046877 WO2006069341A2 (en) 2004-12-22 2005-12-21 Cluster tool architecture for processing a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011224043A Division JP2012069957A (ja) 2004-12-22 2011-10-11 基板を処理するクラスタツールアーキテクチャ

Publications (3)

Publication Number Publication Date
JP2008526032A JP2008526032A (ja) 2008-07-17
JP2008526032A5 JP2008526032A5 (de) 2008-08-28
JP4990160B2 true JP4990160B2 (ja) 2012-08-01

Family

ID=36147070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007548551A Expired - Fee Related JP4990160B2 (ja) 2004-12-22 2005-12-21 基板を処理するクラスタツールアーキテクチャ

Country Status (4)

Country Link
EP (1) EP1842225A2 (de)
JP (1) JP4990160B2 (de)
KR (1) KR101006685B1 (de)
WO (1) WO2006069341A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685584B2 (ja) 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
JP5267691B2 (ja) * 2012-02-15 2013-08-21 東京エレクトロン株式会社 塗布、現像装置、その方法及び記憶媒体
US9543186B2 (en) 2013-02-01 2017-01-10 Applied Materials, Inc. Substrate support with controlled sealing gap
KR102037900B1 (ko) * 2017-11-10 2019-10-29 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US20200194297A1 (en) * 2018-12-14 2020-06-18 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Track system and method of processing semiconductor wafers
US11413767B2 (en) 2019-10-29 2022-08-16 Applied Materials, Inc. Sensor-based position and orientation feedback of robot end effector with respect to destination chamber

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW318258B (de) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP3816929B2 (ja) * 1995-12-12 2006-08-30 東京エレクトロン株式会社 半導体処理装置
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
EP2099061A3 (de) * 1997-11-28 2013-06-12 Mattson Technology, Inc. Verfahren und Anlage zur Handhabung von Werkstücken unter Vakuum mit niedriger Kontamination und hohem Durchsatz
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
KR20080016782A (ko) 2008-02-22
EP1842225A2 (de) 2007-10-10
WO2006069341A2 (en) 2006-06-29
KR101006685B1 (ko) 2011-01-10
JP2008526032A (ja) 2008-07-17
WO2006069341A3 (en) 2006-10-12

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