TWI419628B - Printed circuit board - Google Patents

Description

A printed circuit board

This invention relates to a printed circuit board.

In the Korean Patent Application, KR 10-1998-059239 A (1998/10/7), a process for fixing a semiconductor wafer to a printed circuit board is disclosed, which directly fixes the semiconductor wafer to the upper surface of the printed circuit board. In order to achieve a high-density fixed form, the printed circuit board and the semiconductor wafer are electrically connected.

Then, a packaging process is performed by applying a thermosetting resin to the printed circuit board to cover the semiconductor wafers fixed on the printed circuit board.

In this case, the thermosetting resin is sometimes applied to the lower surface of the printed circuit board, that is, the surface opposite to the surface to which the semiconductor wafer is fixed, and may affect the connection pads formed on the lower surface of the printed circuit board.

SUMMARY OF THE INVENTION The present invention is directed to providing a printed circuit board that protects the surface of a printed circuit board on which a motherboard is formed during the manufacturing process.

According to a preferred embodiment of the present invention, a printed circuit board includes: a substrate having a first surface and a second surface, including a circuit layer formed on the second surface, the circuit layer including a plurality of connection pads and a a circuit pattern; a solder resist formed on the second surface of the substrate, having an opening portion exposing the connection pad; a bridge formed on the solder resist and formed on a portion of the solder resist; and being formed on the bridge member A support member covering the second surface of the substrate, wherein the first surface is a surface on which the semiconductor device is fixed, and the second surface is a surface on which the main board is formed.

The bridge can be made of a solder material.

The support member can be a single-sided tape.

The single-sided tape can be made of a polymer material having heat resistance and ultraviolet curability.

The support member can be a metal plate.

When the support member is a metal flat plate, the printed circuit board may further comprise an adhesive layer formed on the surface of the bridge contacting the support member.

The printed circuit board may further comprise a surface treatment layer formed on the connection pads exposed by the opening portions.

The bridge can be formed on the solder resist formed on the edge of the printed circuit board.

The printed circuit board is a printed circuit board that is cut into a unit, or a panel printed circuit board having a plurality of printed circuit boards formed as a unit.

The various objects, advantages and features of the invention are disclosed in the following description of the embodiments.

Words used in the description of the present invention and in the scope of the claims should not be construed as being limited to their ordinary meaning or definition in the dictionary, but should be described in an optimal manner based on the concept that the inventor can appropriately define the term. The law is interpreted as having meaning and concepts related to the technical field of the present invention.

The above objects or other objects, advantages and features of the present invention will become apparent to those skilled in the <RTIgt; In the description and drawings, like reference numerals are used to refer to the In addition, if the detailed description of the related art of the present invention causes the reading focus to be out of focus, the detailed description will be omitted from the description. In the description of the invention, the terms first, second, etc. are used to distinguish different elements, and are not intended to limit each element.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings.

Fig. 1 is a schematic view showing the form of a printed circuit board according to the present invention.

As shown in FIG. 1, a printed circuit board 100 according to the present embodiment includes a substrate 110 having a first surface 110a, a second surface 110b, and a circuit layer 120 formed on the second surface 110b. The circuit layer 120 includes a plurality of connection pads 121 and a circuit pattern 123. A solder resist 140 formed on the second surface 110b of the substrate 110 has an exposed connection pad 121. An opening portion; a bridge member 150 formed on the solder resist 140 and formed only on a portion of the solder resist 140; and a support member 160 formed on the bridge member 150 to cover the substrate 110 Second surface 110b.

Here, the first surface 110a of the substrate 110 may be a surface on which a semiconductor device (not shown) is fixed, and the second surface 110b may be formed on a main board (not shown). The surface on it.

That is, although not shown in the drawings, the first surface 110a of the substrate 110 includes a semiconductor device fixed thereto, and the second surface 110b includes a main board coupled to the substrate 110.

The semiconductor device (not shown) is a component electrically connected to a printed circuit board to perform a predetermined function, that is, the semiconductor device is, for example, an electronic device that can be embedded in a printed circuit board, such as an integrated circuit chip. (IC chip). The semiconductor device includes an electrode that provides an electrical connection between the printed circuit board and the semiconductor device.

In addition, the main board (not shown) means a substrate; the printed circuit board 100 including the semiconductor device is mounted thereon through an external connection terminal (for example, a solder ball) formed on the outermost layer of the printed circuit board 100. (solder ball)) to connect to the substrate.

In this example, on the outermost layer of the printed circuit board 100 (i.e., the second surface 110b), the circuit pattern 123 is surrounded by the solder resist 140 except for the connection pads 121 electrically connected to the solder balls.

Further, the substrate 110 may be a circuit board having at least one circuit formed on the insulating layer, and is preferably a printed circuit board including a connection pad 121.

For the convenience of explanation, the specific structure of the inner layer circuit is omitted in the drawings, but it should be apparent to those skilled in the art that a common circuit board having at least one circuit formed on the insulating layer can be used as the substrate 110. .

Further, a resin insulating layer can be used as the insulating layer.

A thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide or a resin containing a reinforcing material such as glass fiber or an inorganic filler such as a prepreg or light may be used. A photocurable resin or the like is used as the resin insulating layer; however, it is not particularly limited thereto.

Solder balls may be formed on the connection pads 121 as a external connection terminal in a subsequent process.

Any of the conductive metals used in the circuit board field can be used as the circuit layer 120 including the connection pads 121 without any limitation; however, copper is usually used in the printed circuit board.

The solder resist 140 serves as a protective layer for protecting the outermost circuit and is used for electrical insulation, and has an opening portion exposing the connection pad 121 at the outermost layer of the printed circuit board 100.

The solder resist 140 may be made of, for example, a solder resist ink, a solder resist film, an encapsulant, or other conventional materials, but is not particularly limited thereto.

Further, the bridge 150 may be made of a solder material, but is not limited thereto.

For example, the bridge 150 can be made of the same or similar material as the solder resist 140.

The bridge 150 may be formed on the solder resist 140 formed on the edge of the printed circuit board 100.

More specifically, a bridge 150 for ensuring a space between the substrate 110 and the support member 160 may be formed on the solder resist 140 formed on the edge of the printed circuit board 100 such that the second surface 110b of the substrate 110 is The space between the support member 160 and the solder resist 140 is completely covered.

That is, the bridge 150 is formed as a bridge between the solder resist 140 and the support member 160, thereby fixing the support member 160.

In the case where the area of the second surface 110b of the substrate 110 is extremely large, the intermediate portion of the printed circuit board 100 and the edge are formed with the bridge 150 so that the support member 160 can maintain a flat state.

Here, the bridge 150 ensures a space A between the solder resist 140 and the support member 160, thereby preventing the air in the space A from lifting up the support member 160 to leak to the outside due to lack of space.

Therefore, when a semiconductor device (not shown) is fixed on the first surface 110a of the substrate 110 and a package is molded, it is expected that the mold material does not leak to the portion of the connection pad 121 of the second surface 110b. .

Meanwhile, the support member 160 may be a single-sided tape or a metal plate, but is not particularly limited thereto.

The one-sided tape may be made of a polymer material having heat-resistance and ultraviolet-curability, and has a surface having an adhesion. For example, the single sided tape can be in the form of an adhesive film.

Here, when the support member 160 is a single-sided tape, the adhesive surface thereof is adhered to the bridge member 150.

In this example, a single-sided tape made of a polymer material having heat resistance and ultraviolet curability is used as the support member 160, so that an epoxy molding compound (EMC) or the like is used in the packaging process. When the molding material is subjected to a molding process, it is possible to reduce the situation in which the molten material is infiltrated between the bridge member 150 and the support member 160.

The support member 160 has an area covering the second surface 110b of the entire substrate 110, and is adhered to the bridge member 150, thereby ensuring a space A between the substrate 110 and the support member 160.

Therefore, it is ensured that the space A exists between the substrate 110 and the support member 160, so that it is possible to ensure that even if a void is formed between the substrate 110 and the support member 160, there is a space in which air can be compressed.

Therefore, it is possible to avoid in the case where it is difficult to ensure the space between the substrate 110 and the support member 160, so that the hole is generated, causing the support member 160 to be lifted.

In addition, it is possible to solve the problem that the mold material is infiltrated into the product including the printed circuit board 100 due to the support member 160 being lifted in the packaging process, thereby contaminating the product.

That is, the adhesion between the support member 160 and the substrate 110 is improved, and at the same time, the space A between the support member 160 and the substrate 110 is enlarged, so that the support member 160 may be prevented from being lifted, and the space may be separated from the space during the process. An air void is generated to allow the molding material to infiltrate into the space between the support member 160 and the substrate 110.

Meanwhile, when the support member 160 is a metal flat plate, the printed circuit board 100 further includes an adhesive layer (not shown) formed on the surface of the bridge member 150 contacting the support member 160.

That is, the adhesive layer is formed between the bridge member 150 and the support member 160 made of a metal material, thereby adhering the bridge member 150 to the support member 160.

When the support member 160 is a metal flat plate, any metal material that can serve as the support member 160 can be used.

In addition, the printed circuit board 100 further includes a surface treatment layer 130 formed on the connection pad 121 exposed by the opening portion.

The surface treatment layer is not particularly limited to being produced by a currently known technique, and may be an electro gold plating method, an immersion gold plating method, an organic solderability preservative (OSP) method, Immersion tin plating method, immersion silver plating method, electroless nickel and immersion gold (ENIG) method, direct Immersion gold plating (DGP) method or spray tin ( Hot air solder leveling, HASL) method.

In another aspect, the printed circuit board used in the preferred embodiment of the present invention may be a printed circuit board cut into a unit, or a panel type printed circuit board having a plurality of printed circuit boards formed as a unit. Circuit board).

In a printed circuit board according to an embodiment of the present invention, a bridge member is formed on a solder resist formed on a printed circuit board, so that even if a support member including a protective layer is moved from a surface of a printed circuit board having a main board In addition, there is no residue left on the surface, which may avoid defects caused by residues in the packaging process.

Further, according to the embodiment of the present invention, the bridge is formed on the solder resist, thereby ensuring a sufficient space between the printed circuit board and the protective layer, so that it is possible to avoid the prior art, the printed circuit board and the protective layer. The generation of air holes and the presence of a channel for air injection in the packaging process due to the presence of the air holes cause the molding material to infiltrate between the printed circuit board and the protective layer, which may cause product contamination.

In view of the above, the present invention has been described above in terms of preferred embodiments for the purpose of specifically explaining the embodiments of the present invention, and is not intended to limit the printed circuit board according to the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention.

Accordingly, the invention is to be construed as being limited by the scope of the invention, and the scope of the invention is defined by the scope of the appended claims.

100. . . A printed circuit board

110. . . Substrate

110a. . . First surface

110b. . . Second surface

120. . . Circuit layer

121. . . Connection pad

123. . . Circuit pattern

130. . . Surface treatment layer

140. . . Solder resist

150. . . Bridge

160. . . supporting item

A. . . Space

Fig. 1 is a schematic view showing the form of a printed circuit board according to the present invention.

100. . . A printed circuit board

110. . . Substrate

110a. . . First surface

110b. . . Second surface

120. . . Circuit layer

121. . . Connection pad

123. . . Circuit pattern

130. . . Surface treatment layer

140. . . Solder resist

150. . . Bridge

160. . . supporting item

A. . . Space

Claims (9)

A printed circuit board comprising: a substrate having a first surface and a second surface, the substrate comprising a circuit layer formed on the second surface, the circuit layer comprising a plurality of connection pads and a circuit pattern; a solder resist formed on the second surface of the substrate to have a plurality of opening portions exposing the connection pads; a bridge member formed on the solder resist and formed on a portion of the solder resist; a support member formed on the bridge member and covering the second surface of the substrate, wherein the first surface is a surface on which a semiconductor device is fixed, and the second surface is a surface on which a main board is formed . The printed circuit board of claim 1, wherein the bridge member is made of a solder material. The printed circuit board of claim 1, wherein the support member is a single-sided tape. The printed circuit board according to claim 3, wherein the single-sided tape is made of a polymer material having heat resistance and ultraviolet curability. The printed circuit board of claim 1, wherein the support member is a metal plate. The printed circuit board of claim 1, wherein when the support member is a metal flat plate, the printed circuit board further comprises an adhesive layer formed on a surface of the bridge member contacting the support member. The printed circuit board of claim 1, further comprising a surface treatment layer formed on the plurality of connection pads exposed to the opening portions. The printed circuit board of claim 1, wherein the bridge member is formed on a solder resist formed on an edge of the printed circuit board. The printed circuit board of claim 1, wherein the printed circuit board is a printed circuit board cut into a unit or a panel type printed circuit board having a plurality of printed circuit boards formed as a unit.