JP4989437B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4989437B2
JP4989437B2 JP2007322808A JP2007322808A JP4989437B2 JP 4989437 B2 JP4989437 B2 JP 4989437B2 JP 2007322808 A JP2007322808 A JP 2007322808A JP 2007322808 A JP2007322808 A JP 2007322808A JP 4989437 B2 JP4989437 B2 JP 4989437B2
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacturing
source
pad
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007322808A
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English (en)
Japanese (ja)
Other versions
JP2009147103A5 (enExample
JP2009147103A (ja
Inventor
秀明 民本
匠 曽場
徹 植栗
和雄 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2007322808A priority Critical patent/JP4989437B2/ja
Priority to US12/334,318 priority patent/US7863107B2/en
Publication of JP2009147103A publication Critical patent/JP2009147103A/ja
Priority to US12/962,546 priority patent/US20110073921A1/en
Publication of JP2009147103A5 publication Critical patent/JP2009147103A5/ja
Application granted granted Critical
Publication of JP4989437B2 publication Critical patent/JP4989437B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W70/481—
    • H10W70/466—
    • H10W72/019—
    • H10W72/0198—
    • H10W72/0711—
    • H10W72/60—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/07633—
    • H10W72/07653—
    • H10W72/325—
    • H10W72/352—
    • H10W72/534—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/631—
    • H10W72/652—
    • H10W72/853—
    • H10W72/871—
    • H10W72/884—
    • H10W72/926—
    • H10W72/932—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
    • H10W90/766—
    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
JP2007322808A 2007-12-14 2007-12-14 半導体装置の製造方法 Expired - Fee Related JP4989437B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007322808A JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法
US12/334,318 US7863107B2 (en) 2007-12-14 2008-12-12 Semiconductor device and manufacturing method of the same
US12/962,546 US20110073921A1 (en) 2007-12-14 2010-12-07 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322808A JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009147103A JP2009147103A (ja) 2009-07-02
JP2009147103A5 JP2009147103A5 (enExample) 2011-02-03
JP4989437B2 true JP4989437B2 (ja) 2012-08-01

Family

ID=40752112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007322808A Expired - Fee Related JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法

Country Status (2)

Country Link
US (2) US7863107B2 (enExample)
JP (1) JP4989437B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10847491B2 (en) 2009-02-06 2020-11-24 Kulicke And Soffa Industries, Inc. Ribbon bonding tools and methods of using the same
WO2010091222A2 (en) * 2009-02-06 2010-08-12 Orthodyne Electronics Corporation Ribbon bonding tools and methods of using the same
WO2011033566A1 (ja) * 2009-09-17 2011-03-24 パナソニック株式会社 半導体装置とその製造方法
US8581378B2 (en) * 2009-09-29 2013-11-12 Panasonic Corporation Semiconductor device and method of manufacturing the same
JP2011151322A (ja) * 2010-01-25 2011-08-04 Japan Aviation Electronics Industry Ltd フリップチップ実装構造及びフリップチップ実装方法
WO2011121756A1 (ja) * 2010-03-31 2011-10-06 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8436429B2 (en) * 2011-05-29 2013-05-07 Alpha & Omega Semiconductor, Inc. Stacked power semiconductor device using dual lead frame and manufacturing method
DE102013211405B4 (de) 2013-06-18 2020-06-04 Infineon Technologies Ag Verfahren zur herstellung eines halbleitermoduls
JP2015005623A (ja) * 2013-06-20 2015-01-08 株式会社東芝 半導体装置
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
JP6420704B2 (ja) * 2015-03-30 2018-11-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
CN106229307B (zh) * 2016-08-01 2019-05-17 长电科技（宿迁）有限公司 铝线焊点表面二次装片的焊接结构及其工艺方法
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP6881270B2 (ja) * 2017-12-07 2021-06-02 トヨタ自動車株式会社 電池モジュールの製造方法
DE112020002920T5 (de) * 2019-06-20 2022-02-24 Rohm Co., Ltd. Halbleitervorrichtung und produktionsverfahren für halbleitervorrichtung
IT202000008269A1 (it) * 2020-04-17 2021-10-17 St Microelectronics Srl Dispositivo elettronico di potenza incapsulato impilabile per montaggio superficiale e disposizione circuitale
JP7339933B2 (ja) * 2020-09-11 2023-09-06 株式会社東芝 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3898459B2 (ja) * 2001-04-18 2007-03-28 加賀東芝エレクトロニクス株式会社 半導体装置の製造方法
JP3753426B2 (ja) * 2003-01-15 2006-03-08 株式会社東芝 超音波接合具および超音波接合具を用いた半導体装置の製造方法
US6858943B1 (en) * 2003-03-25 2005-02-22 Sandia Corporation Release resistant electrical interconnections for MEMS devices
US20040217488A1 (en) * 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
JP4047349B2 (ja) * 2004-11-09 2008-02-13 株式会社東芝 半導体装置製造用超音波接合装置、半導体装置、及び製造方法
CN101073151B (zh) * 2004-12-20 2010-05-12 半导体元件工业有限责任公司 具有增强散热性的半导体封装结构
JP4526957B2 (ja) * 2005-01-13 2010-08-18 ルネサスエレクトロニクス株式会社 半導体装置、ボンディング方法およびボンディングリボン
JP2008294384A (ja) * 2007-04-27 2008-12-04 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
US20090152697A1 (en) 2009-06-18
US7863107B2 (en) 2011-01-04
US20110073921A1 (en) 2011-03-31
JP2009147103A (ja) 2009-07-02

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