DE602004028245D1 - Polierkissens mit einem optisch transmissiven bereich - Google Patents
Polierkissens mit einem optisch transmissiven bereichInfo
- Publication number
- DE602004028245D1 DE602004028245D1 DE602004028245T DE602004028245T DE602004028245D1 DE 602004028245 D1 DE602004028245 D1 DE 602004028245D1 DE 602004028245 T DE602004028245 T DE 602004028245T DE 602004028245 T DE602004028245 T DE 602004028245T DE 602004028245 D1 DE602004028245 D1 DE 602004028245D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing pad
- optically transmissive
- transmissive area
- aperture
- transmissive window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/463,721 US6997777B2 (en) | 2003-06-17 | 2003-06-17 | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
PCT/US2004/017289 WO2005000528A1 (en) | 2003-06-17 | 2004-06-03 | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004028245D1 true DE602004028245D1 (de) | 2010-09-02 |
Family
ID=33517134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004028245T Active DE602004028245D1 (de) | 2003-06-17 | 2004-06-03 | Polierkissens mit einem optisch transmissiven bereich |
Country Status (10)
Country | Link |
---|---|
US (1) | US6997777B2 (de) |
EP (1) | EP1638735B1 (de) |
JP (2) | JP4908207B2 (de) |
KR (1) | KR100913282B1 (de) |
CN (1) | CN100467228C (de) |
AT (1) | ATE474692T1 (de) |
DE (1) | DE602004028245D1 (de) |
MY (1) | MY132430A (de) |
TW (1) | TWI286957B (de) |
WO (1) | WO2005000528A1 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4620501B2 (ja) * | 2005-03-04 | 2011-01-26 | ニッタ・ハース株式会社 | 研磨パッド |
JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
AU2009215477B2 (en) * | 2008-02-20 | 2014-10-23 | Mayo Foundation For Medical Education And Research | Systems, devices and methods for accessing body tissue |
CN102065775B (zh) * | 2008-02-20 | 2015-01-07 | 梅约医学教育与研究基金会 | 超声引导系统和方法 |
JP5133830B2 (ja) * | 2008-09-19 | 2013-01-30 | イビデン株式会社 | 基材の被覆方法 |
DE102008059044B4 (de) * | 2008-11-26 | 2013-08-22 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht |
JP5366606B2 (ja) * | 2009-03-25 | 2013-12-11 | シチズンホールディングス株式会社 | 時計用指針の製造方法 |
US8129220B2 (en) | 2009-08-24 | 2012-03-06 | Hong Kong Polytechnic University | Method and system for bonding electrical devices using an electrically conductive adhesive |
US9795404B2 (en) | 2009-12-31 | 2017-10-24 | Tenex Health, Inc. | System and method for minimally invasive ultrasonic musculoskeletal tissue treatment |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
KR101942100B1 (ko) * | 2010-07-07 | 2019-01-24 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 저결함성 창을 갖는 화학 기계 연마 패드 |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
CN101957491A (zh) * | 2010-08-24 | 2011-01-26 | 亚泰影像科技股份有限公司 | 透镜组的固定方法 |
US8876983B2 (en) * | 2011-09-01 | 2014-11-04 | Ford Global Technologies, Llc | In-line cleaning method for ultrasonic welding tools |
US9156125B2 (en) * | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
US11406415B2 (en) | 2012-06-11 | 2022-08-09 | Tenex Health, Inc. | Systems and methods for tissue treatment |
US9149291B2 (en) | 2012-06-11 | 2015-10-06 | Tenex Health, Inc. | Systems and methods for tissue treatment |
US9962181B2 (en) | 2014-09-02 | 2018-05-08 | Tenex Health, Inc. | Subcutaneous wound debridement |
US9763689B2 (en) | 2015-05-12 | 2017-09-19 | Tenex Health, Inc. | Elongated needles for ultrasonic applications |
US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
KR101945878B1 (ko) | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
DE102017214778A1 (de) * | 2017-08-23 | 2019-02-28 | Sgl Carbon Se | Alternatives Fügeverfahren |
CN114196327A (zh) * | 2022-01-28 | 2022-03-18 | 淄博海泰新光光学技术有限公司 | 一种用于光学零件抛光的复合材料及制备方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855706A (en) * | 1992-04-21 | 1999-01-05 | Branson Ultrasonics Corporation | Simultaneous amplitude and force profiling during ultrasonic welding of thermoplastic workpieces |
US5658408A (en) * | 1992-04-21 | 1997-08-19 | Branson Ultrasonics Corporation | Method for processing workpieces by ultrasonic energy |
US6106754A (en) * | 1994-11-23 | 2000-08-22 | Rodel Holdings, Inc. | Method of making polishing pads |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
DE69629054T2 (de) | 1996-09-11 | 2004-04-22 | Minnesota Mining And Manufacturing Company, St. Paul | Abrasiver Gegenstand und Verfahren zu seiner Herstellung. |
US6120352A (en) * | 1997-03-06 | 2000-09-19 | Keltech Engineering | Lapping apparatus and lapping method using abrasive sheets |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
JP3367496B2 (ja) * | 2000-01-20 | 2003-01-14 | 株式会社ニコン | 研磨体、平坦化装置、半導体デバイス製造方法、および半導体デバイス |
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
JP3259225B2 (ja) | 1999-12-27 | 2002-02-25 | 株式会社ニコン | 研磨状況モニタ方法及びその装置、研磨装置、プロセスウエハ、半導体デバイス製造方法、並びに半導体デバイス |
US6569004B1 (en) * | 1999-12-30 | 2003-05-27 | Lam Research | Polishing pad and method of manufacture |
US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
GB0024070D0 (en) | 2000-10-02 | 2000-11-15 | Innavisions Ltd | Mpulding apparatus and method |
JP2002170799A (ja) * | 2000-11-30 | 2002-06-14 | Nikon Corp | 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス |
US6612917B2 (en) * | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
JP2003163191A (ja) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | 機械化学的研磨装置用の研磨パッド |
US6884146B2 (en) * | 2002-02-04 | 2005-04-26 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
DE10302320A1 (de) * | 2003-01-20 | 2004-07-29 | Wipak Walsrode Gmbh & Co.Kg | Wiederverschließbare Verpackung |
JP2004327974A (ja) * | 2003-04-09 | 2004-11-18 | Jsr Corp | 研磨パッド、その製造法と製造用金型および半導体ウエハの研磨方法 |
-
2003
- 2003-06-17 US US10/463,721 patent/US6997777B2/en not_active Expired - Lifetime
-
2004
- 2004-06-03 KR KR1020057024180A patent/KR100913282B1/ko active IP Right Grant
- 2004-06-03 AT AT04753997T patent/ATE474692T1/de not_active IP Right Cessation
- 2004-06-03 DE DE602004028245T patent/DE602004028245D1/de active Active
- 2004-06-03 WO PCT/US2004/017289 patent/WO2005000528A1/en active Application Filing
- 2004-06-03 EP EP04753997A patent/EP1638735B1/de active Active
- 2004-06-03 CN CNB2004800167080A patent/CN100467228C/zh active Active
- 2004-06-03 JP JP2006517168A patent/JP4908207B2/ja active Active
- 2004-06-04 TW TW093116248A patent/TWI286957B/zh active
- 2004-06-15 MY MYPI20042301A patent/MY132430A/en unknown
-
2010
- 2010-10-08 JP JP2010229045A patent/JP2011031392A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200526355A (en) | 2005-08-16 |
TWI286957B (en) | 2007-09-21 |
EP1638735A1 (de) | 2006-03-29 |
US6997777B2 (en) | 2006-02-14 |
CN100467228C (zh) | 2009-03-11 |
KR20060010843A (ko) | 2006-02-02 |
ATE474692T1 (de) | 2010-08-15 |
US20040259483A1 (en) | 2004-12-23 |
KR100913282B1 (ko) | 2009-08-21 |
WO2005000528A1 (en) | 2005-01-06 |
MY132430A (en) | 2007-10-31 |
CN1805828A (zh) | 2006-07-19 |
JP2011031392A (ja) | 2011-02-17 |
EP1638735B1 (de) | 2010-07-21 |
JP2006527664A (ja) | 2006-12-07 |
JP4908207B2 (ja) | 2012-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004028245D1 (de) | Polierkissens mit einem optisch transmissiven bereich | |
BRPI0314814C1 (pt) | anticorpo compreendendo uma variante de fc | |
WO2003072803A3 (en) | Nanostructures containing antibody assembly units | |
HRP20050354B1 (de) | ||
EP1820624A3 (de) | Gehäuse, tragbare Vorrichtung und Verfahren zum Laserschweißen von Harzteilen | |
BR0307500B1 (pt) | sachÊ com trÊs soldas. | |
SG139558A1 (en) | Light guide optical device | |
DE60318929D1 (de) | Optisches bi-directionales Tranceiver-modul mit Doppelkappe und Verfahren zur Verbesserung von dessen Effizienz und Zuverlässigkeit | |
DE60311736D1 (de) | Ultraschallpunktionsnadel | |
NL1029315A1 (nl) | Lichtgeleidingspaneel dat is te gebruiken met achterlichteenheid, achterlichteenheid die hetzelfde toepast en vervaardigingsmethode daarvoor. | |
DE69907274D1 (de) | Pumpvorrichtung mit optischem wellenleiter, einem halbleiter- und einem festkörperlaser sowie zugehöriges pumpverfahren | |
ATE473430T1 (de) | Optoelektronische sensoreinrichtung | |
DE60313747D1 (de) | Steife pvb-laminate mit reduzierter verfärbung | |
DK1850269T3 (da) | Scanningsfremgangsmåde- og anordning | |
DE50301005D1 (de) | Anschlusskupplung mit datenschnittstelle | |
SE0102917D0 (sv) | A battery and a battery encapsulation | |
NO20031686L (no) | Kontaktlinser med innkapslede lysreflekterende partikler | |
DE60305244D1 (de) | Einseitige Laserschockstrahlen | |
DE50313634D1 (de) | Progressives brillenglas mit zwei asphärischen, progressiven flächen | |
TW200632445A (en) | Light reflection-diffusion sheet and method for manufacturing the same and display apparatus employing the same | |
MXPA03005322A (es) | Mejora de integridad de almohadilla mediante el reemplazar el adhesivo constructivo con compresiones ultrasonicas. | |
DE60314192D1 (de) | Passfoto mit einem ID-Chip | |
TW200630643A (en) | Reflector and method for producing the same | |
NO20080409L (no) | Fremgangsmater og preparater til malsoking av IFNAR2 | |
GT200300027S (es) | Botella. |