JP4939861B2 - Circuit board and portable terminal - Google Patents

Circuit board and portable terminal Download PDF

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Publication number
JP4939861B2
JP4939861B2 JP2006194604A JP2006194604A JP4939861B2 JP 4939861 B2 JP4939861 B2 JP 4939861B2 JP 2006194604 A JP2006194604 A JP 2006194604A JP 2006194604 A JP2006194604 A JP 2006194604A JP 4939861 B2 JP4939861 B2 JP 4939861B2
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resin portion
circuit board
resin
base material
solder
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JP2008021933A (en
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正浩 小野
清史 中西
盛司 山口
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、基材の回路パターンにハンダを介して端子部を固定することにより複数の電子部品が実装された回路基板および携帯端末に関する。   The present invention relates to a circuit board and a mobile terminal on which a plurality of electronic components are mounted by fixing terminal portions to a circuit pattern of a base material via solder.

例えば携帯電話等の携帯端末に収容される回路基板は、回路パターンが形成された基材と、回路パターンにハンダを介して端子部を固定することにより実装された複数の電子部品とを備えている。   For example, a circuit board accommodated in a portable terminal such as a mobile phone includes a base material on which a circuit pattern is formed, and a plurality of electronic components mounted by fixing terminal portions to the circuit pattern via solder. Yes.

また、近年では、電子部品における本体の一部を覆うとともに基材に密着する樹脂部（アンダーフィル）により電子部品の実装強度を向上させた回路基板が提案されている（特許文献１参照）。
この特許文献１は、基材に実装された複数の電子部品を一括して樹脂部により実装強度を向上させる場合にも適用可能である。
特許第３２４１６６９号 In recent years, a circuit board has been proposed in which the mounting strength of the electronic component is improved by a resin portion (underfill) that covers a part of the main body of the electronic component and adheres closely to the base material (see Patent Document 1).
This Patent Document 1 can also be applied to a case where a plurality of electronic components mounted on a base material are collectively improved in mounting strength by a resin portion.
Japanese Patent No. 3241669

ところで、従来より、回路基板に不具合が生じた場合、各電子部品を実装したままの状態で、基材の裏面（電子部品が実装されていない面）の所定箇所にテストピンを接触させ、導通試験をおこなうことにより基材の不良検証を行っていた。
ところが、近年の回路基板は基材の両面に電子部品が実装されることが多く、裏面にテストピンを接触させる従来の不良検証が不可能になりつつある。 By the way, when a problem occurs in the circuit board, the test pin is brought into contact with a predetermined position on the back surface of the substrate (the surface on which the electronic component is not mounted) in a state in which each electronic component is mounted, and is electrically connected. The substrate was inspected for defects by performing a test.
However, in recent circuit boards, electronic components are often mounted on both surfaces of a base material, and conventional defect verification in which test pins are brought into contact with the back surface is becoming impossible.

このため、回路基板に不具合が生じた場合、実装された電子部品を基材から剥離し、基材単体の状態にしてから不良検証を行う必要がある。
しかしながら、前述した特許文献１のように、樹脂部により電子部品の実装強度が補完された回路基板の場合、電子部品の剥離が難しく、あるいは手間が掛かるという問題がある。 For this reason, when a malfunction occurs in the circuit board, it is necessary to perform defect verification after peeling the mounted electronic component from the base material to make the base material alone.
However, as in Patent Document 1 described above, in the case of a circuit board in which the mounting strength of the electronic component is complemented by the resin portion, there is a problem that peeling of the electronic component is difficult or troublesome.

本発明は、上述した従来の問題を解決するためになされたものであり、その目的は、基材に実装された電子部品が樹脂部により実装強度を補完されていても、基材から電子部品を容易に剥離可能な回路基板および携帯端末を提供することにある。   The present invention has been made in order to solve the above-described conventional problems. The purpose of the present invention is to make an electronic component from a base material even if the electronic component mounted on the base material has a mounting strength supplemented by a resin portion. It is to provide a circuit board and a portable terminal that can be easily peeled off.

本発明の回路基板は、回路パターンが形成された基材と、前記回路パターンにハンダを介して固定される複数の電子部品と、少なくとも前記ハンダを覆うように前記基材上に積層された第１の樹脂部と、前記第１の樹脂部に積層され、かつ、前記複数の電子部品総ての本体を完全に被覆し、かつ、弾性率が前記第１の樹脂部の弾性率よりも高い第２の樹脂部と、前記第１の樹脂部及び前記第２の樹脂部を囲うととともに、前記基材とは別部材である一体の枠体と、を有し、前記第１の樹脂部は、前記枠体内に存在する前記回路パターン及び前記ハンダの総てを覆うとともに、前記枠体内に存在する前記複数の電子部品総ての前記基材に対向した面と当該基材との間の空間を満たすように、前記基材上に積層され、前記一体の枠体は前記第１の樹脂部及び前記第２の樹脂部の側面の全域に渡って密着するとともに外部へ露出する。 The circuit board of the present invention includes a base material on which a circuit pattern is formed, a plurality of electronic components fixed to the circuit pattern via solder, and a first laminated on the base material so as to cover at least the solder. 1 resin portion and the first resin portion, and the whole body of all the electronic components is completely covered, and the elastic modulus is higher than the elastic modulus of the first resin portion. a second resin part, together with the surrounding said first resin part and the second resin portion, anda integral frame is another member and the substrate, the first resin portion Covers all of the circuit pattern and the solder existing in the frame, and between the substrate and the surface of the plurality of electronic components existing in the frame facing the substrate. so as to fill a space, stacked on the substrate, the frame of the integral first Exposed to the outside as well as in close contact over the entire fat portion and a side surface of the second resin portion.

そして、本発明の携帯端末は、前述した回路基板を有することを特徴とする。   And the portable terminal of this invention has the circuit board mentioned above, It is characterized by the above-mentioned.

本発明によれば、第１の樹脂部を基材から剥離する際に、第１の樹脂部から第２の樹脂部が離れることを防ぐことができるという効果を有する。 According to the present invention, when the first resin portion is peeled from the base material, the second resin portion can be prevented from being separated from the first resin portion .

（第１実施形態）
以下、本発明の実施形態に係る回路基板について、図面を参照して説明する。
図１、図２に示すように、第１実施形態の回路基板１０は、基材１１の表面１１Ａに回路パターン１２が形成され、回路パターン１２にハンダ１３を介して端子部１４Ａを固定することにより複数の電子部品１４を実装し、携帯端末の筐体に収容されるものである。 (First embodiment)
Hereinafter, a circuit board according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, in the circuit board 10 of the first embodiment, the circuit pattern 12 is formed on the surface 11 </ b> A of the base material 11, and the terminal portion 14 </ b> A is fixed to the circuit pattern 12 via the solder 13. Thus, a plurality of electronic components 14 are mounted and accommodated in the casing of the portable terminal.

さらに、回路基板１０は、基材１１の表面１１Ａに樹脂部１７を構成する第１の樹脂部１５を積層し、第１の樹脂部１５で回路パターン１２およびハンダ１３を覆い、第１の樹脂部１５に樹脂部１７を構成する第２の樹脂部１６を積層し、第２の樹脂部で各電子部品１４の本体１４Ｂを被覆したものである。
この回路基板１０は、例えば、携帯電話等の携帯端末に収容されて用いられる。 Further, the circuit board 10 is formed by laminating the first resin part 15 constituting the resin part 17 on the surface 11A of the base material 11, covering the circuit pattern 12 and the solder 13 with the first resin part 15, and the first resin. The second resin part 16 constituting the resin part 17 is laminated on the part 15, and the main body 14 </ b> B of each electronic component 14 is covered with the second resin part.
For example, the circuit board 10 is accommodated in a portable terminal such as a cellular phone.

第１の樹脂部１５は、回路パターン１２およびハンダ１３を覆うことにより各電子部品１４の実装強度を補完するものである。
この第１の樹脂部１５は、各電子部品１４の耐熱温度のうち最も低い耐熱温度Ｔ以下に加熱されたときに、加熱前よりも弾性率が一定以下となるものである。
最も低い耐熱温度Ｔは、一例として１５０℃（主にリフロー時の耐熱温度）である。 The first resin portion 15 covers the circuit pattern 12 and the solder 13 to supplement the mounting strength of each electronic component 14.
When the first resin portion 15 is heated to a temperature equal to or lower than the lowest heat resistance temperature T among the heat resistance temperatures of the electronic components 14, the elastic modulus becomes a certain value or lower than before the heating.
The lowest heat resistant temperature T is, for example, 150 ° C. (mainly the heat resistant temperature during reflow).

ここで、第１の樹脂部１５は、加熱前の状態において弾性率が確保されている。よって、第１の樹脂部１５は、基材１１に比較的強固に積層された状態に保たれる。これにより、第１の樹脂部１５で、ハンダ１３を覆うことにより各電子部品１４の実装強度を補完することが可能になる。
一方、第１の樹脂部１５は、前記最も低い耐熱温度Ｔ以下に加熱された状態において、弾性率が、一例として１００ＭＰａまで低下する。これにより、第１の樹脂部１５を基材１１から容易に剥離することが可能になる。 Here, the elastic modulus of the first resin portion 15 is ensured in a state before heating. Therefore, the first resin portion 15 is kept in a state of being relatively firmly laminated on the base material 11. As a result, the mounting strength of each electronic component 14 can be supplemented by covering the solder 13 with the first resin portion 15.
On the other hand, the elastic modulus of the first resin portion 15 is reduced to 100 MPa as an example in a state where the first resin portion 15 is heated to the lowest heat resistant temperature T or lower. Thereby, the first resin portion 15 can be easily peeled from the base material 11.

すなわち、第１の樹脂部１５を前記最も低い耐熱温度Ｔ以下に加熱して、第１の樹脂部１５を基材１１から剥離し易くすることで、回路パターン１２から端子部１４Ａをハンダ１３ごと簡単に取り外すことができる。   That is, by heating the first resin portion 15 below the lowest heat-resistant temperature T and making the first resin portion 15 easy to peel from the base material 11, the terminal portion 14 </ b> A is connected to the solder 13 from the circuit pattern 12. Easy to remove.

また、第１の樹脂部１５は、例えば、エポキシ系、アクリル系の樹脂が用いられる。第１の樹脂部１５の組成は、エポキシ系としては、ビスフェノールＡ型及び酸無水物（硬化剤）である。   In addition, for example, an epoxy resin or an acrylic resin is used for the first resin portion 15. The composition of the 1st resin part 15 is a bisphenol A type and an acid anhydride (curing agent) as an epoxy system.

第２の樹脂部１６は、弾性率が第1の樹脂部１５の弾性率よりも高く設定されている。
このように、弾性率の高い第２の樹脂部１６で各電子部品１４を覆うことで、各電子部品１４の実装強度をさらに向上できる。 The elastic modulus of the second resin part 16 is set higher than that of the first resin part 15.
Thus, the mounting strength of each electronic component 14 can be further improved by covering each electronic component 14 with the second resin portion 16 having a high elastic modulus.

つぎに、第１実施形態の回路基板１０の作用を図２および図３に基づいて説明する。
まず、図２に示す状態において、第１の樹脂部１５を、各電子部品１４の耐熱温度のうち最も低い耐熱温度Ｔ以下に加熱する。最も低い耐熱温度Ｔは、一例として１５０℃である。
第１の樹脂部１５を最も低い耐熱温度Ｔ以下に加熱することで、第１の樹脂部１５の弾性率が加熱前よりも一定以下となり、一例として１００ＭＰａまで低下する。これにより、第１の樹脂部１５を基材１１から容易に剥離することが可能になる。 Next, the operation of the circuit board 10 of the first embodiment will be described with reference to FIGS.
First, in the state shown in FIG. 2, the first resin portion 15 is heated to the lowest heat resistant temperature T or lower among the heat resistant temperatures of the electronic components 14. The lowest heat-resistant temperature T is 150 degreeC as an example.
By heating the first resin part 15 below the lowest heat-resistant temperature T, the elastic modulus of the first resin part 15 becomes a certain value or lower than before heating, and decreases to 100 MPa as an example. Thereby, the first resin portion 15 can be easily peeled from the base material 11.

図３に示すように、第１の樹脂部１５を基材１１から容易に剥離するとともに、回路パターン１２から端子部１４Ａをハンダ１３ごと簡単に取り外す。
これにより、各電子部品１４に損傷を与えることなく、回路パターン１２から端子部１４Ａが取り外される。
回路パターン１２から端子部１４Ａをハンダ１３ごと簡単に取り外すことで、基材１１のみの不良解析や各電子部品１４のみの不良解析を行うことができる。 As shown in FIG. 3, the first resin portion 15 is easily peeled from the substrate 11, and the terminal portion 14 </ b> A is easily removed from the circuit pattern 12 together with the solder 13.
Thereby, the terminal portion 14 </ b> A is removed from the circuit pattern 12 without damaging each electronic component 14.
By simply removing the terminal portion 14 </ b> A together with the solder 13 from the circuit pattern 12, it is possible to perform a failure analysis of only the base material 11 or a failure analysis of only each electronic component 14.

以下、第２〜第３実施形態を図４〜図５に基づいて説明する。なお、第２〜第３実施形態において、第１実施形態の回路基板１０と同一類似部材については同じ符号を付して説明を省略する。   Hereinafter, 2nd-3rd embodiment is described based on FIGS. 4-5. In addition, in 2nd-3rd embodiment, the same code | symbol is attached | subjected about the same similar member as the circuit board 10 of 1st Embodiment, and description is abbreviate | omitted.

（第２実施形態）
図４に示す第２実施形態の回路基板２０は、第１実施形態の第１の樹脂部１５に代えて樹脂部２１を用い、かつ第１実施形態の第２の樹脂部１６を用いないようにしたもので、その他の構成は第１実施形態の回路基板１０と同様である。
樹脂部２１は、回路パターン１２およびハンダ１３を覆い、加えて、各電子部品１４における本体１４ｂの一部を被覆するものである。 (Second Embodiment)
The circuit board 20 of the second embodiment shown in FIG. 4 uses the resin portion 21 instead of the first resin portion 15 of the first embodiment, and does not use the second resin portion 16 of the first embodiment. The other configuration is the same as that of the circuit board 10 of the first embodiment.
The resin part 21 covers the circuit pattern 12 and the solder 13, and in addition covers a part of the main body 14 b in each electronic component 14.

この樹脂部２１は、第１実施形態の第１の樹脂部１５と同じ組成である。よって、樹脂部２１は、第１実施形態の第１の樹脂部１５と同様に、各電子部品１４の耐熱温度のうち最も低い耐熱温度Ｔ以下に加熱されたときに、加熱前よりも弾性率が一定以下となるものである。   The resin part 21 has the same composition as the first resin part 15 of the first embodiment. Therefore, as with the first resin portion 15 of the first embodiment, the resin portion 21 has an elastic modulus higher than that before heating when heated to a temperature equal to or lower than the lowest heat resistant temperature T among the heat resistant temperatures of the electronic components 14. Is below a certain level.

第２実施形態の回路基板２０によれば、第１実施形態の回路基板１０と同様の効果が得られる。
加えて、第２実施形態の回路基板２０によれば、第２の樹脂部１６を用いないことにより、部材数を減らすことができ、かつ、第２の樹脂部１６を第１の樹脂部１５に積層する手間を省くことができる。 According to the circuit board 20 of the second embodiment, the same effect as the circuit board 10 of the first embodiment can be obtained.
In addition, according to the circuit board 20 of the second embodiment, by not using the second resin portion 16, the number of members can be reduced, and the second resin portion 16 is replaced with the first resin portion 15. It is possible to save the trouble of laminating.

（第３実施形態）
図５に示す第３実施形態の回路基板３０は、第１実施形態の第１の樹脂部１５および第２の樹脂部１６の外周を枠体３１で覆い、枠体３１の上開口部３１Ａを蓋体３２で覆ったもので、その他の構成は第１実施形態の回路基板１０と同様である。 (Third embodiment)
The circuit board 30 of the third embodiment shown in FIG. 5 covers the outer periphery of the first resin portion 15 and the second resin portion 16 of the first embodiment with a frame body 31, and the upper opening portion 31A of the frame body 31 is covered. The other structure is the same as that of the circuit board 10 of the first embodiment.

蓋体３２で枠体３１の上開口部３１Ａを覆った状態において、蓋体３２の切欠３２Ａと枠体３１とで供給口３３を形成する。
供給口３３は、第１の樹脂部１５および第２の樹脂部１６を枠体３１内に供給するための開口部である。 In a state where the upper opening 31 </ b> A of the frame body 31 is covered with the lid body 32, the supply port 33 is formed by the notch 32 </ b> A of the lid body 32 and the frame body 31.
The supply port 33 is an opening for supplying the first resin portion 15 and the second resin portion 16 into the frame body 31.

回路基板３０を製造する場合には、まず、基材１１の回路パターン１２にハンダ１３を介して端子部１４Ａを固定することにより複数の電子部品１４を実装する。
複数の電子部品１４を実装した後、供給口３３から枠体３１内の空間に第１の樹脂部１５を供給し、第１の樹脂部１５を基材１１に積層する。第１の樹脂部１５で、回路パターン１２、ハンダ１３、端子部１４Ａ、および各電子部品１４における本体１４ｂの一部を覆う。
つぎに、供給口３３から枠体３１の空間に第２の樹脂部１６を供給し、第２の樹脂部１６を第１の樹脂部１５に積層する。第１の樹脂部１５で各電子部品１４を覆う。 When manufacturing the circuit board 30, first, the plurality of electronic components 14 are mounted by fixing the terminal portions 14 </ b> A to the circuit pattern 12 of the base material 11 via the solder 13.
After mounting the plurality of electronic components 14, the first resin portion 15 is supplied from the supply port 33 to the space in the frame 31, and the first resin portion 15 is stacked on the base material 11. The first resin portion 15 covers the circuit pattern 12, the solder 13, the terminal portion 14A, and a part of the main body 14b in each electronic component 14.
Next, the second resin portion 16 is supplied from the supply port 33 to the space of the frame body 31, and the second resin portion 16 is stacked on the first resin portion 15. Each electronic component 14 is covered with the first resin portion 15.

第３実施形態の回路基板３０によれば、第１実施形態の回路基板１０と同様の効果が得られる。
加えて、第３実施形態の回路基板３０によれば、第１の樹脂部１５および第２の樹脂部１６を枠体３１や蓋体３２で覆うことで、枠体３１や蓋体３２で外力を受けることができる。これにより、複数の電子部品１４や、回路パターン１２に端子部１４Ａをハンダ付けした部位を、枠体３１や蓋体３２でより良好に保護できる。
また、第３実施形態の回路基板３０によれば、第１の樹脂部１５および第２の樹脂部１６を枠体３１で囲うことで、枠体３１が第１の樹脂部１５および第２の樹脂部１６と密着することができる。これにより、第１の樹脂部１５を基材１１から剥離する際に、第１の樹脂部１５から第２の樹脂部１６が離れることを防ぐことができる。 According to the circuit board 30 of the third embodiment, the same effect as the circuit board 10 of the first embodiment can be obtained.
In addition, according to the circuit board 30 of the third embodiment, the first resin portion 15 and the second resin portion 16 are covered with the frame body 31 and the lid body 32, so that the external force is applied by the frame body 31 and the lid body 32. Can receive. Thereby, the part which soldered terminal part 14A to a plurality of electronic parts 14 or circuit pattern 12 can be better protected with frame 31 or lid 32.
In addition, according to the circuit board 30 of the third embodiment, the frame body 31 is surrounded by the frame body 31 so that the frame body 31 is surrounded by the first resin section 15 and the second resin section 16. The resin part 16 can be adhered. Thereby, when peeling the 1st resin part 15 from the base material 11, it can prevent that the 2nd resin part 16 leaves | separates from the 1st resin part 15. FIG.

なお、前記第１実施形態では、第１の樹脂部１５で回路パターン１２およびハンダ１３を覆う例について説明したが、これに限らないで、少なくともハンダ１３を覆うことにより各電子部品１４の実装強度を補完することも可能である。   In the first embodiment, the example in which the circuit pattern 12 and the solder 13 are covered with the first resin portion 15 has been described. However, the present invention is not limited thereto, and at least the solder 13 covers the mounting strength of each electronic component 14. Can be supplemented.

さらに、前記第１実施形態では、第２の樹脂部１６で各電子部品１４における本体１４Ｂの全体を被覆する例について説明したが、これに限らないで、各電子部品１４における本体１４Ｂの少なくとも一部を被覆することにより各電子部品１４の実装強度を補完することも可能である。   Furthermore, in the first embodiment, the example in which the entire main body 14B of each electronic component 14 is covered with the second resin portion 16 has been described. However, the present invention is not limited to this, and at least one of the main bodies 14B of each electronic component 14 is not limited. It is also possible to supplement the mounting strength of each electronic component 14 by covering the portion.

本発明は、基材の回路パターンにハンダを介して端子部を固定することにより複数の電子部品が実装された回路基板および携帯端末への適用に好適である。   The present invention is suitable for application to a circuit board and a mobile terminal on which a plurality of electronic components are mounted by fixing terminal portions to a circuit pattern of a base material via solder.

本発明に係る回路基板の第１実施形態を示す断面図である。1 is a cross-sectional view showing a first embodiment of a circuit board according to the present invention. 図１の２部拡大図である。FIG. 2 is an enlarged view of part 2 of FIG. 1. 第１実施形態に係る回路基板において基材から複数の電子部品を取り外した状態を説明する図である。It is a figure explaining the state which removed the some electronic component from the base material in the circuit board which concerns on 1st Embodiment. 本発明に係る回路基板の第２実施形態を示す断面図である。It is sectional drawing which shows 2nd Embodiment of the circuit board based on this invention. 本発明に係る回路基板の第３実施形態を示す断面図である。It is sectional drawing which shows 3rd Embodiment of the circuit board based on this invention.

符号の説明Explanation of symbols

１０，２０，３０ 回路基板
１１ 基材
１２ 回路パターン
１３ ハンダ
１４ 電子部品
１４Ａ 端子部
１４ｂ 電子部品の本体
１５ 第１の樹脂部
１６ 第２の樹脂部
１７ 樹脂部
Ｔ 最も低い耐熱温度 DESCRIPTION OF SYMBOLS 10, 20, 30 Circuit board 11 Base material 12 Circuit pattern 13 Solder 14 Electronic component 14A Terminal part 14b Main part of electronic component 15 1st resin part 16 2nd resin part 17 Resin part T The lowest heat-resistant temperature

Claims (2)

回路パターンが形成された基材と、
前記回路パターンにハンダを介して固定される複数の電子部品と、
少なくとも前記ハンダを覆うように前記基材上に積層された第１の樹脂部と、
前記第１の樹脂部に積層され、かつ、前記複数の電子部品総ての本体を完全に被覆し、かつ、弾性率が前記第１の樹脂部の弾性率よりも高い第２の樹脂部と、
前記第１の樹脂部及び前記第２の樹脂部を囲うととともに、前記基材とは別部材である一体の枠体と、を有し、
前記第１の樹脂部は、前記枠体内に存在する前記回路パターン及び前記ハンダの総てを覆うとともに、前記枠体内に存在する前記複数の電子部品総ての前記基材に対向した面と当該基材との間の空間を満たすように、前記基材上に積層され、
前記一体の枠体は前記第１の樹脂部及び前記第２の樹脂部の側面の全域に渡って密着するとともに外部へ露出する回路基板。 A substrate on which a circuit pattern is formed;
A plurality of electronic components fixed to the circuit pattern via solder;
A first resin portion laminated on the substrate so as to cover at least the solder;
A second resin portion that is laminated on the first resin portion, completely covers the main body of all of the plurality of electronic components, and has a higher elastic modulus than the elastic modulus of the first resin portion; ,
And surrounding the first resin part and the second resin part, and having an integral frame that is a separate member from the base material ,
The first resin portion covers all of the circuit pattern and the solder existing in the frame, and faces the base of all the plurality of electronic components existing in the frame, and Laminated on the base material so as to fill the space between the base material,
The integrated frame is a circuit board that is in close contact with the entire side surfaces of the first resin portion and the second resin portion and is exposed to the outside . 請求項１に記載の回路基板を有する携帯端末。   A portable terminal comprising the circuit board according to claim 1.
JP2006194604A 2006-07-14 2006-07-14 Circuit board and portable terminal Expired - Fee Related JP4939861B2 (en)

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JPH0864926A (en) * 1994-08-26 1996-03-08 Fujitsu Ltd Mounting structure of semiconductor chip
JPH1126897A (en) * 1997-07-03 1999-01-29 Fujitsu Ten Ltd Substrate mounting structure
KR20010088292A (en) * 1998-04-24 2001-09-26 추후보정 Flip chip devices with flexible conductive adhesive
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