JP4989437B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4989437B2
JP4989437B2 JP2007322808A JP2007322808A JP4989437B2 JP 4989437 B2 JP4989437 B2 JP 4989437B2 JP 2007322808 A JP2007322808 A JP 2007322808A JP 2007322808 A JP2007322808 A JP 2007322808A JP 4989437 B2 JP4989437 B2 JP 4989437B2
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Japan
Prior art keywords
semiconductor device
manufacturing
source
pad
lead
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Expired - Fee Related
Application number
JP2007322808A
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English (en)
Japanese (ja)
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JP2009147103A5 (enExample
JP2009147103A (ja
Inventor
秀明 民本
匠 曽場
徹 植栗
和雄 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
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Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2007322808A priority Critical patent/JP4989437B2/ja
Priority to US12/334,318 priority patent/US7863107B2/en
Publication of JP2009147103A publication Critical patent/JP2009147103A/ja
Priority to US12/962,546 priority patent/US20110073921A1/en
Publication of JP2009147103A5 publication Critical patent/JP2009147103A5/ja
Application granted granted Critical
Publication of JP4989437B2 publication Critical patent/JP4989437B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
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    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07632—Compression bonding, e.g. thermocompression bonding
    • H10W72/07633—Ultrasonic bonding, e.g. thermosonic bonding
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
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    • H10W72/321—Structures or relative sizes of die-attach connectors
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/59—Bond pads specially adapted therefor
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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JP2007322808A 2007-12-14 2007-12-14 半導体装置の製造方法 Expired - Fee Related JP4989437B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007322808A JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法
US12/334,318 US7863107B2 (en) 2007-12-14 2008-12-12 Semiconductor device and manufacturing method of the same
US12/962,546 US20110073921A1 (en) 2007-12-14 2010-12-07 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322808A JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009147103A JP2009147103A (ja) 2009-07-02
JP2009147103A5 JP2009147103A5 (enExample) 2011-02-03
JP4989437B2 true JP4989437B2 (ja) 2012-08-01

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JP2007322808A Expired - Fee Related JP4989437B2 (ja) 2007-12-14 2007-12-14 半導体装置の製造方法

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US (2) US7863107B2 (enExample)
JP (1) JP4989437B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105598573B (zh) * 2009-02-06 2019-08-20 奥托戴尼电气公司 带式焊接工具及采用所述工具的方法
US10847491B2 (en) 2009-02-06 2020-11-24 Kulicke And Soffa Industries, Inc. Ribbon bonding tools and methods of using the same
US8378468B2 (en) 2009-09-17 2013-02-19 Panasonic Corporation Semiconductor device and method of manufacturing the same
WO2011039795A1 (ja) * 2009-09-29 2011-04-07 パナソニック株式会社 半導体装置とその製造方法
JP2011151322A (ja) * 2010-01-25 2011-08-04 Japan Aviation Electronics Industry Ltd フリップチップ実装構造及びフリップチップ実装方法
US20130009300A1 (en) * 2010-03-31 2013-01-10 Renesas Electronics Corporation Semiconductor device and method for manufacturing same
US8436429B2 (en) * 2011-05-29 2013-05-07 Alpha & Omega Semiconductor, Inc. Stacked power semiconductor device using dual lead frame and manufacturing method
DE102013211405B4 (de) 2013-06-18 2020-06-04 Infineon Technologies Ag Verfahren zur herstellung eines halbleitermoduls
JP2015005623A (ja) * 2013-06-20 2015-01-08 株式会社東芝 半導体装置
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
JP6420704B2 (ja) * 2015-03-30 2018-11-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
CN106229307B (zh) * 2016-08-01 2019-05-17 长电科技（宿迁）有限公司 铝线焊点表面二次装片的焊接结构及其工艺方法
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP6881270B2 (ja) * 2017-12-07 2021-06-02 トヨタ自動車株式会社 電池モジュールの製造方法
CN113994465B (zh) * 2019-06-20 2025-12-05 罗姆股份有限公司 半导体装置以及半导体装置的制造方法
IT202000008269A1 (it) * 2020-04-17 2021-10-17 St Microelectronics Srl Dispositivo elettronico di potenza incapsulato impilabile per montaggio superficiale e disposizione circuitale
JP7339933B2 (ja) * 2020-09-11 2023-09-06 株式会社東芝 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3898459B2 (ja) * 2001-04-18 2007-03-28 加賀東芝エレクトロニクス株式会社 半導体装置の製造方法
JP3753426B2 (ja) * 2003-01-15 2006-03-08 株式会社東芝 超音波接合具および超音波接合具を用いた半導体装置の製造方法
US6858943B1 (en) * 2003-03-25 2005-02-22 Sandia Corporation Release resistant electrical interconnections for MEMS devices
US20040217488A1 (en) * 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
JP4047349B2 (ja) * 2004-11-09 2008-02-13 株式会社東芝 半導体装置製造用超音波接合装置、半導体装置、及び製造方法
US7944044B2 (en) * 2004-12-20 2011-05-17 Semiconductor Components Industries, Llc Semiconductor package structure having enhanced thermal dissipation characteristics
JP4526957B2 (ja) * 2005-01-13 2010-08-18 ルネサスエレクトロニクス株式会社 半導体装置、ボンディング方法およびボンディングリボン
JP2008294384A (ja) * 2007-04-27 2008-12-04 Renesas Technology Corp 半導体装置

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Publication number Publication date
US7863107B2 (en) 2011-01-04
JP2009147103A (ja) 2009-07-02
US20110073921A1 (en) 2011-03-31
US20090152697A1 (en) 2009-06-18

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