KR101753685B1 - Flexible printed circuit boards - Google Patents

Flexible printed circuit boards Download PDF

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Publication number
KR101753685B1
KR101753685B1 KR1020160019890A KR20160019890A KR101753685B1 KR 101753685 B1 KR101753685 B1 KR 101753685B1 KR 1020160019890 A KR1020160019890 A KR 1020160019890A KR 20160019890 A KR20160019890 A KR 20160019890A KR 101753685 B1 KR101753685 B1 KR 101753685B1
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KR
South Korea
Prior art keywords
wiring pattern
base film
pattern
region
dummy
Prior art date
Application number
KR1020160019890A
Other languages
Korean (ko)
Inventor
최경성
김진호
김진규
허민
Original Assignee
스템코 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 스템코 주식회사 filed Critical 스템코 주식회사
Priority to KR1020160019890A priority Critical patent/KR101753685B1/en
Application granted granted Critical
Publication of KR101753685B1 publication Critical patent/KR101753685B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions

Abstract

A flexible circuit board is provided. The flexible circuit board includes a base film including a first surface and a second surface, an inner lead defined on at least one of the first surface and the second surface of the base film and having a driving element mounted thereon, An outer lead region which is defined on at least one of the outer lead region and the outer lead region and which is connected to an external device, a wiring pattern region in which a plurality of wiring patterns connecting the inner lead region and the outer lead region are arranged, And a first dummy pattern disposed between the direction end portions.

Description

[0001] FLEXIBLE PRINTED CIRCUIT BOARDS [0002]

The present invention relates to a flexible circuit board.

BACKGROUND ART [0002] In recent years, a chip on film (COF) package technology using a flexible circuit board has been used in electronic devices in accordance with the miniaturization trend. The flexible circuit board and the COF package technology using the flexible circuit board are used for a flat panel display (FPD) such as a liquid crystal display (LCD), an organic light emitting diode do.

In recent years, an additive or semi-additive method of forming a circuit by plating rather than an etching method of forming a circuit by etching a metal layer according to a demand for highly integrated wiring patterns is manufactured.

In the semi-additive method, for example, an FCCL having a thin metal underlayer on one side or both sides of an insulating base film is used. When a resist pattern is formed on the underlayer and is immersed in a plating solution to which current is applied A circuit is formed while a metal is grown on a ground layer on which a resist pattern is not formed.

Referring to FIG. 1, the current density is distributed with respect to the circuit region to be plated, so that the metal is uniformly grown for each circuit. In the edge portion of the circuit region, the current density is formed to be relatively higher than the inner portion. This may cause an unevenness in the circuit thickness at which the thickness of the circuit at the edge of the circuit area becomes relatively thicker than the circuit inside. If the circuit thickness is uneven, defects such as open or short may occur when the semiconductor device or the external device is bonded to the semiconductor device or the external device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a flexible circuit board capable of uniformly forming a thickness of a wiring pattern by including a dummy pattern adjacent to the wiring pattern.

The technical objects of the present invention are not limited to the technical matters mentioned above, and other technical subjects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a flexible circuit board, including: an inner lead defined on a surface of a base film and mounted with a driving device; An outer lead region connected to an external device, a first wiring pattern region in which a plurality of first wiring patterns connecting the inner lead region and the outer lead region are arranged, and a second wiring pattern region formed in the longitudinal direction of the base film And a first dummy pattern disposed between the wiring pattern region and the sprocket hole region, wherein the sprocket hole region is adjacent to the end portion in the width direction of the base film.

In some embodiments of the present invention, the base film may further include a second dummy pattern disposed between the outer lead region of the base film and the longitudinal end of the base film.

In some embodiments of the present invention, the first dummy pattern and the second dummy pattern may be disposed so as to surround the first wiring pattern region.

In some embodiments of the present invention, the plurality of wiring patterns may be spaced apart from each other by a first distance, and the wiring pattern area and the dummy pattern may be spaced apart from each other by a second distance different from the first distance.

In some embodiments of the present invention, on the other surface of the base film, a second wiring pattern region in which a plurality of second wiring patterns are disposed and a second wiring pattern region in which the second wiring pattern region is disposed between the width direction ends of the base film And may further include a second dummy pattern.

In some embodiments of the present invention, the second dummy pattern may not be electrically connected to the plurality of first wiring patterns and the plurality of second wiring patterns.

In some embodiments of the present invention, the second dummy pattern may be disposed so as to surround the second wiring pattern region.

In some embodiments of the present invention, the first dummy pattern may be disposed between the outer lead area and the sprocket hole area.

In some embodiments of the present invention, a driving device disposed in the inner lead area and an external device connected from the outer lead area may be further included.

According to the flexible circuit board according to the embodiments of the present invention, by including the dummy pattern in the area other than the wiring pattern area where the wiring pattern is formed, the damage of the base film which can be caused by the stress applied to the base film can be reduced have.

Further, since the wiring pattern and the dummy pattern disposed adjacent to the wiring pattern are simultaneously plated, the effect that the thickness of the wiring pattern is formed uniformly can be obtained.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.


1 is a cross-sectional view showing a part of a manufacturing method of a flexible circuit board according to the prior art.
2 is a top view of a flexible circuit board according to an embodiment of the present invention.
3 is a cross-sectional view taken along line A-A 'in Fig.
4 is a cross-sectional view illustrating a portion of a manufacturing process of a flexible circuit board according to an embodiment of the present invention.
5 is a top view of a flexible circuit board according to another embodiment of the present invention.
6 is a top view of another surface of a flexible circuit board according to another embodiment of the present invention.
7 is a side view of an electronic device including a flexible circuit board according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of the components shown in the figures may be exaggerated for clarity of description. Like reference numerals refer to like elements throughout the specification and "and / or" include each and every combination of one or more of the mentioned items.

It is to be understood that when an element or layer is referred to as being "on" or " on "of another element or layer, All included. On the other hand, a device being referred to as "directly on" or "directly above" indicates that no other device or layer is interposed in between.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Although the first, second, etc. are used to describe various elements or components, it is needless to say that these elements or components are not limited by these terms. These terms are used only to distinguish one element or component from another. Therefore, it is needless to say that the first element or the constituent element mentioned below may be the second element or constituent element within the technical spirit of the present invention.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

FIG. 2 is a top view of a flexible circuit board according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line A-A 'of FIG.

2 and 3, the flexible circuit board 1 has a structure in which the inner lead region 100, the outer lead regions 101 and 102, the first wiring pattern region 25 and the sprocket hole region 50 are defined A first wiring pattern 20 formed in the first wiring pattern region 25, and a first dummy pattern 40. The first wiring pattern 20 may be formed of a conductive material.

The base film 10 may be formed of a flexible material and may be included as a base material on the flexible circuit board 1 so that the flexible circuit board 1 may be bent or folded.

The base film 10 may be, for example, a polyimide film. Alternatively, the base film 10 may be an insulating film such as a PET (polyethylene terephthalate) film, a polyethylene naphthalate film, or a polycarbonate film, or a metal foil such as an aluminum oxide foil. In the flexible circuit board 1 according to the embodiment of the present invention, the base film 10 is described as a polyimide film.

On one surface of the base film 10, the inner lead region 100 and the outer lead regions 101 and 102 can be defined.

The inner lead region 100 may be a region where the driving element is mounted and the outer lead regions 101 and 102 may be an area connected to an external device connected to the flexible circuit board 1. [ The driving element is disposed in the inner lead region 100 and can be electrically connected to the first wiring pattern 20 and the flexible circuit board 1 through a solder bump or the like. Similarly, an external device can also be electrically connected to the first wiring pattern 20 disposed on the outer lead regions 101 and 102 through a solder bump or the like.

A plurality of first wiring patterns 20 may be formed on the first wiring pattern area 25 on the base film 10. [ The first wiring patterns 20 may be spaced apart from each other with a predetermined gap therebetween.

The first wiring pattern 20 may include a conductive material such as a metal. Specifically, the first wiring pattern 20 may be a conductive wiring for transmitting an electric signal or a transparent conductive wiring for transmitting a capacitance according to a touch. The first wiring pattern 20 may include a conductive material such as copper, but the present invention is not limited thereto. The first wiring pattern 20 may include a material such as gold, aluminum, or the like .

The first wiring pattern 20 can connect the inner lead area 100 and the outer lead areas 101 and 102 to each other. Specifically, the first wiring pattern 20 can electrically connect a driving element mounted on the inner lead area 100 and an external device connected to the outer lead areas 101 and 102. One end of the first wiring pattern 20 overlaps with the inner lead region 100 and the other end of the first wiring pattern 20 overlaps with the outer lead regions 101 and 102. [

A plating layer 30 may be formed on the first wiring pattern 20 and the plating layer 30 serves to protect the first wiring pattern 20 from the outside or to improve the bonding property with a device or an external device can do. The plating layer 30 may include metals such as tin (Sn), nickel (Ni), gold (Au), and aluminum (Al).

A protective layer including a solder resist or the like may be formed to cover the first wiring pattern 20 and the plating layer 30 so as to protect the first wiring pattern 20 and the plating layer 30. [

A sprocket hole area 50 having a predetermined width and in which a plurality of sprocket holes 51 are formed can be defined on one side of the base film 10. [ The plurality of sprocket holes 51 are inserted into the flexible circuit board 1 by inserting protrusions such as a gripper in manufacturing the flexible circuit board 1 to enable the flexible circuit board 1 to be transported . The sprocket holes 51 may be arranged along the longitudinal direction of the base film 10 along the sprocket hole area 50. The sprocket hole region 50 can be defined to abut the widthwise end of the base film 10.

The first dummy pattern 40 may be disposed between the first wiring pattern region 25 and the sprocket hole region 50 of the base film 10. [

The first dummy pattern 40 may be arranged to fill between the first wiring pattern region 25 and the sprocket hole region 50. The first dummy pattern 40 and the first wiring pattern 20 may not be connected. That is, the first dummy pattern 40 and the first wiring pattern 20 are electrically insulated from each other, and the first dummy pattern 40 may not affect an electrical signal flowing to the first wiring pattern 20.

As shown, the first dummy pattern 40 may be disposed on the base film 10 in a lattice form, but the present invention is not limited thereto. The first dummy pattern 40 may be a plurality of long patterns extending in the longitudinal direction of the base film 10 or may include an array of single land patterns. That is, the first dummy pattern 40 may not include the pattern extending in the width direction of the base film 10, unlike the one shown in the drawing.

The first dummy patterns 40 and the first wiring patterns 20 are spaced apart from each other by the first distance D1 and the first dummy patterns 40 and the first wiring patterns 20 are spaced from each other by the second distance D2 They can be disposed apart from each other. The first distance D1 and the second distance D2 may be different from each other. The second distance D2 may preferably be between 0.001 mm and 2 mm.

On the other hand, the first dummy patterns 40 may be spaced apart from each other by an interval of the third distance D3 from the sprocket hole region 50. The third distance D3 may be greater than the second distance D2. That is, the dummy pattern 40 disposed adjacent to the first wiring pattern area 25 at the second distance D2 fills all the space between the first wiring pattern area 25 and the sprocket hole area 50 But may be arranged to fill only a part thereof.

The space region where the first wiring pattern 20 is not formed in the base film 10 may be physically weaker than the first wiring pattern region 20. [ Particularly, the base film 10 in which a mechanism such as a gripper is inserted and transported in the sprocket holes 51 causes a problem that wrinkles or deformation occur in the space area due to the stress applied to the base film 10 in the transportation process .

The flexible circuit board according to the embodiment of the present invention includes the first dummy pattern 40 formed in the space region to prevent the surface of the base film 10 from being exposed, It is possible to protect it from wrinkles and deformation caused by the applied stress.

On the other hand, the first dummy pattern 40 can be distinguished from a reinforcing pattern (not shown). As described above, the first dummy pattern 40 may be formed to reinforce the space region. However, when a separate reinforcing pattern is formed to reinforce the base film in the space region, the first dummy pattern 40 may be reinforced Pattern can be formed between the first wiring pattern 20 and the pattern.

The first dummy pattern 40 may be formed at the same level as the first wiring pattern 20. Here, the same level means that the same level is formed by the same manufacturing process. That is, in the plating process for forming the first wiring patterns 20, the first dummy patterns 40 may be formed together. Accordingly, the first dummy pattern 40 may include the same material as the first wiring pattern 20. This manufacturing process will be described in more detail with reference to FIG.

4 is a cross-sectional view illustrating a portion of a manufacturing process of a flexible circuit board according to an embodiment of the present invention.

Referring to FIG. 4, a first wiring pattern 20 and a first dummy pattern 40 are formed on the base film 10 by plating.

The first wiring pattern 20 is formed by forming a resist on a region where the first wiring pattern 20 is not formed on the base film 10 and performing plating by electrolytic or non- additive process.

At this time, when the first dummy pattern 40 is not formed adjacent to the wiring pattern as in the conventional flexible circuit board manufacturing method described above, the inner wiring pattern 21 and the outer side The difference in height due to the difference in the thickness of the plating may occur between the wiring patterns 22 of the wiring pattern. That is, when a current is applied from the anode used for plating, since the current density applied to the wiring pattern 22 on the outer side is larger than that on the inner wiring pattern 21, the plating amount on the outer side is increased, 22 may be relatively large in thickness. If the pattern thickness is not uniform, a problem may arise in the operation reliability of the circuit. In particular, the connection reliability with the first wiring pattern 20 overlapping the inner lead area 100 or the outer lead area 101, that is, with the driving element or the external device at the terminal part may be reduced.

The flexible circuit board 1 according to the embodiment of the present invention is formed by the first dummy pattern 40 arranged from the first wiring pattern area 25 toward the widthwise end of the base film or toward the sprocket hole area 50 , The current density applied to the wiring pattern 22 on the outside can be dispersed, so that the coating thickness of the wiring patterns 21, 22 on the inside and outside can be relatively uniform.

Here, when the distance (D2 in Fig. 2) between the first dummy pattern 40 and the outside wiring pattern 22 is large, the current density at which the first dummy pattern 40 is applied to the outside wiring pattern 22 The distance between the first dummy pattern 40 and the outer wiring pattern 22 is preferably 0.001 mm to 2 mm.

That is, uniformity of the thickness of the first wiring pattern 20 can be ensured by the first dummy pattern 40 of the flexible circuit board 1 according to the embodiment of the present invention, Or the connection reliability in the outer lead regions 101 and 102 can be improved.

5 is a top view of a flexible circuit board according to another embodiment of the present invention.

5, a flexible circuit board 2 according to another embodiment of the present invention includes a plurality of first and second flexible printed circuit boards 2 and 3 disposed between the outer lead portions 101 and 102 and the longitudinal ends 61 and 62 of the base film 10, And dummy patterns 71 and 72. [ A pattern may also be formed between the outer lead regions 101, 102 and the sprocket hole regions 50 to connect the dummy patterns 40, 71, 72.

The dummy patterns 40, 71, and 72 may be arranged to surround the first wiring pattern region 25. [ In addition, the dummy patterns 40, 71, and 72 may surround the inner lead 100 and the outer lead 101, 102.

The thickness in the longitudinal direction of the first wiring pattern 20 can be made uniform due to the second dummy patterns 71 and 72 which sandwich the first wiring pattern region 25 in the longitudinal direction. That is, in the process of forming the first wiring patterns 20, the current densities applied in the longitudinal direction of the first wiring patterns 20 are dispersed by forming the second dummy patterns 71, 72 together, The plating thickness on the inside and outside of the substrate 20 can be made uniform. Particularly, the thicknesses of the portions of the first wiring pattern 20 overlapping the outer lead regions 101 and 102 and the portions of the first wiring patterns 20 overlapping the inner lead region 100 can be made uniform.

The second dummy patterns 71 and 72 are not connected to the first wiring pattern 20 but may be connected to the first dummy pattern 40. That is, only the dummy patterns 40, 71, and 72 are connected, so that the electrical signals flowing through the first wiring pattern 20 may not be affected.

As shown, the second dummy patterns 71 and 72 may include a lattice shape, but the present invention is not limited thereto. The second dummy patterns 71 and 72 may extend only in the longitudinal or width direction of the base film 10 or may be an array of single land patterns.

The second dummy patterns 71 and 72 are spaced apart from the longitudinal ends 61 and 62 of the base film 10 by a fourth distance D4 and the fifth distance D5 from the outer lead regions 101 and 102, As shown in Fig. The fourth distance D4 and the fifth distance D5 may be different from each other. As another embodiment of the present invention, the second dummy patterns 71 and 72 may extend to the longitudinal ends 61 and 62 of the base film 10.

6 is a top view showing another side of a flexible circuit board according to another embodiment of the present invention.

6, the flexible printed circuit board 3 includes a second wiring pattern 120, third dummy patterns 140, 171, and 171 on the opposite surface of the base film 10 on which the first wiring pattern 20 is formed. 172, < / RTI >

The second wiring pattern 120 may be electrically connected to the first wiring pattern 20 through a via (not shown), but the present invention is not limited thereto.

The third dummy patterns 140, 171, and 172 may be formed to surround the second wiring pattern region 125. The third dummy patterns 140, 171 and 172 may not be connected to the first wiring pattern 20 and the second wiring pattern 120. [ That is, the third dummy patterns 140, 171, and 172 may be electrically insulated from the first wiring patterns 20 and the second wiring patterns 120. On the other hand, the third dummy patterns 140, 171 and 172 are formed in the first and second dummy patterns 40 and 71, respectively, like the first and second wiring patterns 20 and 120 which can be connected via vias And 72 via vias.

If necessary, portions of the second dummy patterns 171 and 172 may be omitted, such as a flexible circuit board (1 in FIG. 1) according to an embodiment of the present invention.

7 is a cross-sectional view of an electronic device including a flexible circuit board according to some embodiments of the present invention.

7, an electronic device according to an embodiment of the present invention may include a flexible circuit board 5, a first external device 200, a second external device 300, and a semiconductor device 400 .

The first external device 200 and the second external device 300 may be electrically connected by the flexible circuit board 5. [ The first external device 200 may be, for example, a display panel displaying an image, and the second external device 300 may be a hard circuit board connected to such a display panel, but the present invention is not limited thereto . That is, it is sufficient that the first and second external devices 200 and 300 can be electrically connected by the flexible circuit board 5 according to the embodiment of the present invention.

The first external device 200 and the second external device 300 may be connected to the flexible circuit board through the outer lead area of the flexible circuit board.

The semiconductor device 400 may be disposed on the flexible circuit board 5. [ More specifically, the semiconductor element 400 can be disposed in the inner lead region of the flexible circuit board 5. [ If the first external device 200 is a display panel, the semiconductor device 400 may be, for example, a Display Driver IC (DDIC) for driving the display panel.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1, 2, 3: Flexible circuit board 10: Base film
20: wiring pattern 30: plated layer
40, 71, 72: dummy pattern

Claims (11)

A base film including one side and the other side;
An inner lead defined on at least one of the one surface and the other surface of the base film and having a driving element mounted thereon;
An outer lead region defined on at least one of the one surface and the other surface of the base film and connected to an external device;
A wiring pattern region in which a plurality of wiring patterns connecting the inner lead region and the outer lead region are arranged;
A first dummy pattern disposed between the wiring pattern region and the width direction end portion of the base film; And
And a second dummy pattern disposed between the outer lead region and the longitudinal end of the base film. delete The method according to claim 1,
Wherein the first dummy pattern and the second dummy pattern are disposed so as to surround the wiring pattern region. The method according to claim 1,
Wherein the first dummy pattern is spaced apart from the outermost wiring pattern of the wiring pattern area by 0.001 mm to 2 mm. 1. A flexible circuit board in which a wiring pattern is formed in a semi-additive manner,
A base film including one side and the other side;
An inner lead defined on at least one of the one surface and the other surface of the base film and having a driving element mounted thereon;
An outer lead region defined on at least one of the one surface and the other surface of the base film and connected to an external device;
A wiring pattern region in which the wiring pattern connecting the inner lead region and the outer lead region is disposed; And
Includes a dummy pattern is disposed between the transverse direction end portions of the wiring pattern area and the base film,
Wherein the wiring pattern and the dummy pattern are formed on the base film by plating,
Wherein the dummy pattern disperses a current density applied to the wiring pattern when plating the wiring pattern. 6. The method of claim 5,
Wherein the wiring pattern and the dummy pattern are formed at the same level. The method according to claim 1,
Wherein the first and second dummy patterns are not electrically connected to the plurality of wiring patterns. The method according to claim 1,
And a reinforcing pattern for reinforcing the base film,
Wherein the first dummy pattern is disposed between the reinforcing pattern and the wiring pattern. A base film including one side and the other side;
An inner lead defined on at least one of the one surface and the other surface of the base film and having a driving element mounted thereon;
An outer lead region defined on at least one of the one surface and the other surface of the base film and connected to an external device;
A wiring pattern region in which a plurality of wiring patterns connecting the inner lead region and the outer lead region are arranged;
A first dummy pattern disposed between the wiring pattern region and the width direction end portion of the base film;
A second dummy pattern disposed between the outer lead region and the longitudinal end of the base film;
A semiconductor element mounted on the inner lead region; And
And an external device connected from the outer lead area.
10. The method of claim 9,
Wherein the first dummy pattern is spaced apart from the outermost wiring pattern of the wiring pattern area by 0.001 mm to 2 mm.
6. The method of claim 5,
Wherein the dummy pattern is spaced apart from the outermost wiring pattern of the wiring pattern area by 0.001 mm to 2 mm.
KR1020160019890A 2016-02-19 2016-02-19 Flexible printed circuit boards KR101753685B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102118417B1 (en) * 2018-12-21 2020-06-03 김기태 Part Aligning Device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074492A (en) * 2010-09-28 2012-04-12 Hitachi Cable Film Device Ltd Film substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074492A (en) * 2010-09-28 2012-04-12 Hitachi Cable Film Device Ltd Film substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102118417B1 (en) * 2018-12-21 2020-06-03 김기태 Part Aligning Device

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