JP4924831B2 - 半導体装置及び電子デバイス - Google Patents

半導体装置及び電子デバイス Download PDF

Info

Publication number
JP4924831B2
JP4924831B2 JP2007202751A JP2007202751A JP4924831B2 JP 4924831 B2 JP4924831 B2 JP 4924831B2 JP 2007202751 A JP2007202751 A JP 2007202751A JP 2007202751 A JP2007202751 A JP 2007202751A JP 4924831 B2 JP4924831 B2 JP 4924831B2
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
wiring
resin protrusion
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007202751A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009038279A5 (https=
JP2009038279A (ja
Inventor
秀一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007202751A priority Critical patent/JP4924831B2/ja
Publication of JP2009038279A publication Critical patent/JP2009038279A/ja
Publication of JP2009038279A5 publication Critical patent/JP2009038279A5/ja
Application granted granted Critical
Publication of JP4924831B2 publication Critical patent/JP4924831B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP2007202751A 2007-08-03 2007-08-03 半導体装置及び電子デバイス Expired - Fee Related JP4924831B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007202751A JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007202751A JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2009038279A JP2009038279A (ja) 2009-02-19
JP2009038279A5 JP2009038279A5 (https=) 2010-09-09
JP4924831B2 true JP4924831B2 (ja) 2012-04-25

Family

ID=40439911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007202751A Expired - Fee Related JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Country Status (1)

Country Link
JP (1) JP4924831B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5954519B2 (ja) * 2011-03-15 2016-07-20 セイコーエプソン株式会社 電子部品及び電子部品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237459A (ja) * 2005-02-28 2006-09-07 Matsushita Electric Ind Co Ltd 配線基板およびそれを用いた半導体装置
JP4224717B2 (ja) * 2005-07-11 2009-02-18 セイコーエプソン株式会社 半導体装置
JP2007165744A (ja) * 2005-12-16 2007-06-28 Epson Imaging Devices Corp 半導体装置、実装構造体、電気光学装置、半導体装置の製造方法、実装構造体の製造方法、電気光学装置の製造方法、及び、電子機器

Also Published As

Publication number Publication date
JP2009038279A (ja) 2009-02-19

Similar Documents

Publication Publication Date Title
JP4816297B2 (ja) 実装端子基板及びこれを用いた表示装置
JP4572376B2 (ja) 半導体装置の製造方法および電子デバイスの製造方法
JP4235835B2 (ja) 半導体装置
US10256174B2 (en) Film type semiconductor package
JP4924831B2 (ja) 半導体装置及び電子デバイス
JP4554983B2 (ja) 液晶表示装置
JP5105103B2 (ja) 半導体装置
JP4645832B2 (ja) 半導体装置及びその製造方法
CN100438005C (zh) 半导体装置
JP5217299B2 (ja) 半導体装置および電子デバイス
JP4296434B2 (ja) 半導体装置
JP4968424B2 (ja) 半導体装置
JP4305674B2 (ja) 半導体装置
JP4273347B2 (ja) 半導体装置
JP5077540B2 (ja) 半導体装置の製造方法
US20250096085A1 (en) Chip on film package and display apparatus including the same
JP5088488B2 (ja) 半導体モジュール及びその製造方法
JP4720992B2 (ja) 半導体装置
JP2009049189A (ja) 電子デバイス
KR100816348B1 (ko) 반도체 장치
KR100755354B1 (ko) 반도체 장치
KR100773408B1 (ko) 반도체 장치
JP2009043830A (ja) 半導体装置
JP2009038279A5 (https=)
JP2006303169A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100722

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100722

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120111

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120124

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150217

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4924831

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees