JP4925296B2 - Method for manufacturing high thermal conductivity circuit module and high thermal conductivity circuit module - Google Patents

Description

  The present invention relates to a method of manufacturing a highly thermally conductive circuit module used for holding electronic components such as power chips and LEDs used in the power electronics field and LED field and mounting them on a circuit board at a high density, and this The present invention relates to a high thermal conductivity circuit module obtained by the method.

  In recent years, electronic components have been required to be mounted on a circuit board with high density as electronic devices become more functional and smaller and thinner. Particularly in the field of power electronics, electronic components (for example, LEDs) that tend to generate heat are mounted with high density as electronic components, so that high-density wiring with fine patterns (fine patterns) is applied to circuit boards. In addition to the above design, it is required that the heat generated from the electronic components be highly radiated. However, since there is a limit to expecting high heat dissipation in the circuit board itself, it is desirable to prepare a circuit module in which electronic components are mounted in a package with high heat dissipation and mount this circuit module on the circuit board.

  As such a package, a package disclosed in Japanese Patent Application Laid-Open No. 2003-163378 is known. In this package, two metal bases that are electrically isolated from each other are formed by interposing an insulating spacer formed of an insulating resin in a part of a metal body formed by injection molding, and terminals of electronic components are formed on each metal base. By being coupled, electrical connection between the electronic component and the circuit board can be made by using each metal base as an electrode, and heat released from the electronic component can be released through the metal base.

  However, since each such package is formed by injection molding, there is a problem that the efficiency of manufacturing the circuit module is low and the manufacturing cost is high.

  Furthermore, since the distance between terminals in microelectronic components has become very short with the miniaturization of electronic components used in high-density circuit boards, the thickness of the insulating spacer that electrically isolates the metal bases As for (insulation distance), it is required to be made thin in accordance with the distance between terminals. However, there has been a problem that it is difficult to achieve the thickness (insulation distance) of the insulating spacers with an extremely thin dimension of, for example, about 20 to 500 μm with high accuracy and uniformity with the above prior art.

  In addition, since the mounting surface of many microelectronic components is flat, it is desirable that the surface of the metal base on which it is mounted be as flat as possible, so the metal base molded by injection molding is filled with insulating resin. Such a conventional method is expected to cause a problem that a complicated process is required to flatten the surface on which the electronic component is mounted.

    SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a method for efficiently and cost-effectively producing a circuit module having a high heat dissipation property for heat generated in an electronic component at a low cost and a high thermal conductivity circuit module produced by this method. It is to be.

The method of the present invention is a method of manufacturing a circuit module that is used to hold an electronic component that generates heat and to mount it on a circuit board, and includes at least two metals that are conductive materials and have high thermal conductivity After the layers are stacked with an insulating resin layer interposed between them, the metal layer is joined by the insulating resin layer to form an integrated stack, and then the stack is sliced to cut out the package and cut by slicing Get the package with the mounting surface. The package has a structure in which two metal bases are joined by an insulating spacer that electrically isolates them and mechanically couples them, and the metal base is formed by a part of the metal layer, The insulating spacer is formed by a part of the insulating resin layer. Thereafter, at least one electronic component having at least two terminals is disposed on the mounting surface of the package so as to straddle the insulating spacer, and at least two terminals are connected to different metal bases separated by the insulating spacer. Make electrical connections. The insulating resin layer is highly filled with an inorganic filler.

  Thus, in order to form a package in which one laminated body is sliced and the electronic component is mounted on the cut surface, the mounting surface of the package including the insulating spacer and the metal base on both sides thereof is flat from the beginning. Can be finished. In addition, since the insulating spacer is defined by the insulating resin layer that constitutes the laminate, the thickness of the insulating spacer (insulating distance between the metal bases) can be finished with high precision to a thin dimension, and it is possible to use fine electronic components. Even if it exists, the electrical connection of the electronic component to the different metal base which separated the insulating spacer can be performed reliably.

  In addition, if multiple electronic components are placed in parallel on the package and electrically connected in parallel to different metal bases separated by insulating spacers, parallel electrical connection to each other is required. Thus, a circuit module having a plurality of electronic components can be easily manufactured with fewer steps.

  In this case, if the package is cut at a part in the longitudinal direction in which a plurality of electronic components are arranged to obtain a plurality of circuit modules each mounted with at least one electronic component, a package in which the electronic components are arranged in a row Thus, a plurality of circuit modules can be easily manufactured.

  Furthermore, after laminating a plurality of metal layers alternately with a plurality of insulating resin layers to form a laminated body in which the metal layers are bonded and integrated by the insulating resin layer, the laminated body is moved along the laminating direction. If a package is cut out by slicing, a large number of metal bases and insulating spacers are alternately arranged on the mounting surface of the package, so that many electronic components can be easily mounted vertically and horizontally on the mounting surface. be able to.

  In this case, a plurality of circuit modules each mounting at least one electronic component can be easily obtained by cutting the package after mounting the plurality of electronic components on the package.

  It is also possible to arrange the electronic component on the mounting surface of the package so as to straddle the plurality of insulating spacers. This is suitable for mounting an electronic component having three or more terminals, and each terminal can be electrically connected to a metal base electrically isolated from each other.

  Also in this case, a plurality of circuit modules each mounted with at least one electronic component can be obtained by cutting the package into a size including a plurality of insulating spacers and a metal base positioned outside these insulating spacers. Can do.

  The insulating spacer is preferably 20 to 500 μm thick. This thickness is easily set by selecting the thickness of the insulating resin layer to be used.

  The metal layer is selected from the group consisting of copper, aluminum, nickel, iron, an alloy containing at least one, and a copper-invar copper composite material in order to exhibit high heat dissipation and high conductivity.

Furthermore, the insulating resin layer is desirably a resin having ultraviolet resistance. In particular, when an electronic component that generates ultraviolet rays, for example, an LED, is used, it is required to prevent the insulating performance of the insulating spacer from being deteriorated by the irradiation of ultraviolet rays. An insulating resin excellent in ultraviolet rays is used.
A high thermal conductivity circuit module according to the present invention includes a package formed by slicing a laminate in which at least two metal layers, which are high thermal conductivity and conductive materials, and an insulating resin layer are integrated, and the above package And an electronic component mounted on the mounting surface. The package mounting surface is defined by a cut surface that slices the laminate. The package includes at least two metal bases formed by a part of the metal layer and an insulating spacer formed by a part of the insulating resin layer, and the metal base is electrically isolated by the insulating spacer. The electronic component is disposed on the mounting surface of the package so as to straddle the insulating spacer. At least two terminals of the electronic component are electrically connected to different metal bases separated by the insulating spacer. The insulating resin layer is highly filled with an inorganic filler. In this circuit module, since the surface defined by the cut surface of the laminate is used as the package mounting surface, the mounting surface becomes smooth and the mounting accuracy of the electronic component is increased. In addition, since the thickness of the insulating spacer appearing on the mounting surface, that is, the insulating distance between the metal bases is uniformly determined by the thickness of the insulating resin layer used in the laminate, the thickness of the insulating spacer (insulating distance) Can be made uniform over the entire package, and electrical connection with the electronic component can be performed accurately.

When LEDs are used as electronic components, a plurality of LEDs are mounted on the package in a parallel relationship with each other, thereby realizing a circuit module as a line-shaped light source in which LEDs are arranged in a line.

Explanatory drawing which shows each process (A)-(E) in the manufacturing method of the high thermal conductivity circuit module which concerns on one Embodiment of this invention. The perspective view of the circuit module obtained by the manufacturing method same as the above. The side view of a circuit module same as the above. Sectional drawing which shows the circuit board with which the circuit module same as the above was mounted. Explanatory drawing which shows each process (A)-(F) in the manufacturing method of the high thermal conductivity circuit module which concerns on other embodiment of this invention. The perspective view of the circuit module obtained by the manufacturing method same as the above. The side view of a circuit module same as the above. The perspective view of the other circuit module obtained with the manufacturing method same as the above. The top view which shows the manufacturing method of the high thermal conductivity circuit module which concerns on other embodiment of this invention. The perspective view of the circuit module obtained by the manufacturing method same as the above. The front view of a circuit module same as the above. The top view which shows the manufacturing method of the high thermal conductivity circuit module which concerns on further another embodiment of this invention. The perspective view of the other circuit module obtained with the manufacturing method same as the above.

  1 to 4 show a method for manufacturing a high thermal conductivity circuit module according to an embodiment of the present invention. The circuit module M in the present invention holds an electronic component 40 that generates a large amount of heat, such as a power transistor or LED, in a high heat dissipation package 30 and, as shown in FIG. Used to mount the component 40. The package 30 is mostly made of metal, and has a function of radiating heat generated by the electronic component 40 due to the high thermal conductivity of the metal. The package 30 is given a function as an electrode for electrically connecting the terminal of the electronic component 40 to the circuit pattern 60 formed on the circuit board P. That is, as shown in FIGS. 2 and 3, the package 30 has a structure in which two metal bases 11 and 12 electrically isolated by the insulating spacer 22 are integrated with the insulating spacer 22. The electronic component 40 is disposed on the package 30 so as to straddle the insulating spacer 22, and the two terminals formed on the lower surface of the electronic component 40, that is, the bump 44, are coupled to the two metal bases 11 and 12 separated by the insulating spacer 22. Thus, it is mounted on the package 30.

  The circuit board P has a fine circuit pattern 60 formed on the insulating substrate 50, the circuit module M is disposed on a part of the circuit pattern 60, and the metal bases 11 and 12 are soldered to a part of the circuit pattern 60. The circuit module M is mounted on the circuit board P by being coupled by 62. The lower surface of the insulating substrate 50 is covered with a metal plate 70, and part of the heat generated by the electronic component 40 is released through the circuit pattern 60, the insulating substrate 50, and the metal plate 70.

  The circuit module shown in the present embodiment is used as a linear light source in which a plurality of LEDs are connected in parallel as the electronic component 40, and the LEDs are arranged in a row on the horizontally long package 30.

  Each package 30 is cut out from the laminated body L formed as shown in FIG. The laminate L is formed by laminating two metal layers 10 with an insulating resin layer 20 sandwiched between them (FIG. 1A), and applying heat and pressure to firmly bond the metal layers 10 together with the insulating resin layer 20. Is obtained (FIG. 1B). Next, the stacked body L is sliced to obtain a plurality of packages 30 whose cut surfaces are the mounting surfaces of the electronic components (FIG. 1C). The package 30 thus obtained has a structure in which two metal bases 11 and 12 formed by different metal layers 10 are integrally coupled by an insulating spacer 22 formed by a part of the insulating resin layer 20. Become.

  After this package is surface-treated to remove dirt, a large number of electronic components 40 are arranged in parallel on the mounting surface of the package so that each electronic component 40 straddles the insulating resin layer 20, and each electronic component 40 is soldered. The terminal on the lower surface is bonded to the metal layer 10 (FIG. 1D). Thereafter, the package 30 is cut along the surface indicated by the broken line in the drawing to obtain a plurality of circuit modules M each holding a predetermined number of electronic components 40 (FIG. 1E). In this manner, a plurality of circuit modules M each having the electronic component 40 mounted on the divided package pieces 32 are taken out simultaneously.

  The thickness (t) of the package 30 is set sufficiently larger than the thickness of the circuit pattern 60 on the circuit board P in order to obtain high heat dissipation. Since the circuit pattern 60 is 35 μm or less in order to form a fine circuit by etching, the thickness of the package 30 is set to 0.5 to 3 mm. Since the package 30 is created by slicing the stacked body L, the thickness (t) can be easily set.

  In the figure, an example is shown in which a plurality of circuit modules M are created by subdividing the package 30 cut out from the stacked body L, but the present invention is not limited to this, and one circuit module is preliminarily provided. The laminated body L may be configured in accordance with the length of M, and a single circuit module M may be manufactured using a package 30 obtained by slicing the stacked body L.

  Moreover, after preparing the laminated body L of the two metal layers 10 and the one insulating resin layer 20 as one unit, superposing a plurality of these, and forming a structure that holds the units by an appropriate method, It is also possible to slice this and create a plurality of packages 30 simultaneously.

  In producing the laminate L, it is preferable that the surface of the metal layer 10 is roughened in advance in order to obtain adhesion between the metal layer 10 and the resin insulating layer 20. For example, an oxide film can be formed on the surface of the metal layer 10 and chemically roughened, or the surface of the metal layer 10 can be physically roughened by sandblasting.

  The metal layer 10 is not particularly limited, but includes copper, aluminum, nickel, iron, and an alloy including at least one of these, and a copper / invar / copper multilayer. It is preferable to use a material selected from materials (clad materials obtained by superimposing copper, various invar alloys and copper in this order). Further, different metal layers 10 may be disposed on both sides of the insulating resin layer 20. Although the thickness of the metal layer 10 is not specifically limited, For example, the range of 0.5-20 mm is preferable.

  As the insulating resin forming the insulating resin 20, a thermosetting resin composition or a thermoplastic resin composition can be used. As these compositions, it is preferable to use those containing an inorganic filler in order to adjust the fluidity or further increase the thermal conductivity. Such a composition can be prepared by adding a known inorganic filler, curing agent, curing accelerator, solvent, surface treatment agent, pigment or the like to the thermosetting resin or thermoplastic resin. The form of the insulating resin layer 20 is not particularly limited, but is preferably a sheet. Specifically, it is a B-stage adhesive film obtained by applying and drying an insulating resin onto a PET film or the like, or a B-stage prepreg obtained by impregnating and drying an insulating resin on a substrate such as a glass cloth. Is preferred. When an adhesive sheet such as the above adhesive film or prepreg is used, the insulating resin 20 having a thin and uniform thickness can be easily formed.

  Also. The insulating resin layer 20 can also be formed by a paste applied to the metal layer 10. This paste is obtained by adding a known inorganic filler, curing agent, curing accelerator, solvent, surface treatment agent, pigment or the like to a thermosetting resin (or thermoplastic resin). (Resin composition) is obtained by slurrying the composition.

  Specifically, the thickness of the insulating resin layer 20, that is, the insulating spacer 22, is preferably 20 to 500 μm. If the thickness of the insulating resin layer 20 is less than 20 μm, there is a high possibility of insulation failure due to bubbles mixed in the insulating resin layer 20 and fine protrusions on the surface of the metal layer 10, and sufficient insulation can be secured. There is a risk of disappearing. On the contrary, if the thickness of the insulating resin layer 20 exceeds 500 μm, the distance between the terminals of the target electronic component 40 becomes larger, and electrical connection with the electronic component may not be performed. The thickness of the tree insulating resin layer 20 can be changed according to the specifications of the electronic component 40 to be used. For example, when the distance between the terminals is relatively long, it is 25 to 300 μm, and the distance between the terminals is relatively short and is electrically connected by the bump. It is set as 30-150 micrometers in what is.

  In the case of using a thermosetting resin composition as the insulating resin, as the thermosetting resin as the main component, for example, epoxy resin, phenol resin, polyimide resin, silicone resin, cyanate resin, and the like can be used. A brominated resin or a phosphorus-modified resin can also be used to impart flame retardancy.

  As the thermosetting resin composition used as the insulating resin, a highly filled inorganic filler is preferable. Thus, by highly filling the inorganic filler, the thermal conductivity of the insulating spacer 22 can be further increased, the heat generated from the electronic component 40 can be dissipated more efficiently, and the thermal expansion coefficient of the insulating spacer 22 can be increased. However, the thermal expansion coefficient of the metal bases 21 and 22 approaches, and the thermal reliability of the high thermal conductivity circuit module can be improved. By adjusting the filling amount of the inorganic filler as necessary, the flow characteristics of the thermosetting resin composition at the time of producing the laminate L can also be adjusted.

Examples of the inorganic filler include, but are not particularly _{limited, Al 2 O 3, MgO,} BN, AlN, can be used those selected from SiO _2, TiO _2, CaCO _3, etc., Al ₂ O ₃ , MgO, BN, and AlN are preferable because they have better thermal conductivity than other inorganic fillers. In addition, in order to improve the dispersibility to the thermosetting resin of an inorganic filler, it is preferable to use a coupling agent, a dispersing agent, etc. together.

  In the case where, for example, an LED that emits UV light (ultraviolet light) is used as the electronic component 40, the insulating spacer 22 is required to have sufficient UV resistance. In such a case, the insulating resin layer 20 can be formed using an insulating resin containing a UV-resistant material to prevent the insulating spacer 22 from being deteriorated. Examples of the insulating resin containing the material having UV resistance include a fluorine-based resin composition (for example, a resin mainly composed of Teflon (registered trademark)) and a silicone-based resin composition (for example, a silicone resin). It is preferable to use one or both of the main components).

  Examples of the present embodiment will be described below.

Example 1
An adhesive sheet for forming the insulating resin layer 20 was prepared as follows.
100 parts by weight of epoxy resin, 5 parts by weight of dicyandiamide (curing agent), 0.1 part by weight of 2-ethyl-4-methylimidazole (curing accelerator), 10 parts by weight of epoxy silane coupling agent, methyl ethyl ketone and dimethylformamide A solution in which 70 parts by weight of a solvent (MEK: DMF = 1: 2 (weight ratio)) was mixed and dissolved in advance was prepared.

  Next, 700 parts by weight of an alumina filler (inorganic filler) having an average particle diameter of 5 μm was further mixed with this solution, and this was stirred with a disper to obtain a slurry having a solid content of 93 wt% and a viscosity of 3000 cps. And this slurry was apply | coated on PET film, this was dried at 150 degreeC for 10 minute (s), and the adhesive sheet of B stage state (85 wt% of inorganic fillers) which has adhesiveness of 50 micrometers in thickness was created.

Next, an aluminum plate having a thickness of 5 mm is used as the metal layer 10 and laminated with the above adhesive sheet. Under a reduced pressure of 6.67 hPa (5 Torr) or less, the actual pressure is 0.29 MPa (3 kgf / cm ² ). 130 ° C. × 10 minutes + 175 ° C. × 60 minutes heat and pressure treatment to produce a laminate L.
Thereafter, the laminate L is sliced to obtain a package 30 having a thickness (t = 5 mm), the surface of the metal layer 10 is gold-plated, and a plurality of LEDs as electronic components 40 are arranged on the mounting surface of the package. 44, the electronic component 40 was joined to the metal base.
Finally, the package 30 was subdivided to obtain individual circuit modules M on which a plurality of electronic components 40 were mounted.

  In the embodiment shown in FIG. 3, an example in which the electronic component 40 is bonded to the metal bases 11 and 12 by the bumps 44 formed on the lower surface is shown. However, it is optimal depending on the structure of each electronic component 4 such as wire bonding and solder reflow. Can be selected. In particular, in the case where terminals are provided on the upper surface and side surfaces of the electronic component, the contact area between the lower surface of the electronic component and the metal bases 11 and 12 can be increased by making electrical connection by wire bonding. And heat dissipation can be improved.

  Further, in the above-described embodiment, the example in which the electronic component 40 is arranged here as a flat surface on the upper surface of the package 30 is shown. However, a recess is formed on the upper surface of the package 30 and the electronic component 40 is accommodated in the recess. If required, a process for forming a recess having a desired shape in the package 30 can be performed before and after the surface treatment shown in FIG. Further, when the surface of the package 30 is required to be plated or mirror-finished, the insulating resin layer 20 is concealed with a mask over the entire package 30, and a plating layer or an aluminum layer is deposited on the surface of the metal layer 10. Can be formed.

  5 to 7 show other embodiments of the present invention, in which a plurality of metal layers 10 are alternately laminated with a plurality of insulating resin layers 20 (FIG. 5A), and this is heated and pressed. After the integrated laminate L is formed (FIG. 5B), it is sliced into a sheet-like package 30 (FIG. 5C) and insulated from the metal layer 10 on the cut surface that becomes the mounting surface of the component. A package 30 is obtained in which the resin layers 20 appear alternately along the stacking direction (FIG. 5D), the package 30 is surface-treated to remove dirt, and each electronic component straddles the insulating resin layer 20, A large number of electronic components 40 are arranged vertically and horizontally on the package 30, and the terminals on the lower surface of each electronic component 40 are joined to the metal layer 10 by soldering (FIG. 5E), and then the package 30 is cut vertically and horizontally. Are divided into individual package pieces 32 and electronic components 4 Are obtained (FIG. 5F) In this manner, a plurality of circuit modules M are simultaneously taken out from one package 30 cut out from the stacked body L. Accordingly, each of the circuit modules M is obtained. The circuit module M has a structure in which metal bases 11 and 12 formed by a part of different metal layers 10 are integrally coupled by an insulating spacer 22 formed by a part of the insulating resin layer 20.

  In the present embodiment, an example is shown in which each package piece 32 obtained by dividing a package 30 in which a plurality of electronic components 40 are mounted vertically and horizontally is mounted on one electronic component, but the present invention is not necessarily limited to this. The present invention is not limited to this configuration, and the package 30 may be cut at an arbitrary location so that each of the plurality of circuit modules M is mounted with a plurality of electronic components. Furthermore, a single circuit module may be configured by a single package 30 cut out from the laminate L. In any case, by cutting the package 30 from the stacked body L, the thickness (insulation distance) of the insulating spacer 22 can be adjusted to a small value with high accuracy, and one surface of the package flattened by the cut surface By using as the mounting surface of the electronic component, it is possible to mount the electronic component with high accuracy. This enables high-density mounting on a circuit board while improving heat dissipation of fine electronic components. In this sense, the electronic component may be mounted on individual package pieces after the package is subdivided.

  When LEDs are used as electronic components, as shown in FIG. 5E, LEDs as shown in FIG. 2 are arranged in a horizontal row from a structure in which electronic components are arranged vertically and horizontally on one package 30. A circuit module as a line-shaped light source arranged in a row, or a dot display circuit module in which LEDs are arranged in a vertical row can be obtained. That is, a circuit module of a line light source can be obtained by cutting the package 30 in FIG. The dot display circuit module is obtained by cutting the package in the vertical direction. A plurality of metal bases and insulating spacers are alternately arranged in the vertical direction, and two terminals of each of the plurality of LEDs arranged in the vertical direction. Are electrically connected to adjacent metal bases separated by insulating spacers. Therefore, by applying a voltage between any set of metal bases, the corresponding LED can be selectively made to emit light. For this reason, the dot display apparatus which displays a character and an image is realizable by arranging the appropriate number of the circuit modules in which LED is arrange | positioned in 1 line in a row.

FIG. 8 shows a modification of the present embodiment. By utilizing the fact that the package piece 32 obtained by subdividing the package 30 has a rectangular parallelepiped shape, different electronic components 40 are mounted on two adjacent surfaces. It shows that it was possible to do. In this case, each electronic component 40 is electrically connected to the metal bases 11 and 12 separated by the insulating spacer 22 by an appropriate method, and is electrically connected in parallel. The thickness of the package 30 can be arbitrarily set in accordance with the dimensions of the electronic component to be used.

9 to 11 show still another embodiment of the present invention. Here, as shown in FIGS. 10 and 11, three metal bases 11 electrically isolated by two insulating spacers 22, The circuit module M in which the electronic component 40 is mounted on the package piece 32 provided with 12 and 13 is manufactured. The package piece 30 is designed to mount, for example, a power transistor having three terminals as an electronic component, and uses the metal bases 11, 12, and 13 as electrodes that connect to the emitter, collector, and base of the power transistor, respectively. . In the illustrated embodiment, terminals 41, 42, and 43 on the upper surface of the electronic component 40 are connected to each metal base by wire bonding, and heat dissipation is improved by bringing the lower surface of the electronic component 40 into close contact with the metal base. . When the power transistor to be used has a bump on the lower surface, the electronic component is bonded to the metal base by the bump.

  Such a circuit module M using the package piece 30 including the three metal bases 11, 12, and 13 can also be created from the laminate L created in the same manner as in the above-described embodiment. That is, as shown in FIG. 5, after mounting a plurality of electronic components 40 side by side on a package 30 cut out from the stacked body L so that each electronic component 40 straddles two insulating resin layers 20, By dividing the package 30 into package pieces 32 along the cutting line indicated by the broken line, a large number of circuit modules M can be created simultaneously.

  The present invention is not limited to the number of metal bases that are electrically isolated from each other in one package piece 32, and a package or circuit module including any number of metal bases can be created. In accordance with the number of circuit modules taken out from one package, various requirements are satisfied by selecting the number of metal layers 10 and insulating resin layers 20 in the laminate L and the width of the laminate L. it can. That is, since the package 30 is formed by cutting out the laminated body L in which the metal layers 10 and the insulating resin layers 20 are alternately arranged, the package 30 including the number of metal bases according to the number of terminals of the electronic component, and the circuit module M Many can be manufactured at once.

Further, the number of electronic components 40 mounted on one circuit module M is not limited to one. As shown in FIG. 12 and FIG. 13, two electronic components 40A and 40B are combined into one individual package piece. 30. In this case, the individual package piece 32 includes three metal bases 11, 12, 13, the central metal base 12 is used as a common electrode, and each electronic component 40 </ b> A, 40 </ b> B straddles the insulating spacer 22 on the metal base. And is electrically connected to the metal bases 11, 12, and 13 by bump connection, wire bonding, or soldering. In this way, even when a plurality of electronic components are required to be mounted on one individual package, as shown in FIG. 12, the number of metal bases, that is, the number of metal layers depends on the number of components. The number of circuit modules M including a plurality of electronic components as shown in FIG. 13 is cut at a time after the number of electronic components is freely selected and a plurality of electronic components are mounted on the package cut out from the stacked body. Can be manufactured. Further, as shown in the figure, even when electronic parts 40A and 40B having different shapes are used, it is easy to regularly arrange them on the package, and thus a large number of circuit modules M are efficiently manufactured. be able to. It is also possible to arrange two or more electronic components in parallel on the package piece 32 and electrically connect them in parallel.

Claims (13)

A method for manufacturing a high thermal conductivity circuit module mounted on a circuit board, comprising the following steps:
At least two metal layers, which are high thermal conductivity and conductive materials, are laminated via an insulating resin layer between them, and the metal layer is joined by the insulating resin layer to form an integrated laminate, and the above-mentioned integral Slicing the layered stack to cut out the package, to obtain a package in which two metal bases are electrically isolated from each other and mechanically joined together by insulating spacers,
The metal base is formed of a part of the metal layer, the insulating spacer is formed of a part of the insulating resin layer,
At least one electronic component having at least two terminals is disposed on the mounting surface of the package so as to straddle the insulating spacer . The mounting surface is defined by a cut surface that slices the stacked body.
Electrically connecting at least two terminals to different metal bases separated by the insulating spacer;
The insulating resin layer is highly filled with an inorganic filler. In the manufacturing method of the high thermal conductivity circuit module according to claim 1,
A plurality of electronic components are arranged in parallel on the mounting surface of the package, and the plurality of electronic components are electrically connected in parallel to different metal bases separated by the insulating spacer. In the manufacturing method of the high thermal conductivity circuit module according to claim 2,
The package is cut at a part in the longitudinal direction in which a plurality of electronic components are arranged to obtain a plurality of circuit modules each mounting at least one electronic component. In the manufacturing method of the high thermal conductivity circuit module according to claim 1,
A plurality of metal layers are alternately laminated with a plurality of insulating resin layers, and the metal layers are combined by the insulating resin layers to form an integrated laminate,
The integrated laminated body is sliced along the stacking direction to cut out a package. In this package, a plurality of the metal bases are alternately arranged along the stacking direction with the plurality of insulating spacers,
A plurality of the electronic components are respectively disposed on the mounting surface of the package and electrically connected to the different metal bases with the insulating spacers therebetween. In the manufacturing method of the high thermal conductivity circuit module according to claim 4,
After mounting a plurality of electronic components on the mounting surface of the package, the package is cut out to obtain a plurality of circuit modules each mounted with at least one electronic component. In the manufacturing method of the high thermal conductivity circuit module according to claim 4,
The electronic component is disposed on the mounting surface of the package so as to straddle the plurality of insulating spacers. In the manufacturing method of the high thermal conductivity circuit module according to claim 6,
The package is cut into a size including a plurality of insulating spacers and a metal base positioned outside these insulating spacers, thereby obtaining a plurality of circuit modules each mounted with at least one electronic component. In the manufacturing method of the high thermal conductivity circuit module according to claim 1,
The insulating spacer has a thickness of 20 to 500 μm,
The metal layer is selected from the group consisting of copper, aluminum, nickel, iron, an alloy containing at least one, and a copper-invar copper composite. In the manufacturing method of the high thermal conductivity circuit module according to claim 1,
The insulating resin layer is a resin having ultraviolet resistance. In the manufacturing method of the high thermal conductivity circuit module according to claim 9,
The resin having ultraviolet resistance is selected from the group consisting of a fluororesin and a silicone resin. A high thermal conductivity circuit module mounted on a circuit board,
A package formed by slicing a laminate in which at least two metal layers and insulating resin layers, which are high thermal conductivity and conductive materials, are integrated;
Consists of electronic components mounted on the mounting surface of the package,
The mounting surface of the package is defined by a cut surface that slices the laminate,
The package includes at least two metal bases formed of a part of the metal layer and an insulating spacer formed of a part of the insulating resin layer, and the metal base is electrically isolated by the insulating spacer,
The electronic component is disposed on the mounting surface of the package so as to straddle the insulating spacer,
At least two terminals of the electronic component are electrically connected to different metal bases separated by the insulating spacer;
The insulating resin layer is highly filled with an inorganic filler. The high thermal conductivity circuit module according to claim 11,
The electronic component is an LED having two terminals, and a plurality of LEDs are mounted on the package in parallel with each other. The high thermal conductivity circuit module according to claim 11,
The insulating spacer has a thickness of 20 to 500 μm.

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