JP4892496B2 - Aligner equipment - Google Patents

Description

  The present invention relates to an aligner apparatus used for semiconductor manufacturing and used for positioning a circular thin plate-like wafer.

  Semiconductor manufacturing includes a plurality of processes on circular thin wafers. Each processing is performed using an individual processing device. The wafer is transferred via a robot to a processing apparatus that performs the next processing every time processing in one processing apparatus is completed. In order to perform an appropriate process on a wafer in each processing apparatus, it is necessary to transport the wafer to an accurate position at an appropriate rotation angle with respect to each processing apparatus. For this reason, an aligner that positions a wafer at a predetermined reference angle is used for semiconductor manufacturing (see, for example, Patent Document 1).

  The aligner is configured to detect a notch or an orientation flat formed on the peripheral edge of the wafer by an edge sensor while rotating the wafer around a vertical axis while holding the wafer at a plurality of rotation angle positions at the peripheral edge. To detect. The edge sensor includes a light emitting portion and a light receiving portion that sandwich the wafer in the thickness direction (vertical direction) at the peripheral portion of the wafer, emits light from the light emitting portion toward the light receiving portion, and corresponds to the light receiving position in the radial direction. A detection signal is output from the light receiving unit.

  However, since the wafer is carried into the aligner device at an irregular rotation angle, the claw of the aligner device may come into contact with the detection unit of the wafer. When the claw comes into contact with the detection portion of the wafer, the detection portion cannot be detected by the edge sensor, and the rotation angle of the wafer cannot be adjusted.

For this reason, in the conventional aligner apparatus, when the detection unit cannot be detected by the edge sensor, the wafer is temporarily placed on the robot hand or stage and the nail is separated from the peripheral edge of the wafer, and then the nail is removed. A holding change process is performed in which the wafer is rotated by a predetermined amount and brought into contact with the peripheral edge of the wafer again. By this processing, the claw can be brought into contact with the peripheral portion of the wafer where the detection portion is not formed, and the detection portion can be reliably detected by the edge sensor.
JP-A-11-233594

  However, in the conventional aligner apparatus, since the wafer held by the claw at the time of changing the wafer is placed on the hand or the stage, it is necessary to raise and lower the claw holding the wafer. There is a problem that the structure becomes complicated as the time increases.

  The object of the present invention is to enable the wafer to be held and held without displacing the wafer by enabling the wafer to be alternately held between two sets of claws, thereby shortening the rotation angle control of the wafer. It is another object of the present invention to provide an aligner device that can realize a simplified structure.

  The aligner device of the present invention includes a plurality of first arms, a plurality of second arms, a first cylinder, a second cylinder, a first drive unit, and a second drive unit. The sensor detects the detection unit of the wafer at a predetermined angular position at the peripheral edge of the wafer whose surface is located in the first plane. The plurality of first arms and the plurality of second arms are provided with claw portions at their tip portions that selectively abut each of a plurality of equally spaced rotation angle positions on the periphery of the wafer whose surface is located within the first plane. ing. The first cylinder holds the bases of the plurality of first arms in a second parallel to the first surface, and is rotatable about an axis perpendicular to the first surface. The second cylinder holds the base portions of the plurality of second arms in a third plane that is parallel to the first surface and different from the second surface, and at a rotational position different from the plurality of first arms. It is made to be rotatable around a vertical axis. A 1st drive part and a 2nd drive part supply a rotational force separately to each of a 1st cylinder and a 2nd cylinder, respectively.

  In this configuration, by simultaneously bringing the claw portions of the plurality of first arms and the plurality of second arms into contact with the peripheral edge of the wafer, the wafer is simultaneously held between the plurality of first arms and the plurality of second arms. If each claw part of any one of a plurality of 1st arms or a plurality of 2nd arms is separated from the peripheral part of a wafer from this state, each of the other claw parts which a plurality of 2nd arms or a plurality of 1st arms will remain Only the wafer is clamped.

  Therefore, when the wafer is moved between the plurality of first arms and the plurality of second arms, it is not necessary to displace the wafer, and the plurality of first arms and the plurality of second arms are orthogonal to the surface of the wafer. There is no need to move to.

  In this configuration, the first cylinder and the second cylinder may respectively hold a plurality of first arms and a plurality of second arms so as to be capable of reciprocating along the radial direction of the wafer. While responding to changes in the size of the wafer, the plurality of first arms and the plurality of second arms can be freely rotated about an axis perpendicular to the surface of the wafer without interfering with each other.

  Further, a detection unit that detects a detection unit formed on the peripheral edge of the wafer, and operations of the plurality of first arms, the plurality of second arms, the first drive unit, and the second drive unit based on the detection result of the detection unit And a control means for controlling. For example, when only the plurality of first arms sandwich the wafer and the plurality of first arms are rotated around an axis orthogonal to the surface of the wafer, the detection means does not detect the detection unit. The operation of detecting the detection unit by rotating the plurality of second arms while the wafer is held only by the second arm can be simplified.

  According to the present invention, the wafer can be changed between the plurality of first arms and the plurality of second arms without displacing the wafer. For this reason, the adjustment work of the rotation angle position of the wafer can be shortened, and the structure can be simplified.

  FIG. 1 is an external view of an aligner device according to a first embodiment of the present invention. FIG. 2 is a plan view of the aligner device. 3 is a cross-sectional view in the XX direction in FIG. The aligner 10 controls the rotation angle of the wafer 100 without displacing the wafer 100 from a predetermined loading position. For this reason, the aligner device 10 includes, as an example, three first arms 1A to 1C, second arms 2A to 2C, a first cylinder 3 (not shown in FIG. 1), a second cylinder 4, and a first motor. 5, a second motor 6, three sensors 7 </ b> A to 7 </ b> C, and a support 8.

  The wafer 100 is loaded into a loading position indicated by a two-dot chain line in FIG. 1 by a robot hand (not shown). The surface of the wafer 100 located at the carry-in position is the first surface of the present invention.

  The support body 8 has a cylindrical shape, and is rotatably arranged coaxially with the wafer 100 below the wafer 100 at the loading position.

  As shown in FIG. 3, the support 8 houses the first cylinder 3 and the second cylinder 4 inside. Inside the support 8, a rotating shaft 31 is inserted coaxially with the support 8 from below. The rotating shaft 31 passes through the hollow shaft 41. The rotating shaft 31 and the hollow shaft 41 are rotatably supported by a frame (not shown) of the aligner device 10 via a bearing 311 and a bearing 411, respectively.

  The first cylinder 3 is attached to the upper end of the rotating shaft 31 and is fixed to the inner peripheral surface of the support 8. The second cylinder 4 is attached to the upper end of the hollow shaft 41, is rotatable with respect to the rotation shaft 31 by bearings 422 and 423, and is rotatable on the inner peripheral surface of the support 8 by the bearing 424. ing. Therefore, the first cylinder 3 rotates integrally with the support 8 and the rotation shaft 31 and independently of the second cylinder 4 and the hollow shaft 41. The second cylinder 4 rotates integrally with the hollow shaft 41 and independently of the first cylinder 3, the support 8 and the rotation shaft 31.

  As shown in FIGS. 2 and 3, the first cylinder 3 has a rotation angle (120 degrees) at equal intervals between the bases of the first arms 1 </ b> A to 1 </ b> C in a second plane parallel to the first plane. Holding in position. The second cylinder 4 holds the respective bases of the second arms 2A to 2C at positions at equal rotation angles (120 degrees) in a third plane parallel to the first plane and different from the second plane. ing. In the vertical direction, the first arms 1A to 1C do not overlap the second arms 2A to 2C.

  As shown in FIG. 1, windows 8 </ b> A to 8 </ b> C (the window 8 </ b> A does not appear in FIG. 1) are formed on the peripheral surface of the support 8 along the circumferential direction. The upper portion and the lower portion sandwiching the window portions 8A to 8C of the support 8 are connected between the respective window portions 8A to 8C located below the first arms 1A to 1C. A toothed pulley 32 is fixed to the peripheral surface of the lower end portion of the support 8.

  Each of the first arms 1 </ b> A to 1 </ b> C extends from the vicinity of the upper end portion of the support 8. At the tip of each of the first arms 1A to 1C, the claw portions 11A to 11C, which are the first claw portions of the present invention, respectively, have a retracted position parallel to the longitudinal direction of the first arms 1A to 1C and the first arm. It is supported so as to be swingable between the exposure positions orthogonal to the longitudinal direction of 1A to 1C. Each of the claw portions 11 </ b> A to 11 </ b> C comes into contact with the rotation angle positions at equal intervals in the peripheral portion of the wafer 100 at the exposed position.

  Each of the second arms 2A to 2C extends from each of the window portions 8A to 8C. At the tip of each of the second arms 2A to 2C, each of the claw portions 21A to 21C, which are the second claw portions of the present invention, has a retracted position parallel to the longitudinal direction of the second arms 2A to 2C and the second arm. It is supported so as to be swingable between the exposed positions orthogonal to the longitudinal direction of 2A to 2C. Each of the claw portions 21 </ b> A to 21 </ b> C comes into contact with the rotation angle positions at equal intervals in the peripheral portion of the wafer 100 at the exposed position.

  The claw portions 11A to 11C and the claw portions 21A to 21C can both hold the wafer 100 at the predetermined loading position at the exposure position.

  As shown in FIG. 3, the first arm 1B houses an air cylinder 12B having a piston 14B. A pressure air passage 312 communicating from the air pump 313 to the air cylinder 12B is formed in the rotary shaft 31, the first cylinder 3, and the first arm 1B. A valve 314 is disposed in the pressure air passage 312. When the valve 314 is opened and pressurized air is supplied into the air cylinder 12B, the piston 14B moves against the elastic force of the spring 13B, and the claw portion 11B swings from the retracted position to the exposed position. When the valve 314 is opened to release the pressure air in the pressure air passage 312, the claw portion 11B swings from the exposed position to the retracted position by the elastic force of the spring 13B. The first arms 1A and 1C are configured similarly to the first arm 1B.

  The second arm 2C houses an air cylinder 22C having a piston 24C. In the hollow shaft 41, the second cylinder 4, and the second arm 2C, a pressure air passage 412 that communicates from the air pump 413 to the air cylinder 22B is formed. A valve 414 is disposed in the pressure air passage 412. When the valve 414 is opened and pressurized air is supplied into the air cylinder 22C, the piston 24C moves against the elastic force of the spring 23C, and the claw portion 21C swings from the retracted position to the exposed position. When the valve 414 is opened to release the pressure air in the pressure air passage 412, the claw portion 21C swings from the exposed position to the retracted position by the elastic force of the spring 23C. The second arms 2A and 2B are configured similarly to the second arm 2C.

  A toothed pulley 51 is fixed to the rotating shaft 5A of the first motor 5 which is the first drive unit of the present invention. A cogged belt 52 is stretched between the toothed pulley 32 and the toothed pulley 51. The rotation of the rotating shaft 5 </ b> A is transmitted to the support 8 through the toothed pulley 32, the toothed pulley 51, and the cogged belt 52. Therefore, when the first motor 5 is driven, the first arms 1 </ b> A to 1 </ b> C rotate together with the support body 8, the first cylinder 3, and the rotating shaft 31.

  A toothed pulley 61 is fixed to the rotating shaft 6A of the second motor 6 which is the second drive unit of the present invention. A cogged belt 62 is stretched between the toothed pulley 32 and the toothed pulley 61. The rotation of the rotating shaft 6 </ b> A is transmitted to the support body 8 through the toothed pulley 32, the toothed pulley 61 and the cogged belt 62. Therefore, when the second motor 6 is driven, the second arms 2 </ b> A to 2 </ b> C rotate together with the second cylinder 4 and the hollow shaft 41.

  A universal joint is disposed between the lower end portion of the rotary shaft 31 and the valve 314 in the pressurized air passage 312, and the rotation of the rotary shaft 31 also hinders the flow of pressurized air in the pressurized air passage 312. There is nothing. In addition, a flexible tube is disposed between the hollow shaft 41 and the valve 414 in the pressurized air passage 412, and the rotation of the hollow shaft 41 may hinder the flow of pressurized air in the pressurized air passage 412. There is no.

  As shown in FIGS. 1 and 2, the sensors 7 </ b> A to 7 </ b> C are arranged to face the upper surface of the wafer 100 at equal rotation angle positions (120 degrees) at the peripheral edge of the wafer 100. The sensors 7A to 7C are fixed to a frame (not shown) of the aligner device 10, and do not rotate even if the first arms 1A to 1C and the second arms 2A to 2C rotate. The sensors 7 </ b> A to 7 </ b> C detect a detection unit such as a notch or an orientation flat formed in a part of the peripheral edge of the wafer 100.

  FIG. 4 is a block diagram of a control unit of the aligner apparatus. The aligner device 10 includes a control unit 200 on a frame (not shown). The control unit 200 as the control means of the present invention is configured by connecting motor drivers 204 and 205, solenoid drivers 206 and 207, sensors 7A to 7C and the like to a CPU 201 having a ROM 202 and a RAM 203.

  The ROM 202 stores a program that defines the operation of the CPU 201. Detection signals from the sensors 7A to 7C are input to the CPU 201. The CPU 201 outputs drive data to the motor drivers 204 and 205 and the solenoid drivers 206 and 207 according to the detection results of the sensors 7A to 7C in accordance with a program stored in the ROM 202.

  A first motor 5 and a second motor 6 are connected to the motor drivers 204 and 205, respectively. The motor drivers 204 and 205 drive the first motor 5 and the second motor 6 based on the drive data.

  Solenoid drivers 206 and 207 are connected to solenoids 301 and 302 of valves 314 and 414, respectively. Solenoid drivers 206 and 207 drive solenoids 301 and 302 based on the drive data.

  FIG. 5 is a flowchart showing the processing procedure of the control unit when controlling the rotation angle of the wafer in the aligner. 6 (A) to 6 (D) are diagrams showing an operation state during the same rotation angle control. When controlling the rotation angle of the wafer, the CPU 201 opens the valves 314 and 414 and positions the claw portions 11A to 11C of the first arms 1A to 1C and the claw portions 21A to 21C of the second arms 2A to 2C to the retracted positions. Waiting for the loading of the wafer (S1, S2). The wafer 100 is held by a robot hand (not shown) and is horizontally loaded at a predetermined loading position as shown in FIG.

  When the wafer 100 reaches the loading position, the CPU 201 closes the valve 314 and positions the claw portions 11A to 11C of the first arms 1A to 1C at the exposed position as shown in FIG. The wafer 100 is held between 11A to 11C (S3).

  Next, the CPU 201 waits for the robot hand to leave (S4). When the robot hand leaves, the CPU 201 drives the first motor 5 to rotate the first arms 1A to 1C within an angle range of 120 degrees (S5), and fetches the detection signals of the sensors 7A to 7C (S6).

  When any of the sensors 7A to 7C detects the detection unit of the wafer 100 while the first arms 1A to 1C rotate 120 degrees, the CPU 201 stops driving the first motor 5 and the first arms 1A to 1C. (S7), and the rotation angle of the wafer 100 is controlled based on the detection result (S14).

  If none of the sensors 7A to 7C detect the detection unit of the wafer 100 while the first arms 1A to 1C rotate 120 degrees, the CPU 201 stops driving the first motor 5 and the first arm 1A. The rotation of ˜1C is stopped (S8). Next, the CPU 201 opens the valve 414 and positions the claw portions 21A to 21C of the second arms 2A to 2C at the exposed position (S9). As shown in FIG. 6C, the wafer 100 is also held by the claw portions 21A to 21C at a portion different from the portion held by the claw portions 11A to 11C. Further, the CPU 201 closes the valve 314 and moves the claw portions 11A to 11C to the retracted position (S10). As shown in FIG. 6D, the wafer 100 is held only by the claw portions 21A to 21C.

  In a state where only the claw portions 21A to 21C hold the wafer 100, the CPU 201 drives the first motor 5 and the second motor 6 to rotate the first arms 1A to 1C and the second arms 2A to 2C ( S11), the detection signals of the sensors 7A to 7C are fetched (S12).

If none of the sensors 7A to 7C detect the detection unit in S6, it is considered that any of the claw portions 11A to 11C holds the detection unit of the wafer 100. Therefore, the claw portions 21A to 21C sandwich a portion that is different from the portion where the claw portions 11A to 11C are sandwiched at the periphery of the wafer 100 and have no detection portion formed, and rotate the wafer 100 by 120 degrees. Then, the detection unit is detected by the sensors 7A to 7C (S12).

  The reason why the first arms 1A to 1C are rotated together with the second arms 2A to 2C in S11 is to avoid interference between the claw portions 21A to 21C at the exposed position and the claw portions 11A to 11C at the retracted position.

  In S11, after the second arms 2A to 2C are rotated counterclockwise until immediately before the claw portions 21A to 21C contact the claw portions 11A to 11C, the claw portions 21A to 21C are moved to the claw portions 11B, 11C, and 11A. It can also be rotated clockwise until just before contact. Accordingly, the detection unit can be detected without rotating the first arms 1A to 1C.

  When any of the sensors 7A to 7C detects the detection unit, the CPU 201 stops driving the first motor 5 and the second motor 6 and stops the rotation of the first arms 1A to 1C and the second arms 2A to 2C. (S13) The rotation angle of the wafer 100 is controlled based on the detection result (S14).

  When the rotation angle control of the wafer 100 is completed, the CPU 201 waits for the robot arm to enter and moves the claw portions 11A to 11C or the claw portions 21A to 21C to the retracted position (S16), and then the CPU 201 transfers the wafer to the robot hand. 100 is carried out (S17).

  As described above, the wafer 100 is moved in the vertical direction by selectively clamping the different portions of the periphery of the wafer 100 whose surface is located on the first surface with the claw portions 11A to 11C and the claw portions 21A to 21C. The wafer 100 can be changed without being displaced. Thereby, the rotation angle control of the wafer can be shortened and the configuration of the aligner can be simplified.

  Further, by arranging the first arms 1A to 1C including the claw portions 11A to 11C and the second arms 2A to 2C including the claw portions 21A to 21C on different surfaces, they can be rotated without interfering with each other. .

  In the aligner apparatus 10, the detection unit of the wafer 100 is detected by the three sensors 7A to 7C. However, the present invention is not limited to this. By rotating the first arms 1A to 1C and the second arms 2A to 2C by 360 degrees, the detection unit of the wafer 100 can be detected by a single sensor.

  FIG. 7 is a side sectional view of an aligner device according to a second embodiment of the present invention. An aligner device 110 shown in FIG. 7 is different from the aligner device 10 in that a first cylinder 103 and a second cylinder 104 are provided instead of the first cylinder 3 and the second cylinder 4, and the other configurations are the aligner. It is the same as the device 10. Note that the first arm 1C and the second arm 2B do not appear in FIG.

  The first cylinder 103 holds the first arms 1 </ b> A to 1 </ b> C movably within a predetermined range along the radial direction of the wafer 100. The second cylinder 104 holds the second arms 2 </ b> A to 2 </ b> C movably within a predetermined range along the radial direction of the wafer 100. The first cylinder 103 and the second cylinder 104 are provided with a moving mechanism for moving the first arms 1A to 1C and the second arms 2A to 2C in the horizontal direction. This moving mechanism can be appropriately selected from various actuators such as a motor, a solenoid or an air cylinder.

  By moving the first arms 1 </ b> A to 1 </ b> C and the second arms 2 </ b> A to 2 </ b> C along the radial direction of the wafer 100, changes in the size of the wafer 100 can be dealt with. Further, by moving the first arms 1 </ b> A to 1 </ b> C inward, the claw portions 21 </ b> A to 21 </ b> C at the exposed position are prevented from overlapping the claw portions 11 </ b> A to 11 </ b> C at the retracted position along the circumferential direction of the wafer 100. Can do. Accordingly, the second arms 2A to 2C can be freely rotated without interference between the claw portions 11A to 11C and the claw portions 21A to 21C.

  8A to 8C are side cross-sectional views of aligner devices according to third to fifth embodiments of the present invention.

  An aligner device 120 shown in FIG. 8A is an aligner device in that it includes first arms 101A to 101C and second arms 102A to 102C instead of the first arms 1A to 1C and the second arms 2A to 2C. 110. Other configurations of the aligner device 110 are the same as those of the aligner device 110. Note that the first arm 101C and the second arm 102B do not appear in FIG.

  By providing the first cylinder 103 and the second cylinder 104, the claw portions 11A to 11C and the claw portions 21A to 21C are retracted by moving the first arm 1A to 1C and the second arm 2A to 2C in the radial direction of the wafer 100. And the exposure position. For this reason, the structure for rock | fluctuating claw part 11A-11C and claw part 21A-21C becomes unnecessary. Therefore, in the aligner device 120, the claw portions 111A to 111C are integrally provided on each of the first arms 101A to 101C, and the claw portions 121A to 121C are integrally provided on each of the second arms 102A to 102C. Thereby, the configuration can be simplified.

  An aligner device 130 shown in FIG. 8B is different from the aligner device 10 in that it includes second arms 132A to 132C instead of the second arms 2A to 2C. Other configurations of the aligner device 130 are the same as those of the aligner device 10. Note that the first arm 1C and the second arm 132B do not appear in FIG.

  2nd arm 132A-132C has arrange | positioned the fulcrum of claw part 141A-141C on the outer side of claw part 11A-11C located in a retracted position. The claw portions 21A to 21C at the exposed position do not overlap the claw portions 11A to 11C at the retracted position along the circumferential direction of the wafer 100. As a result, the second arms 132A to 132C are not moved in the second cylinder 4 along the radial direction of the wafer 100, and interference between the claw portions 11A to 11C and the claw portions 141A to 141C is avoided. The arms 132A to 132C can be freely rotated independently.

  In the aligner 140 shown in FIG. 8C, a first cylinder 143 and a second cylinder 144 are arranged vertically with the wafer 100 in the loading position interposed therebetween. The first arm 141C and the second arm 142B do not appear in FIG.

  Also with this configuration, the wafer 100 can be changed between the claw portions 11A to 11C of the first arms 1A to 1C and the claw portions 21A to 21C of the second arms 2A to 2C without being displaced. Further, the claw portions 21A to 21C at the exposed position can be prevented from overlapping the claw portions 11A to 11C at the retracted position along the circumferential direction of the wafer 100. The first cylinder 143 and the second cylinder 144 can have a vertically symmetrical shape, and the first arms 141A to 141C and the second arms 142A to 142C can have a vertically symmetrical shape. Thereby, the number of parts can be reduced. The configuration of the aligner devices 110 to 130 may be combined with the configuration of the aligner device 140.

  In the above-described embodiment, an example in which three first arms and two second arms are provided has been described, but two first arms and two second arms may be provided.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

1 is an external view of an aligner device according to a first embodiment of the present invention. It is a top view of the aligner apparatus. It is sectional drawing of the XX direction in FIG. It is a block diagram of the control part of the aligner apparatus. It is a flowchart which shows the process sequence of the control part at the time of rotation angle control of the wafer in an aligner apparatus. (A)-(D) are figures which show the operation state at the time of the rotation angle control. It is side surface sectional drawing of the aligner apparatus which concerns on 2nd Embodiment of this invention. (A)-(C) are side surface sectional drawings of the aligner apparatus which concerns on 3rd-5th embodiment of this invention.

Explanation of symbols

1-first arm 2-second arm 3-first cylinder 4-second cylinder 5-first motor 6-second motor 7A-7C-sensor 10-aligner device 11A-11C-claw part 21A-21C-claw Part

Claims (5)

A sensor for detecting the detection unit of the wafer at a predetermined angular position at the peripheral edge of the wafer whose surface is located in the first plane;
A plurality of first arms each provided with a first claw portion at a tip thereof that selectively contacts each of a plurality of equally spaced rotation angle positions on the periphery of the wafer whose surface is located in the first plane;
A first cylinder that holds the bases of the plurality of first arms in a second plane parallel to the first plane and is rotatably supported about an axis orthogonal to the first plane;
A plurality of second arms each provided with a second claw portion at the tip thereof that selectively contacts each of a plurality of equally spaced rotation positions on the periphery of the wafer;
The bases of the plurality of second arms are held in a third plane parallel to the first surface and different from the second surface and at a rotational position different from the plurality of first arms, and rotated about the axis. A second cylinder supported freely;
A first drive unit and a second drive unit that individually supply a rotational force to each of the first cylinder and the second cylinder;
Control means for controlling the positions of the first claw part and the second claw part and the operations of the first drive part and the second drive part based on the detection result of the sensor;
Aligner device with   The first arm and the second arm are swingable between an exposed position where the first claw portion and the second claw portion are in contact with a peripheral edge of the wafer and a retracted position outside the first surface. The aligner apparatus of Claim 1 which supports.   2. The aligner according to claim 1, wherein the first cylinder and the second cylinder respectively hold the plurality of first arms and the plurality of second arms so as to be reciprocally movable along a radial direction of the wafer.   The aligner device according to claim 3, wherein the first arm is integrally provided with the first claw portion, and the second arm is integrally provided with the second claw portion.   3. The aligner according to claim 1, wherein the second claw portion does not overlap the first claw portion in the retracted position at the exposed position in a circumferential direction of the wafer.

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