JP4967607B2 - IC chip assembly manufacturing apparatus - Google Patents

Description

  The present invention relates to an IC chip package manufacturing apparatus.

  Recently, an IC chip mounting body called an RFID (Radio Frequency Identification) card has appeared. This has a memory and a small antenna inside, and by transmitting information without contact with the reader antenna, the necessary information is recorded in the memory, and a communication device such as a reader / writer as necessary. Thus, information can be recorded, rewritten and read out in a short time.

  As an apparatus for manufacturing an IC chip mounting body such as an RFID card, for example, a base sheet having adhesiveness on one side is conveyed by a conveyor, and a circuit sheet on which an antenna circuit and an IC chip are formed is bonded to the adhesive side. Furthermore, what manufactures an IC chip mounting body by bonding the cover sheet which has adhesiveness on the one surface is proposed (for example, refer patent document 1). Also, the base sheet coated with an adhesive on one side is conveyed by a conveyor, a circuit sheet similar to that described above is bonded to the adhesive surface, and a cover sheet is further bonded to the IC chip mounting body through an adhesive. Proposals have also been made of manufacturing an IC chip mounting body by transporting a film substrate having an antenna circuit formed on one side by a conveyor and mounting an IC chip so as to be connected to the antenna circuit. (For example, refer to Patent Documents 2 and 3).

In addition, in order to manufacture the IC chip mounting body at high speed, the synchronization roller is synchronized with the conveyance speed of the film substrate while the IC chip is attracted by the suction holes formed at equal intervals on the side surface of the cylindrical synchronization roller. There has also been proposed a technique of rotating and affixing to a film substrate to which an adhesive has been applied in advance when the IC chip is positioned directly below the synchronous roller.
JP 2003-6596 A (FIG. 1) Japanese Patent Laying-Open No. 2003-58848 (FIG. 1) Japanese Patent Laying-Open No. 2003-168099 (FIG. 1)

  However, the following problems remain in the conventional apparatus for manufacturing an IC chip mounting body. That is, in the conventional IC chip mounting body manufacturing apparatus, the adhesive is applied to all positions on the film substrate where the IC chip is mounted. Therefore, if the IC chip is not attracted to the suction hole of the synchronous roller for some reason, the adhesive is in contact with the suction hole of the synchronous roller, and the adhesive adheres to the suction hole, thereby closing the suction hole. Such a problem occurs.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an apparatus for manufacturing an IC chip mounting body in which an adhesive does not adhere to a suction hole of a synchronous roller.

  The present invention employs the following configuration in order to solve the above problems. That is, the manufacturing apparatus of the IC chip mounting body of the present invention includes a transport unit that transports a film substrate having an antenna circuit formed on a surface at a constant interval at a constant speed, and an adhesive that applies an adhesive onto the film substrate. A printing unit, a synchronizing roller unit for mounting the IC chip on the film substrate conveyed at a constant speed while moving the IC chip along the film substrate, and supplying the IC chip to the synchronizing roller unit An IC chip supply unit, which determines whether or not the IC chip is provided in the IC chip mounting unit for mounting the IC chip on the part of the film substrate to which the adhesive is applied, and the synchronization roller unit. A determination unit, and when the determination unit determines that the IC chip is not included in the synchronization roller unit, the adhesive printing unit is configured to provide the IC chip on the film substrate. Characterized in that no coating the adhesive to the site to be mounted.

In the IC chip mounting body manufacturing apparatus according to the present invention, when there is a place where the IC chip is not sucked in the suction hole of the synchronous roller, the portion of the film substrate where the IC chip is to be mounted (the IC chip is sucked). Do not apply adhesive to the contact area of the suction holes that are not. Therefore, since only the film substrate comes into contact with the suction hole where the IC chip of the synchronous roller is not sucked, it is possible to avoid problems such as the suction hole being blocked by the adhesive, and the manufacturing efficiency of the IC chip mounting body is improved. .
Further, when the IC chip mounting unit mounts the IC chip at a predetermined position of the antenna circuit formed on the film substrate, the synchronization roller unit mounts the IC chip while moving it at a speed synchronized with the transport speed of the film substrate. . Therefore, since the IC chip can be mounted without temporarily stopping the film substrate, the manufacturing efficiency of the IC chip mounting body is improved.
In addition, the number of IC chip mounting bodies that can be manufactured per unit time increases, and the cost of the IC chip mounting body can be reduced.
Furthermore, the film substrate is not adversely affected by conveying the film substrate at a constant speed.

In the IC chip mounting apparatus according to the present invention, the determination unit images the synchronization roller unit, and determines whether the synchronization roller unit includes the IC chip based on the captured image. It is preferable to do.
In the manufacturing apparatus of the IC chip mounting body according to the present invention, the synchronization roller is imaged, and whether or not the IC chip is mounted is determined from the captured image, so that the adhesive is not applied when there is no IC chip. Therefore, inconveniences such as the suction holes being blocked by the adhesive can be avoided, and the manufacturing efficiency of the IC chip mounting body is improved.

  According to the manufacturing apparatus of the IC chip mounting body of the present invention, when the IC chip is mounted on the film substrate on which the antenna circuit is formed by using the synchronization roller, the IC chip of the synchronization roller is not attracted to the suction hole. Since the film substrate to which the adhesive is not applied comes into contact, it is possible to avoid problems such as the suction hole of the synchronous roller being blocked by the adhesive.

Hereinafter, an embodiment of a manufacturing apparatus of an IC chip mounting body according to the present invention will be described with reference to FIGS.
The IC chip mounting body manufacturing apparatus 1 according to the present embodiment is a manufacturing apparatus that manufactures, for example, an ID tag 2 as an IC chip mounting body.

As shown in FIG. 1, the ID tag 2 includes a film substrate 3 having an antenna circuit 3a formed at a predetermined position, an IC chip 4 mounted at a predetermined position on the antenna circuit 3a, and a cover sheet 5. It is configured.
The antenna circuit 3a is formed in advance on the film substrate 3 by a printing technique or etching, and is continuously formed on the film substrate 3 at equal intervals as shown in FIG.
The IC chip 4 is provided with bumps 4b made of, for example, copper or gold for connecting to the antenna circuit 3a on the back surface 4a. The IC chip 4 is connected to the antenna circuit 3a via an adhesive 6 made of, for example, conductive paste. Connected.
One surface of the cover sheet 5 has adhesiveness, and is arranged so as to cover the film substrate 3 and the IC chip 4.

  As shown in FIG. 3, this IC chip mounting body manufacturing apparatus 1 has a film substrate housing portion 11 that houses a film substrate 3 and an adhesive that applies an adhesive 6 to a position where the IC chip 4 is mounted on the film substrate 3. The adhesive printing unit 12, the IC chip mounting unit 13 for mounting the IC chip 4 at a predetermined position on the film substrate 3, the heater 14 for drying the adhesive 6, and the surface of the film substrate 3 on which the IC chip 4 is mounted A cover sheet laminating unit 15 to be combined, a product winding unit 16 that winds up the film substrate 3 on which the cover sheet 5 is bonded, and a control unit 17 that controls them are configured.

The film substrate container 11 is controlled by the controller 17 so that the roll 21 of the film substrate 3 shown in FIG. 2 is accommodated and the film substrate 3 has a constant speed and a constant tension.
In addition, the film substrate 3 sent out from the film substrate housing portion 11 is configured to be continuously conveyed toward the adhesive printing portion 12.

  The adhesive printing unit 12 includes a CCD camera 22 and a printing unit 23 that applies the adhesive 6 to a predetermined position of the film substrate 3. In addition, the film substrate 3 sent out from the adhesive printing unit 12 is configured to be continuously conveyed in the horizontal direction toward the IC chip mounting unit 13.

The IC chip mounting unit 13 includes a mounting device 25 for mounting the IC chip 4 on the film substrate 3 that has been transported.
The mounting device 25 includes an IC chip supply unit 26, a rotary head unit 27, and a synchronization roller unit 28 as shown in FIGS.
As shown in FIG. 4, the IC chip supply unit 26 includes a bowl 31 that accommodates the IC chip 4, a linear feeder 32 that conveys the IC chip 4 in a certain direction at a constant speed, and the IC chip 4 from the linear feeder 32 to the bowl. A return feeder (not shown) transported to 31, a vibration drive (not shown) that vibrates the bowl 31, the linear feeder 32 and the return feeder, and a CCD camera 34, which is two CCD cameras for imaging the IC chip 4, 35. As a method for applying vibration, for example, electromagnetic vibration is used.

The bowl 31 is formed with a spiral conveyance path 36 on the inner peripheral wall thereof, and the IC chip 4 accommodated is conveyed on the conveyance path 36 to the conveyance path 37 of the linear feeder 32 at a constant speed by vibration. Has been.
The linear feeder 32 is configured to similarly transport the IC chip 4 transported by the bowl 31 to the front end of the transport path 36 by vibration.
The CCD cameras 34 and 35, which are two CCD cameras, are respectively disposed at substantially the center and the front end of the conveyance path 37 of the linear feeder 32, and are configured to transmit captured image signals to the control unit 17, respectively. ing.
The air blow is arranged on the conveyance path 37 between the CCD camera 34 and the CCD camera 35, and the control unit 17 determines that the IC chip 4 imaged by the CCD camera 34 is the front (bump 4b faces downward). In this case, the IC chip 4 is discharged to the return feeder.
The return feeder is configured to discharge the IC chip 4 discharged by air blow to the bowl 31.

  As shown in FIG. 5, the rotary head unit 27 includes a drive motor 41 that rotates the disk plate 42, and a disk plate 42 that is disposed on the lower surface of the drive motor 41 so as to be rotatable about the central axis of the drive motor 41. The four nozzle units 43 arranged at equal intervals in the circumferential direction of the disk plate 42 and a pair of Z-axis units 44 provided to face the side surfaces of the drive motor 41 are provided.

  The disc plate 42 is made of, for example, aluminum, and is disposed so as to be rotatable about the central axis of the drive motor 41 by the drive motor 41. The disk plate 42 is formed with four through holes 42a at equal intervals in the circumferential direction, and a nozzle unit 43 is disposed.

The nozzle unit 43 includes a nozzle body 45 having a substantially cylindrical shape, and a cylinder portion 46 provided so as to be movable in a direction perpendicular to the disk plate 42.
The cylinder portion 46 is provided with an adsorption portion 47 that adsorbs the IC chip 4 at the tip, and a disc portion 48 that is engaged with an engagement portion 53 of a Z-axis unit 44 described later at the base end. .
The nozzle unit 43 is configured such that when the suction portion 47 rotates the disk plate 42, the nozzle unit 43 overlaps with the leading end of the conveyance path 37 of the linear feeder 32 in a top view and also overlaps with a suction hole 61 a of the synchronous roller 61 described later. Arranged in position.

  Inside the nozzle body 45, there is provided a θ-axis rotation gear (not shown) that rotates the cylinder portion 46 about the central axis of the nozzle unit 43 as a rotation axis. The θ-axis rotating gear is configured such that the control unit 17 rotates the IC chip 4 in a predetermined direction based on an image captured by the IC chip 4 captured by the CCD camera 35.

The drive motor 41 is configured to perform a so-called index operation in which the disk plate 42 is intermittently rotated about the central axis of the drive motor 41 by 90 degrees by the control unit 17. By this index operation, as shown in FIG. 6, the nozzle unit 43 overlaps a position Sa that overlaps with the leading end of the conveyance path 37 of the linear feeder 32 in a top view, a position Sb, and a suction hole 61 a of the synchronization roller 61 described later. It is configured to temporarily stop at the position Sc and the position Sd.
Further, when rotating the disk plate 42, the cylinder portion 46 performs vacuum suction of the IC chip 4 on the transport path 36 at the position Sa, and releases the IC chip 4 at the position Sc.

Two Z-axis units 44 are arranged so as to face the side surface of the drive motor 41, and a Z-axis unit main body 51 and a slide portion that is movable in the Z-axis direction that is perpendicular to the disk plate 42. 52.
The slide part 52 is movable in the Z-axis direction by an AC servo motor (not shown) disposed in the Z-axis unit main body 51. Further, an engaging portion 53 that engages the disc portion 48 of the nozzle unit 43 is provided on the side surface of the slide portion 52 so as to protrude outward in the circumferential direction of the disc plate 42. The disc portion 48 is engaged by the engaging portion 53, and the slide portion 52 is slid in the Z-axis direction by an AC servo motor, so that the cylinder portion 46 is movable in the Z-axis direction.

  As shown in FIG. 7, the synchronization roller unit 28 includes a synchronization roller 61, a drive motor 62 that operates the synchronization roller 61, an alignment stage 63 that corrects the mounting position of the IC chip 4 by the synchronization roller 61, and the synchronization roller 61. A CCD camera 64 (determination unit) that images the upper IC chip 4 is provided.

The synchronous roller 61 has five suction holes 61 a formed at equal intervals in the circumferential direction, and is configured to suck the IC chip 4 conveyed by the rotary head unit 27.
The drive motor 62 is configured such that the control unit 17 causes the synchronization roller 61 to perform an indexing operation about the central axis of the synchronization roller 61 by 72 ° in each rotation. By this indexing operation, the suction hole 61a of the synchronization roller 61 is configured to temporarily stop at a position Se that overlaps the position Sc and the positions Sf to Si in a side view, as shown in FIG.

  The alignment stage 63 has an X-axis motor 65 and a Y-axis motor 66. The alignment stage 63 includes the X-axis motor 65 and the X-axis motor 65 according to the correction amount calculated by the control unit 17 based on the position information of the antenna circuit 3a on the film substrate 3 by the CCD camera 22 and the position information of the IC chip 4 by the CCD camera 64. The Y-axis motor 66 is appropriately driven and corrected.

  The heater 14 dries and heat-treats the adhesive 6 on the film substrate 3 on which the IC chip 4 is mounted.

The bonding unit 15 includes a bonding roller 71 that bonds the film substrate 3 on which the IC chip 4 is mounted and the cover film 5, and a cover film storage unit 73 that stores the roller 72 of the cover film 5.
The bonding roller 71 is a transport unit that transports the film substrate 3 from the film substrate housing unit 11 together with the product winding unit 16. The bonding roller 71 pulls out the cover film from the cover film housing unit 73, and the film substrate 3 and the cover film 5 It is the structure which sticks together.
The product take-up unit 16 is configured to take up the ID tag 2 manufactured by bonding the cover film 5 and accommodate it as a roll 75.

  As shown in FIG. 9, the control unit 17 includes a drive control unit 81 that controls driving of the film substrate housing unit 11, the bonding roller 71, and the product winding unit 74, and print control that controls driving of the adhesive printing unit 12. Part 82, heater control part 83 that controls the drive of the heater 14, vibration control part 84 that controls the vibration of the IC chip supply part 26, and operation control that controls the indexing operation of the synchronous roller part 28 and the rotary head part 27. Unit 85, image processing units 86, 87, 88, 89 that perform image processing of each image captured by the CCD cameras 22, 35, 36, 64, and the rotary head unit from the images processed by the image processing unit 88 The correction amount is calculated from the image processed by the rotation correction control unit 91 and the image processing unit 89 for controlling the 27 θ-axis rotation gear. A correction control unit 92 to be transmitted to the instrument stage 63, and a front and back judgment unit 93 that controls the IC chip supply portion 26 from the processed image by the image processing unit 87 determines the front and rear surfaces of the IC chip 4. Among these, the image processing unit 89 functions as a determination unit in the present invention.

Next, an ID tag manufacturing method will be described with reference to FIG.
First, the bonding roller 71 and the product winding unit 74 convey the film substrate 3 from the film substrate housing unit 11 to the adhesive printing unit 12 at a constant speed (step ST1).
Next, the CCD camera 64 images the synchronization roller 61, and whether or not the synchronization chip 61 is provided with the IC chip 4 based on the image captured by the image processing unit 89 (that is, the IC chip 4 in the suction hole 61a). Is determined) (step ST2). When the IC chip 4 is not provided on the synchronous roller 61, an adhesive is applied to a portion of the film substrate 3 where the IC chip 4 is to be mounted (a portion where the suction hole 61a is not sucked by the IC chip 4). No (step ST3).

  When the IC chip 4 is provided on the synchronization roller 61, the CCD camera 22 of the adhesive printing unit 12 images the antenna circuit 3 a of the film substrate 3, and the image processing unit 86 captures the image on the film substrate 3. The position of the formed antenna circuit 3a is confirmed. Then, the printing unit 23 uses an application device such as a rotary press without stopping the film substrate 3 on the part on which the IC chip 4 imaged in step ST2 on the film substrate 3 is mounted based on the position information. 6 is applied (step ST4).

Next, the chip mounting unit 13 mounts the IC chip 4 at a predetermined position of the antenna circuit 3a (step ST5).
Then, the heater 14 heats the film substrate 3 on which the IC chip 4 is mounted, and cures the adhesive 6 to fix the IC chip 4 to the film substrate 3 (step ST6).
Thereafter, the bonding unit 15 bonds the cover film so as to cover the antenna circuit 3a and the IC chip 4 (step ST7).
Finally, the product winding unit 16 winds up the film substrate 3 on which the cover film 5 is bonded (step ST8).

Next, a method of mounting the IC chip 4 by the chip mounting unit 13 will be described in detail with reference to FIG. 11 including steps ST2 to ST5 in the above-described ID tag manufacturing method.
First, the vibration control unit 84 drives the vibration drive so that the IC chip supply unit 26 conveys the IC chip 4 in the bowl 31 on the conveyance path 37 at a constant speed and at equal intervals by vibration. At this time, the CCD camera 34 performs imaging of the IC chip 4 conveyed on the conveyance path 37 of the linear feeder 32 from the upper surface side, and the image processing unit 87 of the control unit 17 captures an image captured from the photographed image of the CCD camera 34. The front / back determination of the chip 4 is performed (step ST11). Here, the surface on which the bumps 4b are provided is the back surface.

In step ST11, when the image processing unit 87 determines that the IC chip 4 is the front, the front / back determination unit 93 discharges the IC chip 4 to the return feeder. The discharged IC chip is conveyed to the bowl 31 by the return feeder (step ST12).
In step ST <b> 11, when the image processing unit 87 determines that the IC chip 4 is behind, the linear feeder 32 further conveys the IC chip 4 toward the tip of the conveyance path 37. Here, the CCD camera 35 takes an image of the IC chip 4 conveyed to the tip of the linear feeder 32. (Step ST13).

Next, the nozzle unit 43 at the position Sa shown in FIG. 6 sucks the IC chip 4 at the tip of the transport path 37. That is, the slide portion 52 is slid downward in the Z axis while the disk portion 48 of the nozzle unit 43 is engaged with the engagement portion 53 of the Z axis unit 44. Then, the cylinder part 46 moves downward in the Z axis, and the suction part 47 sucks the IC chip 4 transported on the transport path 37 of the linear feeder 32 (step ST14).
After adsorbing the IC chip 4, the cylinder portion 46 moves upward in the Z axis by the Z axis unit 44. Then, the disk plate 42 performs an index operation that rotates 90 ° in the circumferential direction, and moves the nozzle unit 43 to a position Sb shown in FIG.
At this time, the image processing unit 88 of the control unit 17 determines pass / fail of the IC chip 4 captured from the image captured by the CCD camera 35 in step ST13 (step ST15).

In step ST15, when the image processing unit 88 determines that the IC chip 4 is a defective product, the nozzle unit 43 discharges the IC chip 4 as a defective product when the cylinder unit 46 releases the IC chip 4 (step ST16).
In step ST15, when the image processing unit 88 determines that the IC chip 4 is a non-defective product, the disk plate 42 performs an index operation. During this indexing operation, the image processing unit 88 calculates an appropriate direction for mounting the IC chip 4 from the image captured by the CCD camera 35, and the θ-axis rotation gear rotates the IC chip 4 in a predetermined direction ( Step ST17).

The nozzle unit 43 moves to the position Sc shown in FIG. 6 by this index operation.
The rotary head portion 27 slides the slide portion 52 downward in the Z axis and moves the cylinder portion 46 downward in the Z axis. And the adsorption | suction part 47 contact | abuts to the suction hole 61a of the synchronous roller 61, and releases the IC chip 4, so that the IC chip 4 is attracted to the suction hole 61a of the synchronous roller 61 at the position Se shown in FIG. Step ST18).

The synchronous roller 61 performs an index operation that is rotated 72 ° by the drive motor 62.
As a result, the IC chip 4 moves to the position Sf shown in FIG. Here, the CCD camera 64 images the IC chip 4 (position Sf shown in FIG. 8) on the synchronization roller 61, and the presence or absence of the IC chip 4 is determined based on the image captured by the image processing unit 89 (step ST19). ).

  When the IC chip 4 is not imaged and the image processing unit 89 determines that the IC chip 4 is not provided on the synchronization roller 61, the print control unit 82 determines that the adhesive is based on the signal from the image processing unit 89. The printing unit 12 is controlled so that the adhesive 6 is not applied to the part where the IC chip 4 of the film substrate 3 is to be mounted (the part where the IC chip 4 is not adsorbed and contacting the suction hole 61a) (step ST20).

  When it is determined that the IC chip 4 is provided on the synchronization roller 61, the CCD camera 22 of the adhesive printing unit 12 images the antenna circuit 3a of the film substrate 3, and the image processing unit 86 images. The position of the antenna circuit 3a formed on the film substrate 3 is confirmed based on the image. Then, the printing unit 23 uses an application device such as a rotary press without stopping the film substrate 3 on the part on which the IC chip 4 imaged in step ST19 on the film substrate 3 is mounted based on this position information. 6 is applied (step ST21).

Subsequently, the correction control unit 92 calculates the correction amount of the position of the synchronization roller 61 from the position information of the antenna circuit 3 a by the image processing unit 86 and the position information of the IC chip 4 by the image processing unit 89.
The synchronization roller 61 further performs an index operation, and the alignment stage 63 corrects the position of the synchronization roller 61 by the correction control unit 92 (step ST22).

  The synchronization roller 61 further performs an indexing operation to bring the film substrate 3 and the IC chip 4 into contact with each other between the position Sg and the position Sh shown in FIG. 8, thereby releasing the IC chip 4 from the suction hole 61a. IC chip 4 is mounted on substrate 3 (step ST23). In the synchronization roller 61, the contact position with the film substrate 3 is a position opposite to the position where the IC chip 4 is released from the rotary head unit 27 to the synchronization roller 61. Therefore, the IC chip 4 is arranged on the film substrate 3 without stopping by the index operation at the position of contact with the film substrate 3.

According to the manufacturing apparatus of the IC chip mounting body configured as described above, when there is a place where the IC chip 4 is not sucked in the suction hole 61a of the synchronous roller 61, the IC chip 4 of the film substrate 3 is mounted. The adhesive 6 is not applied to a portion to be formed (a portion where the IC chip 4 is not adsorbed and which is in contact with the suction hole 61a). Therefore, since only the film substrate 3 is in contact with the suction hole 61a of the synchronous roller 61, inconveniences such as the suction hole 61a being blocked by the adhesive 6 can be avoided, and the manufacturing efficiency of the ID tag 2 is improved.
Further, the synchronization roller 61 is mounted on the film substrate 3 while moving the IC chip 4 at a speed synchronized with the speed at which the film substrate 3 is conveyed. Therefore, since the IC chip 4 is mounted without temporarily stopping the film substrate, the manufacturing efficiency of the ID tag 2 is improved.

In addition, since a large number of ID tags 2 can be manufactured per unit time, the cost of the ID tag 2 can be reduced. Further, since the film substrate 3 is conveyed at a constant speed, the film substrate 3 is not adversely affected.
The CCD cameras 34 and 35 image the antenna circuit 3 a and the IC chip 4, and the mounting position of the IC chip 4 by the synchronization roller 61 is corrected from the image captured by the alignment stage 63. Thereby, the feeding accuracy of the film substrate 3 is improved. Further, since the IC chip 4 can be mounted at a predetermined mounting position, the manufacturing yield of the ID tag 2 is improved.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, the ID tag manufacturing apparatus is used, but a card mounted with an IC chip may be used.
Further, the IC chip mounting unit may include a plurality of mounting devices.
Further, the suction holes formed in the synchronous roller are not limited to five places.
In addition, although an antenna circuit is formed in advance on the film substrate, an apparatus for supplying a film substrate on which an antenna circuit is not formed by disposing an apparatus for manufacturing the antenna circuit in front of the adhesive printing apparatus. It may be.
Further, the cover film may be structured so as to cover the antenna circuit and the IC chip.
Further, the roller 21 of the film substrate may be rotatable.
Further, the drive motor 41 may be built in the housing.

The ID tag in one Embodiment concerning this invention is shown, (a) is a top view, (b) is sectional drawing. It is a top view which shows the film substrate in one Embodiment concerning this invention. It is a schematic side view which shows the manufacturing apparatus of the IC chip mounting body in one Embodiment concerning this invention. It is a perspective view which shows the IC chip supply part in one Embodiment concerning this invention. It is a perspective view which shows the rotary head part in one Embodiment concerning this invention. It is a schematic diagram bottom view showing a stop position of a nozzle unit by index operation of a rotary head part in one embodiment concerning the present invention. It is a perspective view which shows the synchronous roller part in one Embodiment concerning this invention. It is a schematic sectional drawing which shows the stop position of the suction hole by the index operation | movement of the synchronous roller part in one Embodiment concerning this invention. It is a block diagram which shows the control part in one Embodiment concerning this invention. It is a flowchart which shows the manufacture procedure of the ID tag in one Embodiment concerning this invention. It is a flowchart which shows the mounting procedure of IC chip by the chip mounting apparatus in one Embodiment concerning this invention.

Explanation of symbols

1 IC chip mounting apparatus 2 ID tag (IC chip mounting body)
3 Film substrate 4 IC chip 5 Cover film 11 Film substrate housing part (conveyance part)
12 Adhesive printing part 13 IC chip mounting part 15 Cover film laminating part 16 Product winding part (conveyance part)
25 CCD camera 26 IC chip supply unit 28 Synchronous roller unit 64 CCD camera (determination unit)
71 Bonding roller (conveying section)
89 Image processing unit (determination unit)

Claims (2)

A transport unit that transports a film substrate having an antenna circuit formed on a surface at a constant interval at a constant speed;
An adhesive printing section for applying an adhesive on the film substrate;
A synchronizing roller unit for mounting the IC chip on the film substrate conveyed at a constant speed while moving the IC chip along the film substrate at a certain interval, and an IC chip supplying unit for supplying the IC chip to the synchronizing roller unit An IC chip mounting portion for mounting an IC chip on a portion of the film substrate to which the adhesive is applied,
A determination unit that determines whether or not the IC chip is provided in the synchronization roller unit,
When the determination unit determines that the IC chip is not provided in the synchronization roller unit, the adhesive printing unit does not apply the adhesive to a portion on the film substrate where the IC chip is to be mounted. An IC chip assembly manufacturing apparatus characterized by the above.   2. The IC chip mounting according to claim 1, wherein the determination unit images the synchronization roller unit and determines whether the synchronization roller unit includes the IC chip based on the captured image. Body manufacturing equipment.

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