JP4952869B1 - はんだ小片、チップソルダ、及びはんだ小片の製造方法 - Google Patents
はんだ小片、チップソルダ、及びはんだ小片の製造方法 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 151
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000004080 punching Methods 0.000 claims abstract description 28
- 238000001179 sorption measurement Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 6
- 238000010008 shearing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0448—With subsequent handling [i.e., of product]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0481—Puncturing
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Abstract
はんだ小片1Aは、ハンドリングの際に吸着される吸着面となり得る第1の面11、第2の面12、第3の面13及び第4の面14の4面と、打ち抜き加工で発生するだれ部15aが形成される面である第5の面15及び第5の面15と対向する第6の面16を備え、第1の面11、第2の面12、第3の面13及び第4の面14がせん断面となるように、矢印Aで示す方向に打ち抜かれる。これにより、はんだ小片1Aは、だれ部15aが形成される第5の面15及び第5の面15と対向する第6の面16を除く4面が、所定の寸法精度で形成し得る面となり、第1の面11、第2の面12、第3の面13及び第4の面14のいずれか1面を吸着面として、だれ部15aが形成される第5の面15が吸着面とならないように構成される。
【選択図】図1
Description
図1は、本実施の形態のはんだ小片の一例を示す斜視図、図2は、本実施の形態のはんだ小片の一例を示す側面図である。
図3は、本実施の形態のチップソルダの一例を示す斜視図である。本実施の形態のチップソルダ10Aは、上述したはんだ小片1Aと、はんだ小片1Aが収納される供給テープ3を備える。供給テープ3は樹脂材料あるいは紙等で長尺状に構成され、はんだ小片1Aを収納し得る複数の開口凹部30が、延在方向に沿って形成される。また、チップソルダ10Aは、供給テープ3を走行させるための送り穴31が、延在方向に沿って形成される。チップソルダ10Aは、開口凹部30にはんだ小片1Aが収納された後、図示しないカバーテープによって封止される。
図4A及び図4Bは、本実施の形態のはんだ小片の使用形態の一例を示す説明図である。はんだ小片1Aは、図4Aに示すように、ソルダペースト50が塗布された基板51上のランド52に、電子部品53と共に搭載される。はんだ小片1Aを基板51に搭載する工程では、チップソルダ10Aの形態で供給されるはんだ小片1Aが真空吸着で吸着され、所定のランド上に搭載される。
図5A及び図5Bは、本実施の形態のはんだ小片の製造方法の一例を示す動作説明図であり、次に、各図を参照して、本実施の形態のはんだ小片の製造方法について説明する。本実施の形態のはんだ小片1Aは、図5Aに示すように、所定の厚さに構成されるテープ状の板材であるはんだ圧延テープ4がダイ40に供給され、図5Bに示すように、はんだ圧延テープ4をパンチ41で打ち抜く打ち抜き加工で、直方体形状に構成される。
次に、各図を参照して、本実施の形態のチップソルダの製造方法の一例について説明する。本実施の形態のチップソルダ10Aは、供給テープ3の開口凹部30にはんだ小片1Aを収納して構成される。
図6は、本実施の形態のはんだ小片の変形例を示す斜視図である。変形例のはんだ小片1Bは、だれ部15aが形成される面である第5の面15と、第5の面15と対向する第6の面16を、長方形で構成したものである。変形例のはんだ小片1Bの形状では、例えば、第5の面15及び第6の面16の長辺と辺が共有される第1の面11と、第1の面11と対向する第2の面12が吸着面となる。変形例のはんだ小片1Bは、一例として、2.6mm×2.0mm×0.5mmの寸法を有する。
Claims (5)
- 打ち抜き加工で直方体形状に構成されるはんだ小片であって、
打ち抜き加工で発生するだれ部が形成される面、及び前記だれ部が形成される面と対向する面を除く4面のうち、少なくとも対向する2面のいずれか1面を吸着面とした
ことを特徴とするはんだ小片。 - 前記だれ部が形成される面、及び前記だれ部が形成される面と対向する面に対して、吸着面となり得る面の面積が大きく構成される
ことを特徴とする請求項1に記載のはんだ小片。 - 前記だれ部が形成される面、及び前記だれ部が形成される面と対向する面の各辺に対し、吸着面となり得る面を含む4面の長手方向の辺の長さが長く構成される
ことを特徴とする請求項1または請求項2に記載のはんだ小片。 - 打ち抜き加工で直方体形状に構成され、打ち抜き加工で発生するだれ部が形成される面、及び前記だれ部が形成される面と対向する面を除く4面のうち、少なくとも対向する2面のいずれか1面を吸着面としたはんだ小片と、
前記はんだ小片が収納される開口凹部が形成される供給テープを備え、
前記開口凹部は、前記はんだ小片の前記だれ部が形成される面、及び前記だれ部が形成される面と対向する面を除く4面のうち、少なくとも、吸着面となり得る面または吸着面となり得る面と対向する面を露出させる形状で構成される
ことを特徴とするチップソルダ。 - 打ち抜き加工で直方体形状に構成されるはんだ小片の製造方法であって、
前記はんだ小片は、打ち抜き加工で発生するだれ部が形成される面、及び前記だれ部が形成される面と対向する面を除く4面のうち、少なくとも対向する2面のいずれか1面を吸着面とし、吸着面となり得る面を含む4面がせん断面となる向きで、素材を打ち抜いて構成される
ことを特徴とするはんだ小片の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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PCT/JP2011/072622 WO2013046450A1 (ja) | 2011-09-30 | 2011-09-30 | はんだ小片、チップソルダ、及びはんだ小片の製造方法 |
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JP4952869B1 true JP4952869B1 (ja) | 2012-06-13 |
JPWO2013046450A1 JPWO2013046450A1 (ja) | 2015-03-26 |
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JP2012501488A Active JP4952869B1 (ja) | 2011-09-30 | 2011-09-30 | はんだ小片、チップソルダ、及びはんだ小片の製造方法 |
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US (3) | US8991679B2 (ja) |
EP (1) | EP2749374B1 (ja) |
JP (1) | JP4952869B1 (ja) |
KR (1) | KR101164396B1 (ja) |
CN (1) | CN102612867B (ja) |
CY (1) | CY1119735T1 (ja) |
ES (1) | ES2640319T3 (ja) |
HU (1) | HUE035183T2 (ja) |
PL (1) | PL2749374T3 (ja) |
PT (1) | PT2749374T (ja) |
TW (1) | TWI388391B (ja) |
WO (1) | WO2013046450A1 (ja) |
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---|---|---|---|---|
CN102612867B (zh) * | 2011-09-30 | 2013-11-27 | 千住金属工业株式会社 | 焊料小块、焊料小块供给体、和焊料小块的制造方法 |
JP6327873B2 (ja) * | 2014-02-03 | 2018-05-23 | ウツミ電気株式会社 | 半田小片、チップソルダおよび半田小片の製造方法 |
US20170203380A1 (en) * | 2016-01-20 | 2017-07-20 | Indium Corporation | Capillary block |
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JPS61172697A (ja) * | 1985-01-28 | 1986-08-04 | Victor Co Of Japan Ltd | 半田集合体 |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
JPS6411095A (en) * | 1987-10-30 | 1989-01-13 | Anritsu Corp | Production of granular solder |
JPH06275944A (ja) | 1993-03-22 | 1994-09-30 | Sharp Corp | 半田付け方法 |
JPH06283536A (ja) * | 1993-03-30 | 1994-10-07 | Nec Corp | 半田バンプ実装基板 |
JPH09219580A (ja) * | 1996-02-09 | 1997-08-19 | Fuji Xerox Co Ltd | 半田供給装置および供給方法 |
US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
US6929170B2 (en) * | 2003-09-30 | 2005-08-16 | Ted Ju | Solder deposition method |
US7533793B2 (en) * | 2004-02-20 | 2009-05-19 | Fry's Metals, Inc. | Solder preforms for use in electronic assembly |
JP2005294035A (ja) | 2004-03-31 | 2005-10-20 | Matsushita Electric Works Ltd | コネクタ |
CN102612867B (zh) * | 2011-09-30 | 2013-11-27 | 千住金属工业株式会社 | 焊料小块、焊料小块供给体、和焊料小块的制造方法 |
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CN102612867B (zh) | 2013-11-27 |
US8991679B2 (en) | 2015-03-31 |
US20150122874A1 (en) | 2015-05-07 |
US20130082087A1 (en) | 2013-04-04 |
EP2749374B1 (en) | 2017-08-09 |
US20160199946A1 (en) | 2016-07-14 |
US9327364B2 (en) | 2016-05-03 |
EP2749374A1 (en) | 2014-07-02 |
CN102612867A (zh) | 2012-07-25 |
JPWO2013046450A1 (ja) | 2015-03-26 |
EP2749374A4 (en) | 2015-07-01 |
HUE035183T2 (hu) | 2018-05-02 |
CY1119735T1 (el) | 2018-06-27 |
WO2013046450A1 (ja) | 2013-04-04 |
PL2749374T3 (pl) | 2018-01-31 |
KR101164396B1 (ko) | 2012-07-09 |
PT2749374T (pt) | 2017-10-03 |
TWI388391B (zh) | 2013-03-11 |
ES2640319T3 (es) | 2017-11-02 |
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