JP4750527B2 - 超音波接合装置 - Google Patents
超音波接合装置 Download PDFInfo
- Publication number
- JP4750527B2 JP4750527B2 JP2005306797A JP2005306797A JP4750527B2 JP 4750527 B2 JP4750527 B2 JP 4750527B2 JP 2005306797 A JP2005306797 A JP 2005306797A JP 2005306797 A JP2005306797 A JP 2005306797A JP 4750527 B2 JP4750527 B2 JP 4750527B2
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- amplitude
- bonded
- bonding
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000000717 retained effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 110
- 238000005304 joining Methods 0.000 description 70
- 238000001514 detection method Methods 0.000 description 47
- 239000002184 metal Substances 0.000 description 41
- 229910052751 metal Inorganic materials 0.000 description 41
- 239000000758 substrate Substances 0.000 description 34
- 230000008569 process Effects 0.000 description 31
- 230000006378 damage Effects 0.000 description 24
- 230000007246 mechanism Effects 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 230000006866 deterioration Effects 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 14
- 230000002159 abnormal effect Effects 0.000 description 12
- 230000007423 decrease Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000116 mitigating effect Effects 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Wire Bonding (AREA)
Description
2 ボルト・ナット機構
3 上下ガイド
4 ヘッド自重カウンター
5 ヘッド逃がしガイド
6 共振器保持部
7 共振器
8 振動子
10 ステージ
11 ステージヒータ
12 ステージテーブル
13 架台フレーム
14 上下マーク認識手段
15 認識手段移動テーブル
16 基板搬送装置
17 基板搬送コンベア
18 チップ供給装置
19 チップトレイ
20 チップ
21 金属突起
22 基板
23 金属パッド
24 ヘッド高さ検出手段
25 上下駆動機構
26 ヘッド部
27 接合機構
28 実装機構
29 位置認識部
30 搬送部
31 制御装置
32 加圧力検出手段
33 振幅検出手段
34 ヘッドアンプ
35 受信板
36 圧電セラッミックス
37 ケース
38 コネクタ
39 保持部分
40 被接合物接触面
41 共振器外形
42 被接合物吸着穴
43 真空源連結吸着穴
44 真空源連結手段
45 保持手段
46 ヒータ
Claims (1)
- 複数の重ね合わされた被接合物を加圧する加圧手段と、
共振器保持部の保持手段により保持され、振動子が結合された共振器と、
前記被接合物を保持するステージとを備え、
前記複数の重ね合わされた被接合物が、前記共振器と前記ステージとの間に加圧保持され、前記共振器に結合された前記振動子から前記共振器に超音波振動を伝達し、前記複数の重ね合わされた被接合物を接合する超音波接合装置において、
前記共振器のノーダルポイントの断面上の外周に凹形状の溝が形成されることにより、前記共振器の外周面より内側に埋没した外周面を有する保持される部分が形成されており、
前記保持手段は、前記保持される部分の外周面に面接触して前記保持される部分をクランプすることにより前記共振器を保持し、
前記共振器が一体構造であり、前記共振器の最大振幅点における外周に沿って前記被接合物への接触面が複数設けられており、
前記保持される部分が回転対称な形状である
ことを特徴とする超音波接合装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005306797A JP4750527B2 (ja) | 2004-10-25 | 2005-10-21 | 超音波接合装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004309068 | 2004-10-25 | ||
JP2004309068 | 2004-10-25 | ||
JP2005306797A JP4750527B2 (ja) | 2004-10-25 | 2005-10-21 | 超音波接合装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009192734A Division JP4915823B2 (ja) | 2004-10-25 | 2009-08-24 | 超音波接合装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006156970A JP2006156970A (ja) | 2006-06-15 |
JP2006156970A5 JP2006156970A5 (ja) | 2008-12-04 |
JP4750527B2 true JP4750527B2 (ja) | 2011-08-17 |
Family
ID=36634807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005306797A Active JP4750527B2 (ja) | 2004-10-25 | 2005-10-21 | 超音波接合装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4750527B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5076163B2 (ja) * | 2007-07-24 | 2012-11-21 | 株式会社アドウェルズ | 超音波振動接合方法および超音波振動接合装置 |
JP5082081B2 (ja) * | 2010-07-20 | 2012-11-28 | 株式会社アドウェルズ | 超音波振動接合装置 |
JP5737562B2 (ja) * | 2011-02-09 | 2015-06-17 | 株式会社アドウェルズ | 共振器の支持装置 |
CN105750722B (zh) * | 2016-04-28 | 2019-02-22 | 广东金弘达自动化科技股份有限公司 | 一种汽车氛围灯自动超声波焊接设备 |
JP6893018B2 (ja) | 2016-11-14 | 2021-06-23 | 株式会社キーレックス | 超音波接合装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4282214B2 (ja) * | 2000-08-07 | 2009-06-17 | パナソニック株式会社 | 超音波ホーンの取付方法 |
JP3541354B2 (ja) * | 2000-12-21 | 2004-07-07 | ソニー株式会社 | 超音波振動接合装置 |
JP2003059972A (ja) * | 2001-08-10 | 2003-02-28 | Kaijo Corp | ボンディングヘッド及びこれを備えたボンディング装置 |
-
2005
- 2005-10-21 JP JP2005306797A patent/JP4750527B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2006156970A (ja) | 2006-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4915823B2 (ja) | 超音波接合装置 | |
JP4546576B2 (ja) | バンプ接合判定装置及び方法、並びに半導体部品製造装置及び方法 | |
JP2705423B2 (ja) | 超音波接合装置及び品質モニタリング方法 | |
JP5313751B2 (ja) | 電子部品装着装置 | |
JP4750527B2 (ja) | 超音波接合装置 | |
JP4950478B2 (ja) | 加圧方法およびこの方法を用いた接合方法並びにこの接合方法により作成されるデバイス並びに加圧装置およびこの装置を用いた接合装置 | |
JP2006156970A5 (ja) | ||
JP5266395B2 (ja) | ガラス状部品を金属に圧力嵌めにより結合する方法及び装置 | |
JP4268360B2 (ja) | 摩擦接合方法と装置 | |
JP5076163B2 (ja) | 超音波振動接合方法および超音波振動接合装置 | |
JP2005138181A (ja) | 超音波振動制御方法及び装置 | |
JP4265461B2 (ja) | 電子部品装着装置 | |
JP4431020B2 (ja) | 超音波振動接合方法及び装置 | |
JP5082081B2 (ja) | 超音波振動接合装置 | |
JP4239881B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
KR20010014832A (ko) | 초음파 접합에 의해 서스펜션에 장착된 헤드 ic 칩을갖는 디스크 장치의 헤드 조립체 | |
JP2006186325A (ja) | 超音波振動接合装置 | |
JP2009246185A (ja) | 超音波接合装置および超音波接合方法 | |
JP5317753B2 (ja) | ボンダ装置 | |
JP4529759B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
JP7257598B2 (ja) | 熱接合装置 | |
JP2009028728A (ja) | 超音波振動接合方法およびこの方法により形成されるデバイス並びに超音波振動接合装置 | |
JP2005340780A (ja) | 電子部品装着装置および電子部品装着方法 | |
JP5386973B2 (ja) | 基板処理装置、基板処理方法、及び、半導体装置の製造方法 | |
JP4280169B2 (ja) | 平行調整装置及び平行調整方法、ボンディング装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081020 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081020 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20081020 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090128 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20090128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20090129 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090226 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090302 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101012 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110111 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110405 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110422 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110517 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110519 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4750527 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140527 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |