JP4919170B2 - ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置 - Google Patents

ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置 Download PDF

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Publication number
JP4919170B2
JP4919170B2 JP2007320306A JP2007320306A JP4919170B2 JP 4919170 B2 JP4919170 B2 JP 4919170B2 JP 2007320306 A JP2007320306 A JP 2007320306A JP 2007320306 A JP2007320306 A JP 2007320306A JP 4919170 B2 JP4919170 B2 JP 4919170B2
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Japan
Prior art keywords
heat sink
heat
composite member
base
high thermal
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Expired - Fee Related
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JP2007320306A
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English (en)
Japanese (ja)
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JP2009146961A5 (enExample
JP2009146961A (ja
Inventor
慎治 品部
健生 鈴木
健丞 秋吉
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Priority to JP2007320306A priority Critical patent/JP4919170B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Inverter Devices (AREA)
JP2007320306A 2007-12-12 2007-12-12 ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置 Expired - Fee Related JP4919170B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007320306A JP4919170B2 (ja) 2007-12-12 2007-12-12 ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007320306A JP4919170B2 (ja) 2007-12-12 2007-12-12 ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置

Publications (3)

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JP2009146961A JP2009146961A (ja) 2009-07-02
JP2009146961A5 JP2009146961A5 (enExample) 2011-08-11
JP4919170B2 true JP4919170B2 (ja) 2012-04-18

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JP2007320306A Expired - Fee Related JP4919170B2 (ja) 2007-12-12 2007-12-12 ヒートシンクとその製造方法およびそれを用いたモータとインバータ装置

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JP (1) JP4919170B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112018003847T5 (de) 2017-07-28 2020-04-09 Nidec Corporation Motor
JP2019041076A (ja) * 2017-08-29 2019-03-14 昭和電工株式会社 放熱装置用フィン及び放熱装置
BR112022006535A2 (pt) * 2019-10-08 2022-06-28 Alakai Tech Corporation Sistema de placa de resfriamento, método e aparelho para veículos elétricos de combustível limpo
CN113161306B (zh) * 2021-04-15 2024-02-13 浙江集迈科微电子有限公司 芯片的高效散热结构及其制备工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312360A (ja) * 1996-05-21 1997-12-02 Janome Sewing Mach Co Ltd ヒートシンク及びその製造法
JP2003046038A (ja) * 2001-07-27 2003-02-14 Mitsubishi Electric Corp 熱伝導基材とその製造方法及び半導体装置
JP2003188324A (ja) * 2001-12-20 2003-07-04 Mitsubishi Electric Corp 放熱基材、放熱基材の製造方法、及び放熱基材を含む半導体装置

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