JP4899962B2 - How to connect electronic devices - Google Patents

How to connect electronic devices Download PDF

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Publication number
JP4899962B2
JP4899962B2 JP2007076114A JP2007076114A JP4899962B2 JP 4899962 B2 JP4899962 B2 JP 4899962B2 JP 2007076114 A JP2007076114 A JP 2007076114A JP 2007076114 A JP2007076114 A JP 2007076114A JP 4899962 B2 JP4899962 B2 JP 4899962B2
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JP
Japan
Prior art keywords
composite ball
substrate
electronic device
printing mask
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007076114A
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Japanese (ja)
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JP2008235751A (en
Inventor
学 近藤
真吾 堀井
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007076114A priority Critical patent/JP4899962B2/en
Publication of JP2008235751A publication Critical patent/JP2008235751A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

本発明は、コアと表面層からなる複数個の複合ボールで、上下の電子デバイス（パッケ
ージ等）の対向する電極間を接続する方法に関する。 The present invention relates to a method for connecting between opposing electrodes of upper and lower electronic devices (packages, etc.) with a plurality of composite balls comprising a core and a surface layer.

パッケージオンパッケージ構造の電子部品は、上下のパッケージが複数個の半田ボール
で接続されているが、全体が半田からなる半田ボールに代えて、金属またはメッキされた
耐熱樹脂製のコアの表面に半田層が形成された複合ボールを使用する場合がある。その場
合には、下側のパッケージの基板の電極上に複合ボールを固定した後に、各複合ボールの
上に半田ペーストを塗布し、その上に上側のパッケージを載せてリフロー加熱を行う必要
がある。 Electronic components with a package-on-package structure have upper and lower packages connected by a plurality of solder balls. Instead of solder balls made entirely of solder, solder is applied to the surface of a metal or plated heat-resistant resin core. In some cases, a composite ball having a layer is used. In that case, after fixing the composite ball on the electrode of the substrate of the lower package, it is necessary to apply a solder paste on each composite ball and place the upper package thereon to perform reflow heating. .

従来は、この半田ペーストの塗布をディスペンサーを用いて行っているため、生産性が
低い、微量のペーストを小径の複合ボールに安定的に塗布することが難しい、といった問
題がある。
なお、半田ボールによる接続方法に関する従来文献としては、下記の特許文献１が挙げ
られるが、この文献には、コアと表面の半田層からなる複合ボールを用いた場合の方法に
ついては記載されていない。
特開平１０−２３３５７４号公報 Conventionally, since this solder paste is applied using a dispenser, there is a problem that productivity is low and it is difficult to stably apply a small amount of paste to a small-diameter composite ball.
In addition, as a conventional document relating to a connection method using a solder ball, the following Patent Document 1 can be cited, but this document does not describe a method using a composite ball composed of a core and a surface solder layer. .
JP-A-10-233574

本発明の課題は、コアと表面層からなる複数個の複合ボールで、上下の電子デバイス（
パッケージ等）の対向する電極間を接続する方法として、前述の方法と比較して、生産性
が高く、微量のペーストを小径の複合ボールに安定的に塗布できる方法を提供することで
ある。 An object of the present invention is to provide a plurality of composite balls each having a core and a surface layer, and upper and lower electronic devices (
As a method for connecting electrodes facing each other in a package or the like, the method is to provide a method that is more productive than the above-described method and can stably apply a small amount of paste to a small-diameter composite ball.

発明１の電子デバイスの接続方法は、コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を接続する方法であって、（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記複合ボールを固定する工程と、（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、
前記第１の電子デバイスは、前記電子部品が前記基板にワイヤを用いてワイヤボンディ
ングされたパッケージであり、前記印刷マスクの前記ワイヤの最も高くなっている部分と
オーバーラップする部分の厚さは、前記印刷マスクの他の部分の厚さより薄く形成されて
いることを特徴とする。
発明１の方法によれば、ワイヤの突出部分と印刷マスクが干渉しないようにできる。
An electronic device connection method according to a first aspect of the present invention is a method for connecting between opposing electrodes of a first electronic device and a second electronic device with a composite ball comprising a core and a surface layer, comprising: (a) a substrate; and Fixing the composite ball on the electrode of the first electronic device, comprising: an electronic component provided on the substrate; and an electrode electrically connected to the electronic component and provided on the substrate; (B) After the step (a), a printing mask having an opening is placed such that at least a part of the composite ball enters the opening and the vertex of the composite ball is below the upper surface of the printing mask. Placing and attaching a solder paste to the top of the composite ball,
In the first electronic device, the electronic component uses a wire on the substrate to form a wire bonder.
And the highest portion of the wire of the printing mask; and
The thickness of the overlapping part is thinner than the thickness of the other part of the printing mask.
And said that you are.
According to the method of the invention 1, the protruding portion of the wire and the print mask can be prevented from interfering with each other.

発明２の電子デバイスの接続方法は、コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を接続する方法であって、（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記複合ボールを固定する工程と、（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、
前記基板は、前記電子部品を形成しないダミー部を有し、前記（ｂ）工程では、前記ダミー部に前記印刷マスクを支持するスペーサを設けた状態で行うことを特徴とする。
発明２の方法によれば、印刷マスクが電子部品に接触することを防ぐことができる。
An electronic device connection method according to a second aspect of the present invention is a method for connecting between opposing electrodes of the first and second electronic devices with a composite ball comprising a core and a surface layer , the method comprising: (a) a substrate; Fixing the composite ball on the electrode of the first electronic device, comprising: an electronic component provided on the substrate; and an electrode electrically connected to the electronic component and provided on the substrate; (B) After the step (a), a printing mask having an opening is placed such that at least a part of the composite ball enters the opening and the vertex of the composite ball is below the upper surface of the printing mask. Placing and attaching a solder paste to the top of the composite ball,
The substrate includes a dummy portion that does not form the electronic component, and the step (b) is performed in a state where a spacer for supporting the print mask is provided in the dummy portion .
According to the method of the invention 2, it is possible to prevent the print mask from coming into contact with the electronic component .

発明３の電子デバイスの接続方法は、コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を接続する方法であって、（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記複合ボールを固定する工程と、（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、前記印刷マスクの開口部の直径は前記複合ボールの直径より大きく形成されており、前記第１の電子デバイスは、前記電子部品が前記基板にワイヤを用いてワイヤボンディングされたパッケージであり、前記印刷マスクの前記ワイヤの最も高くなっている部分とオーバーラップする部分の厚さは、前記印刷マスクの他の部分の厚さより薄く形成されていることを特徴とする。
発明３の方法によれば、ワイヤの突出部分と印刷マスクが干渉しないようにできる。
An electronic device connection method according to a third aspect of the present invention is a method of connecting the opposing electrodes of the first and second electronic devices with a composite ball comprising a core and a surface layer, the method comprising: (a) a substrate; and Fixing the composite ball on the electrode of the first electronic device, comprising: an electronic component provided on the substrate; and an electrode electrically connected to the electronic component and provided on the substrate; (B) After the step (a), a printing mask having an opening is placed such that at least a part of the composite ball enters the opening and the vertex of the composite ball is below the upper surface of the printing mask. And placing a solder paste on top of the composite ball, wherein the diameter of the opening of the printing mask is larger than the diameter of the composite ball, and the first electronic device is , The electronic part Is a package that is wire-bonded to the substrate using a wire, and the thickness of the portion of the printing mask that overlaps the highest portion of the wire is thinner than the thickness of the other portion of the printing mask. It is formed.
According to the method of the invention 3, the protruding portion of the wire and the printing mask can be prevented from interfering with each other.

発明４の電子デバイスの接続方法は、前記発明１又は３に記載の電子デバイスの接続方法において、前記基板は、前記電子部品を形成しないダミー部を有し、前記（ｂ）工程では、前記ダミー部に前記印刷マスクを支持するスペーサを設けた状態で行うことを特徴とする。
発明４の方法によれば、印刷マスクが電子部品に接触することを防ぐことができる。
An electronic device connection method according to a fourth aspect of the present invention is the electronic device connection method according to the first or third aspect, wherein the substrate has a dummy portion that does not form the electronic component, and in the step (b), the dummy It is performed in a state where a spacer for supporting the printing mask is provided in the part.
According to the method of the invention 4, the printing mask can be prevented from coming into contact with the electronic component.

発明５の電子デバイスの接続方法は、前記発明４に記載の電子デバイスの接続方法において、前記スペーサは、前記（ａ）工程時に同時に形成することを特徴とする。
発明５の方法によれば、別工程でスペーサを設ける手間が低減できる。
An electronic device connection method according to a fifth aspect of the invention is the electronic device connection method according to the fourth aspect, wherein the spacer is formed simultaneously with the step (a) .
According to the method of the invention 5, the trouble of providing the spacer in a separate process can be reduced .

発明６の電子デバイスの接続方法は、前記発明１又は３に記載の電子デバイスの接続方法において、前記印刷マスクの厚さは、前記各開口部の周縁で複合ボールの直径より大きく、前記（ｂ）工程時には、この印刷マスクを前記基板（下側基板）上に接触させて配置することを特徴とする。
発明６の方法によれば、印刷マスクを下側基板の上に置くだけで簡単に、印刷マスクの
高さを所定高さに保持することができる。

Electronic device connecting method of inventions 6, the connection method for an electronic device according to the invention 1 or 3, the thickness of the printing mask is larger than the diameter of the composite ball periphery of each opening, the ( In the step b), the printing mask is arranged in contact with the substrate (lower substrate).
According to the method of the invention 6 , the height of the printing mask can be easily maintained at a predetermined height simply by placing the printing mask on the lower substrate.

以下、本発明の実施形態について説明する。
図１は、本発明の電子デバイスの接続方法の実施形態を説明する図である。
この実施形態では、パッケージオンパッケージ構造の電子部品を製造する際に、下側基
板に形成された複数個のパッケージ上に、それぞれ上側パッケージを固定する方法につい
て説明する。 Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a diagram for explaining an embodiment of an electronic device connection method according to the present invention.
In this embodiment, a method for fixing an upper package on a plurality of packages formed on a lower substrate when manufacturing an electronic component having a package-on-package structure will be described.

先ず、図１（ａ）に示すように、下側基板１の上に、チップ２がワイヤ３によりボンデ
ィングされた下側パッケージ（第１の電子デバイス）が複数個形成されている。この下側
基板１には、また、各パッケージの接続用電極４が形成されている。そして、接続用電極
４の上に、コア５１と表面の半田層５２からなる複合ボール５が固定されている。また、
固定された複合ボール５の全ての位置に開口部６１を有する印刷マスク６を用意する。 First, as shown in FIG. 1A, a plurality of lower packages (first electronic devices) in which chips 2 are bonded by wires 3 are formed on a lower substrate 1. On the lower substrate 1, connection electrodes 4 for the respective packages are formed. A composite ball 5 comprising a core 51 and a solder layer 52 on the surface is fixed on the connection electrode 4. Also,
A printing mask 6 having openings 61 at all positions of the fixed composite ball 5 is prepared.

次に、図１（ｂ）に示すように、印刷マスク６を、複合ボール５の上部が各開口部６１
に入って、その頂点が印刷マスク６の上面より下側となるように配置する。言い換えると
、複合ボール２の下側基板１から最も離れている点が、印刷マスク６の下側基板１と対向
する面とは反対側の面よりも、下側基板１に近くなるように配置する。その際に、下側基
板１と印刷マスク６の間に印刷マスク６を受けるスペーサＳを配置しておくことで、印刷
マスク６の高さを所定高さに保持してもよい。このとき、スペーサＳは複合ボール５の間
に設けてもよい。また、複合ボール５を接続用電極４の上に設ける際に、同時にスペーサ
Ｓを形成してもよい。 Next, as shown in FIG. 1 (b), the printing mask 6 is arranged such that the upper part of the composite ball 5 has openings 61.
And placed so that its apex is below the upper surface of the printing mask 6. In other words, the point farthest from the lower substrate 1 of the composite ball 2 is arranged closer to the lower substrate 1 than the surface opposite to the surface facing the lower substrate 1 of the printing mask 6. To do. At this time, the height of the print mask 6 may be maintained at a predetermined height by arranging a spacer S for receiving the print mask 6 between the lower substrate 1 and the print mask 6. At this time, the spacer S may be provided between the composite balls 5. Further, when the composite ball 5 is provided on the connection electrode 4, the spacer S may be formed at the same time.

この状態で、印刷マスク６の上に置いた半田ペースト７を、スキージ７１により図１の
右から左へ掻き取りながら移動させることで、半田ペースト印刷を行い、全ての開口部６
１内に半田ペースト７を入れる。
次に、印刷マスク６を外すことで、図１（ｃ）に示すように、各複合ボール５の上部に
半田ペースト７が付着する。次に、図１（ｄ）に示すように、上側のパッケージ８の各接
続用電極８１を、対応する下側のパッケージの各複合ボール５に合わせて載せる。次に、
図１（ｅ）に示すように、リフロー加熱を行って、半田ペースト７および複合ボール５の
半田層５２を溶融させることにより、上下のパッケージを接続する。 In this state, the solder paste 7 placed on the printing mask 6 is moved while being scraped from the right to the left in FIG.
1 is filled with solder paste 7.
Next, by removing the printing mask 6, the solder paste 7 adheres to the top of each composite ball 5 as shown in FIG. Next, as shown in FIG. 1D, the connection electrodes 81 of the upper package 8 are placed on the corresponding composite balls 5 of the lower package. next,
As shown in FIG. 1 (e), reflow heating is performed to melt the solder paste 7 and the solder layer 52 of the composite ball 5, thereby connecting the upper and lower packages.

この実施形態の方法によれば、半田ペースト印刷を採用することで、ディスペンサーを
用いた方法と比較して、生産性が高く、微量のペーストを小径の複合ボール上に安定的に
塗布することができる。
ここで、図２に示すように、印刷マスク６の開口部６１の直径Ａを、複合ボール５の直
径より大きく、印刷マスク６の上面とその開口部６１に入った複合ボール５の頂点との距
離Ｂを、使用する半田ペーストに含まれる半田粒子の直径より大きく、印刷マスク６の厚
さｔの２／３以下とする。例えば、複合ボール５の直径が２２０ｍｍ、印刷マスク６の厚
さｔ＝１２０ｍｍの場合、Ａ＝２８０ｍｍ、Ｂ＝７０ｍｍとする。これにより、印刷マス
ク６を外した時に、半田ペースト７が開口部６１に残ることが防止され、適量の半田ペー
スト７を複合ボール５上に付着させることができる。 According to the method of this embodiment, by adopting solder paste printing, productivity is high compared to the method using a dispenser, and a small amount of paste can be stably applied onto a small-diameter composite ball. it can.
Here, as shown in FIG. 2, the diameter A of the opening 61 of the printing mask 6 is larger than the diameter of the composite ball 5, and the upper surface of the printing mask 6 and the apex of the composite ball 5 that has entered the opening 61. The distance B is larger than the diameter of the solder particles contained in the solder paste to be used and is 2/3 or less of the thickness t of the printing mask 6. For example, when the diameter of the composite ball 5 is 220 mm and the thickness t of the printing mask 6 is 120 mm, A = 280 mm and B = 70 mm. Thereby, when the printing mask 6 is removed, the solder paste 7 is prevented from remaining in the opening 61, and an appropriate amount of the solder paste 7 can be adhered onto the composite ball 5.

また、図３に示すように、印刷マスク６の、ワイヤ３の最も高くなっている部分とオー
バーラップする部分の厚さｔ１を開口部６１の周縁部分の厚さｔより薄くすることで、ワ
イヤ３の突出部分と印刷マスク６が干渉しないようにすることができる。ここで、ワイヤ
３の最も高くなっている部分とは、言い換えるとワイヤ３の下側基板１から最も離れた部
分を指す。
また、図４の例では、下側基板１に電子デバイスを形成しないダミー部１１を設け、こ
のダミー部１１に、スペーサとして上下のパッケージ接続用と同じ複合ボール５を固定し
、開口部６１の周縁部に突出部６２を設けた印刷マスク６を用いている。この突出部６２
の突出量は、複合ボール５の開口部６１への挿入量の設定値に対応させて決める。 Further, as shown in FIG. 3, the thickness t1 of the portion of the printing mask 6 that overlaps the highest portion of the wire 3 is made smaller than the thickness t of the peripheral portion of the opening 61, thereby 3 and the printing mask 6 can be prevented from interfering with each other. Here, the highest part of the wire 3 refers to the part farthest from the lower substrate 1 of the wire 3 in other words.
Further, in the example of FIG. 4, a dummy portion 11 that does not form an electronic device is provided on the lower substrate 1, and the same composite ball 5 for connecting the upper and lower packages as a spacer is fixed to the dummy portion 11. A printing mask 6 having a protrusion 62 at the periphery is used. This protrusion 62
Is determined in accordance with the set value of the insertion amount of the composite ball 5 into the opening 61.

そのため、図４（ａ）の状態から印刷マスク６を降下させることで、印刷マスク６はダ
ミー部１１の複合ボール５に当たり、図４（ｂ）に示す状態となる。これにより、印刷マ
スク６は複合ボール５の高さに保持され、複合ボール５は印刷マスク６の開口部６１へ設
定量だけ挿入された状態となる。この状態で、半田ペースト印刷を行った後に印刷マスク
６を外すことで、接続用電極４上の複合ボール５の上部に半田ペースト７が付着し、ダミ
ー部１１には複合ボール５がそのまま存在する。なお、このダミー部１１は、下側基板１
のダイシング工程で切断された後に廃棄される。 Therefore, by lowering the printing mask 6 from the state of FIG. 4A, the printing mask 6 hits the composite ball 5 of the dummy portion 11 and becomes the state shown in FIG. As a result, the print mask 6 is held at the height of the composite ball 5, and the composite ball 5 is inserted into the opening 61 of the print mask 6 by a set amount. In this state, by removing the printing mask 6 after performing solder paste printing, the solder paste 7 adheres to the upper part of the composite ball 5 on the connection electrode 4, and the composite ball 5 exists as it is in the dummy portion 11. . The dummy part 11 is provided on the lower substrate 1.
It is discarded after being cut in the dicing process.

また、図５の例では、印刷マスク９を、複合ボール５の直径より厚い金属板に、複合ボ
ール５位置に対応させた貫通穴（開口部）９１と、チップ２およびワイヤ３の部分が入る
凹部９２を設けることで作製し、この印刷マスク９を下側基板１の上に載せている。この
状態で複合ボール５の頂点と印刷マスク９の上面との間に所定の距離Ｂが保持されるよう
に、印刷マスク９の厚さが設定されている。 Further, in the example of FIG. 5, a through hole (opening) 91 corresponding to the position of the composite ball 5, the chip 2 and the wire 3 is inserted into a metal plate thicker than the diameter of the composite ball 5. Produced by providing the recess 92, the printing mask 9 is placed on the lower substrate 1. In this state, the thickness of the printing mask 9 is set so that a predetermined distance B is maintained between the vertex of the composite ball 5 and the upper surface of the printing mask 9.

この状態で、印刷マスク９の上に置いた半田ペースト７を、スキージ７１により図５の
右から左へ掻き取りながら移動させることで、半田ペースト印刷を行い、全ての開口部９
１内の上部に半田ペースト７を入れる。次に、印刷マスク９を外すことで、図１（ｃ）と
同様に、各複合ボール５の上部に半田ペースト７が付着する。
このような印刷マスク９を用いることで、図１（ｂ）のようなスペーサＳの設置や、図
４のような複合ボール５をダミー部１１に固定することを行わなくても、下側基板１の上
に置くだけで簡単に、印刷マスクの高さを所定高さに保持することができる。 In this state, the solder paste 7 placed on the printing mask 9 is moved while being scraped from the right to the left in FIG.
Solder paste 7 is put in the upper part of 1. Next, by removing the printing mask 9, the solder paste 7 adheres to the top of each composite ball 5 as in FIG.
By using such a printing mask 9, the lower substrate can be obtained without the installation of the spacer S as shown in FIG. 1B or the fixing of the composite ball 5 as shown in FIG. The height of the printing mask can be easily maintained at a predetermined height simply by placing it on the top of 1.

実施形態の方法を説明する断面図。Sectional drawing explaining the method of embodiment. 印刷マスクの厚さおよび開口部と複合ボールとの関係を示す断面図。Sectional drawing which shows the thickness of a printing mask, and the relationship between an opening part and a composite ball. ワイヤを避ける形状の印刷マスクを示す断面図。Sectional drawing which shows the printing mask of the shape which avoids a wire. 下側基板にダミー部を有する場合を示す断面図。Sectional drawing which shows the case where a lower part has a dummy part. 図１とは異なる印刷マスクを使用した例を示す断面図。Sectional drawing which shows the example which uses the printing mask different from FIG.

符号の説明Explanation of symbols

１…下側基板、２…チップ、３…ワイヤ、４…下側パッケージの接続用電極、５…複合
ボール、５１…コア、５２…表面の半田層、６…印刷マスク、６１…開口部、７…半田ペ
ースト、７１…スキージ、８…上側のパッケージ、８１…上側パッケージの接続用電極、
９…印刷マスク、９１…開口部、９２…凹部、Ｓ…スペーサ。 DESCRIPTION OF SYMBOLS 1 ... Lower substrate, 2 ... Chip | tip, 3 ... Wire, 4 ... Connection electrode of lower package, 5 ... Composite ball | bowl, 51 ... Core, 52 ... Surface solder layer, 6 ... Printing mask, 61 ... Opening part, 7 ... Solder paste, 71 ... Squeegee, 8 ... Upper package, 81 ... Connecting electrode for upper package,
9 ... Print mask, 91 ... Opening, 92 ... Recess, S ... Spacer.

Claims (6)

コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を接続する方法であって、
（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、
前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記
複合ボールを固定する工程と、
（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの
少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように
配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、
前記第１の電子デバイスは、前記電子部品が前記基板にワイヤを用いてワイヤボンディ
ングされたパッケージであり、前記印刷マスクの前記ワイヤの最も高くなっている部分と
オーバーラップする部分の厚さは、前記印刷マスクの他の部分の厚さより薄く形成されて
いることを特徴とする電子デバイスの接続方法。 A method of connecting the opposing electrodes of the first and second electronic devices with a composite ball comprising a core and a surface layer,
(A) a substrate, an electronic component provided on the substrate, and electrically connected to the electronic component;
Fixing the composite ball on the electrode of the first electronic device having an electrode provided on the substrate;
(B) After the step (a), the print mask having an opening is disposed so that at least a part of the composite ball enters the opening and the vertex of the composite ball is below the upper surface of the print mask. And a step of attaching a solder paste to the upper part of the composite ball,
In the first electronic device, the electronic component uses a wire on the substrate to form a wire bonder.
And the highest portion of the wire of the printing mask; and
The thickness of the overlapping part is thinner than the thickness of the other part of the printing mask.
A method for connecting an electronic device. コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を接続する方法であって、
（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、
前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記
複合ボールを固定する工程と、
（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの
少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように
配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、
前記基板は、前記電子部品を形成しないダミー部を有し、前記（ｂ）工程では、前記ダミー部に前記印刷マスクを支持するスペーサを設けた状態で行うことを特徴とする電子デバイスの接続方法。 A method of connecting the opposing electrodes of the first and second electronic devices with a composite ball comprising a core and a surface layer,
(A) a substrate, an electronic component provided on the substrate, and electrically connected to the electronic component;
An electrode provided on the substrate, on the electrode of the first electronic device,
Fixing the composite ball;
(B) After the step (a), a printing mask having an opening is formed on the opening of the composite ball.
So that at least a portion of the composite ball enters and the vertex of the composite ball is below the upper surface of the printing mask.
Placing and attaching a solder paste to the top of the composite ball,
The substrate includes a dummy portion that does not form the electronic component, and the step (b) is performed in a state where a spacer that supports the print mask is provided in the dummy portion. . コアと表面層からなる複合ボールで、第１及び第２の電子デバイスの対向する電極間を
接続する方法であって、
（ａ）基板と、前記基板上に設けられた電子部品と、前記電子部品と電気的に接続され、
前記基板上に設けられた電極と、を有する前記第１の電子デバイスの前記電極上に、前記
複合ボールを固定する工程と、
（ｂ）前記（ａ）工程後、開口部を有する印刷マスクを、前記開口部に前記複合ボールの
少なくとも一部が入り、前記複合ボールの頂点が印刷マスクの上面より下側となるように
配置して、前記複合ボールの上部に半田ペーストを付着させる工程と、を有し、
前記印刷マスクの開口部の直径は前記複合ボールの直径より大きく形成されており、
前記第１の電子デバイスは、前記電子部品が前記基板にワイヤを用いてワイヤボンディ
ングされたパッケージであり、前記印刷マスクの前記ワイヤの最も高くなっている部分と
オーバーラップする部分の厚さは、前記印刷マスクの他の部分の厚さより薄く形成されて
いることを特徴とする電子デバイスの接続方法。 A method of connecting the opposing electrodes of the first and second electronic devices with a composite ball comprising a core and a surface layer,
(A) a substrate, an electronic component provided on the substrate, and electrically connected to the electronic component;
Fixing the composite ball on the electrode of the first electronic device having an electrode provided on the substrate;
(B) After the step (a), the print mask having an opening is disposed so that at least a part of the composite ball enters the opening and the vertex of the composite ball is below the upper surface of the print mask. And a step of attaching a solder paste to the upper part of the composite ball,
The diameter of the opening of the printing mask is formed larger than the diameter of the composite ball,
The first electronic device is a package in which the electronic component is wire-bonded to the substrate using a wire, and the thickness of a portion of the print mask that overlaps the highest portion of the wire is: A method of connecting an electronic device, characterized in that the electronic device is formed to be thinner than other portions of the print mask. 前記基板は、前記電子部品を形成しないダミー部を有し、前記（ｂ）工程では、前記ダミー部に前記印刷マスクを支持するスペーサを設けた状態で行う請求項１又は３に記載の電子デバイスの接続方法。 4. The electronic device according to claim 1, wherein the substrate includes a dummy portion that does not form the electronic component, and the step (b) is performed in a state where a spacer that supports the print mask is provided in the dummy portion. 5. Connection method. 前記スペーサは、前記（ａ）工程時に同時に形成する請求項４に記載の電子デバイスの
接続方法。 The electronic device connection method according to claim 4 , wherein the spacer is formed simultaneously with the step (a) . 前記印刷マスクの厚さは、前記各開口部の周縁で複合ボールの直径より大きく、前記（
ｂ）工程時には、この印刷マスクを前記基板上に接触させて配置する請求項１又は３に記載の電子デバイスの接続方法。 The thickness of the printing mask is larger than the diameter of the composite ball at the periphery of each opening,
The method for connecting electronic devices according to claim 1 or 3, wherein in the step b), the print mask is disposed in contact with the substrate .
JP2007076114A 2007-03-23 2007-03-23 How to connect electronic devices Expired - Fee Related JP4899962B2 (en)

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