JP4915823B2 - 超音波接合装置 - Google Patents
超音波接合装置 Download PDFInfo
- Publication number
- JP4915823B2 JP4915823B2 JP2009192734A JP2009192734A JP4915823B2 JP 4915823 B2 JP4915823 B2 JP 4915823B2 JP 2009192734 A JP2009192734 A JP 2009192734A JP 2009192734 A JP2009192734 A JP 2009192734A JP 4915823 B2 JP4915823 B2 JP 4915823B2
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- bonded
- amplitude
- bonding
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 description 70
- 238000005304 joining Methods 0.000 description 54
- 238000001514 detection method Methods 0.000 description 41
- 239000000758 substrate Substances 0.000 description 33
- 239000002184 metal Substances 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 30
- 230000008569 process Effects 0.000 description 23
- 238000004140 cleaning Methods 0.000 description 18
- 230000006378 damage Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 11
- 230000006866 deterioration Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 230000002159 abnormal effect Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Description
2 ボルト・ナット機構
3 上下ガイド
4 ヘッド自重カウンター
5 ヘッド逃がしガイド
6 共振器保持部
7 共振器
8 振動子
10 ステージ
11 ステージヒータ
12 ステージテーブル
13 架台フレーム
14 上下マーク認識手段
15 認識手段移動テーブル
16 基板搬送装置
17 基板搬送コンベア
18 チップ供給装置
19 チップトレイ
20 チップ
21 金属突起
22 基板
23 金属パッド
24 ヘッド高さ検出手段
25 上下駆動機構
26 ヘッド部
27 接合機構
28 実装機構
29 位置認識部
30 搬送部
31 制御装置
32 加圧力検出手段
33 振幅検出手段
34 ヘッドアンプ
35 受信板
36 圧電セラッミックス
37 ケース
38 コネクタ
39 保持部分
40 被接合物接触面
41 共振器外形
42 被接合物吸着穴
43 真空源連結吸着穴
44 真空源連結手段
45 保持手段
46 ヒータ
Claims (3)
- 共振器により超音波振動を印加して複数の重ね合わされた被接合物を接合する超音波接合装置において、
前記共振器の外周面に形成された被保持部と、
前記共振器の最大振幅点における外周面に周方向に沿って設けられ、いずれか1つがステージに対向して配置される複数の被接合物接触面と、
前記被保持部をクランプして前記共振器を保持する保持手段とを備え、
前記被保持部は、
前記共振器が前記保持手段に保持されたときに、前記複数の被接合物接触面のいずれか1つと前記ステージとがほぼ平行となるように、断面が多角形状に形成され、
前記被保持部の断面形状と、前記複数の被接合物接触面が設けられた前記共振器の最大振幅点における断面形状とが相似である
ことを特徴とする超音波接合装置。 - 前記被保持部は、
前記共振器のノーダルポイントの断面上に、前記共振器の外周面より内側に凹状に埋没して形成されている請求項1に記載の超音波接合装置。 - 前記共振器が一体構造である請求項1または2に記載の超音波接合装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009192734A JP4915823B2 (ja) | 2004-10-25 | 2009-08-24 | 超音波接合装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004309068 | 2004-10-25 | ||
JP2004309068 | 2004-10-25 | ||
JP2009192734A JP4915823B2 (ja) | 2004-10-25 | 2009-08-24 | 超音波接合装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005306797A Division JP4750527B2 (ja) | 2004-10-25 | 2005-10-21 | 超音波接合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009279657A JP2009279657A (ja) | 2009-12-03 |
JP4915823B2 true JP4915823B2 (ja) | 2012-04-11 |
Family
ID=41450666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009192734A Active JP4915823B2 (ja) | 2004-10-25 | 2009-08-24 | 超音波接合装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4915823B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5171905B2 (ja) * | 2010-09-07 | 2013-03-27 | 三菱電機エンジニアリング株式会社 | 超音波接合制御装置及び超音波接合制御方法 |
WO2014112272A1 (ja) * | 2013-01-15 | 2014-07-24 | 日産自動車株式会社 | 超音波接合装置および超音波接合装置のアンビル交換方法 |
JP6054219B2 (ja) * | 2013-03-19 | 2016-12-27 | 株式会社東芝 | 超音波接合装置 |
JP6113567B2 (ja) * | 2013-04-22 | 2017-04-12 | ブランソン・ウルトラソニックス・コーポレーション | 超音波溶接装置 |
CN104923890B (zh) * | 2015-07-20 | 2017-02-01 | 青岛理工大学 | 声源入射角度及位置可调超声辅助氩弧焊方法及辅助装置 |
JP6893018B2 (ja) | 2016-11-14 | 2021-06-23 | 株式会社キーレックス | 超音波接合装置 |
JP7347797B2 (ja) * | 2019-12-19 | 2023-09-20 | 株式会社アルテクス | 機械振動加工装置及び機械振動加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3234520B2 (ja) * | 1997-01-07 | 2001-12-04 | 株式会社オートネットワーク技術研究所 | 超音波溶接装置 |
JP3373810B2 (ja) * | 1999-08-02 | 2003-02-04 | 株式会社アルテクス | 超音波振動接合用超音波ホーン |
JP4282214B2 (ja) * | 2000-08-07 | 2009-06-17 | パナソニック株式会社 | 超音波ホーンの取付方法 |
-
2009
- 2009-08-24 JP JP2009192734A patent/JP4915823B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009279657A (ja) | 2009-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4915823B2 (ja) | 超音波接合装置 | |
JP4546576B2 (ja) | バンプ接合判定装置及び方法、並びに半導体部品製造装置及び方法 | |
JP5313751B2 (ja) | 電子部品装着装置 | |
JP2705423B2 (ja) | 超音波接合装置及び品質モニタリング方法 | |
JP4750527B2 (ja) | 超音波接合装置 | |
JP4950478B2 (ja) | 加圧方法およびこの方法を用いた接合方法並びにこの接合方法により作成されるデバイス並びに加圧装置およびこの装置を用いた接合装置 | |
JP2006156970A5 (ja) | ||
JP5076163B2 (ja) | 超音波振動接合方法および超音波振動接合装置 | |
JP4268360B2 (ja) | 摩擦接合方法と装置 | |
JP6235453B2 (ja) | 切断装置及び切断方法 | |
JP5412617B2 (ja) | 加圧装置およびこの装置を用いた接合装置並びに加圧方法およびこの方法を用いた接合方法 | |
JP2005138181A (ja) | 超音波振動制御方法及び装置 | |
JP4431020B2 (ja) | 超音波振動接合方法及び装置 | |
JP4265461B2 (ja) | 電子部品装着装置 | |
JP5082081B2 (ja) | 超音波振動接合装置 | |
JP4239881B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
JP4588245B2 (ja) | 半導体チップ装着方法 | |
KR20010014832A (ko) | 초음파 접합에 의해 서스펜션에 장착된 헤드 ic 칩을갖는 디스크 장치의 헤드 조립체 | |
JP5317753B2 (ja) | ボンダ装置 | |
JP4529759B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
JP2009028728A (ja) | 超音波振動接合方法およびこの方法により形成されるデバイス並びに超音波振動接合装置 | |
JP2005340780A (ja) | 電子部品装着装置および電子部品装着方法 | |
JP7257598B2 (ja) | 熱接合装置 | |
JP5386973B2 (ja) | 基板処理装置、基板処理方法、及び、半導体装置の製造方法 | |
JP2009090296A (ja) | 超音波振動接合装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090910 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111017 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111025 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111124 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111220 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120118 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150203 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4915823 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |