JP4932912B2 - パッシブ埋設構造の上部導電層に対するブリッジ相互接続を有する小型電子装置、およびこれを製作する方法 - Google Patents
パッシブ埋設構造の上部導電層に対するブリッジ相互接続を有する小型電子装置、およびこれを製作する方法 Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- H—ELECTRICITY
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
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- H—ELECTRICITY
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
Claims (8)
- 高分子で構成された層を含む基板と、
前記基板に埋設されたパッシブ構造であって、
前記高分子で構成された層を覆う底部導電層、
前記底部導電層を覆う誘電体層、および
前記誘電体層を覆う上部導電層
を有するパッシブ構造と、
前記高分子で構成された層を貫通して延在し、前記底部導電層から電気的に絶縁された導電性ビアと、
前記底部導電層から、前記導電性ビアを絶縁する絶縁材料と、
前記上部導電層の前記誘電体層から遠ざかる側に設置されたブリッジ相互接続であって、前記導電性ビアを前記上部導電層に電気的に接続するブリッジ相互接続と、
を有する小型電子装置であって、
前記上部導電層は、上部電極層であり、
前記誘電体層は、キャパシタ誘電体層であり、
前記底部導電層は、底部電極層であり、
前記上部電極層、前記キャパシタ誘電体層、および前記底部電極層の組み合わせは、前記基板に、埋設されたキャパシタ構造を形成し、
さらに、前記導電性ビアの側壁を取り囲み、前記上部導電層および前記底部導電層から、前記導電性ビアを絶縁する絶縁スリーブを有し、前記絶縁材料は、前記絶縁スリーブの一部となり、
前記ブリッジ相互接続は、平坦なブリッジ相互接続であり、前記上部導電層上および前記導電性ビア上に直接配置され、前記上部導電層に隣接して配置され、前記ビアおよび前記上部電極層を覆うことを特徴とする小型電子装置。 - 前記導電性ビアは、上部電極導電性ビアであり、
当該装置は、さらに、
前記キャパシタ誘電体層を貫通して延在し、前記底部電極層に接続された底部電極導電性ビアを有し、該底部電極導電性ビアは、前記上部電極層から絶縁されていることを特徴とする請求項1に記載の装置。 - 前記キャパシタ誘電体層は、セラミック誘電体材料を有することを特徴とする請求項1に記載の装置。
- 前記セラミック誘電体材料は、チタン酸ストロンチウム、チタン酸バリウムストロンチウム、および/またはチタン酸バリウムからなる群から選定されることを特徴とする請求項3に記載の装置。
- 前記基板は、有機基板であることを特徴とする請求項4に記載の装置。
- 前記基板は、ビスマレイミドトリアジン樹脂を含むコアを有することを特徴とする請求項5に記載の装置。
- 電子組立体と、前記電子組立体に結合されたメインメモリとを有するシステムであって、
前記電子組立体は、小型電子装置を有し、
該小型電子装置は、
高分子で構成された層を含む基板、
前記基板に埋設されたパッシブ構造であって、
前記高分子で構成された層を覆う底部導電層と、
前記底部導電層を覆う誘電体層と、
前記誘電体層を覆う上部導電層と、
を有するパッシブ構造、
前記高分子で構成された層を貫通して延在し、前記底部導電層から電気的に絶縁された導電性ビア、
前記底部導電層から前記導電性ビアを絶縁する絶縁材料、および
前記上部導電層の前記誘電体層から遠ざかる側に設置された、ブリッジ相互接続であって、前記導電性ビアを前記上部導電層に接続するブリッジ相互接続、
を有し、
前記上部導電層は、上部電極層であり、
前記誘電体層は、キャパシタ誘電体層であり、
前記底部導電層は、底部電極層であり、
前記上部電極層、前記キャパシタ誘電体層、および前記底部電極層の組み合わせは、前記基板に、埋設されたキャパシタ構造を形成し、
さらに、前記導電性ビアの側壁を取り囲み、前記上部導電層および前記底部導電層から、前記導電性ビアを絶縁する絶縁スリーブを有し、前記絶縁材料は、前記絶縁スリーブの一部となり、
前記ブリッジ相互接続は、平坦なブリッジ相互接続であり、前記上部導電層上および前記導電性ビア上に直接配置され、前記上部導電層に隣接して配置され、前記ビアおよび前記上部電極層を覆うことを特徴とするシステム。 - 小型電子装置であって、
高分子で構成された層を含む基板と、
前記基板に埋設されたパッシブ構造であって、
前記高分子で構成された層を覆う底部導電層、
前記底部導電層を覆う誘電体層、
前記誘電体層を覆う上部導電層
を有するパッシブ構造と、
前記パッシブ構造の第1の部分を貫通して延在する第1の導電性ビアと、
前記パッシブ構造の第2の部分を貫通して延在する第2の導電性ビアであって、前記上部導電層から絶縁され、前記底部導電層に電気的に接続された第2の導電性ビアと、
前記第1の導電性ビアの側壁を取り囲み、前記上部導電層および前記底部導電層から、前記第1の導電性ビアを絶縁する絶縁スリーブと、
前記上部導電層の前記誘電体層から遠ざかる側に設置された、ブリッジ相互接続であって、前記第1の導電性ビアを前記上部導電層に電気的に接続するブリッジ相互接続と、
を有し、
前記上部導電層は、上部電極層であり、
前記誘電体層は、キャパシタ誘電体層であり、
前記底部導電層は、底部電極層であり、
前記上部電極層、前記キャパシタ誘電体層、および前記底部電極層の組み合わせは、前記基板に、埋設されたキャパシタ構造を形成し、
前記ブリッジ相互接続は、平坦なブリッジ相互接続であり、前記上部導電層上および前記第1の導電性ビア上に直接配置され、前記上部導電層に隣接して配置され、前記第1の導電性ビアおよび前記上部電極層を覆うことを特徴とする小型電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/610,385 | 2006-12-13 | ||
US11/610,385 US7738257B2 (en) | 2006-12-13 | 2006-12-13 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
PCT/US2007/086665 WO2008076659A1 (en) | 2006-12-13 | 2007-12-06 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
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Publication Number | Publication Date |
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JP2010512667A JP2010512667A (ja) | 2010-04-22 |
JP4932912B2 true JP4932912B2 (ja) | 2012-05-16 |
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JP2009541488A Expired - Fee Related JP4932912B2 (ja) | 2006-12-13 | 2007-12-06 | パッシブ埋設構造の上部導電層に対するブリッジ相互接続を有する小型電子装置、およびこれを製作する方法 |
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US (1) | US7738257B2 (ja) |
JP (1) | JP4932912B2 (ja) |
KR (1) | KR101100946B1 (ja) |
CN (1) | CN101563963B (ja) |
TW (1) | TWI348880B (ja) |
WO (1) | WO2008076659A1 (ja) |
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WO2018004692A1 (en) * | 2016-07-01 | 2018-01-04 | Pietambaram Srinivas V | Molded embedded bridge for enhanced emib applications |
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KR100645625B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
KR100867038B1 (ko) * | 2005-03-02 | 2008-11-04 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
KR100716824B1 (ko) | 2005-04-28 | 2007-05-09 | 삼성전기주식회사 | 하이브리드 재료를 이용한 커패시터 내장형 인쇄회로기판및 그 제조방법 |
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JPH06104578A (ja) * | 1992-09-22 | 1994-04-15 | Ngk Spark Plug Co Ltd | 多層配線基板及びその製造方法 |
JPH0730258A (ja) * | 1993-07-13 | 1995-01-31 | Ngk Spark Plug Co Ltd | キャパシタ内蔵多層配線基板とその製造方法 |
JP2001274034A (ja) * | 2000-01-20 | 2001-10-05 | Shinko Electric Ind Co Ltd | 電子部品パッケージ |
WO2006001501A1 (en) * | 2004-06-25 | 2006-01-05 | Taisho Pharmaceutical Co., Ltd. | Pyrrolopyrimidine and pyrrolopyridine derivatives substituted with tetrahydropyridine as crf antagonists |
WO2006001505A1 (ja) * | 2004-06-25 | 2006-01-05 | Ibiden Co., Ltd. | プリント配線板及びその製造方法 |
Also Published As
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US20080142253A1 (en) | 2008-06-19 |
TWI348880B (en) | 2011-09-11 |
TW200847860A (en) | 2008-12-01 |
KR101100946B1 (ko) | 2011-12-29 |
US7738257B2 (en) | 2010-06-15 |
KR20090079263A (ko) | 2009-07-21 |
WO2008076659A1 (en) | 2008-06-26 |
CN101563963A (zh) | 2009-10-21 |
JP2010512667A (ja) | 2010-04-22 |
CN101563963B (zh) | 2013-07-10 |
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