JP4975581B2 - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
- Publication number
- JP4975581B2 JP4975581B2 JP2007265615A JP2007265615A JP4975581B2 JP 4975581 B2 JP4975581 B2 JP 4975581B2 JP 2007265615 A JP2007265615 A JP 2007265615A JP 2007265615 A JP2007265615 A JP 2007265615A JP 4975581 B2 JP4975581 B2 JP 4975581B2
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- resist layer
- wiring pattern
- layer
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 62
- 229910000679 solder Inorganic materials 0.000 claims description 186
- 239000002184 metal Substances 0.000 claims description 136
- 238000009792 diffusion process Methods 0.000 claims description 92
- 239000000758 substrate Substances 0.000 claims description 76
- 230000002265 prevention Effects 0.000 claims description 62
- 239000011888 foil Substances 0.000 claims description 41
- 230000000149 penetrating effect Effects 0.000 claims description 41
- 238000007788 roughening Methods 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 22
- 230000035515 penetration Effects 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 3
- 230000007261 regionalization Effects 0.000 claims description 2
- 230000003449 preventive effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 33
- 239000011347 resin Substances 0.000 description 33
- 229920005989 resin Polymers 0.000 description 33
- 239000000463 material Substances 0.000 description 18
- 238000007747 plating Methods 0.000 description 8
- 238000003672 processing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007265615A JP4975581B2 (ja) | 2007-10-11 | 2007-10-11 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007265615A JP4975581B2 (ja) | 2007-10-11 | 2007-10-11 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009094403A JP2009094403A (ja) | 2009-04-30 |
| JP2009094403A5 JP2009094403A5 (enrdf_load_stackoverflow) | 2010-10-21 |
| JP4975581B2 true JP4975581B2 (ja) | 2012-07-11 |
Family
ID=40666062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007265615A Expired - Fee Related JP4975581B2 (ja) | 2007-10-11 | 2007-10-11 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4975581B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5606268B2 (ja) | 2010-10-27 | 2014-10-15 | 日本特殊陶業株式会社 | 多層配線基板の製造方法 |
| JP6291738B2 (ja) | 2013-07-25 | 2018-03-14 | 富士通株式会社 | 回路基板、回路基板の製造方法及び電子機器 |
| JP6554303B2 (ja) * | 2014-03-31 | 2019-07-31 | ナミックス株式会社 | 多層配線基板の製造方法 |
| JP6594264B2 (ja) * | 2016-06-07 | 2019-10-23 | 新光電気工業株式会社 | 配線基板及び半導体装置、並びにそれらの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4691763B2 (ja) * | 2000-08-25 | 2011-06-01 | イビデン株式会社 | プリント配線板の製造方法 |
| JP2003046250A (ja) * | 2001-02-28 | 2003-02-14 | Furukawa Electric Co Ltd:The | ビア付きビルドアップ用多層基板及びその製造方法 |
| JP4619223B2 (ja) * | 2004-12-16 | 2011-01-26 | 新光電気工業株式会社 | 半導体パッケージ及びその製造方法 |
| JP4538373B2 (ja) * | 2005-05-23 | 2010-09-08 | 日本特殊陶業株式会社 | コアレス配線基板の製造方法、及びそのコアレス配線基板を有する電子装置の製造方法 |
| JP2007173371A (ja) * | 2005-12-20 | 2007-07-05 | Shinko Electric Ind Co Ltd | フレキシブル配線基板の製造方法及び電子部品実装構造体の製造方法 |
-
2007
- 2007-10-11 JP JP2007265615A patent/JP4975581B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009094403A (ja) | 2009-04-30 |
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