JP2003324278A - Wiring member and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily provide a low price wiring member having higher reliability which is reduced in size and integrated as required for transferring an electrical signal between members required for an electronic device which is reduced in size. <P>SOLUTION: There is provided a wiring member 1 which is formed integrally including a board 2 and a wiring portion 3 mainly formed in shapes of films. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring member and a method for manufacturing a wiring member, and more particularly to a wiring in which a substrate portion and a wiring portion are integrally formed without a joint portion such as solder. It relates to members.

[0002]

2. Description of the Related Art Conventionally, in general, a desired electric signal is taken out from at least one substrate portion or an appropriate semiconductor device and the electric signal is transmitted to another substrate portion or another semiconductor device, or A flexible wiring portion having an appropriate width, thickness, and length has been used in order to input a necessary electric signal from the outside to a substrate portion or an appropriate semiconductor device. Such a conventional board portion or semiconductor device and the wiring portion are manufactured separately, and at the required time, that is, when it is necessary to connect the both, the connection terminal portions of the both are electrically conductive such as solder. They are connected using a connection means that guarantees the sex. Therefore, a manufacturing process of each member is required individually, and at the same time, a process of connecting the substrate part and the wiring part, which are individually manufactured, is required. There was a problem that the manufacturing cost would rise.

Incidentally, FIG. 4A is a cross-sectional view showing an example of a conventional flexible wiring portion, in which a conductor layer 7 and a cover film layer 8 are laminated only on one side of a base film 6, An appropriate surface layer 14 is provided on a part of the conductor layer 7, and an appropriate reinforcing material 16 is arranged on the opposite side of the base film 6. On the other hand, FIG. 4B is a cross-sectional view showing another example of a conventional flexible wiring part, in which a conductor layer 7 and a cover film layer 8 are laminated on both sides of a base film 6, An appropriate surface layer 14 is provided on a part of the conductor layer 7,
In addition, an appropriate reinforcing material 1 is provided on the opposite side of the base film 6.
6 is arranged. Incidentally, in this conventional example, a configuration in which the through hole 12 is provided in the base film 6 of the flexible wiring portion is adopted.

Further, as shown in FIG. 7, in the conventional case, for example, a desired control is performed by electrically connecting two hard substrates 2 and 2'on which appropriate semiconductor devices 4 and 4'are mounted. When transmitting signals or information signals, connectors 5 are provided on both ends of a flexible sheet (FPC) 3 having a built-in wiring section.
5'is attached or is joined to a predetermined signal terminal portion of each rigid board by using an appropriate solder.

Further, in recent years, with downsizing of electronic devices, a board portion and a wiring portion used for them have been downsized, and as a result, a manufacturing process of the substrate portion or the wiring portion is also performed. In addition to becoming more complicated, the step of joining the both becomes smaller and the work becomes complicated and complicated.

On the other hand, in the prior art, for example, Japanese Unexamined Patent Publication No.
As disclosed in Japanese Patent No. 62543, there is disclosed a flexible wiring sheet in which a flat wire harness is formed by a plurality of wiring portions and the wiring portions are branched. However, in the conventional example, simply, , Only a technique of forming a branch wiring part or a foldable branch wiring part in a part of a single wiring layer is disclosed, and the end of the wiring part is
It merely shows a configuration in which a corresponding substrate portion or a predetermined signal terminal portion of a semiconductor device is connected via a separately formed connector portion, and a substrate portion having a thickness and flexible wiring as in the present invention are shown. There is no disclosure or suggestion of a wiring member having a structure in which a sheet and a sheet are integrated without the presence of a joint.

Therefore, an object of the present invention is to solve the above-mentioned drawbacks of the related art and to provide a substrate portion, a semiconductor device, a control device, or the like, which are necessary in a miniaturized electronic device, or between the substrate portion and the semiconductor device. Or, to provide easily and inexpensively, a miniaturized and integrated highly reliable wiring member necessary for transmitting an electric signal between control devices,
Furthermore, it is possible to easily manufacture the wiring member,
A method for manufacturing a wiring member is provided.

[0008]

In order to achieve the above-mentioned object, the present invention adopts the following basic technical constitution. That is, the first aspect of the present invention is a wiring member characterized in that the substrate portion and the wiring portion are integrally formed mainly of a film body. As a second aspect, a step of laminating a plurality of unit forming layers composed of a conductive member layer and a cover film layer on at least one surface of a base film via an appropriate adhesive layer, and the laminated film. A step of taking out a wiring member forming body in which a substrate portion having a desired shape and a wiring portion having a desired width and length, which are viewed in a plan view, are integrated from the body, and configuring the wiring portion of the wiring forming body And a step of removing at least a part of the unit forming layers of the plurality of laminated unit forming layers in the portion to be removed, the manufacturing method of the wiring member.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Since the wiring member of the present invention adopts the technical structure as described above, it is composed of a desired substrate portion or a desired sensor portion and a wiring portion in a desired electronic device. In general measuring equipment, electrical connection between necessary board parts, semiconductor devices, control devices, etc. in the miniaturized electronic equipment, or between the board parts, semiconductor devices, or control devices. It is possible to easily and inexpensively provide a downsized and integrated wiring member required for transmitting a signal.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a specific example of the wiring member according to the present invention will be described in detail below with reference to the drawings. That is,
FIG. 1A is a schematic view showing a specific example of a wiring member according to the present invention, in which wiring in which a substrate portion 2 and a wiring portion 3 are integrally formed mainly of a film body. Member 1 is shown. That is, in the wiring member 1 according to the present invention, it is desirable that the wiring portion 3 is made of a flexible sheet. Further, in the wiring member 1 according to the present invention, it is preferable that the substrate portion 2 is configured so that the thickness T thereof is larger than the thickness t of the wiring portion 3.

Further, in the present invention, the substrate portion 2 concerned
Is also preferably formed and arranged at both ends of the wiring part 3. On the other hand, in the wiring member 1 according to the present invention, the board portion 2 is preferably harder than the wiring portion 3. This is expected to mount appropriate transistors, memories, CPUs, and other semiconductor elements 4, 4 ', 4 "on the board portion 2 as in the conventional technique. Is required to have sufficient strength to mount the semiconductor elements.

A further characteristic of the present invention is that there is no connection structure portion including solder between the substrate portion 2 and the wiring portion 3. Therefore, in the present invention, as in the prior art, an appropriate signal receiving / transmitting terminal portion of the substrate portion 2 or a signal receiving / transmitting terminal portion of the semiconductor element portion and at least one end portion of the wiring portion 3 are provided. It is not necessary to perform an operation of electrically connecting the connecting portion using a technique such as soldering, and the substrate portion 2 can be used in the manufacturing process.
Since the wiring part 3 and the wiring part 3 are integrally connected in advance, the structure itself is simple and downsized, the manufacturing method is simplified, and at the same time when the wiring member 1 is used. Since there is no connection processing of, the wiring processing operation becomes extremely easy. As described above, in the wiring member 1 according to the present invention, the substrate portion 2 is an appropriate transistor,
It is necessary to have a function as a mounting board on which a memory, a CPU, and other semiconductor devices are mounted.

As another mode of the wiring member 1 in the present invention, as shown in FIG. 1 (B), the above-mentioned substrate portion 2 is arranged only at one end of the wiring portion 3. The other end of the wiring portion 3 constitutes a free end, and is configured to be connected to another substrate portion or a semiconductor device 2 ′ or the like which is configured as an appropriate separate body by an appropriate connector or solder 5 or the like. It may be one that has been done. Further, FIG. 1C shows still another aspect of the wiring member 1 according to the present invention, in which the wiring portion 3 is separated and separated from a plurality of laminated unit forming layers, A plurality of independent wiring portions 3 and 3 ′ which function as individual wiring portions are integrally formed with the substrate portion 2. As shown in FIG. 1 (A), another substrate part 2 ′ may be connected to the other end of each of the separated wiring parts 3, 3 ′, etc. )
It may be formed as a free end as shown in FIG. The wiring layer made of the respective conductors in the wiring member 1 according to the present invention has a wiring pattern as shown in FIG. 1D in each conductive member layer portion.

A more specific structure of the wiring member 1 according to the present invention will be described below. FIG. 2 is a cross-sectional view showing the outline of the configuration of one specific example of the wiring member 1 according to the present invention, in which the board portion 2 is integrally arranged only at one end of the wiring portion 3. The wiring member 1 of a structure is shown.
That is, the board portion 2 of the wiring member 1 according to the present invention.
As illustrated in FIG. 2, the conductive member layer 7 and the cover film layer 8 are provided on at least one surface of the appropriate base film 6.
It is desirable that the unit forming layer 9 composed of and is laminated by one layer or a plurality of appropriate adhesive layers 10 if necessary. Incidentally, it is desirable that an appropriate resist layer 13 and an appropriate surface treatment layer 14 are arranged on the upper surface of the conductive member layer 7 so as to have an appropriate pattern. Similarly, it is desirable that an appropriate resist layer 13 and an appropriate surface treatment layer 14 are arranged on the lower surface of the substrate portion 2 with an appropriate pattern.

Further, the concrete example of FIG. 2 shows an example in which the above-mentioned unit forming layers 9 and 9 ′ are arranged and formed on both sides of the base film 6. Further, the wiring portion 3 in the present concrete example has a conductive member layer 7 as shown in FIG.
It may be composed of one unit forming layer 9 composed of a cover film layer 8 and a cover film layer 8, and FIG.
As illustrated in (A), the wiring portion 3 has an adhesive layer 10
As shown in FIG. 3 (B), two unit forming layers 9 and 9 ′ are laminated with a layer sandwiched between them, and then the adhesive layer 10 is removed or the adhesive function is lost. The unit forming layers 9 and 9 ′ may be separated from each other and separated to be used as independent wiring portions.

The material of the base film 6 used in the present invention is not particularly limited, but, for example, a polyimide film, a polyester film or the like having an appropriate thickness can be used. Further, the number of layers of the unit forming layer 9 laminated on both front and back surfaces of the base film 6 or on one side surface of the base film 6 in the present invention is not particularly limited, and is required for the substrate unit 2. The thickness T and the wiring configuration required for the substrate section 2 are determined. Also, the material of the adhesive layer 10 used in the present invention is not particularly limited, and a predetermined treating agent is used when removing or separating the predetermined unit forming layer 9 described later. Therefore, it is desirable to use a chemical substance whose adhesive function can be easily reduced.

In the wiring portion 3 of the wiring member 1 according to the present invention, at least a part of the plurality of unit forming layers forming the substrate portion 2 extends to the outside of the substrate portion 2. It is preferably formed. That is, in the present invention, as shown in FIG.
A planar design in which a portion that constitutes the substrate portion 2 and a portion that constitutes the wiring portion 3 are integrated from a laminated body 100 in which a plurality of unit forming layers 9 are laminated with an adhesive layer 10 in between. , A wiring formation body 110 having a shape is cut out, and the substrate section 2 is constituted by a plurality of unit formation layers 9 constituting the laminated body 100 by using a method described later. The part 3 is a part of the plurality of unit forming layers 9 forming the laminate 100.
Is formed by being extended from the substrate portion 2 to the outside.

Therefore, the board portion 2 and the wiring portion 3 of the wiring member 1 according to the present invention are integrally formed, and a conductive material such as solder is used at the joint portion between the two. The connection structure used does not exist at all, therefore
Even if the structure is minimized, the manufacturing cost can be kept low, and at the same time, the yield is high without the bonding treatment operation, and since there is no bonding structure, the thickness can be made extremely thin. Become. On the other hand, it is desirable that the board portion 2 has a function as a mounting board as described above. Therefore, as shown in FIG. 2, the board portion 2 is formed with the board portion as needed. At least one of the desired base film 6, the conductive member layer 7, the cover film 8 and the adhesive layer 10 is provided with the conductive wire portion 11 that electrically connects arbitrary unit formation layers different from each other in the plurality of unit formation layers 9. It is desirable that it is formed so as to penetrate therethrough.

According to the function of the substrate portion 2, the conductor portion 11 has the respective laminated positions of the laminated unit forming layers 9 and the arrangement positions of the connection terminals arranged on the surface of the substrate portion 2. Is designed and arranged. or,
Although not shown, when the conductor portion 11 penetrates the conductive member layer 7 in each unit forming layer substantially vertically, an appropriate via hole 12 is formed in the conductive member layer 7 and It is desirable to penetrate the inside through an appropriate insulator. In the wiring member 1 according to the present invention, the width w of the wiring portion 3 in the plane shape is orthogonal to the longitudinal direction.
Is preferably smaller than the width W in the same direction in the planar shape of the substrate portion 2.

Further, in the present invention, it is desirable that an appropriate resist film 13 is disposed on the surface portion of the substrate portion 2 and that an appropriate surface treatment layer 14 is provided. Is also good. Further, in the present invention, the substrate portion 2
The surface of the semiconductor device 4 mounted on the substrate 2 is
Alternatively, the terminal portion 15 to which another wiring portion or the like is connected may be provided.

Next, in the wiring member 1 according to the present invention, at least one surface of the base film 6 and, if necessary, both surfaces of the base film 6, the conductive member layer 7 and an appropriate cover. The unit forming layer 9 including the film layer 8 is laminated in a single layer or a plurality of layers to form the unit forming layer 9
And an appropriate adhesive layer 10 between the base film 6 and the unit forming layers 9 laminated on each other.
It is laminated and fixed by interposing. In addition, in the above-mentioned specific example of the present invention, the portion constituting the substrate portion 2 is configured by using the thickness of the laminated film body 100 having the above-described film configuration as it is. Each conductive member layer 7 disposed on each of the plurality of unit forming layers 9 forming the substrate portion 2 is appropriately connected to another conductive member layer 7 forming another appropriate unit forming layer 9. It is electrically connected to the vertically formed conductive wire portion 11 via the via hole 12.

On the other hand, the wiring portion 3 according to the present invention has the same structure as the portion corresponding to the substrate portion 2 in the laminated film body 100, as shown by the dotted line in FIG. The other unit forming layers 9 are separated and removed from the portion corresponding to the substrate portion 2, leaving only the unit forming layer 9 forming the portion corresponding to the wiring portion 3. Further, in the above-described specific example, the adhesive layer 10 is provided between the contact surfaces of the base film 6 and the cover film layer 8.
Although it is possible to provide the above, it is also possible to perform an appropriate connection process without providing the adhesive layer 10.

In the wiring member 1 according to the present invention as shown in FIG. 2, as the cover film layer 8, for example, a polyimide film, a polyester film, a cover coat (heat UV curing, photo solder resist) or the like is used. The conductive member layer 7 can be made of a copper foil material such as an electrolytic copper foil or a rolled copper foil. On the other hand, as the surface treatment layer 14 used in the present invention, for example, a rust preventive treatment material, a heat resistant rust preventive treatment material, a solder treatment material, a plating treatment (solder, nickel,
It is possible to use gold plating, bonding gold plating material, etc. Further, in the present invention, an appropriate reinforcing material can be used to reinforce the wiring member 1. The reinforcing material 14 is, for example, a reinforcing film made of a polyimide film, a polyester film or the like. ,
Paper phenol, glass epoxy (FR-4), CEM-3 resin molded product (laminate composed of polyetherimide (Ultem), polyether sulfone, etc., or aluminum, silicon rigid plate, galvanized rigid plate, etc. It is possible to use a metal plate or the like.

Next, the wiring member 1 according to the present invention described above.
A specific example of the manufacturing method will be described in detail below. That is,
As a method of manufacturing the wiring member 1 according to the present invention, basically, as shown in FIG. 8, a conductive member layer 7 and a cover film layer 8 are formed on at least one surface of a base film 6. A plurality of unit forming layers 9 and an appropriate adhesive layer 10
A step of forming the laminated film body 100 by laminating the substrate body 2 having a desired shape and a wiring portion 3 having a desired width and length in a plan view from the laminated film body 100.
A step of taking out the wiring member forming body 110 in which
And a step of removing at least a part of the unit forming layers 9 of the plurality of laminated unit forming layers 9 in a portion of the wiring forming body 110 that constitutes the wiring unit 3. This is a method of manufacturing a wiring member that has been used.

In the present invention, the desired unit forming layer 9
In the step of removing the adhesive layer 10, at least a part of the adhesive layer 10 of the laminated unit forming layers 9 in the portion forming the wiring portion 3 of the wiring forming body 110 is removed, or Of the laminated unit forming layers 9 in the portion forming the wiring portion 3 of the wiring forming body 110, the portion forming the wiring portion 3 of the wiring forming body 110 and the substrate portion 2 are connected to each other. It is preferable to perform a cutting process on the boundary with the constituent part. That is, in the method for manufacturing the wiring member 1 according to the present invention, a plurality of the unit forming layers 9 are laminated and at the site where the substrate portion 2 is to be formed as shown in FIG. It is desirable that a three-dimensional wiring structure is formed in advance in response to a wiring layout designed in advance.

Thereafter, as shown in FIG. 8A, appropriate means are used in accordance with a predetermined design of the wiring member 1 from the laminated structure 100 in which the unit forming layers 9 are appropriately laminated. Then, as shown in FIG. 8B, it is desirable to add a step of cutting out one or a plurality of the wiring forming bodies 110 which are the bases of the wiring member 1. Then, with respect to the wiring forming body 110, for example, a blade or a laser is used for the unit forming layer 9 to be separated or removed among the unit forming layers 9 of the portion forming the wiring portion 3. It is unnecessary to dispose an appropriate protective film or the like on the side surface or the like of the unit forming layer 9 where a necessary portion is to be cut or to be left and to treat the adhesive layer 10 with a treatment material capable of destroying or dissolving. The operation of separating and removing the different unit forming layers 9 is performed.

Further, in the present invention, the wiring portion 3 extended from the substrate portion 2 does not necessarily have to be one, and a plurality of wiring portions 3 are simultaneously formed. Is also good. That is, as shown in FIG. 8 (D), two wiring parts 3 may be arranged in parallel and connected to the same substrate part 2 ', or different substrate parts 2'can be used. It is also possible to separately connect them to each other by 2 ". Further, as another specific example, as shown in FIG. 8E, the one substrate portion 2'is divided into two stages. At the same time, the wiring part 3 can be divided into two layers and branched, and the wiring parts 3 and 3'can be individually connected to the substrate parts 2'and 2 ". Of course, in the wiring member 1 according to the present invention, it is also possible to leave the substrate 2 at the end of each branched wiring portion 3 without providing the substrate 2. That is, in the above-mentioned specific example, it is necessary to appropriately change the thicknesses of the board portion 2 and the wiring portion 3 according to the respective designs.

An example of changing the thickness of the wiring part 3 is, as shown concretely above, in the combination of the unit forming layer 9 and the adhesive layer 10 constituting the wiring part 3,
It is also possible to separate the unit forming layers 9 from each other or from the base film 6 to form a bifurcated shape. That is,
In order to manufacture the above wiring member 1 according to the present invention,
It is also preferable to add a step of forming the wiring portion in a structure in which a plurality of unit forming layers are stacked and then separating and separating the unit forming layers to form independent wiring portions. In such a structure, it can be used as a jumper wiring. In addition, the board portion 2 or the wiring portion 3
As a method of changing the thickness of the base film 6
Alternatively, the thickness of the reinforcing material 14 may be changed, or the thickness of the cover film layer 8 may be changed within the range of 12.5 to 50 μm. In addition, it is possible to change the thickness of the base film 6 by using glass epoxy (FR-4) or a metal plate.

Application examples of the above specific examples are illustrated in FIGS. 5 and 6, respectively. In the wiring member 1 according to the present invention described above, in consideration of mounting electronic components, it becomes possible to mount the CSP on the same level as that of the conventional hard substrate.
Since it is possible to realize buildup and the like, it is possible to sufficiently cope with high-density mounting. Further, the wiring member 1 in the present invention is characterized in that it is light and thin as a whole. Especially, if the base film 6 is a polyimide film, its thickness can be made thin, and at the same time it is light and strong. A film body will be obtained. Further, in the present invention, the device can be downsized by the three-dimensional wiring utilizing the plastic deformation of the conductor material. On the other hand, in the present invention, a more optimal shape can be realized by appropriately selecting the material and thickness of the conductor according to the application. More specifically, by integrating the board and the cable, a connector, a hard board, and an FPC are not required, which is optimal for use in a small device.

On the other hand, in the wiring member 1 of the present invention, when the housing design is determined,
The rigid board and cable can be designed as a unit, which improves the flexibility of pattern design. In addition, the restrictions on mounting connectors between cables and boards are released, and the degree of freedom in design is dramatically improved. In addition, since the conductor is laminated with an insulator, a plurality of small connection parts can be integrated. Furthermore, in the present invention, since no connector is used, no contact failure occurs, and since the substrate is polyimide for all layers, there is no difference in the temperature characteristics of the materials and the reliability of the through holes is high. high. On the other hand, in the past, since it was necessary to install the FPC connection parts (solder pads, connectors, etc.) on the hard substrate, the flexibility of component mounting and wiring pattern was reduced, and the reliability of the connection part was also reduced. Is lower than that of the integrated type as in the present invention.

Conventionally, when connecting with solder, it is necessary to manage the positions of the FPC and the pads on the hard substrate (to perform a welding process together, and a dedicated positioning jig for that purpose is required). ) Is required, and it is generally difficult to perform the connection processing operation in a form incorporated in the housing. Further, in the conventional case, a separate manufacturing process was required for the hard substrate and the FPC, so that an increase in cost was inevitable. Generally, it is estimated that the conventional method costs about twice as much as the initial investment cost when using the present invention. That is, in the case of a hard substrate and an FPC, the initial cost for manufacturing the hard substrate, the initial cost for manufacturing the FPC, and the cost for connecting the hard substrate and the FPC are high. If the FPC is integrated with the FPC, only the initial cost of the FPC is required. Further, it is possible to obtain an effect that the number of parts and the work process are reduced. On the other hand, in the present invention, since there is no connecting portion between the substrate and the FPC, the connection reliability is high, which is advantageous as compared with the conventional method. Further, in the present invention, since the bonding pad with the FPC is not required, there is an effect that the space for wiring and mounting of components is widened.

Here, a more specific structure of the wiring member 1 according to the present invention is illustrated in FIG. That is, in the wiring member 1 of FIG. 9, among the plurality of unit forming layers forming the laminate 100, the uppermost unit forming layer 9 is extended outward from the substrate portion 2 to form the wiring portion 3. It has a forming structure. More specifically, about 50 μm is formed on the upper surface of the base film 6 made of polyimide having a thickness of about 50 μm.
A bonding sheet, which is an adhesive layer 10 having a thickness of, is laminated, and a polyimide layer having a thickness of about 12.5 μm as a cover sheet 8 is further provided on the upper surface thereof, and a thickness of about 12 μm is provided on the upper surface of the polyimide layer. A conductive member layer 7 is formed by laminating the electrolytic copper foil layer 7 ′ and the copper plating layer 7 ″ having a thickness of about 10 μm.

Further, on the upper surface of the conductive member layer 7, a resist film layer 13 made of a suitable resist having a thickness of about 10 μm, and a resist film layer 13 having a thickness of about 3 μm arranged at a suitable position of the resist film layer 13. Solder plating 17 having a thickness is arranged. On the other hand, on the other surface of the base film 6, that is, on the lower surface, a bonding sheet, which is an adhesive layer 10 having a thickness of about 35 μm, is laminated, and on the lower surface thereof, a cover sheet 8 of about 12. A polyimide layer having a thickness of 5 μm and an electrolytic copper foil layer 7 ′ having a thickness of about 12 μm on the lower surface of the polyimide layer 8 and a thickness of about 10 μm.
A conductive member layer 7 is formed by laminating a copper plating layer 7 ″ having a thickness of m.

It should be noted that, below the conductive member layer 7, about 50 μm is provided via an adhesive layer 10 having a thickness of about 35 μm.
A polyimide layer having a thickness of m may be arranged as an appropriate cover film 8. In the above-described wiring member 1 according to the present invention, as shown in FIG. 9, each of the above-mentioned components except the substrate portion 2 and excluding the uppermost unit forming layer 9 that constitutes the wiring portion 3 is used. The film layer, mainly the bonding sheet portion which is the adhesive layer 10 having a thickness of about 50 μm,
About 1 unit formation layer forming the unit formation layer 9 of the uppermost layer
Polyimide layer cover sheet 8 having a thickness of 2.5 μm
From the substrate part 2 and the wiring part 3
The boundary portion forming the boundary portion with and is cut by using a suitable cutting means.

By the method of manufacturing a wiring member according to the present invention, it is possible to form an FPC having board portions having different thicknesses on both sides of which components can be mounted, and at the same time, to form portions having different thicknesses. The layer structure of the laminate 100 can be designed. In other words, the feature of the present invention is that the thickness is not increased by attaching a reinforcing plate after manufacturing a thin FPC that partially becomes double-sided or single-sided FPC. In addition, in the method for manufacturing the wiring member according to the present invention, it is desirable that the base film 6 is designed so as to remain on the side of the substrate portion 2 having a thickness. It is necessary to design the composition of the membrane layers.

Further, in the present invention, a multi-layer FPC
Can be formed, and the thickness can be changed according to usage conditions. The wiring part 3 of the present invention
As the thinnest thickness, for example, about 30 μm
Is. On the other hand, since the thin portion of the wiring portion in the present invention is used for mounting a sensor IC having a height limit to the detection surface, its thickness is about 40 μm and the thick portion is connected to the FPC connector. Thickness is about 300μm
Is desirable. Further, in the present invention, circuit adjustment is performed after the wiring member 1 is incorporated in the housing.
As shown in FIG. 9, a connection adjustment terminal X for connection with an external circuit is provided for that purpose, and it is possible to cut off the adjustment terminal X that is wasted after the adjustment is completed.

[0037]

Since the present invention adopts the above-mentioned structure, it solves the above-mentioned problems of the prior art and requires a substrate portion, a semiconductor device or a control unit in a downsized electronic device. It is possible to easily and inexpensively obtain a miniaturized and integrated highly reliable wiring member necessary for transmitting an electrical signal between devices or the like, or between the substrate portion, the semiconductor device or the control device. Further, the present invention provides a method for manufacturing a wiring member, which enables easy manufacturing of the wiring member.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a specific example of a wiring member according to the present invention.

FIG. 2 is a cross-sectional view showing the structure of another specific example of the wiring member according to the present invention.

FIG. 3 is a cross-sectional view showing a configuration of a specific example of a conventional wiring member.

FIG. 4 is a cross-sectional view showing the configuration of another specific example of the conventional wiring member.

FIG. 5 is a diagram showing an application example in which a wiring member according to a specific example of the present invention is used.

FIG. 6 is a diagram showing another application example in which the wiring member according to one specific example of the present invention is used.

FIG. 7 is a perspective view showing a configuration example of a conventional wiring member portion.

FIG. 8 is a diagram illustrating an example of a procedure of a method for manufacturing a wiring member according to the present invention.

FIG. 9 is a diagram illustrating an example of a method for manufacturing a wiring member according to the present invention.

[Explanation of symbols]

1 wiring member 2 board part 3 Wiring part, flexible sheet 4 Semiconductor device 5 connector 6 base film 7 Conductive member layer 8 Cover film layer 9 unit formation layer 10 Adhesive layer 11 Conductor 12 beer hall 13 Resist film 14 Surface treatment layer 16 Reinforcement layer 100 laminated film body 110 wiring formation

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 1/11 H05K 1/11 C 3/00 3/00 X F term (reference) 5E317 AA04 AA24 BB03 BB11 CD23 CD31 CD34 GG16 5E338 AA03 AA12 AA16 BB02 BB13 BB25 BB31 BB63 BB75 CC01 CD33 CD40 EE22 EE32 5E346 AA05 AA06 AA12 AA15 AA16 AA17 AA22 AA41 BB01 BB16 CC10 CC12 CC31 DD02 EE01H22EE24 EE02H22

Claims (19)

[Claims] 1. A wiring member in which a substrate portion and a wiring portion are integrally formed mainly with a film body. 2. The wiring member according to claim 1, wherein the wiring portion is made of a flexible sheet. 3. The wiring member according to claim 1, wherein the substrate portion is configured such that its thickness is larger than that of the wiring portion. 4. The wiring member according to claim 1, wherein the substrate portion is harder than the wiring portion. 5. The wiring member according to claim 1, wherein no connection structure portion including solder is present between the board portion and the wiring portion. 6. The wiring member according to claim 1, wherein the board portion has a function of a mounting board on which a semiconductor device is mounted. 7. The substrate part has a unit forming layer composed of a conductive member layer and a cover film layer laminated on at least one surface of a base film via a plurality of appropriate adhesive layers. The wiring member according to claim 1, wherein the wiring member is a wiring member. 8. The wiring portion is formed by extending at least a part of a plurality of unit forming layers forming the substrate portion. The wiring member according to claim 1. 9. The wiring member according to claim 1, wherein the board portion is arranged and formed at both ends of the wiring portion. 10. The substrate section is provided with a conductive wire section for electrically connecting arbitrary unit formation layers different from each other in a plurality of unit formation layers forming the substrate section to a desired base film and a conductive layer. The wiring member according to any one of claims 1 to 9, wherein the wiring member is formed so as to penetrate at least one of the member layer, the cover film, and the adhesive layer. 11. The width of the wiring portion in the plane shape orthogonal to the longitudinal direction is shorter than the width of the wiring portion in the same direction in the plane shape.
The wiring member according to any one of 0. 12. An appropriate resist film is disposed on the surface of the substrate portion, according to any one of claims 1 to 1.
1. The wiring member according to any one of 1. 13. The terminal portion to which a semiconductor device mounted on the substrate portion, another wiring portion, or the like is connected to the surface portion of the substrate portion. The wiring member according to any one of 1. 14. The plurality of wiring portions are extended from one substrate portion.
The wiring member according to any one of 3 above. 15. The plurality of wiring portions are formed by separating and separating from the wiring portion forming body in which the plurality of unit forming layers are laminated. 14. The wiring member according to 14. 16. At least one surface of the base film,
A step of laminating a plurality of unit forming layers composed of a conductive member layer and a cover film layer via an appropriate adhesive layer, and having a desired shape when viewed in plan from the laminated film body. A step of taking out a wiring member forming body in which a substrate portion and a wiring portion having a desired width and length are integrated, and unit formation of the laminated plural layers in a portion forming the wiring portion of the wiring forming body And a step of removing at least a part of the unit forming layer among the layers, the manufacturing method of the wiring member. 17. The step of removing the desired unit forming layer includes the step of adhering at least a part of the plurality of laminated unit forming layers in a portion of the wiring forming body which constitutes the wiring section. A layer is removed or a portion of the wiring forming body that constitutes the wiring portion and a portion of the wiring forming body that constitutes the wiring portion and the substrate portion among the laminated unit forming layers of the plurality of layers. The method for manufacturing a wiring member according to claim 15, wherein a boundary portion between the wiring member and a portion that constitutes the wiring member is cut. 18. The method according to claim 16, wherein a step of cutting out a plurality of the wiring forming bodies which are the bases of the wiring members is added from a laminated body in which a plurality of the unit forming layers are laminated. A method for manufacturing a wiring member according to. 19. A step of forming the wiring part in a structure in which a plurality of unit forming layers are laminated and then separating and separating the unit forming layers to form independent wiring parts is added. The method for manufacturing a wiring member according to any one of claims 16 to 18.