JP4908207B2 - 光透過領域を有する研磨パッドを製造するための超音波溶接法 - Google Patents

光透過領域を有する研磨パッドを製造するための超音波溶接法 Download PDF

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Publication number
JP4908207B2
JP4908207B2 JP2006517168A JP2006517168A JP4908207B2 JP 4908207 B2 JP4908207 B2 JP 4908207B2 JP 2006517168 A JP2006517168 A JP 2006517168A JP 2006517168 A JP2006517168 A JP 2006517168A JP 4908207 B2 JP4908207 B2 JP 4908207B2
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JP
Japan
Prior art keywords
polishing pad
window
light transmissive
pad
polishing
Prior art date
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Expired - Lifetime
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JP2006517168A
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English (en)
Japanese (ja)
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JP2006527664A (ja
Inventor
ジェイ． ニューエル，ケリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
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Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of JP2006527664A publication Critical patent/JP2006527664A/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2006517168A 2003-06-17 2004-06-03 光透過領域を有する研磨パッドを製造するための超音波溶接法 Expired - Lifetime JP4908207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/463,721 US6997777B2 (en) 2003-06-17 2003-06-17 Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US10/463,721 2003-06-17
PCT/US2004/017289 WO2005000528A1 (en) 2003-06-17 2004-06-03 Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010229045A Division JP2011031392A (ja) 2003-06-17 2010-10-08 光透過領域を有する研磨パッドを製造するための超音波溶接法

Publications (2)

Publication Number Publication Date
JP2006527664A JP2006527664A (ja) 2006-12-07
JP4908207B2 true JP4908207B2 (ja) 2012-04-04

Family

ID=33517134

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006517168A Expired - Lifetime JP4908207B2 (ja) 2003-06-17 2004-06-03 光透過領域を有する研磨パッドを製造するための超音波溶接法
JP2010229045A Pending JP2011031392A (ja) 2003-06-17 2010-10-08 光透過領域を有する研磨パッドを製造するための超音波溶接法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010229045A Pending JP2011031392A (ja) 2003-06-17 2010-10-08 光透過領域を有する研磨パッドを製造するための超音波溶接法

Country Status (10)

Country Link
US (1) US6997777B2 (de)
EP (1) EP1638735B1 (de)
JP (2) JP4908207B2 (de)
KR (1) KR100913282B1 (de)
CN (1) CN100467228C (de)
AT (1) ATE474692T1 (de)
DE (1) DE602004028245D1 (de)
MY (1) MY132430A (de)
TW (1) TWI286957B (de)
WO (1) WO2005000528A1 (de)

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* Cited by examiner, † Cited by third party
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JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
EP2244642A4 (de) * 2008-02-20 2011-07-20 Mayo Foundation Systeme, vorrichtungen und verfahren für den zugang zu körpergewebe
US20110118601A1 (en) * 2008-02-20 2011-05-19 Mayo Foundation For Medical Education And Research Nonprofit Corporation Ultrasound Guided Systems and Methods
JP5133830B2 (ja) * 2008-09-19 2013-01-30 イビデン株式会社 基材の被覆方法
DE102008059044B4 (de) * 2008-11-26 2013-08-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht
JP5366606B2 (ja) * 2009-03-25 2013-12-11 シチズンホールディングス株式会社 時計用指針の製造方法
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US9795404B2 (en) * 2009-12-31 2017-10-24 Tenex Health, Inc. System and method for minimally invasive ultrasonic musculoskeletal tissue treatment
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
KR101942100B1 (ko) * 2010-07-07 2019-01-24 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 저결함성 창을 갖는 화학 기계 연마 패드
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN101957491A (zh) * 2010-08-24 2011-01-26 亚泰影像科技股份有限公司 透镜组的固定方法
US8876983B2 (en) * 2011-09-01 2014-11-04 Ford Global Technologies, Llc In-line cleaning method for ultrasonic welding tools
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9149291B2 (en) 2012-06-11 2015-10-06 Tenex Health, Inc. Systems and methods for tissue treatment
US11406415B2 (en) 2012-06-11 2022-08-09 Tenex Health, Inc. Systems and methods for tissue treatment
US9962181B2 (en) 2014-09-02 2018-05-08 Tenex Health, Inc. Subcutaneous wound debridement
US9763689B2 (en) 2015-05-12 2017-09-19 Tenex Health, Inc. Elongated needles for ultrasonic applications
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
DE102017214778A1 (de) * 2017-08-23 2019-02-28 Sgl Carbon Se Alternatives Fügeverfahren
CN114196327A (zh) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 一种用于光学零件抛光的复合材料及制备方法

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US5658408A (en) * 1992-04-21 1997-08-19 Branson Ultrasonics Corporation Method for processing workpieces by ultrasonic energy
US5855706A (en) * 1992-04-21 1999-01-05 Branson Ultrasonics Corporation Simultaneous amplitude and force profiling during ultrasonic welding of thermoplastic workpieces
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
CA2264872A1 (en) 1996-09-11 1998-03-19 Jeffrey W. Nelson Abrasive article and method of making
US6120352A (en) * 1997-03-06 2000-09-19 Keltech Engineering Lapping apparatus and lapping method using abrasive sheets
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
JP3367496B2 (ja) * 2000-01-20 2003-01-14 株式会社ニコン 研磨体、平坦化装置、半導体デバイス製造方法、および半導体デバイス
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
JP3259225B2 (ja) 1999-12-27 2002-02-25 株式会社ニコン 研磨状況モニタ方法及びその装置、研磨装置、プロセスウエハ、半導体デバイス製造方法、並びに半導体デバイス
US6569004B1 (en) 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
GB0024070D0 (en) 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
JP2002170799A (ja) * 2000-11-30 2002-06-14 Nikon Corp 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス
US6612917B2 (en) * 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2003163191A (ja) * 2001-11-28 2003-06-06 Tokyo Seimitsu Co Ltd 機械化学的研磨装置用の研磨パッド
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
DE10302320A1 (de) * 2003-01-20 2004-07-29 Wipak Walsrode Gmbh & Co.Kg Wiederverschließbare Verpackung
JP2004327974A (ja) * 2003-04-09 2004-11-18 Jsr Corp 研磨パッド、その製造法と製造用金型および半導体ウエハの研磨方法

Also Published As

Publication number Publication date
TWI286957B (en) 2007-09-21
ATE474692T1 (de) 2010-08-15
JP2006527664A (ja) 2006-12-07
MY132430A (en) 2007-10-31
TW200526355A (en) 2005-08-16
US6997777B2 (en) 2006-02-14
US20040259483A1 (en) 2004-12-23
CN100467228C (zh) 2009-03-11
EP1638735A1 (de) 2006-03-29
KR100913282B1 (ko) 2009-08-21
KR20060010843A (ko) 2006-02-02
WO2005000528A1 (en) 2005-01-06
DE602004028245D1 (de) 2010-09-02
CN1805828A (zh) 2006-07-19
JP2011031392A (ja) 2011-02-17
EP1638735B1 (de) 2010-07-21

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