TWI348880B - Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same - Google Patents
Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making sameInfo
- Publication number
- TWI348880B TWI348880B TW096143694A TW96143694A TWI348880B TW I348880 B TWI348880 B TW I348880B TW 096143694 A TW096143694 A TW 096143694A TW 96143694 A TW96143694 A TW 96143694A TW I348880 B TWI348880 B TW I348880B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive layer
- device including
- microelectronic device
- making same
- top conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/610,385 US7738257B2 (en) | 2006-12-13 | 2006-12-13 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200847860A TW200847860A (en) | 2008-12-01 |
TWI348880B true TWI348880B (en) | 2011-09-11 |
Family
ID=39525770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096143694A TWI348880B (en) | 2006-12-13 | 2007-11-19 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same |
Country Status (6)
Country | Link |
---|---|
US (1) | US7738257B2 (zh) |
JP (1) | JP4932912B2 (zh) |
KR (1) | KR101100946B1 (zh) |
CN (1) | CN101563963B (zh) |
TW (1) | TWI348880B (zh) |
WO (1) | WO2008076659A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI730100B (zh) * | 2016-07-01 | 2021-06-11 | 美商英特爾公司 | 用於增強型嵌入式多晶粒互連橋接(emib)應用之模製嵌入式橋接件 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4904891B2 (ja) * | 2006-03-31 | 2012-03-28 | 富士通株式会社 | 回路基板および電子装置、回路基板の製造方法 |
US7608538B2 (en) * | 2007-01-05 | 2009-10-27 | International Business Machines Corporation | Formation of vertical devices by electroplating |
US7710709B2 (en) * | 2007-03-30 | 2010-05-04 | Intel Corporation | Carbon nanotube coated capacitor electrodes |
US8068328B2 (en) * | 2008-03-12 | 2011-11-29 | Intel Corporation | Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same |
KR20090120103A (ko) * | 2008-05-19 | 2009-11-24 | 삼성전자주식회사 | 정전기 방전 보호 장치를 갖는 전자 장치 및 그 제조방법들 |
TWI392404B (zh) * | 2009-04-02 | 2013-04-01 | Unimicron Technology Corp | 線路板及其製作方法 |
DE102010023550B4 (de) * | 2010-06-03 | 2015-02-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Beleuchtungselement |
CN103596358B (zh) * | 2013-12-04 | 2016-11-23 | 江苏长电科技股份有限公司 | Smt加法高密度封装多层线路板结构及其制作方法 |
JP6418237B2 (ja) * | 2014-05-08 | 2018-11-07 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
CN109788663B (zh) * | 2017-11-10 | 2021-08-24 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法及由该方法制得的电路板 |
US11410921B2 (en) * | 2018-08-21 | 2022-08-09 | Intel Corporation | Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films |
US11240908B2 (en) * | 2018-10-29 | 2022-02-01 | Tdk Corporation | Thin film capacitor and circuit board incorporating the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06104578A (ja) * | 1992-09-22 | 1994-04-15 | Ngk Spark Plug Co Ltd | 多層配線基板及びその製造方法 |
JP3154594B2 (ja) * | 1993-07-13 | 2001-04-09 | 日本特殊陶業株式会社 | キャパシタ内蔵多層配線基板とその製造方法 |
US6224965B1 (en) * | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
JP3809053B2 (ja) * | 2000-01-20 | 2006-08-16 | 新光電気工業株式会社 | 電子部品パッケージ |
JP3817463B2 (ja) | 2001-11-12 | 2006-09-06 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
JP4166013B2 (ja) * | 2001-12-26 | 2008-10-15 | 富士通株式会社 | 薄膜キャパシタ製造方法 |
CN100576979C (zh) * | 2004-06-25 | 2009-12-30 | 揖斐电株式会社 | 印刷配线板及其制造方法 |
WO2006001501A1 (en) * | 2004-06-25 | 2006-01-05 | Taisho Pharmaceutical Co., Ltd. | Pyrrolopyrimidine and pyrrolopyridine derivatives substituted with tetrahydropyridine as crf antagonists |
US7100277B2 (en) * | 2004-07-01 | 2006-09-05 | E. I. Du Pont De Nemours And Company | Methods of forming printed circuit boards having embedded thick film capacitors |
KR100645625B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
KR100867038B1 (ko) * | 2005-03-02 | 2008-11-04 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
KR100716824B1 (ko) | 2005-04-28 | 2007-05-09 | 삼성전기주식회사 | 하이브리드 재료를 이용한 커패시터 내장형 인쇄회로기판및 그 제조방법 |
-
2006
- 2006-12-13 US US11/610,385 patent/US7738257B2/en not_active Expired - Fee Related
-
2007
- 2007-11-19 TW TW096143694A patent/TWI348880B/zh not_active IP Right Cessation
- 2007-12-06 WO PCT/US2007/086665 patent/WO2008076659A1/en active Application Filing
- 2007-12-06 CN CN2007800459542A patent/CN101563963B/zh not_active Expired - Fee Related
- 2007-12-06 JP JP2009541488A patent/JP4932912B2/ja not_active Expired - Fee Related
- 2007-12-06 KR KR1020097012208A patent/KR101100946B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI730100B (zh) * | 2016-07-01 | 2021-06-11 | 美商英特爾公司 | 用於增強型嵌入式多晶粒互連橋接(emib)應用之模製嵌入式橋接件 |
Also Published As
Publication number | Publication date |
---|---|
US7738257B2 (en) | 2010-06-15 |
CN101563963A (zh) | 2009-10-21 |
KR20090079263A (ko) | 2009-07-21 |
JP4932912B2 (ja) | 2012-05-16 |
KR101100946B1 (ko) | 2011-12-29 |
US20080142253A1 (en) | 2008-06-19 |
WO2008076659A1 (en) | 2008-06-26 |
TW200847860A (en) | 2008-12-01 |
JP2010512667A (ja) | 2010-04-22 |
CN101563963B (zh) | 2013-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |