JP2013089943A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
JP2013089943A
JP2013089943A JP2011288634A JP2011288634A JP2013089943A JP 2013089943 A JP2013089943 A JP 2013089943A JP 2011288634 A JP2011288634 A JP 2011288634A JP 2011288634 A JP2011288634 A JP 2011288634A JP 2013089943 A JP2013089943 A JP 2013089943A
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Japan
Prior art keywords
printed circuit
circuit board
support member
solder resist
base substrate
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JP2011288634A
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Japanese (ja)
Inventor
Young Su Jang
ス ジャン・ヨン
Kyung Tae Kim
テ キム・キュン
Soon Jin Cho
ジン チョ・ソン
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of JP2013089943A publication Critical patent/JP2013089943A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board.SOLUTION: The printed circuit board comprises: a base substrate which has a first face and a second face, the second face having a circuit layer formed, and the circuit layer containing connection pads and a circuit pattern; a solder resist formed to have openings to expose the connection pads on the second face of the base substrate; a bridge member formed on the solder resist and formed at part of the solder resist; and a support member formed on the bridge member so as to cover the second face of the base substrate.

Description

本発明は、プリント回路基板に関する。   The present invention relates to a printed circuit board.

以下の特許文献１（１９９８年１０月７日公開）に開示されているように、プリント回路基板に半導体チップを実装する工程は、高密度実装のために、半導体チップをプリント回路基板の上面に直接実装した後、プリント回路基板と半導体チップとの間の電気的な連結工程により行われる。
その後、パッケージング工程は、プリント回路基板上に実装された半導体チップを覆うように熱硬化性樹脂を塗布する。 As disclosed in the following Patent Document 1 (published on Oct. 7, 1998), the step of mounting a semiconductor chip on a printed circuit board is performed on the upper surface of the printed circuit board for high-density mounting. After the direct mounting, the electrical connection process between the printed circuit board and the semiconductor chip is performed.
Thereafter, in the packaging process, a thermosetting resin is applied so as to cover the semiconductor chip mounted on the printed circuit board.

ここで、半導体チップを実装する面の反対面であるプリント回路基板の下部面にまで熱硬化性樹脂が塗布される場合があるが、このような場合、プリント回路基板の下部面に形成された接続パッドなどに影響を及ぼす問題点がある。   Here, the thermosetting resin may be applied to the lower surface of the printed circuit board, which is the opposite surface to the surface on which the semiconductor chip is mounted. In such a case, the thermosetting resin is formed on the lower surface of the printed circuit board. There is a problem affecting connection pads.

韓国公開特許第１０−１９９８−０５９２３９号公報Korean Published Patent No. 10-1998-059239

本発明は、上記従来技術の問題点を解決するためのものであり、本発明は、製造工程中にプリント回路基板のメインボード形成面を保護できるようにするためのプリント回路基板を提供することを目的とする。   The present invention is to solve the above-mentioned problems of the prior art, and the present invention provides a printed circuit board for protecting the main board forming surface of the printed circuit board during the manufacturing process. With the goal.

本発明の実施例によるプリント回路基板は、第１面及び第２面を有し、前記第２面に接続パッド及び回路パターンを含む回路層が形成されたベース基板と、前記ベース基板の第２面に前記接続パッドを露出させる開口部を有するように形成されたソルダレジストと、前記ソルダレジスト上に形成され、前記ソルダレジストの一部に形成されたブリッジ部材と、前記ブリッジ部材上に形成され、前記ベース基板の第２面を覆うように形成された支持部材と、を含み、前記第１面は半導体素子の実装面であり、前記第２面はメインボードの形成面であってもよい。
ここで、前記ブリッジ部材はソルダ材質からなってもよい。
また、前記支持部材は片面テープであってもよい。
また、前記片面テープは、耐熱性及び紫外線硬化性を有する高分子物質で形成されることができる。
また、前記支持部材は金属板であってもよい。
また、前記支持部材が金属板の場合、前記ブリッジ部材と前記支持部材とが接触する面に形成された接着層をさらに含むことができる。
また、前記開口部を介して露出された接続パッド上に形成された表面処理層をさらに含むことができる。
また、前記ブリッジ部材は、前記プリント回路基板の縁に形成されたソルダレジスト上に形成されることができる。 A printed circuit board according to an embodiment of the present invention includes a base substrate having a first surface and a second surface, wherein a circuit layer including a connection pad and a circuit pattern is formed on the second surface, and a second surface of the base substrate. A solder resist formed to have an opening for exposing the connection pad on the surface; a bridge member formed on the solder resist and formed on a part of the solder resist; and formed on the bridge member. And a support member formed to cover the second surface of the base substrate, the first surface may be a mounting surface for a semiconductor element, and the second surface may be a surface for forming a main board. .
Here, the bridge member may be made of a solder material.
The support member may be a single-sided tape.
The single-sided tape may be formed of a polymer material having heat resistance and ultraviolet curable properties.
The support member may be a metal plate.
When the support member is a metal plate, the support member may further include an adhesive layer formed on a surface where the bridge member and the support member are in contact with each other.
The surface treatment layer may be further formed on the connection pad exposed through the opening.
The bridge member may be formed on a solder resist formed on an edge of the printed circuit board.

また、前記プリント回路基板は、ユニット単位で切断された形態であったり、またはユニット単位のプリント回路基板が多数形成されたパネル形態であってもよい。
本発明の特徴及び利点は添付図面に基づいた以下の詳細な説明によってさらに明らかになるであろう。 In addition, the printed circuit board may be cut in units, or may be a panel in which a large number of printed circuit boards in units are formed.
The features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

本発明の詳細な説明に先立ち、本明細書及び請求範囲に用いられた用語や単語は通常的かつ辞書的な意味に解釈されてはならず、発明者が自らの発明を最善の方法で説明するために用語の概念を適切に定義することができるという原則にしたがって本発明の技術的思想にかなう意味と概念に解釈されるべきである。   Prior to the detailed description of the invention, the terms and words used in the specification and claims should not be construed in a normal and lexicographic sense, and the inventor best describes the invention. Therefore, it should be construed as meanings and concepts corresponding to the technical idea of the present invention in accordance with the principle that the concept of terms can be appropriately defined.

本発明の実施例によるプリント回路基板は、プリント回路基板上に形成されたソルダレジスト上にブリッジ部材を形成するため、プリント回路基板のメインボード形成面に保護フィルムをはじめとする支持部材を除去しても残渣が残らず、そのため残渣によるパッケージング工程不良を予防することができるという効果が期待できる。   In the printed circuit board according to the embodiment of the present invention, in order to form a bridge member on the solder resist formed on the printed circuit board, a supporting member such as a protective film is removed from the main board forming surface of the printed circuit board. However, no residue remains, so that an effect of preventing a packaging process defect due to the residue can be expected.

また、本発明の実施例は、プリント回路基板のソルダレジスト上にブリッジ部材を形成するため、プリント回路基板と保護フィルムとの間の離隔空間が広く確保され、従来プリント回路基板と保護フィルムとの間にボイドが発生し、ボイドによりパッケージング工程時にエア噴出の通路を介してモールドが浸透されて製品が汚染される現象を予め防止することができるという長所がある。   In addition, since the bridge member is formed on the solder resist of the printed circuit board according to the embodiment of the present invention, a large space is ensured between the printed circuit board and the protective film, and the conventional printed circuit board and the protective film are There is an advantage that a phenomenon that a void is generated between the mold and the mold is infiltrated by the void through the air ejection path during the packaging process and the product is contaminated can be prevented in advance.

本発明の目的、特定の長所及び新規の特徴は添付図面に係る以下の詳細な説明及び好ましい実施例によってさらに明らかになるであろう。本明細書において、各図面の構成要素に参照番号を付け加えるに際し、同一の構成要素に限っては、たとえ異なる図面に示されても、できるだけ同一の番号を付けるようにしていることに留意しなければならない。また、「第１」、「第２」などの用語は一つの構成要素を他の構成要素と区分するために用いられるものであって、構成要素が前記用語により制限されるものではない。また、本発明を説明するにあたり、係わる公知技術についての具体的な説明が本発明の要旨を不明瞭にする可能性があると判断される場合は、その詳細な説明を省略する。
以下、添付の図面を参照して本発明の好ましい実施例を詳細に説明する。
プリント回路基板
図１は、本発明の実施例によるプリント回路基板の構成を示す図面である。 Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, it should be noted that when adding reference numerals to the components of each drawing, the same components are given the same number as much as possible even if they are shown in different drawings. I must. Further, terms such as “first” and “second” are used to distinguish one component from other components, and the component is not limited by the terms. Further, in describing the present invention, if it is determined that a specific description of the known technique may obscure the gist of the present invention, a detailed description thereof will be omitted.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Printed Circuit Board FIG. 1 is a view showing a configuration of a printed circuit board according to an embodiment of the present invention.

図１に図示したように、プリント回路基板１００は、第１面１１０ａ及び第２面１１０ｂを有し、第２面１１０ｂに接続パッド１２１及び回路パターン１２３を含む回路層１２０が形成されたベース基板１１０と、ベース基板１１０の第２面１１０ｂに接続パッド１２１を露出する開口部を有するように形成されたソルダレジスト１４０と、ソルダレジスト１４０上に形成され、ソルダレジストの一部に形成されたブリッジ（Ｂｒｉｄｇｅ）部材１５０と、ブリッジ部材１５０上に形成され、ベース基板１１０の第２面を覆うように形成された支持部材１６０と、を含むことができる。
ここで、前記ベース基板１１０の第１面１１０ａは半導体素子（不図示）実装面であり、第２面１１０ｂはメインボード（不図示）形成面であってもよい。
即ち、図示してはいないが、ベース基板１１０は、第１面に半導体素子を実装し、第２面でメインボードと結合するものである。 As shown in FIG. 1, the printed circuit board 100 has a first surface 110a and a second surface 110b, and a base substrate on which a circuit layer 120 including connection pads 121 and a circuit pattern 123 is formed on the second surface 110b. 110, a solder resist 140 formed to have an opening exposing the connection pad 121 on the second surface 110b of the base substrate 110, and a bridge formed on the solder resist 140 and formed on a part of the solder resist. A (Bridge) member 150 and a support member 160 formed on the bridge member 150 and covering the second surface of the base substrate 110 may be included.
Here, the first surface 110a of the base substrate 110 may be a semiconductor element (not shown) mounting surface, and the second surface 110b may be a main board (not shown) forming surface.
That is, although not shown, the base substrate 110 has a semiconductor element mounted on the first surface and is coupled to the main board on the second surface.

前記半導体素子（不図示）は、プリント回路基板に電気的に連結されて一定機能を担当することができる部品であって、例えば、集積回路チップ（ＩＣ）のようにプリント回路基板に内蔵することができる電子素子を意味する。電極は、プリント回路基板と半導体素子との間に電気的連結を提供する半導体素子の一部分である。   The semiconductor element (not shown) is a component that is electrically connected to a printed circuit board and can perform a certain function, and is incorporated in the printed circuit board such as an integrated circuit chip (IC). Means an electronic device capable of The electrode is a portion of the semiconductor element that provides electrical connection between the printed circuit board and the semiconductor element.

また、メインボード（不図示）は、半導体素子を実装したプリント回路基板１００が、プリント回路基板１００の最外層に形成された外部接続端子（例えば、はんだボール）を介して連結される基板を意味する。   The main board (not shown) refers to a substrate on which a printed circuit board 100 on which a semiconductor element is mounted is connected via an external connection terminal (for example, a solder ball) formed on the outermost layer of the printed circuit board 100. To do.

ここで、プリント回路基板１００の最外層（第２面１１０ｂ）は、はんだボールに電気的に接続する接続パッド１２１を除いた回路パターン１２３がソルダレジスト１４０によって包まれる。   Here, in the outermost layer (second surface 110 b) of the printed circuit board 100, the circuit pattern 123 excluding the connection pads 121 electrically connected to the solder balls is wrapped with the solder resist 140.

また、前記ベース基板１１０は、絶縁層に接続パッド１２１を含む１層以上の回路が形成された回路基板であって、好ましくはプリント回路基板であってもよい。   The base substrate 110 may be a circuit board in which one or more circuits including connection pads 121 are formed on an insulating layer, and may be a printed circuit board.

本図面では説明の便宜上具体的な内層回路の構成は省略して図示したが、当業者であれば、前記ベース基板１１０として、絶縁層に１層以上の回路が形成された通常の回路基板が適用されることができることを十分認識できる。
また、前記絶縁層としては樹脂絶縁層が使用されてもよい。 In this drawing, the configuration of a specific inner layer circuit is omitted for convenience of explanation. However, those skilled in the art will understand that the base substrate 110 is an ordinary circuit substrate in which one or more circuits are formed in an insulating layer. You can fully appreciate that it can be applied.
Moreover, a resin insulating layer may be used as the insulating layer.

前記樹脂絶縁層としては、エポキシ樹脂のような熱硬化性樹脂、ポリイミドのような熱可塑性樹脂、またはこれらにガラス繊維または無機フィラーのような補強材が含浸された樹脂、例えば、プリプレグが使用されてもよく、また光硬化性樹脂などが使用されてもよく、特にこれに限定されない。
前記接続パッド１２１上には後工程により外部接続端子としてはんだボールが形成されることができる。 As the resin insulating layer, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or an inorganic filler, such as a prepreg, is used. In addition, a photocurable resin or the like may be used, and the present invention is not particularly limited thereto.
A solder ball may be formed on the connection pad 121 as an external connection terminal by a later process.

前記接続パッド１２１を含む回路層は、回路基板の分野で回路用伝導性金属として使用されるものであれば制限なく適用することができ、プリント回路基板には銅を使用することが一般的である。   The circuit layer including the connection pads 121 can be applied without limitation as long as it is used as a conductive metal for circuits in the field of circuit boards, and copper is generally used for printed circuit boards. is there.

前記ソルダレジスト１４０は、最外層回路を保護する保護層の機能を行い、電気的絶縁のために形成されるものであり、プリント回路基板の最外層の接続パッド１２１を露出させるために開口部が形成される。   The solder resist 140 functions as a protective layer for protecting the outermost layer circuit and is formed for electrical insulation. The solder resist 140 has an opening for exposing the outermost connection pad 121 of the printed circuit board. It is formed.

前記ソルダレジスト１４０は、当業界に公知されたように、例えば、ソルダレジストインク、ソルダレジストフィルムまたはカプセル化剤などで構成されることができ、特にこれに限定されない。
また、前記ブリッジ部材１５０はソルダ材質からなってもよく、これに限定されない。
例えば、ブリッジ部材１５０は、ソルダレジスト１４０と同一であったり、類似した材質からなることができる。
前記ブリッジ部材１５０は、プリント回路基板１００の縁に形成されたソルダレジスト１４０上に形成されることができる。 The solder resist 140 may be composed of, for example, a solder resist ink, a solder resist film, an encapsulating agent, or the like as is known in the art, and is not particularly limited thereto.
The bridge member 150 may be made of a solder material, but is not limited thereto.
For example, the bridge member 150 can be made of the same material as the solder resist 140 or a similar material.
The bridge member 150 may be formed on a solder resist 140 formed on the edge of the printed circuit board 100.

より詳細に説明すると、ブリッジ部材１５０は、ベース基板１１０と支持部材１６０との間の空間を確保するためのものであって、ソルダレジスト１４０上に形成される支持部材１６０がソルダレジスト１４０から離隔された状態でベース基板の第２面を全て覆うことができるようにプリント回路基板１００の縁に形成されたソルダレジストに形成されてもよい。
即ち、ブリッジ部材１５０は、ソルダレジスト１４０と支持部材１６０との間に橋状に形成され、支持部材１６０を固定するものである。 More specifically, the bridge member 150 is for securing a space between the base substrate 110 and the support member 160, and the support member 160 formed on the solder resist 140 is separated from the solder resist 140. The solder resist may be formed on the edge of the printed circuit board 100 so that the entire second surface of the base substrate can be covered in the state where it is formed.
That is, the bridge member 150 is formed in a bridge shape between the solder resist 140 and the support member 160 and fixes the support member 160.

万が一、ベース基板１１０の第２面の面積が広い場合、ブリッジ部材１５０は、プリント回路基板の縁だけでなく中間領域にさらに形成され、支持部材１６０が平坦に維持されるようにすることもできる。   If the area of the second surface of the base substrate 110 is large, the bridge member 150 may be further formed not only at the edge of the printed circuit board but also in the intermediate region so that the support member 160 is maintained flat. .

ここで、ブリッジ部材１５０は、ソルダレジスト１４０と支持部材１６０との間の離隔空間Ａを確保し、離隔空間Ａに存在する空気が空間不足により支持部材１６０が剥離されて外部に流出される現象を予め防止する。   Here, the bridge member 150 secures the separation space A between the solder resist 140 and the support member 160, and the air existing in the separation space A is peeled off due to lack of space and flows out to the outside. Prevent in advance.

これにより、ベース基板１１０の第１面１１０ａに半導体素子（不図示）を実装した後にモールディングを行う場合、モールドが第２面１１０ｂの接続パッド１２１の部分に浸透しないという効果が期待できる。
一方、支持部材１６０は片面テープであったり、または金属板であってもよく、これに限定されない。
前記片面テープは、耐熱性及び紫外線硬化性を有する高分子物質で形成され、片面が接着力を有することができる。例えば、接着フィルム形態であってもよい。
ここで、支持部材１６０が片面テープである場合、接着面が前記ブリッジ部材１５０に接着される。 Accordingly, when molding is performed after mounting a semiconductor element (not shown) on the first surface 110a of the base substrate 110, an effect that the mold does not penetrate into the connection pad 121 portion of the second surface 110b can be expected.
Meanwhile, the support member 160 may be a single-sided tape or a metal plate, but is not limited thereto.
The single-sided tape may be formed of a polymer material having heat resistance and ultraviolet curable property, and one side may have an adhesive force. For example, an adhesive film form may be used.
Here, when the support member 160 is a single-sided tape, the bonding surface is bonded to the bridge member 150.

ここで、支持部材１６０として耐熱性及び紫外線硬化性を有する高分子物質で形成された片面テープを使用することにより、パッケージング工程中にＥＭＣ（Ｅｐｏｘｙ Ｍｏｌｄｉｎｇ Ｃｏｍｐｏｕｎｄ）のようなモールディング部材を用いてモールディング工程を進める場合、ブリッジ部材１５０と支持部材１６０との間に溶融されたモールディング部材が流入されることを最小化することができる。   Here, by using a single-sided tape formed of a heat-resistant and ultraviolet-curing polymer material as the support member 160, a molding member such as an EMC (Epoxy Molding Compound) is used during the packaging process. When the process proceeds, it is possible to minimize the molten molding member flowing between the bridge member 150 and the support member 160.

上記支持部材１６０は、ベース基板１１０の第２面１１０ｂを全て覆う面積に形成され、ブリッジ部材１５０に接着されベース基板１１０と支持部材１６０との間の離隔空間Ａを確保する。   The support member 160 is formed in an area that covers the entire second surface 110 b of the base substrate 110 and is bonded to the bridge member 150 to ensure a separation space A between the base substrate 110 and the support member 160.

これにより、ベース基板１１０と支持部材１６０との間に離隔空間Ａを確保することにより、ベース基板１１０と支持部材１６０との間にボイドが発生してもエアが圧縮されることができる空間を確保することができる。   As a result, by securing the separation space A between the base substrate 110 and the support member 160, a space in which air can be compressed even if a void occurs between the base substrate 110 and the support member 160. Can be secured.

これにより、ベース基板１１０と支持部材１６０との間に空間を確保することが難しく、ボイド発生により支持部材１６０が剥離される現象を予め防止することができるという効果が期待できる。   Thereby, it is difficult to secure a space between the base substrate 110 and the support member 160, and an effect that the phenomenon that the support member 160 is peeled off due to the generation of a void can be prevented in advance can be expected.

また、パッケージング工程を行う際、支持部材１６０が剥離されてモールドがプリント回路基板１００を含む製品に浸透し、これを汚染させる問題も改善することができるという長所がある。   In addition, when performing the packaging process, the support member 160 is peeled off, and the mold permeates into the product including the printed circuit board 100, thereby contaminating the product.

即ち、支持部材１６０とベース基板１１０との間の離隔空間を拡大するとともに、支持部材１６０とベース基板１１０との接着力が向上することにより、工程中に離隔空間Ａで発生され得るエアボイド（Ａｉｒ ｖｏｉｄ）による支持部材１６０の剥離現象とモールド侵入現象を全て除去することができる。   That is, the separation space between the support member 160 and the base substrate 110 is enlarged, and the adhesive force between the support member 160 and the base substrate 110 is improved, so that air voids (Air) that can be generated in the separation space A during the process. The peeling phenomenon of the support member 160 and the mold intrusion phenomenon due to void) can be removed.

一方、前記支持部材１６０が金属板である場合、プリント回路基板は、ブリッジ部材１５０と支持部材１６０とが接触する面に形成された接着層（不図示）をさらに含むことができる。
即ち、接着層は、ブリッジ部材１５０と金属材質の支持部材１６０との間に形成され、ブリッジ部材１５０と支持部材１６０を接着させる。
支持部材１６０が金属板である場合、適用される金属材質は支持部材１６０の機能を行う金属材質は全て使用することができる。
また、プリント回路基板１００は、開口部を介して露出された接続パッド１２１上に形成された表面処理層１３０をさらに含むことができる。 Meanwhile, when the support member 160 is a metal plate, the printed circuit board may further include an adhesive layer (not shown) formed on a surface where the bridge member 150 and the support member 160 are in contact with each other.
That is, the adhesive layer is formed between the bridge member 150 and the metal support member 160, and bonds the bridge member 150 and the support member 160 together.
When the support member 160 is a metal plate, any metal material that performs the function of the support member 160 can be used.
The printed circuit board 100 may further include a surface treatment layer 130 formed on the connection pad 121 exposed through the opening.

前記表面処理層は、当業界に公知されたものであれば特に限定されず、例えば、電解金めっき（Ｅｌｅｃｔｒｏ Ｇｏｌｄ Ｐｌａｔｉｎｇ）、無電解金めっき（Ｉｍｍｅｒｓｉｏｎ Ｇｏｌｄ Ｐｌａｔｉｎｇ）、ＯＳＰ（Ｏｒｇａｎｉｃ Ｓｏｌｄｅｒａｂｉｌｉｔｙ Ｐｒｅｓｅｒｖａｔｉｖｅ）または無電解スズめっき（Ｉｍｍｅｒｓｉｏｎ Ｔｉｎ Ｐｌａｔｉｎｇ）、無電解銀めっき（Ｉｍｍｅｒｓｉｏｎ Ｓｉｌｖｅｒ Ｐｌａｔｉｎｇ）、ＥＮＩＧ（Ｅｌｅｃｔｒｏｌｅｓｓ Ｎｉｃｋｅｌ ａｎｄ Ｉｍｍｅｒｓｉｏｎ Ｇｏｌｄ；無電解ニッケルめっき／置換金めっき）、ＤＩＧめっき（Ｄｉｒｅｃｔ Ｉｍｍｅｒｓｉｏｎ Ｇｏｌｄ Ｐｌａｔｉｎｇ）、ＨＡＳＬ（Ｈｏｔ Ａｉｒ Ｓｏｌｄｅｒ Ｌｅｖｅｌｉｎｇ）などによって形成されることができる。   The surface treatment layer is not particularly limited as long as it is known in the art, and for example, electrolytic gold plating, electroless gold plating, OSP (Organic Solderability Preservative) or non-electrolytic gold plating. Electrolytic tin plating (Immersion Tin Plating), electroless silver plating (Immersion Silver Plating), ENIG (Electroless Nickel and Immersion Gold), DIG plating (Direct Immersion GoldPlatting) Solder Leveling) Can be formed.

一方、本発明の実施例で適用されるプリント回路基板は、ユニット（Ｕｎｉｔ）単位で切断された形態のプリント回路基板であったり、またはユニット単位のプリント回路基板が多数形成されたパネル（Ｐａｎｅｌ）形態のプリント回路基板であってもよい。   On the other hand, the printed circuit board applied in the embodiment of the present invention is a printed circuit board that is cut in units, or a panel in which a large number of printed circuit boards in units are formed. It may be a printed circuit board of the form.

以上、本発明を好ましい実施例に基づいて詳細に説明したが、これは本発明を具体的に説明するためのものであり、本発明によるプリント回路基板はこれに限定されず、該当分野における通常の知識を有する者であれば、本発明の技術的思想内にての変形や改良が可能であることは明白であろう。
本発明の単純な変形乃至変更はいずれも本発明の領域に属するものであり、本発明の具体的な保護範囲は添付の特許請求の範囲により明確になるであろう。 As described above, the present invention has been described in detail based on the preferred embodiments. However, this is for the purpose of specifically explaining the present invention, and the printed circuit board according to the present invention is not limited thereto, and is usually used in the corresponding field. It will be apparent to those skilled in the art that modifications and improvements can be made within the technical idea of the present invention.
All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

本発明の実施例によるプリント回路基板の構成を示す図面である。1 is a diagram illustrating a configuration of a printed circuit board according to an embodiment of the present invention.

１００ プリント回路基板
１１０ ベース基板
１１０ａ 第１面
１１０ｂ 第２面
１２０ 回路層
１２１ 接続パッド
１２３ 回路パターン
１３０ 表面処理層
１４０ ソルダレジスト
１５０ ブリッジ部材
１６０ 支持部材 DESCRIPTION OF SYMBOLS 100 Printed circuit board 110 Base board 110a 1st surface 110b 2nd surface 120 Circuit layer 121 Connection pad 123 Circuit pattern 130 Surface treatment layer 140 Solder resist 150 Bridge member 160 Support member

Claims (9)

第１面及び第２面を有し、前記第２面に接続パッド及び回路パターンを含む回路層が形成されたベース基板と、
前記ベース基板の第２面に前記接続パッドを露出させる開口部を有するように形成されたソルダレジストと、
前記ソルダレジスト上に形成され、前記ソルダレジストの一部に形成されたブリッジ部材と、
前記ブリッジ部材上に形成され、前記ベース基板の第２面を覆うように形成された支持部材と、を含み、
前記第１面は半導体素子の実装面であり、前記第２面はメインボードの形成面であるプリント回路基板。 A base substrate having a first surface and a second surface, wherein a circuit layer including a connection pad and a circuit pattern is formed on the second surface;
A solder resist formed to have an opening for exposing the connection pad on the second surface of the base substrate;
A bridge member formed on the solder resist and formed on a part of the solder resist;
A support member formed on the bridge member and formed to cover the second surface of the base substrate,
The first surface is a mounting surface of a semiconductor element, and the second surface is a main board forming surface. 前記ブリッジ部材はソルダ材質からなる請求項１に記載のプリント回路基板。   The printed circuit board according to claim 1, wherein the bridge member is made of a solder material. 前記支持部材は片面テープである請求項１に記載のプリント回路基板。   The printed circuit board according to claim 1, wherein the support member is a single-sided tape. 前記片面テープは、耐熱性及び紫外線硬化性を有する高分子物質で形成される請求項３に記載のプリント回路基板。   The printed circuit board according to claim 3, wherein the single-sided tape is formed of a polymer material having heat resistance and ultraviolet curability. 前記支持部材は金属板である請求項１に記載のプリント回路基板。   The printed circuit board according to claim 1, wherein the support member is a metal plate. 前記支持部材が金属板である場合、
前記ブリッジ部材と前記支持部材とが接触する面に形成された接着層をさらに含む請求項１に記載のプリント回路基板。 When the support member is a metal plate,
The printed circuit board according to claim 1, further comprising an adhesive layer formed on a surface where the bridge member and the support member are in contact with each other. 前記開口部を介して露出された接続パッド上に形成された表面処理層をさらに含む請求項１に記載のプリント回路基板。   The printed circuit board according to claim 1, further comprising a surface treatment layer formed on the connection pad exposed through the opening. 前記ブリッジ部材は、前記プリント回路基板の縁に形成されたソルダレジスト上に形成される請求項１に記載のプリント回路基板。   The printed circuit board according to claim 1, wherein the bridge member is formed on a solder resist formed on an edge of the printed circuit board. 前記プリント回路基板は、ユニット単位で切断された形態であったり、またはユニット単位のプリント回路基板が多数形成されたパネル形態である請求項１に記載のプリント回路基板。   2. The printed circuit board according to claim 1, wherein the printed circuit board is cut in a unit unit or a panel form in which a large number of printed circuit boards in a unit unit are formed.
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