JP4974260B1 - 量子ナノ接合トムソン素子とその製造方法 - Google Patents
量子ナノ接合トムソン素子とその製造方法 Download PDFInfo
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- JP4974260B1 JP4974260B1 JP2012014678A JP2012014678A JP4974260B1 JP 4974260 B1 JP4974260 B1 JP 4974260B1 JP 2012014678 A JP2012014678 A JP 2012014678A JP 2012014678 A JP2012014678 A JP 2012014678A JP 4974260 B1 JP4974260 B1 JP 4974260B1
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Abstract
本発明が解決しようとする課題は、ナノメータレベルのスピン量子ナノ接合トムソン素子を既存の製造技術で実現させることである。
【解決手段】
70℃の過熱温度にしたTMAH水溶液40wt%中で、Si単結晶基板を異方性エッチングする製造方法と、あわせてスケール拡大したマスクパターンを使用することによりp型半導体細線やn型半導体細線からなるスピン量子ナノ接合トムソン素子を作製する。Si基板上に異方性エッチングによりL字形V溝を形成する工程と、Si基板を酸化炉で熱酸化する工程と熱酸化工程後のL字形V溝に金属膜とn型半導体細線またはp型半導体細線をスパッタリングまたは蒸着で埋め込む工程からなる。
【効果】
以上のとおり、本発明の量子ナノ接合トムソン素子とその製造法は、集積化が可能であり、その工業的価値は極めて高い。
【選択図】 図1
Description
102 酸化膜V溝
103 酸化膜レジストパターン
104 V溝埋め込み
201 量子ナノ接合トムソン素子パターン
202 Ni膜パターン
203 量子ナノ細線パターン
204 Ni膜パターン
301 Ni膜
302 NiO(p型半導体)細線
303 Ni膜
401 V溝
402 Si表面
Claims (1)
- Si基板上に異方性エッチングによりL字形V溝を形成する工程と、前記Si基板を酸化炉で熱酸化する工程と前記熱酸化工程後のL字形V溝からなる量子ナノ接合トムソン素子パターンに金属膜とn型半導体薄膜またはp型半導体薄膜をスパッタリングまたは蒸着で埋め込む工程からなる量子ナノ接合トムソン素子とその製造方法。
Priority Applications (2)
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JP2012014678A JP4974260B1 (ja) | 2012-01-26 | 2012-01-26 | 量子ナノ接合トムソン素子とその製造方法 |
PCT/JP2012/063635 WO2013094237A1 (ja) | 2011-12-23 | 2012-05-28 | 量子ナノ接合トムソン素子とその製造方法 |
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JP2012014678A JP4974260B1 (ja) | 2012-01-26 | 2012-01-26 | 量子ナノ接合トムソン素子とその製造方法 |
Publications (2)
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JP4974260B1 true JP4974260B1 (ja) | 2012-07-11 |
JP2014112574A JP2014112574A (ja) | 2014-06-19 |
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JP2012014678A Expired - Fee Related JP4974260B1 (ja) | 2011-12-23 | 2012-01-26 | 量子ナノ接合トムソン素子とその製造方法 |
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