JP4966707B2 - Thermoelectric module - Google Patents

Description

  The present invention relates to a thermoelectric module suitably used for cooling a heating element such as an air conditioner, a cold / hot storage, and a semiconductor.

  Conventionally, a thermoelectric element using the Peltier effect has been used as a thermoelectric element for cooling because one end generates heat and the other end absorbs heat when an electric current is passed. In particular, temperature control of laser diodes as thermoelectric modules, small size and simple structure, cooling devices without refrigerators, refrigerators, thermostats, photodetectors, electronic cooling elements such as semiconductor manufacturing equipment, temperature control of laser diodes, etc. Use is expected.

  The thermoelectric module using this thermoelectric element is configured by connecting a plurality of thermoelectric elements in series between a pair of support substrates, and energizes the thermoelectric elements via terminal electrodes formed on the support substrate. Thus, one support substrate side becomes a heat generating portion, and the other support substrate side becomes a cooling portion. By utilizing this, the thermoelectric module is used as a cooling element or a heating element.

As described above, the thermoelectric module using the thermoelectric element easily heats up due to the existence of the heat generating portion and the cooling portion, and causes the terminal electrode to corrode. Therefore, the terminal electrode portion is usually protected by resin (for example, paragraph 0017 of Patent Document 1 and FIG. 1 attached to Patent Document 1).
JP 2000-22224 A

  However, the conventional thermoelectric module has a problem that the resin-coated member covering the terminal electrode is peeled off from the support substrate.

  Then, this invention can suppress that the coating | coated member which covers a terminal electrode peels from a support substrate, and it aims at providing a highly reliable thermoelectric module.

  In order to achieve the above object, a thermoelectric module according to the present invention includes a pair of support substrates disposed opposite to each other, and a plurality of thermoelectric elements disposed between the pair of support substrates. A thermoelectric module in which the thermoelectric elements are connected by connection electrodes respectively formed on opposing surfaces of a support substrate, and at least one of the support substrates is provided with a terminal electrode that is electrically connected to the connection electrode, The terminal electrode is covered with a covering member formed to extend from the facing surface to at least one side surface of the support substrate.

  In the thermoelectric module according to the present invention, the covering member is preferably formed so as to extend beyond the one side surface to the back surface.

  In the thermoelectric module according to the present invention, it is more preferable that the covering member is formed to extend to one or both of the two side surfaces on both sides of the one side surface.

  In the thermoelectric module according to the present invention, a lead wire may be connected to the terminal electrode by a connecting material, and the terminal electrode, the connecting material, and the lead wire may be covered by the covering member.

  In the thermoelectric module according to the present invention, the lead wire is formed by covering a conductor with an insulating member except for a tip portion thereof, and is connected to the terminal electrode at the tip portion of the conductor, and the covering member is formed of the insulating member. It is preferable to be formed so as to cover the member.

  In the thermoelectric module according to the present invention, it is preferable that a portion of the covering member that covers the insulating member protrudes from the one side surface.

  In the thermoelectric module according to the present invention, the covering member may expose a part of the connecting material.

  In the thermoelectric module according to the present invention, the covering member is preferably made of a silicon resin.

  In the thermoelectric module according to the present invention, the covering member extends to the other support substrate to form a sealed space between the pair of support substrates, and at least some of the plurality of thermoelectric elements are disposed in the sealed space. May be.

  The thermoelectric module according to the present invention may further include a second covering member that forms a sealed space between the pair of support substrates, and at least some of the plurality of thermoelectric elements may be disposed in the sealed space. .

  In the thermoelectric module according to the present invention, it is preferable that a part of the covering member and a part of the second covering member overlap each other.

  In the thermoelectric module according to the present invention, it is preferable that the covering member overlaps the second covering member.

  In the thermoelectric module according to the present invention, it is preferable that the hardness of the covering member is lower than the hardness of the second covering member.

  In the thermoelectric module according to the present invention, it is preferable that the second covering member is made of an epoxy resin.

  In the thermoelectric module according to the present invention configured as described above, the terminal electrode is covered with a covering member formed to extend from the facing surface to at least one side surface of the support substrate. It is possible to suppress peeling of the covering member to be covered from the support substrate, and it is possible to provide a highly reliable thermoelectric module.

  Hereinafter, a thermoelectric module according to an embodiment of the present invention will be described with reference to the drawings. In the following drawings, similar members are denoted by the same reference numerals.

Embodiment 1. FIG.
The thermoelectric module of the embodiment according to the present invention is configured by arranging a plurality of thermoelectric elements 3 between a pair of first support substrate 1a and second support substrate 1b arranged to face each other. Specifically, as shown in FIGS. 1 and 2, the thermoelectric module of the first embodiment includes an N-type thermoelectric element 3a and a P-type thermoelectric element between a first support substrate 1a and a second support substrate 1b. The elements 3b are alternately arranged and are adjacent to each other by the first connection electrode 2a formed on the inner surface of the first support substrate 1a and the second connection electrode 2b formed on the inner surface of the second support substrate 1b. The N-type thermoelectric element 3a and the P-type thermoelectric element 3b are connected.

  Also, one end of the P-type thermoelectric element 3b disposed at one end of the series circuit is connected to the terminal electrode 10 formed on the inner surface of the first support substrate (shown in FIG. 2), and the other end of the series circuit One end of the N-type thermoelectric element 3a disposed at the end of the first substrate is connected to a terminal electrode formed on the inner surface of the first support substrate. In addition, although the connection part of the terminal electrode formed in the inner surface of the 1st support substrate 1a and the end of the N-type thermoelectric element 3a is not illustrated, one end of the P-type thermoelectric element 3b and the terminal electrode 10 It is on the same side as the connecting part and has the same structure.

  In this way, a series circuit in which the N-type thermoelectric elements 3a and the P-type thermoelectric elements 3b are alternately connected is formed between the first support substrate 1a and the second support substrate 1b. Then, lead wires 6 are connected to the terminal electrodes by a joining member 4 such as solder.

  Here, in particular, the thermoelectric module according to the first embodiment is characterized in that the terminal electrode 10 is covered with a covering member 5 that extends (around) from the opposing surface to the side surface.

  Hereinafter, the characteristic part of the thermoelectric module of the first embodiment will be described more specifically. However, in the following description, when the N-type thermoelectric element 3a and the P-type thermoelectric element 3b are not distinguished from each other, they are simply referred to as the thermoelectric element 3. Further, when the first support substrate 1a and the second support substrate 1b are not particularly distinguished, they are simply referred to as the support substrate 1.

  In the first embodiment, the two terminal electrodes 10 are provided in the terminal region outside the region (element region) where a plurality of thermoelectric elements are arranged on the inner surface of the first support substrate 1a. In the first embodiment, the terminal region is provided along one side surface, but the present invention is not limited to this. Further, the lead wires 6 are fixed to the two terminal electrodes 10 by the connection members 4, respectively.

  The covering member 5 covers the two terminal electrodes 10, the lead wires 6, and the connecting member 4 and extends from the terminal region outside the element region on the inner surface of the first support substrate 1a to the side surface (around Provided). Here, the covering member 5 is preferably made of a material that forms an insulating covering film, such as an epoxy resin, a silicon resin, a polyester resin, a polyimide resin, or a polyurethane resin, and is formed by using a silicon resin. It is preferable.

  The covering member 5 can be formed, for example, by application with a dispenser, application of a resin formed into a sheet shape, application with a spatula or the like.

  In the thermoelectric module according to the first embodiment of the present invention configured as described above, the covering member 5 is provided to extend from the terminal region on the inner surface of the first support substrate 1a to the side surface, and the terminal electrode 10 is provided. Since the lead wire 6 and the connecting member 4 are covered, the contact area between the covering member 5 and the substrate can be increased, and the covering member 5 is hardly peeled off from the substrate. Thereby, since the terminal electrode and the surrounding corrosion by dew condensation etc. can be suppressed, a high moisture resistance characteristic is acquired.

  Further, when the side surface of the support substrate 1 is rougher than the inner surface on which the terminal electrode is formed, the covering member 5 is firmly fixed on the side surface around which the covering member 5 is wound. Peeling can be suppressed, and higher moisture resistance can be obtained.

  Furthermore, in the thermoelectric module of Embodiment 1, since the covering member 5 covers the terminal electrode 10, the lead wire 6, and the connection member 4, corrosion of the lead wire 6 and the connection member 4 can be suppressed together with the terminal electrode 10. Furthermore, since the covering member 5 is more firmly fixed by the concavities and convexities formed on the terminal electrode 10 by the lead wire 6 joined to the terminal electrode 10 and the connecting member 4, higher heat resistance characteristics can be obtained.

Embodiment 2. FIG.
The thermoelectric module according to the second embodiment of the present invention is configured in the same manner as in the first embodiment except that the shape of the covering member 5 is different from the thermoelectric module according to the first embodiment. FIG. 3 is a perspective view illustrating the configuration of the thermoelectric module according to the second embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating the configuration of the thermoelectric module according to the second embodiment. 3 and 4, the same reference numerals are used for the same components as those in FIGS. 1 and 2.

  In the second embodiment, the covering member 5 extends from the terminal region on the inner surface of the first support substrate 1 a to the side surface to cover the terminal electrode 10, the lead wire 6, and the connecting member 4. Further, the first support substrate 1a is formed so as to extend to the back surface on the back side of the inner surface.

  In the thermoelectric module of Embodiment 2 configured as described above, the covering member 5 is fixed in close contact with the terminal region and the side surface of the inner surface of the first support substrate 1a, and further, the back surface of the first support substrate 1a. However, since it is fixed, it is more securely and firmly fixed as compared with the thermoelectric module of the first embodiment. Therefore, the thermoelectric module of the second embodiment can obtain higher moisture resistance than the thermoelectric module of the first embodiment.

  Further, in the thermoelectric module of the second embodiment, as a more preferable form, the covering member 5 is formed so as to extend around the side surface to two side surfaces on both sides of the one side surface around which the covering member wraps around. ing. Thereby, in the thermoelectric module of Embodiment 2, the coating | coated member 5 is closely_contact | adhered and fixed also on three side surfaces and a back surface, and it fixes more firmly firmly. Therefore, the thermoelectric module of the said form can obtain a further higher moisture resistance characteristic.

Modification 1
The thermoelectric module of Modification 1 according to the present invention is configured in the same manner as in Embodiment 1 except that the shape of the covering member 5 is different from the thermoelectric module of Embodiment 1. FIG. 5 is a cross-sectional view showing the configuration of the thermoelectric module of Modification 1 according to the present invention. In FIG. 5, the same reference numerals are used for the same components as those in FIGS.

  That is, the thermoelectric module of Modification 1 is different from the covering member 5 of Embodiment 1 in that the covering member 5 protrudes along the lead wire. Specifically, the lead wire 6 has a conductor covered with an insulating member except for its tip, and is connected to the terminal electrode at the tip of the conductor. And in Embodiment 1, as shown in FIG. 2, the coating | coated member 5 is provided so that the insulating member which coat | covers the conductor may be covered. However, in the first modification, the covering member 5 is projected along the lead wire 6, and the lead wire 6 is reliably covered with the insulating member portion covering the conductor. Thereby, in the thermoelectric module of Embodiment 1, a high moisture resistance characteristic is surely obtained.

Modification 2
The thermoelectric module of Modification 2 according to the present invention is configured in the same manner as in Embodiment 1 except that the shape of the covering member 5 is different from the thermoelectric module of Embodiment 1. FIG. 6 is a cross-sectional view showing the configuration of the thermoelectric module of Modification 2 according to the present invention. In FIG. 6, the same reference numerals are used for the same components as those in FIGS.

  Specifically, in the thermoelectric module of Modification 2, the covering member 5 is provided so that a part of the joining member that connects the lead wire to the terminal electrode 10 is exposed. In the thermoelectric module of Modification 2 configured as described above, heat can be released from the exposed surface of the bonding member 4, and deterioration due to heat at the bonding portion between the terminal electrode and the lead wire can be suppressed.

Modification 3
The thermoelectric module of Modification 3 according to the present invention is the thermoelectric module of Embodiment 1 in which the covering member 5 is extended to the element region so as to form a sealed space, and the thermoelectric element 3 is accommodated in the sealed space. The configuration is the same as that of the first embodiment except for the above. FIG. 7 shows a cross-sectional view of the thermoelectric module of the third modification, and the same reference numerals are used for the same components as those in FIGS. 1 and 2.

  The thermoelectric module of Modification 3 configured as described above can protect the thermoelectric element 3, and at the same time, can suppress moisture from entering the terminal electrode from the element region side, and also has reliability around the terminal electrode. Can be improved.

  In Modification 3, all the thermoelectric elements 3 are accommodated in the sealed space formed in the element region. However, the present invention is not limited to this, and some thermoelectric elements 3 are accommodated in the sealed space. You may do it.

Modification 4
The thermoelectric module of Modification 4 according to the present invention is the same as the thermoelectric module of Embodiment 1 except that the second covering member 7 is formed in the element region separately from the covering member 5 to form a sealed space. The configuration is the same as that of the first embodiment except that the covering member 5 is formed in an overlapping manner. FIG. 8 shows a cross-sectional view of the thermoelectric module according to the modified example 4, and the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  The thermoelectric module according to the modified example 4 configured as described above can protect the thermoelectric element 3, and at the same time, can suppress the ingress of moisture from the element region side to the terminal electrode, and also has reliability around the terminal electrode. Can be improved.

  Moreover, in the thermoelectric module of this modification 4, since it has the double structure where the film member 5 overlaps on the 2nd film member 7, the stress by deformation | transformation can be suppressed at the contact interface of resin. Furthermore, since it has a double structure, it can effectively prevent moisture and outside air from entering, and short-circuiting due to condensation is unlikely to occur. Thereby, the destruction life by long-time driving can be further improved.

  In the fourth modification, the hardness of the covering member 5 is preferably lower than the hardness of the second covering member 7. If it does in this way, the stress in the contact interface of the coating | coated member 5 and the 2nd coating | coated member at the time of a cooling cycle when a thermoelectric module is operated can be relieve | moderated, and a fracture life can be improved.

  Moreover, in this modification 4, it is preferable to form the coating | coated member 5 which coat | covers the circumference | surroundings of the terminal electrode 10 using a silicon resin. This silicon resin has good wettability with the substrate, can suppress intrusion of moisture and outside air, and the covering member 5 cannot be peeled off from the substrate.

  When the covering member 5 covering the periphery of the terminal electrode 10 is made of a silicon resin, the second covering member 7 is preferably made of an epoxy resin having good wettability with the silicon resin. If it does in this way, the penetration | invasion of the water | moisture content and external air from the interface of a silicon resin and an epoxy resin can be prevented.

  In Modification 3 and Modification 4 described above, it is preferable that reduced pressure or dry gas is sealed in the sealed space. By doing so, dew condensation can be suppressed even when used at a low temperature, so that reliability can be improved.

  As mentioned above, although embodiment and the modification which concern on this invention were demonstrated, in this invention, as a support substrate, ceramics, such as a ceramics, such as an alumina and aluminum nitride, a resin substrate, such as an epoxy polyimide, and a ceramic to resin of an epoxy polyimide, for example It is possible to use a filler in which heat conduction is improved by adding a filler.

It is a perspective view which shows the structure of the thermoelectric module of Embodiment 1 which concerns on this invention. It is sectional drawing which shows the structure of the thermoelectric module of Embodiment 1. FIG. It is a perspective view which shows the structure of the thermoelectric module of Embodiment 2 which concerns on this invention. It is sectional drawing which shows the structure of the thermoelectric module of Embodiment 2. FIG. It is sectional drawing which shows the structure of the thermoelectric module of the modification 1 which concerns on this invention. It is sectional drawing which shows the structure of the thermoelectric module of the modification 2 which concerns on this invention. It is sectional drawing which shows the structure of the thermoelectric module of the modification 3 which concerns on this invention. It is sectional drawing which shows the structure of the thermoelectric module of the modification 4 which concerns on this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Support substrate, 1a 1st support substrate, 1b 2nd support substrate, 2 connection electrode, 2a 1st connection electrode, 2b 2nd connection electrode, 3 thermoelectric element, 3a N type thermoelectric element, 3b P type thermoelectric Element, 10 terminal electrode, 4 connecting member, 5 covering member, 7 second covering member.

Claims (13)

The thermoelectric element includes a pair of support substrates disposed opposite to each other and a plurality of thermoelectric elements disposed between the pair of support substrates, and the thermoelectric elements are formed by connection electrodes respectively formed on opposing surfaces of the pair of support substrates. A thermoelectric module connected,
A terminal electrode that is electrically connected to the connection electrode is provided on the opposing surface of at least one of the support substrates, and the terminal electrode extends from the opposing surface to at least one side surface of the support substrate. Covered ,
The covering member extends to the other support substrate to form a sealed space between the pair of support substrates, and at least some of the plurality of thermoelectric elements are disposed in the sealed space; and
A thermoelectric module, wherein the sealed space is filled with reduced pressure or dry gas . The thermoelectric element includes a pair of support substrates disposed opposite to each other and a plurality of thermoelectric elements disposed between the pair of support substrates, and the thermoelectric elements are formed by connection electrodes respectively formed on opposing surfaces of the pair of support substrates. A thermoelectric module connected,
A terminal electrode that is electrically connected to the connection electrode is provided on the opposing surface of at least one of the support substrates, and the terminal electrode extends from the opposing surface to at least one side surface of the support substrate. Covered ,
A second covering member that forms a sealed space between the pair of support substrates, wherein at least some of the plurality of thermoelectric elements are disposed in the sealed space; and
A thermoelectric module, wherein the sealed space is filled with reduced pressure or dry gas . The thermoelectric module according to claim 2 , wherein a part of the covering member and a part of the second covering member overlap each other. The thermoelectric module according to claim 3 , wherein the covering member overlaps the second covering member. The thermoelectric module according to any one of claims 2 to 4 , wherein the hardness of the covering member is lower than the hardness of the second covering member. The thermoelectric module according to claim 2 , wherein the second covering member is made of an epoxy resin. The covering member, the thermoelectric module according to any one of claims 1 to 6, characterized in that it is formed to extend further to the rear surface beyond the one side. The thermoelectric module according to any one of claims 1 to 7, wherein the covering member is formed so as to extend to one or both of two side surfaces on both sides of the one side surface. A lead wire is connected to the terminal electrode by a connecting material,
The thermoelectric module according to any one of claims 1-8, wherein the terminal electrode, connection material and the lead wire is covered with the covering member. The lead wire is formed by covering a conductor with an insulating member except for a tip thereof, and being connected to the terminal electrode at the tip of the conductor, and the covering member is formed so as to cover the insulating member. The thermoelectric module according to claim 9 . The thermoelectric module according to claim 10 , wherein a portion of the covering member that covers the insulating member protrudes from the one side surface.   The thermoelectric module according to claim 9, wherein the covering member exposes a part of the connecting material. The thermoelectric module according to any one of claims 1 to 12 , wherein the covering member is made of silicon resin.

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