JP2018041854A - Substrate holding detector, substrate holding device, adjustment method of substrate holding detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate adjustment of transmissive optical sensor for a substrate of different size.SOLUTION: A substrate holding detector includes a transmissive optical sensor, relative position of which changes as a movable holding member moves, and a detection body. The detection body has a first member and a second member capable of adjusting the relative position, and a transmission part for transmitting the light from the light-emitting element to a light-receiving element of the optical sensor or a shielding part for blocking the light, when the substrate is held by the holding member. By adjustment of relative position of the first and second members, position or dimensions of the transmission part or the shielding part can be adjusted, when the substrate was held by the holding means.SELECTED DRAWING: Figure 8

Description

The present invention relates to a substrate gripping detection device that detects gripping of a substrate that grips a substrate such as a semiconductor wafer, and an adjustment method of the substrate gripping detection device.
The present invention also relates to a substrate gripping device for gripping a substrate such as a semiconductor wafer.

  In semiconductor manufacturing equipment, when some kind of treatment (chemical / mechanical treatment, transport to the next process) is performed on a substrate such as a semiconductor wafer, the substrate may be held or fixed by a holding part so that the substrate does not move. . As one of gripping or fixing methods at this time, there is a method of gripping or fixing the held substrate by sandwiching it from one side or both sides (for example, Patent Document 1, FIGS. 17, 34, 35, and Patent Document 2). FIG. 11). In such a gripping or fixing method, a sensor for confirming that the substrate is securely gripped and fixed is provided (for example, sensor 319 in Patent Documents 1 and 2). There are various methods for detecting gripping and fixing, and there are various types of sensors used. One of them is a transmissive optical sensor and a detection dog (detector). There is a method used.

  The transmissive optical sensor has a configuration in which a light emitting element that emits light and a light receiving element that receives light and outputs a signal are placed facing each other. When an object passes through the space between the elements and blocks light, the amount of light received by the light receiving element changes and the output signal also changes. The presence or absence of an object is detected by the change in this signal. A detector called a detection dog may be used for light transmission and shielding. In the method of detecting that the substrate is gripped and fixed with the transmissive optical sensor and the detection dog, one of the sensor and the dog is fixed so that the sensor and the dog move relatively according to the gripping and fixing operation of the substrate. The other side is installed so as to move in conjunction with a movable part (for example, a holding part such as an arm) for holding and fixing the substrate. Then, the position of the detection dog is adjusted so that the light of the optical sensor is detected or shielded at the position of the movable part when the substrate is held and fixed. In order for the detection function for holding and fixing the substrate to function accurately, it is necessary to precisely align the sensor and the dog.

  Conventionally, the position adjustment of the detection dog has been carried out while confirming the change of the sensor signal while holding and fixing the actually used substrate (or a jig of a corresponding size). Although it takes a lot of time and effort depending on the required detection accuracy, if there is only one type of substrate to be handled, it will rarely need to be adjusted again once it is adjusted. There was no particular problem. In most cases, the substrate actually handled by one apparatus is one type of substrate described in the SEMI standard, and there is almost no case of handling substrates of different sizes.

International Publication No. 2007/099976 (Page 28, FIG. 17, FIG. 34, FIG. 35) JP 2014-24161 A (paragraph 0031, FIG. 11)

However, in recent years, in the semiconductor three-dimensional stacking technology, there is a case where a substrate having a diameter different from that of a substrate such as a wafer described in the SEMI standard is handled. When handling such a substrate, it is sufficient if another device can be prepared for a substrate different from the SEMI standard. However, there arises a problem that the device purchase cost and the installation space increase. Although it is only necessary to use a single SEMI standard board and another board in a single device, it is time-consuming and time-consuming to re-adjust the gripping / fixing detection function every time the board to be handled changes.・ There will be an increase in cost.

  As described above, the position of the detection dog (detector) can be adjusted by the operator confirming the change in the sensor signal while holding and fixing the substrate to be actually used (or a jig of a corresponding size). While implementing. For this reason, when high detection accuracy is required, the adjustment accuracy varies depending on the operator, and in the worst case, a detection error may occur. Further, when there are a plurality of types of substrates to be used, it is necessary to perform adjustment / confirmation work for the number of types of the substrates, which requires labor and man-hours. There is a method of preparing a plurality of sensor dogs in the apparatus in advance and switching them for each board. However, there is a concern that the installation space becomes large and cannot be accommodated in a predetermined space, and the number of parts increases, resulting in an increase in cost.

An object of the present invention is to solve at least a part of the problems described above.
One object of the present invention is to facilitate adjustment of a substrate gripping detection device when a plurality of substrates having different dimensions are used in a common device.

  [1] A substrate gripping detection device according to an aspect of the present invention is a substrate gripping detection device that detects that a substrate is gripped by a movable gripping member, and is relative to the movement of the movable gripping member. The optical sensor includes a light emitting element and a light receiving element, and the detection body includes a first member and a second member that can adjust a relative position. A member, and a transmissive part that transmits light from the light emitting element to the light receiving element of the optical sensor when the substrate is gripped by the gripping member, or a shielding part that blocks the light. The transmission part or the shielding part formed by at least one of the member and the second member, and by adjusting the relative positions of the first member and the second member, To gripping member Therefore, the position or dimension of the transmission part or the shielding part when the substrate is gripped can be adjusted.

  In this substrate gripping detection apparatus, when using a plurality of wafers having different diameters, the relative positions of the first member and the second member constituting the detection body are adjusted to obtain the diameter of the wafer to be used. Accordingly, the position or size of the transmission part or the shielding part of the detection body can be adjusted. Therefore, if the wafer is positioned with respect to the gripping portion while actually using the wafer of a specific diameter among a plurality of wafers having different diameters while watching the output of the optical sensor, then wafers of other diameters When used, it is not necessary to adjust the positioning with respect to the grip portion by actually using the wafer, and the relative positions of the first member and the second member of the detection body may be adjusted. That is, when switching to a wafer having a different diameter, the relative positions of the first member and the second member of the detection body may be adjusted by an amount corresponding to the difference in wafer diameter before and after switching. According to this substrate grip detection device, the substrate grip detection device can be easily adjusted when a plurality of substrates having different dimensions are used in a common device. As a result, the labor and man-hours required for adjustment can be reduced.

[2] In the substrate gripping detection apparatus according to [1], the first member has one first reference portion or a plurality of first reference portions at different positions along the first direction. The second member has one second reference part or a plurality of second reference parts at different positions along the first direction, and the first reference part and the second reference part At least one of the reference parts is provided, and the first member and the second member are arranged such that any one of the first reference parts and any one of the second reference parts coincide with each other. The relative position of the member can be adjusted, and the position or size of the transmission part or the shielding part can be adjusted according to the combination of the first reference part and the second reference part to be matched. It is possible to be configured.
In this case, a plurality of relative positions of the first member and the second member are set according to the combination of the reference parts, and the relative positions are assigned to the wafers having different diameters. After positioning the detection body with respect to the gripping part while actually using the wafer of a specific diameter and observing the output of the optical sensor, switching of the wafer of a different diameter is performed by the relative position (reference) assigned to the wafer of that diameter. What is necessary is just to adjust a 1st and 2nd member to the combination of a site | part. By aligning the relative positions of the first and second members of the detection body with the reference portions provided on the respective members, the detection member can be easily and accurately performed.

[3] In the substrate gripping detection apparatus according to [2], the first and second reference portions are a reference plane, a reference line, and a reference hole for alignment provided on the first and second members. And at least one of the reference graphics.
As the reference surface, for example, end surfaces of the first and second members can be used. The reference line includes straight lines, triangles, polygons such as rhombuses, and other figures provided on the first and second members. In the case of a triangle or a quadrangle, alignment may be performed at the position of the vertex. The reference line may be formed of paint or the like on the first and second members, or may be formed by a groove. The reference hole may be a through hole or a bottomed hole provided in the first and second members. The reference part may be a figure other than the reference line. For example, the inside of a polygon such as a triangle or rhombus may be recessed. In this way, the reference portion can be configured using various configurations.

[4] In the substrate gripping detection apparatus according to [2] or [3], the first member has a long hole along the first direction, and the second member has the long hole. The fastening member that has passed through is fixed to the first member, and the relative position between the first member and the second member is adjusted by changing the position of the fastening member in the elongated hole. Is possible.
In this case, the relative positions of the elongated holes and the fastening members can be adjusted without separating the first and second members. The fastening member is, for example, a bolt or a screw.

[5] The substrate gripping detection apparatus according to any one of [1] to [4], wherein the first and second members are a plate-like first portion and a plate shape substantially orthogonal to the first portion. A second portion of the.
In this case, the relative movement of the first and second members is easy. Since each member has two surfaces, it is possible to provide a transmission part or a shielding part on one surface and a mechanism for fastening each other on the other surface.

[6] In the substrate gripping detection apparatus according to [4], the first and second members include a plate-like first portion and a plate-like second portion substantially orthogonal to the first portion. The transmission part or the shielding part may be formed in the first part, and the elongated hole may be formed in the second part.
In this case, the position where the transmission part or the shielding part and the fastening mechanism are provided can be easily secured.

[7] The substrate gripping detection device according to any one of [1] to [6], wherein the transmission portion of the detection body is adjusted in accordance with adjustment of a relative position between the first member and the second member. Or it is possible for the dimension of the said shielding part to be comprised variably.
By increasing / decreasing the dimension of the transmission part or the shielding part, the same effect as the case of displacing the whole transmission part or the shielding part is obtained.

[8] In the substrate gripping detection apparatus according to [7], the transmission portion is a slit or an opening formed between the protruding portion of the first member and the protruding portion of the second member. In addition, the dimension of the transmission portion can be adjusted in accordance with the adjustment of the relative positions of the first member and the second member.
By forming a slit or an opening between the protrusions of the first and second members, the dimension of the transmission part can be adjusted easily and with high accuracy.

[9] In the substrate gripping detection apparatus according to [7], the shielding portion is formed by an overlap between the protruding portion of the first member and the protruding portion of the second member, and With the adjustment of the relative position of the member and the second member, the dimension of the shielding portion can be adjusted.
By forming the shielding part by overlapping the protrusions of the first and second members, the dimension of the shielding part can be easily adjusted with high accuracy.

[10] In the substrate gripping detection apparatus according to [1] or [2], the first member has a lumen along the first direction, and the second member is the lumen. Is fixed to the first member by a set screw, and the relative position of the first member and the second member can be adjusted by loosening the set screw.
In this case, the relative positions of the first and second members can be adjusted easily and with high accuracy.

[11] In the substrate gripping detection apparatus according to [10], it is possible that a small-diameter portion is provided on an outer peripheral surface of the first member, and the small-diameter portion constitutes the transmission portion.
In this case, the transmission part can be formed easily and accurately by the notch.

[12] In the substrate gripping detection apparatus according to [10], the outer peripheral surface of the second member has a large-diameter portion protruding radially outward, and the large-diameter portion constitutes the shielding portion. It is possible.
In this case, the shielding part can be formed easily and accurately by the large diameter part.

[13] A substrate gripping detection device according to one aspect of the present invention is a substrate gripping device, and includes a movable gripping member that grips the substrate in contact with the substrate, and any one of [1] to [12] And a substrate gripping detection device as described.
Use of the substrate gripping detection device described above facilitates adjustment when a plurality of wafers having different diameters are used in the substrate gripping device.

[14] In the substrate gripping apparatus according to [13], the gripping member may have a pair of arms, and the pair of arms may fix the substrate sandwiched from both sides.
By sandwiching the substrate from both sides, the substrate can be stably held.

[15] The substrate gripping apparatus according to [14], further comprising a mechanism for rotating the pair of arms to invert the fixed substrate.
It is possible to apply the substrate gripping detection device described above to a reversing machine.

[16] In the substrate gripping apparatus according to [13], the gripping member includes a clamp pin, and the clamp pin presses and fixes the substrate.
The substrate gripping detection device described above can be applied to a substrate gripping device that grips a substrate with a clamp pin. Such a substrate gripping device is, for example, a robot hand.

[17] In the substrate gripping device according to [16], the substrate gripping device may be provided on a robot hand and further include a claw provided at a position facing the clamp pin.
For example, the substrate can be stably gripped by being sandwiched between claws and clamp pins before and after the substrate.

[18] A method according to one aspect of the present invention is a method of adjusting a substrate gripping detection device that detects that a substrate is gripped by a movable gripping member, wherein the substrate gripping detection device is adjusted by the gripping member. A detection body for providing a transmission part or a shielding part to a transmission type optical sensor when the substrate is gripped, the detection body includes a first member and a second member, and the adjustment method includes: Adjusting the relative position between the first member and the second member to adjust the position or size of the transmitting portion or the shielding portion when the substrate is gripped by the gripping member. Including that.

  In the method of adjusting the substrate gripping detection device, when a plurality of wafers having different diameters are used, the wafer gripping detection device is used by adjusting the relative positions of the first member and the second member constituting the detection body. The position or size of the transmission part or shielding part of the detection body can be adjusted according to the diameter of the wafer. Therefore, if the detection body is positioned with respect to the gripping part while actually using a wafer having a specific diameter among a plurality of wafers having different diameters while watching the output of the optical sensor, wafers having other diameters are used thereafter. In this case, it is not necessary to adjust the positioning with respect to the grip portion by actually using the wafer, and the relative positions of the first member and the second member of the detection body may be adjusted. That is, when switching to a wafer having a different diameter, the relative positions of the first member and the second member of the detection body may be adjusted by an amount corresponding to the difference in wafer diameter before and after switching.

[19] In the method according to [18], the first member includes one first reference portion or a plurality of first reference portions at different positions along a first direction, The two members have one first reference part or a plurality of second reference parts at different positions along the first direction, and the first reference part and the second reference part A plurality of at least one is provided, and the first member and the second member are relative to each other so that any one of the first first reference parts and any one of the second reference parts coincide with each other. The relative positions or dimensions of the first member and the second member are adjusted according to the combination of the first reference portion and the second reference portion to be adjusted and matched.
In this case, a plurality of relative positions of the first member and the second member are set according to the combination of the reference parts, and the relative positions are assigned to the wafers having different diameters. After positioning the detection body with respect to the gripping part while actually using the wafer of a specific diameter and observing the output of the optical sensor, switching of the wafer of a different diameter is performed by the relative position (reference) assigned to the wafer of that diameter. What is necessary is just to adjust a 1st and 2nd member to the combination of a site | part. By aligning the relative positions of the first and second members of the detection body with the reference portions provided on the respective members, the detection member can be easily and accurately performed.

[20] In the method according to [18] or [19], the first and second reference portions are a reference plane for alignment, a reference line, and a reference provided on the first and second members. It is composed of at least one of a hole and a reference graphic.
As the reference surface, end surfaces of the first and second members can be used. The reference line includes straight lines, triangles, polygons such as rhombuses, and other figures provided on the first and second members. In the case of a triangle or a quadrangle, alignment may be performed at the position of the vertex. The reference line may be formed of paint or the like on the first and second members, or may be formed by a groove. The reference hole may be a through hole or a bottomed hole provided in the first and second members. The reference part may be a figure other than the reference line. For example, the inside of a polygon such as a triangle or rhombus may be recessed. In this way, the reference portion can be configured using various configurations.

It is a perspective view which shows a reversing machine provided with the board | substrate holding | grip detection apparatus which concerns on 1st Embodiment. It is a longitudinal cross-sectional view which shows the opening / closing mechanism of a reversing machine. It is an enlarged front view of a board | substrate holding | grip detection apparatus. It is an expansion perspective view of a board | substrate holding | grip detection apparatus. It is explanatory drawing which shows the relationship between a detection dog and the optical path of an optical sensor. It is explanatory drawing explaining a detection when the board | substrate holding | grip detection apparatus is adjusted corresponding to a small diameter wafer when holding | griping several types of wafers with a different diameter. It is explanatory drawing explaining a detection when the board | substrate holding | grip detection apparatus is adjusted corresponding to a large diameter wafer when holding several types of wafer of a different diameter. It is a perspective view of the detection dog which concerns on 1st Embodiment. It is explanatory drawing which shows each position of the holding part at the time of hold | gripping the several wafer of a different diameter with the inversion machine. It is explanatory drawing explaining the principle of the wafer holding | grip detection by the detection dog which concerns on 1st Embodiment. FIG. 6 shows a perspective view of a detection dog applicable to three different diameter wafers. It is a disassembled perspective view of the detection dog which concerns on 2nd Embodiment. It is explanatory drawing explaining the case where the detection dog which concerns on 2nd Embodiment is adjusted with respect to the wafer of a different diameter. It is a disassembled perspective view of the detection dog which concerns on 3rd Embodiment. It is explanatory drawing explaining the case where the detection dog which concerns on 3rd Embodiment is adjusted with respect to the wafer of a different diameter. It is explanatory drawing explaining the principle of the wafer holding | grip detection by the detection dog which concerns on 3rd Embodiment. It is explanatory drawing explaining the case where the detection dog which concerns on 4th Embodiment is adjusted with respect to the wafer of a different diameter. It is explanatory drawing explaining the principle of the wafer holding | grip detection by the detection dog which concerns on 4th Embodiment. It is a disassembled perspective view of the detection dog which concerns on 5th Embodiment. It is explanatory drawing explaining the case where the detection dog which concerns on 5th Embodiment is adjusted with respect to the wafer of a different diameter. It is explanatory drawing explaining the principle of the wafer holding | grip detection by the detection dog which concerns on 5th Embodiment. It is a perspective view of the robot hand provided with the detection dog of 6th Embodiment. It is a side view of the robot hand provided with the detection dog of 6th Embodiment. It is the top view (a) and side view (b), (c) of the detection dog of 6th Embodiment. It is a partially cutaway side view of a detection dog in which a slit is formed between the first and second members. It is the top view (a) and side view (b), (c) of the detection dog which concerns on the modification of 6th Embodiment. It is explanatory drawing explaining the relationship between the difference of the diameter of a board | substrate, and the displacement of a holding member. It is explanatory drawing explaining adjustment of the detection dog performed using the board | substrate actually used.

(First embodiment)
FIG. 1 is a perspective view showing a reversing machine including a substrate gripping detection device according to the first embodiment. FIG. 2 is a longitudinal sectional view showing an opening / closing mechanism of the reversing machine.

The reversing machine 1 is an example of a substrate gripping device, and is used, for example, in a semiconductor manufacturing apparatus such as a plating apparatus or a polishing apparatus. The reversing machine 1 receives a substrate such as a wafer W from a transfer robot or the like, and flips the substrate upside down and passes it to a lifter or the like. In the following description, a disk-shaped wafer will be described as an example of the substrate. However, the substrate is not limited to this, and may be a wafer having another shape such as a rectangle or another substrate. . As shown in FIG. 1, the reversing machine 1 moves in the axial direction of a pair of arc-shaped gripping portions 10 that grip the periphery of the wafer W from both sides, a shaft 14 attached to the gripping portion 10, and the shaft 14. And an opening / closing mechanism 12 for opening and closing the grip portion 10. The pair of gripping portions 10 are arranged so as to face each other across the center of the wafer W, and two chuck portions 11 that are in line contact with the outer peripheral portion of the wafer W are provided at both ends of each gripping portion 10. Is provided. In this embodiment, an example in which two chuck portions 11 are provided in each gripping portion 10 will be described. However, the present invention is not limited to this, and three or more chuck portions 11 are provided in each gripping portion 10. May be.

  As shown in FIG. 2, the opening / closing mechanism 12 includes a compression spring 15 that urges each shaft 14 and the grip portion 10 in the closing direction, and a slide type air cylinder 13 coupled to each shaft 14. Yes. The opening / closing mechanism 12 is configured to grip the wafer W by moving the gripping portion 10 in a direction close to each other by the compression spring 15. At this time, the movable portion 13 a of the air cylinder 13 is in contact with the mechanical stopper 17. It has become. Further, the opening / closing mechanism 12 releases the wafer W by moving the gripping portions 10 in directions away from each other by driving the air cylinder 13.

  That is, when gripping the wafer W, one air cylinder 13 is pressurized, and the other air cylinder 13 is closed only by the urging force of the compression spring 15. At this time, only the movable portion 13a of the pressurized air cylinder 13 is pressed against the mechanical stopper 17 and fixed at that position. At this time, the position of the grip portion 10 connected to the other air cylinder 13 biased by the compression spring 15 is detected by the substrate grip detection device 20 (the optical sensor 21 and the detection dog 22). When there is no wafer W, the air cylinder 13 that is not pressurized is in the full stroke position and the substrate gripping detection device 20 does not respond (or has a response), so it is detected that the wafer W is not gripped. Is done.

  As shown in FIG. 1, the opening / closing mechanism 12 is attached with a rotating shaft 16 that rotates around an axis perpendicular to the central axis of the wafer W. The rotating shaft 16 is connected to a reversing mechanism (not shown) and is rotated by the reversing mechanism. Therefore, when the reversing mechanism is driven, the opening / closing mechanism 12 and the gripping unit 10 are rotated about the rotation shaft 16 so that the wafer W gripped by the gripping unit 10 is reversed.

  FIG. 3 is an enlarged front view of the substrate gripping detection device. FIG. 4 is an enlarged perspective view of the substrate gripping detection apparatus.

  The substrate gripping detection device 20 includes a transmissive optical sensor 21 and a detection dog (detection body) 22. The optical sensor 21 has a light emitting element 21a that generates and outputs light, and a light receiving element 21b that receives and detects light from the light emitting element 21a.

  In the present embodiment, the detection dog 22 is fixed to the movable part 13a of the air cylinder 13, and is movable together with the movable part 13a. Therefore, the detection dog 22 moves in conjunction with the movement or movement of the gripping part 10 in accordance with the opening / closing operation of the gripping part 10. Therefore, it can be said that the detection dog 22 is fixed to the grip portion 10 via the movable portion 13 a of the air cylinder 13. In another embodiment, the position of the detection dog 22 may be fixed, and the optical sensor 21 may be fixed to the movable portion 13a of the air cylinder 13 and movable together with the movable portion 13a. In any case, the substrate gripping detection device 20 can be adjusted for a plurality of wafers having different diameters by an adjustment mechanism of the detection dog 22 described later. However, the direction of adjustment is reversed between the case where the position of the detection dog 22 is movable and the case where it is fixed.

The detection dog 22 has a slit 25 as a light transmission part on its upper surface (first portion 23a). The slit 25 is an opening or a notch provided on the upper surface of the detection dog 22. As shown in FIGS. 3 and 4, when the slit 25 is aligned on the optical path from the light emitting element 21a to the light receiving element 21b of the optical sensor 21, the light output from the light emitting element 21a passes (transmits) through the slit 25. Then, it enters the light receiving element 21b. When the slit 25 is not aligned on the optical path from the light emitting element 21a to the light receiving element 21b of the optical sensor 21, and the wall of the upper surface of the detection dog 22 other than the slit 25 is positioned on the optical path, the output from the light emitting element 21a Is blocked by the wall surface of the first portion 23a, the light does not reach the light receiving element 21b, and the light receiving element 21b does not detect the light. At a position where the pair of gripping portions 10 grips or fixes the wafer W, light passes through the slit 25 from the light emitting element 21a to the light receiving element 21b (so that the slit 25 matches the optical path of the optical sensor 21). In addition, if the position of the detection dog 22 is adjusted in advance with respect to the movable portion 13a (gripping portion 10) of the air cylinder 13, a signal output from the light receiving element 21b is used to grasp and fix the wafer W by the grasping portion 10. Can be detected. That is, when the pair of gripping portions 10 are at a position opened and closed from a position where the slit 25 and the optical sensor 21 coincide with each other, non-detection indicating that the light receiving element 21b of the optical sensor 21 does not detect light. Outputs a signal or does not output a signal. This state corresponds to a state in which the grip portion 10 is not closed to the position of the wafer W or the wafer W cannot be gripped (so-called idle swing). On the other hand, when the pair of gripping portions 10 are at positions where the slit 25 and the optical sensor 21 coincide with each other, the light receiving element 21b of the optical sensor 21 outputs a detection signal indicating that light has been detected. This state corresponds to a state in which the holding unit 10 appropriately holds the wafer W.

  The optical path from the light emitting element 21a to the light receiving element 21b of the optical sensor 21 being matched or matched with the slit 25 means that the optical path is within the range of the slit 25, in other words, the light from the light emitting element 21a is detected by the light receiving element 21b. This shows the positional relationship between the possible optical sensor 21 and the slit 25.

  FIG. 5 is an explanatory diagram showing the relationship between the detection dog and the optical path of the optical sensor. In the same figure, the top view which looked at the detection dog 22 from the 1st part 23a side is shown, 21c shows the optical path from the light emitting element 21a. The arrow X indicates the moving direction of the detection dog 22 accompanying the closing operation of the gripping unit 10, that is, the closing direction of the gripping unit 10. The direction opposite to the arrow X indicates the moving direction of the detection dog 22 accompanying the opening operation of the gripping unit 10, that is, the opening direction of the gripping unit 10. As shown in FIG. 6A, when the optical path 21c from the light emitting element 21a is within the range of the slit 25, the detection is performed so as to indicate that the wafer W is normally held (clamped) by the holding unit 10. The attachment position of the dog 22 to the movable part 13a is adjusted. As shown in FIG. 4B, when the slit 25 goes too far in the closing direction X from the optical path 21c, the optical path 21c is shielded by the wall surface of the first portion 23a, and the light receiving element 21b does not detect light. In this case, it is shown that the gripping part 10 is closed without gripping the wafer W, and there is no wafer W, or the gripping part 10 is in a state of being missed and missed. As shown in FIG. 5C, when the slit 25 does not reach the optical path 21c in the closing direction X, there is a foreign object between the wafer W and the gripping part 10, or the gripping part 10 is not This is a case where the position cannot be closed.

  FIG. 6 is an explanatory diagram for explaining detection when the substrate gripping detection apparatus is adjusted for a small-diameter wafer when gripping multiple types of wafers having different diameters. FIG. 7 is an explanatory diagram for explaining detection when the substrate gripping detection apparatus is adjusted for a large-diameter wafer when gripping multiple types of wafers having different diameters. FIGS. 6A and 7A show the relationship between the detection dog 22 and the optical path 21c when a wafer Wa having a small diameter d = da is held. FIGS. 6B and 7B show the relationship between the detection dog 22 and the optical path 21c when a wafer Wb having a diameter d = db (> da) larger than that of the wafer Wa is held. Here, d indicates the diameter of the wafer.

When the fixing position of the detection dog 22 to the movable portion 13a is adjusted in accordance with the wafer Wa having the small diameter d = da, as shown in FIG. 6A, when the wafer Wa having the small diameter d = da is gripped, the optical path 21c is located within the range of the slit 25, and the optical sensor 21 normally performs light detection (detection of gripping of the wafer Wa). However, when the wafer Wb having a large diameter d = db is gripped in this adjustment, the optical path 21c is not positioned within the slit 25 and the optical sensor 21 detects light as shown in FIG. do not do. That is, when the large-diameter wafer Wb is gripped, the gripper 10 is not completely closed to the same position as the small-diameter wafer Wa, and the slit 25 does not reach the optical path 21c, so that a clamp abnormality is detected.

  On the other hand, when the fixing position of the detection dog 22 to the movable portion 13a is adjusted according to the large-diameter wafer Wb, as shown in FIG. 7B, when the large-diameter d = db wafer Wb is gripped, The optical path 21c is positioned within the range of the slit 25, and the optical sensor 21 normally performs light detection (detection of gripping of the wafer Wa). However, when a small-diameter wafer Wa is gripped in this adjustment, as shown in FIG. 7A, the slit 25 passes through the optical path 21c, and the optical path 21c is not positioned within the range of the slit 25, and the optical sensor 21 is light-transmitted. Do not detect. That is, when the small-diameter wafer Wa is gripped, the gripping portion 10 moves further in the closing direction X from the gripping position of the large-diameter wafer Wb, and the slit 25 passes through the optical path 21c. Is done.

  Accordingly, when the fixing position of the detection dog 22 to the movable portion 13a is adjusted in correspondence with the wafer Wa having the small diameter d = da (FIG. 6A), and then, when the wafer Wb having the large diameter d = db is used. In this case, it is necessary to adjust the position of the slit 25 so as to move in the closing direction X by a distance f (da, db) determined by the diameters da, db (FIG. 6B). On the other hand, when the fixing position of the detection dog 22 to the movable portion 13a is adjusted in correspondence with the wafer Wb having the large diameter d = db (FIG. 7B), and thereafter when the wafer Wa having the small diameter da is used. The position of the slit 25 needs to be adjusted so as to move in the opening direction (the direction opposite to X) by a distance f (da, db) determined by the diameters da, db (FIG. 7A). Note that f represents a predetermined function and is determined by the configuration of the substrate gripping detection apparatus. The distance f (da, db) will be described later. Conventionally, such adjustment has been performed again by adjusting the position where the detection dog 22 is fixed to the movable portion 13a. However, the adjustment of the fixing position of the detection dog 22 to the movable portion 13a is performed by changing the optical sensor signal in a state where the actually used wafer W (or a jig having a corresponding size) is fixed. It is necessary to make adjustments while checking the operator. When adjusting the detection dog 22 using the wafer W actually used, in order to adjust the position of the detection dog 22 with respect to one type of wafer W, the detection dog 22 is opened and closed as described below. To change the signal of the detection dog 22 and set the adjustment position in the middle of the recorded position.

  FIG. 28 is an explanatory diagram for explaining detection dog adjustment performed using a wafer that is actually used. When adjusting the detection dog for a wafer having a specific diameter, for example, as shown in FIG. 5A, the detection dog 22 is moved in the closing direction so that light passes through the slit 25 (detection state). The first position M1 of the detection dog 22 at the time when the state becomes the shielding state (non-detection state) is recorded. Subsequently, as shown in FIG. 5B, the detection dog 22 is moved in the opening direction to return to the state where the light passes through the slit 25 (detection state), and the state where the light passes through the slit 25 again (detection). The second position M2 at the time when the state changes from the state) to the shielding state (non-detection state) is recorded. Then, as shown in FIG. 6C, when the substrate gripping device grips the wafer having the specific diameter, the detection dog 22 is positioned at the middle position between the first position M1 and the second position M2. Thus, the detection dog 22 is fixed to the movable portion 13a of the air cylinder 13. Conventionally, it has been necessary to perform the adjustment operations shown in FIGS. 28A to 28C every time the diameter of a wafer to be used is changed.

  In the present embodiment, instead of adjusting the fixing position of the detection dog 22 to the movable portion 13a again, the detection dog 22 is constituted by a first member 22a and a second member 22b as described later. By adjusting the relative positional relationship between the two members, the position of the detection dog 22 (for example, the slit 25 and protrusions 53, 54a, and 54b described later) with respect to wafers having different diameters is adjusted.

  FIG. 8 is a perspective view of the detection dog according to the first embodiment.

  Hereinafter, the configuration of the detection dog 22 will be described in detail. The detection dog 22 includes two members, a first member 22a and a second member 22b. The first member 22a has a first portion 23a and a second portion 24a that are substantially orthogonal to each other. In the present embodiment, the first portion 23a and the second portion 24a are formed by bending one piece of member, but the first portion 23a and the second portion 24a may be formed by connecting different members. . The second member 22b has a first portion 23b and a second portion 24b that are substantially orthogonal to each other. In the present embodiment, the first portion 23b and the second portion 24b are formed by bending one piece of member, but the first portion 23b and the second portion 24b may be formed by connecting different members. .

  The second member 22b has two elongated holes 29 extending in a direction corresponding to the direction of the opening / closing operation of the gripping part 10 in a state where the detection dog 22 is attached to the movable part 13a of the air cylinder 13. The second member 22b is fixed to the movable portion 13a when the bolts 30 passed through the respective long holes 29 are screwed into screw holes (not shown) of the movable portion 13a. After the bolt 30 is loosened or removed, the fixing position of the second member 22b with respect to the movable portion 13a can be adjusted by adjusting the position of the bolt 30 in the elongated hole 29. Using the wafer W of a specific type (specific diameter), the movable part of the second member 22b so that the optical path 21c of the optical sensor 21 is positioned in the slit 25 at the gripping position of the wafer W by the gripping part 10. The fixed position with respect to 13a is adjusted. In this embodiment, after adjusting the fixed position of the second member 22b with respect to the movable portion 13a using a wafer (or a jig having a corresponding size) with respect to a wafer having a specific diameter, Adjustment to use a wafer having a diameter is performed by adjusting the relative positional relationship between the two members of the detection dog 22 (the first member 22a and the second member 22b).

  The first portion 23a of the first member 22a has a slit 25 formed by an opening or a notch. The second portion 24a of the first member 22a has two elongated holes 26 extending in a direction corresponding to the direction of the opening / closing operation of the gripping portion 10 in a state where the detection dog 22 is attached to the movable portion 13a. Further, the second portion 24 b of the second member 22 b has two screw holes 28 corresponding to the long holes 26. The bolts 27 passed through the long holes 26 are screwed into the screw holes 28 of the second member 22b, whereby the first member 22a is fixed to the second member 22b. Further, by loosening or removing the bolt 27 and changing the position of the screw hole 28 in the elongated hole 26, the second member 22b of the first member 22a (slit 25) (the movable part 13a of the air cylinder 13, It is possible to adjust the relative position with respect to the gripping part 10).

  Adjustment of the relative positions of the first member 22a and the second member 22b is performed by adjusting the long hole 26, the screw hole 28, the bolt 27, and the reference portion provided in the first member 22a and the second member 22b. And a combination of The first member 22a has reference surfaces 41a and 42a as reference parts. In the present embodiment, both end surfaces in the opening / closing direction of the narrow portion of the second portion 24a of the first member 22a are used as the reference surfaces 41a and 42a. The second member 22b has reference surfaces 41b and 42b as reference parts. In the present embodiment, both end surfaces in the opening / closing direction of the second portion 24b of the second member 22b are used as the reference surfaces 41b and 42b. In the present embodiment, as will be described later with reference to FIG. 10, the detection dog 22 (slit 25) has a first relative position (FIG. 10 (a)) where the reference surface 41a and the reference surface 41b coincide with each other, The reference surface 42a and the reference surface 42b have two relative positions, ie, a second relative position (FIG. 10B) where they coincide.

FIG. 9 is an explanatory diagram showing each position of the gripping part when a plurality of wafers having different diameters are gripped by the reversing machine. FIG. 10 is an explanatory diagram for explaining the principle of wafer gripping detection by the detection dog according to the first embodiment.

  In FIG. 9, Xa indicates the position of the gripper 10 when gripping a wafer Wa having a diameter d = da, and Xb indicates the gripper 10 when gripping a wafer Wb having a diameter d = db (db> da). Indicates the position. Hereinafter, the wafers Wa and Wb are also referred to as a small diameter wafer Wa and a large diameter wafer Wb, respectively. As will be described later, Xa-Xb is determined according to the diameters da and db, and is expressed as f (da, db). f represents a predetermined function, and is determined by the configuration of the substrate gripping detection device (in this embodiment, the reversing machine 1). Xa−Xb corresponds to a difference in position of the detection dog 22 when each wafer is held and a distance to adjust the slit 25.

  FIG. 27 is an explanatory diagram for explaining the relationship between the difference in substrate diameter and the displacement of the gripping member. This figure schematically shows a state in which a wafer Wa having a diameter da and a wafer Wb having a diameter db are held by the holding unit 10 (see FIGS. 1 and 9). Here, the center of the wafer Wa is represented by Oa, and the center of the wafer Wb is represented by Ob. Here, a case where the opening / closing path S1 of the chuck 11 of the gripping part 10 is different from the path S0 passing through the centers Oa and Ob of the wafer is shown. Further, the case where the position of the left grip 10 is fixed and the right grip 10 moves along the opening / closing path S1 is shown. Accordingly, when the gripper 10 grips the wafer Wa and the wafer Wb, as shown in FIG. 27, the center Oa of the wafer Wa and the center Ob of the wafer Wb are at different positions.

Here, when the gripper 10 grips the wafer Wa, the angle formed by the chuck 11 of the right gripper 10 with respect to the center Oa is θa, and the angle formed by the chuck 11 of the left gripper 10 with the center Oa is θc. . Further, when the gripper 10 grips the wafer Wb, the angle formed by the chuck 11 of the right gripper 10 with respect to the center Ob is defined as θb, and the angle formed by the chuck 11 of the left gripper 10 with the center Ob is defined as θd. At this time, the position difference in the opening / closing direction of the movable chuck 11 when the wafer Wa and the wafer Wb are held corresponds to Xa-Xb in FIG. As shown in FIG. 27, since the diameters of the wafer Wa and the wafer Wb are da and db, respectively, the radii of the wafer Wa and the wafer Wb can be expressed as da / 2 and db / 2, respectively. Further, when the radius (curvature radius) of the chuck 11 is R, Xa−Xb (= f (da, db)) can be calculated from the description of FIG. 27 as follows.
Xa-Xb
= F (da, db)
= {(R + db / 2) · cos θb− (R + da / 2) · cos θa}
+ {(R + db / 2) · cos θd− (R + da / 2) · cos θc} (Equation 1)
= (Cos θb + cos θd) (R + db / 2) − (cos θa + cos θc) (R + da / 2) (Expression 2)
According to (Formula 1) or (Formula 2), if the diameter (radius) of each wafer, the radius of the chuck, and the angle formed by the center of the chuck and the center of the wafer when each wafer is gripped are known, Ten displacement amounts Xa-Xb (corresponding to the displacement amount of the detection dog 22) can be obtained.
If there is one chuck 11 on each of the movable side and the fixed side, and the open / close path of each chuck 11 is a path S0 passing through the wafer centers Oa and Ob, θa = θb = θc = θd = 0, cos θa = cos θb = Cos θc = cos θd = 1. At this time, from (Equation 1), Xa-Xb is as follows.
Xa−Xb = f (da, db) = db−da (Formula 3)
In other words, the displacement amount Xa−Xb of the grip portion 10 matches the diameter difference db−da.

Further, when the gripping portions 10 on both sides are movable without fixing one position of the gripping portion 10, each gripping portion 10 moves by the same distance to grip the wafer W. The amount of movement of 10 is half of the calculated value of (Equation 1). In this case, Xa-Xb is as follows.
Xa-Xb
= F (da, db)
= 1/2 {(cos θb + cos θd) (R + db / 2) − (cos θa + cos θc) · (R + da / 2)}
... (Formula 4)
At this time, assuming that the movable side and the fixed side chucks 11 are one each, and the open / close path of each chuck 11 is a path S0 passing through the centers Oa and Ob of the wafer, θa = θb = θc = θd = 0, cos θa = cos θb = Cos θc = cos θd = 1. Xa-Xb is as follows.
Xa−Xb = f (da, db) = (db−da) / 2 (Expression 5)
When both the gripping portions are movable, the amount of displacement is halved compared to the case where only one gripping portion is moved (Formula 3).

When the radii of the movable side and fixed side chucks 11 are different from each other, for example, assuming that the radius of the movable side chuck is R1 and the radius of the fixed side chuck is R2, (Equation 1) is expressed by the following (Equation 1). ')become that way.
Xa-Xb
= F (da, db)
= {(R1 + db / 2) · cos θb− (R1 + da / 2) · cos θa}
+ {(R2 + db / 2) · cos θd− (R2 + da / 2) · cos θc}
... (Formula 1 ')
Further, when there is one chuck 11 on each of the movable side and the fixed side, and the open / close path of each chuck 11 is a path S0 passing through the centers Oa and Ob of the wafer, the following (formula 3 ′) is obtained.
Xa−Xb = f (da, db) = db−da (Formula 3 ′)
Moreover, when making the holding | grip part 10 of both sides movable, it becomes following (Formula 4 ').
Xa-Xb
= F (da, db)
= 1/2 [{(R1 + db / 2) · cos θb− (R1 + da / 2) · cos θa}
+ {(R2 + db / 2) · cos θd− (R2 + da / 2) · cos θc}]
... (Formula 4 ')

  When the chuck 11 has a square shape and the chuck 11 contacts the wafer at a corner, R = 0. For example, when the movable chuck 11 contacts at a corner, R1 = 0. When the fixed chuck 11 contacts at a corner, R2 = 0. When the movable side and fixed side chucks come into contact with each other at a corner, R1 = R2 = 0.

  The design of each reference portion of the detection dog 22 can be performed based on the values calculated by the above-described formulas (2) to (5) or (formula 1 ′), (formula 3 ′), and (formula 4 ′). . When designing each reference portion of the detection dog 22, the substrate gripping apparatus is actually gripped by wafers having different diameters, and the difference in the position of the gripping member 10 (chuck 11) when gripping each wafer is measured. May be. Once each reference portion of the detection dog 22 is set, when the detection dog 22 is actually used in the substrate gripping device, the fixing position of the detection dog 22 is adjusted with respect to any one of the diameter wafers. For example, the adjustment of the wafers having other diameters can be performed by adjusting the relative positions of the two members 22a and 22b of the detection dog 22.

FIG. 10 shows the position of the detection dog 22 when the reversing machine 1 grips the small-diameter wafer Wa (FIG. 10A) and the position of the detection dog 22 when the reversing machine 1 grips the large-diameter wafer Wb. The relationship with ((b) of the figure) is shown. Since the optical sensor 21 is fixed to a fixed portion (portion that does not move together with the grip portion 10) in the opening / closing mechanism 12, the optical path 21c is also fixed to the position X0 as shown in FIG. Since the detection dog 22 is fixed to the movable portion 13 a of the air cylinder 13, the detection dog 22 moves in conjunction with the movement of the grip portion 10. Therefore, as shown in FIG. 10, at the position where the gripper 10 grips the small-diameter wafer Wa and the large-diameter wafer Wb, the detection dog 2
2 are at different positions Xa1 and Xb1 (<Xa1). As can be seen from the figure, when gripping a large-diameter wafer Wb, when gripping a large-diameter wafer Wb, the grip portion 10 is not closed as much as gripping a small-diameter wafer Wa (does not move in the closing direction X). The position Xb1 of the detection dog 21 is displaced in the opening direction (direction opposite to X) from the position Xa1 of the detection dog 21 at the time of gripping the small-diameter wafer Wa. Here, as the position of the detection dog 22, the position of the end face of the detection dog 22 on the closing direction X side of the second member 22 b is used. Xa1-Xb1 is expressed by (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 2) based on the diameter da of the small diameter wafer Wa, the diameter db of the large diameter wafer Wb, and the configuration of the substrate gripping device. It is calculated by (Expression 3 ′) and (Expression 4 ′). In the reversing machine 1 of the present embodiment, one gripping portion 10 is fixed, and θa to θd are not zero as shown in FIGS. 9 and 27. Therefore, Xa1-Xb1 is expressed by (Expression 2) or (Expression 2). 1 ′).

  Adjustment of the detection dog 22 is performed as follows. First, as shown in FIG. 10A, the second member is positioned at the first relative position where the reference surface 41a of the first member 22a of the detection dog 22 and the reference surface 41b of the second member 22b coincide. The position of the first member 22a with respect to 22b is adjusted. In this adjustment, the bolt 27 is loosened or removed, and after adjusting the first relative position where the reference surface 41a of the first member 22a and the reference surface 41b of the second member 22b coincide with each other, the bolt 27 is tightened. Then, the first member 22a and the second member 22b are fixed to each other. In this state, an operation of actually holding the small-diameter wafer Wa (or a jig having a corresponding size) on the mounting surface of the holding unit 10 is performed. As shown in FIG. 10A, when the wafer Wa is gripped, the fixed position of the detection dog 22 with respect to the movable portion 13a of the air cylinder 13 is set so that the optical path 21c of the optical sensor 21 is within the range of the slit 25. adjust. This adjustment is performed after the bolt 30 is loosened or removed and the fixing position of the second member 22b with respect to the movable portion 13a of the air cylinder 13 is adjusted so that the optical path 21c of the optical sensor 21 is within the range of the slit 25. Then, the bolt 30 is tightened to fix the second member 22b to the movable portion 13a of the air cylinder 13.

When a large-diameter wafer Wb is used, the fixing position of the second member 22b with respect to the movable portion 13a (and hence the grip portion 10) of the air cylinder 13 is not changed, and the second member 22b of the first member 22a is not changed. Adjust the position with respect to. That is, when the large-diameter wafer Wb is used, it is not necessary to adjust the detection dog 22 by actually grasping the large-diameter wafer Wb (or a jig having a corresponding size). What is necessary is just to adjust the relative position of two members (1st member 22a, 2nd member 22b) which comprise the detection dog 22. FIG. Specifically, as shown in FIG. 10B, the reference surface 42a of the first member 22a of the detection dog 22 and the reference surface 42b of the second member 22b are in the second relative position. In addition, the position of the first member 22a with respect to the second member 22b is adjusted. In this adjustment, the bolt 27 is loosened or removed, and the second member 22b is moved to the second relative position where the reference surface 42a of the first member 22a and the reference surface 42b of the second member 22b coincide with each other. After adjusting the relative position of the first member 22a, the bolt 27 is tightened to fix the first member 22a and the second member 22b to each other. Here, the distance between the position of the slit 25 at the first relative position where the reference surfaces 41a and 41b coincide with the position of the slit 25 at the second relative position where the reference surfaces 42a and 42b coincide is the wafer Wa. , The difference Xa1−Xb1 in the position of the detection dog 22 at the time of gripping Wb is set. As described above, Xa1-Xb1 corresponds to the displacement amount Xa-Xb (FIGS. 9 and 27) of the gripping member 10 (chuck 11) at the time of gripping the diameters da and db of each wafer, and the diameters da and db The distance f (da, db) is determined according to the configuration of the substrate gripping device. When the radii of the chucks on both sides are equal, f (da, db) = (cos θb + cos θd) (R + db / 2) − (cos θa + cos θc) (R + da / 2) from (Equation 2). Corresponding to the fact that the stop position of the detection dog 22 at the wafer gripping position is displaced in the opening direction from Xa1 to Xb1, the position of the slit 25 is displaced in the closing direction by the same displacement Xa1-Xb1 in the detection dog 22. The position of the slit 25 at the holding position of the large-diameter wafer Wb is adjusted to the position of the slit 25 at the holding position of the small-diameter wafer Wa. As a result, the optical path 21 c enters the range of the slit 25 at the holding position of the large-diameter wafer Wb.

  In the above description, when the small-diameter wafer Wa (or a jig having a corresponding size) is actually used to adjust the fixed position of the detection dog 22 with respect to the movable portion 13a and the large-diameter wafer Wb is used, the detection is performed. The case where the relative position between the two members of the dog 22 is adjusted has been described. On the other hand, the fixing position of the detection dog 22 with respect to the movable portion 13a is adjusted by actually using a large-diameter wafer Wb (or a jig having a corresponding size), and a small-diameter wafer Wa is used. In this case, the relative position between the two members of the detection dog 22 may be adjusted. Specifically, as shown in FIG. 10B, the large-diameter wafer Wb (or a jig having a corresponding size) is set in a state where the detection dog 22 is in the second relative position (the reference surfaces 42a and 42b coincide). ) Is actually used to adjust the fixed position of the detection dog 22 with respect to the movable portion 13a. When a small-diameter wafer Wa is used, the detection dog 22 is adjusted so as to be in the first relative position (reference surfaces 41a and 41b coincide).

  According to the detection dog 22 according to the present embodiment, a wafer having a specific diameter is actually gripped, and the fixing position of the detection dog 22 on the movable portion 13a (relative position with respect to the gripping portion 10) is adjusted once. In the case of using a wafer having a diameter of 2 mm, the relative positions of the two members (the first member 22a and the second member 22b) constituting the detection dog 22 may be adjusted. Therefore, the adjustment performed while actually grasping the wafer and confirming the change in the output signal of the optical sensor 21 may be performed once for a wafer of any diameter, and the substrate for a wafer of another diameter may be performed. In order to adjust the grip detection device 20, any one of a combination of a plurality of reference parts in which relative positions of two members (a first member 22 a and a second member 22 b) constituting the detection dog 22 are provided in advance is selected. Adjustment may be made by selection. If the mechanical accuracy of the detection dog 22 is secured, the position adjustment between the two members of the detection dog 22 should be performed accurately and efficiently regardless of the skill level of the operator. Is possible. In addition, labor and man-hours are not required as compared with the adjustment performed while confirming the change in the output signal of the optical sensor 21.

  In the above description, the case where the detection dog is adjusted for two different diameter wafers has been described. However, the present embodiment can also be applied to three or more different diameter wafers.

  FIG. 11 shows a perspective view of a detection dog applicable to three different diameter wafers. (A), (b), and (c) show the adjustment positions of the two members of the detection dog 22 corresponding to the wafers having diameters d = da, db, and dc (da <db <dc), respectively.

The first member 22a of the detection dog 22 has three reference surfaces 41a, 43a, and 44a. As shown in FIG. 5A, when a wafer having a diameter d = da is used, the reference dog 41 of the first member 22a is coincident with the reference surface 41b of the second member 22b. To the first relative position. As shown in FIG. 4B, when a wafer having a diameter d = db is used, the detection dog 22 is aligned with the reference surface 43a of the first member 22a and the reference surface 42b of the second member 22b. To the second relative position. As shown in FIG. 4C, when a wafer having a diameter d = dc is used, the reference dog 44 of the first member 22a is coincident with the reference surface 42b of the second member 22b. To the third relative position. As can be seen from FIG. 11, as the diameter of the wafer increases, the relative position of the first member 22a with respect to the second member 22b is moved in the closing direction X, and accordingly, the slit 25 with respect to the second member 22b. Is also moved in the closing direction X. That is, as the diameter d increases, the gripping unit 10 grips the wafer at a position opposite to the closing direction (opening direction) and the second member 22b stops (the position of the detection dog 22 at the wafer gripping position is opened). Therefore, the position of the slit 25 relative to the second member 22b is displaced in the closing direction by that amount. As a result, even if the second member 22b stops more in the opening direction, the slit 25 can be made to coincide with the optical path 21c of the optical sensor 21. The displacement of the slit 25 between the first relative position in FIG. 11A and the second relative position in FIG. 11B corresponds to f (da, db). FIG.
The displacement of the slit 25 between the second relative position in FIG. 11 and the third relative position in FIG. 11C corresponds to f (db, dc). f (db, dc) may be replaced with da → db and db → dc in (Expression 2) or (Expression 1 ′).

  Adjustment of the detection dog 22 for wafers of different diameters is performed as follows. For example, with respect to the detection dog 22 set at the first relative position (FIG. 11A), a wafer Wa (or a jig having a corresponding size) having a diameter d = da is actually used. The fixed position of the detection dog 22 with respect to the movable portion 13a is adjusted so that the slit 25 and the optical sensor 21 (optical path 21c) are aligned when the Wa is gripped. Thereafter, when a wafer Wb having a diameter d = db is used, the detection dog 22 may be set at the second relative position (FIG. 11B). When using a wafer Wc having a diameter d = dc, the detection dog 22 may be set at the third relative position (FIG. 11C).

  Note that the wafer Wb having a diameter d = db (or a jig having a corresponding size) is actually used for the detection dog 22 set at the second relative position (FIG. 11B). You may adjust the fixed position with respect to the movable part 13a of the detection dog 22 so that the slit 25 and the optical sensor 21 may align when Wb is hold | gripped. Thereafter, when a wafer Wa having a diameter d = da is used, the detection dog 22 may be set to the first relative position (FIG. 11A). When using a wafer Wc having a diameter d = dc, the detection dog 22 may be set at the third relative position (FIG. 11C).

  In addition, the wafer Wc (or a jig having a corresponding size) having a diameter d = dc is actually used for the detection dog 22 set at the third relative position (FIG. 11C). You may adjust the fixed position with respect to the movable part 13a of the detection dog 22 so that the slit 25 and the optical sensor 21 may match when Wc is hold | gripped. Thereafter, when a wafer Wa having a diameter d = da is used, the detection dog 22 may be set to the first relative position (FIG. 11A). When using a wafer Wb having a diameter d = db, the detection dog 22 may be set to the second relative position (FIG. 11B).

  Therefore, when the reversing machine is used for a plurality of types of wafers having different diameters, the relative position of the two members of the detection dog 22 is set to a position corresponding to any one of the specific diameter wafers. If the fixing position of the detection dog 22 with respect to the movable portion 13a is adjusted by actually using a wafer (or a jig having a corresponding size), when using a wafer of another diameter, the diameter of the wafer to be used is set. Accordingly, the relative position of the two members of the detection dog 22 may be adjusted, and adjustment of the fixed position of the detection dog 22 to the movable portion 13a is unnecessary. Therefore, labor and man-hours are reduced as compared with the adjustment performed while checking the change in the output signal of the optical sensor 21 by actually using a wafer (or a jig of a corresponding size) for each wafer having a different diameter. can do.

In the above-described embodiment, the “reference surface” is used as the reference portion of the first member 22a and the second member 22b. However, the reference portion is provided on the front surface or the upper surface of the first member 22a and the second member 22b. The relative position of the first member 22a and the second member 22b may be adjusted by providing a “reference line” as Further, a reference plane and a reference line may be used in combination. For example, the first relative position may be set on the reference plane, and the second relative position may be set on the reference line. Further, the relative position may be set at a position where the reference plane and the reference line coincide. As the reference surface, end surfaces of the first member 22a and the second member 22b can be used. The reference line includes straight lines, triangles, polygons such as rhombuses, and other figures provided on the first member 22a and the second member 22b. In the case of a triangle or a quadrangle, alignment may be performed at the position of the vertex. The reference line may be formed with paint or the like on the first member 22a and the second member 22b, or may be formed with a groove. The reference part may be a figure other than the reference line. For example, the inside of a polygon such as a triangle or rhombus may be recessed. Further, as will be described later, a reference hole may be used as the reference portion. The reference hole may be a through hole or a bottomed hole provided in the first and second members.

(Second Embodiment)
FIG. 12 is an exploded perspective view of the detection dog according to the second embodiment. FIG. 13 is an explanatory diagram illustrating a case where the detection dog according to the second embodiment is adjusted for wafers having different diameters.

  As shown in FIG. 12, in the present embodiment, the first member 22a has a reference hole 45a as a reference portion, and the second member 22b has two reference holes 45b and 46b as reference portions. In the present embodiment, the reference holes 45b and 46b are through holes that penetrate the second member 22b. The two reference holes 45b and 46b are at different positions in the opening and closing directions in a state where the detection dog 22 is attached to the movable portion 13a. For a small-diameter wafer, as shown in FIG. 13A, the relative position of the first member 22a with respect to the second member 22b is set to the first relative position where the reference holes 45a and 45b coincide. adjust. For a large-diameter wafer, as shown in FIG. 13B, the second relative position where the reference hole 45a and the reference hole 46b coincide with each other, and the first member 22a relative to the second member 22b. Adjust the position. As described above, even when the reference hole is used, the relative position of the first member 22a with respect to the second member 22b can be adjusted with high accuracy as in the case where the reference surface or the reference line is used. Further, when the relative position of the first member 22a with respect to the second member 22b is adjusted at three or more locations for three or more different wafers, a number of adjustments can be made by using the reference holes. It is possible to easily form the reference portion corresponding to the position. In the present embodiment, two selectable relative positions (adjustment positions) have been described by taking two different diameter wafers as an example. However, the reference hole of the first member 22a and the second member 22b are described. If the reference holes are provided so that there are three or more combinations with the reference holes, the detection dog can be adjusted for wafers having three or more different diameters. For example, in FIG. 12, if three reference holes having different positions in the closing direction X are provided in the second member 22b, the detection dog can be adjusted for wafers having three or more different diameters. .

(Third embodiment)
FIG. 14 is an exploded perspective view of the detection dog according to the third embodiment. FIG. 15 is an explanatory diagram illustrating a case where the detection dog according to the third embodiment is adjusted for wafers having different diameters. FIG. 16 is an explanatory diagram for explaining the principle of wafer gripping detection by the detection dog according to the third embodiment.

  In the above embodiment, the case where the slit 25 is provided in the first member 22a has been described. However, as shown in FIGS. 14 and 15, the protruding portion 51a of the first member 22a and the protruding portion 51b of the second member 22b. A slit 52 may be formed between the two. As shown in FIG. 14, the first member 22a has a protruding portion 51a that protrudes substantially orthogonal to the second portion 24a in a part of the first portion 23a. The second member 22b has a protruding portion 51b that protrudes substantially perpendicular to the second portion 24b in a part of the first portion 23b. For a small-diameter wafer, as shown in FIG. 15A, the relative position of the first member 22a with respect to the second member 22b is set to the first relative position where the reference surfaces 41a and 41b coincide. adjust. For a large-diameter wafer, as shown in FIG. 15B, the relative position of the first member 22a with respect to the second member 22b is at the second relative position where the reference surfaces 42a and 42b coincide. Adjust.

FIG. 16A corresponds to FIG. 15A, and shows the relationship between the optical sensor 21 (optical path 21c) and the slit 52 when the gripper 10 grips the wafer Wa having a small diameter d = da. . The position of the detection dog 22 with respect to the movable portion 13a is adjusted corresponding to the wafer Wa having a small diameter d = da, and the optical path 21c is within the slit 52 when the wafer Wa is gripped. FIG. 16B shows the relationship between the detection dog 22 and the optical sensor 21 when the detection dog 22 adjusted corresponding to the wafer having the small diameter d = da is used to hold the wafer Wb having the large diameter d = db. Indicates. In this case, when the gripper 10 grips the wafer with the large diameter d = db, it is not closed compared to when the gripper 10 grips the wafer with the small diameter d = da (on the side opposite to the closing direction X (opening direction)). Therefore, the optical path 21c is not within the range of the slit 52 and is shielded by the first member 22a. In order to correct this error and appropriately detect the time point when the wafer having the large diameter d = db is gripped, as shown in FIG. 15B, the second relative position where the reference surfaces 42a and 42b coincide with each other, The relative position of the first member 22a with respect to the second member 22b is adjusted. That is, the width of the slit 52 is increased in the closing direction X by a distance f (da, db) determined by the diameters da and db of the wafer and the configuration of the substrate gripping device. Note that f (da, db) is a difference Xa−Xb (= Xa1−Xb1) in the position of the gripping portion 10 (chuck 11) or the detection dog 22 at the time of gripping the wafer due to the difference between the wafer diameters da and db. f (da, db) is the above-described (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), (Expression), depending on the diameters da and db of the wafer and the configuration of the substrate holding device. 4 ′). As a result, as shown in FIG. 16C, even if the detection dog 22 stops at the same position as in FIG. 16B, the optical path 21c comes into the range of the slit 52, and the large diameter d = db. When the wafer is gripped, the optical sensor 21 detects light.

  In the present embodiment, the width of the slit 52 in the opening / closing direction is changed (increased or decreased) so that the optical path 21c of the optical sensor 21 is adjusted to fall within the range of the slit 52 for wafers of different diameters. Is possible. Here, the reference plane or the reference line is used as the reference portion, but the same adjustment can be made by using a reference hole as shown in FIGS. Further, when the relative position of the first member 22a with respect to the second member 22b is adjusted at three or more locations for three or more different wafers, the first member 22b is adjusted according to the diameter of each wafer. What is necessary is just to provide a reference | standard part so that the combination of the reference | standard part (a reference surface, a reference line, a reference | standard hole) of the member 22a and the 2nd member 22b may be three or more. For example, a reference surface can be provided as shown in FIG. 11, and three or more reference holes of the second member 22b in FIG. 13 can be provided.

  As described above with reference to FIG. 28, the adjustment of the detection dog 22 using an actual wafer includes the adjustments shown in FIGS. Further, when adjusting the slits of the detection dog 22 to a position where two different diameter wafers are allowed, the procedure shown in FIGS. 28A to 28C is performed for each diameter wafer (for example, the diameter da). , Db wafers Wa, Wb), and the adjustment position M3 of the detection dog 22 relative to the wafer Wa (FIG. 28C) and the adjustment position M3 of the detection dog 22 relative to the wafer Wb (FIG. 28C). In addition, it is necessary to adjust the position of the detection dog 22 in the middle between the adjustment position M3 with respect to the wafer Wa and the adjustment position M3 with respect to the wafer Wb. On the other hand, according to the third embodiment, if the position of the detection dog 22 is adjusted only for the wafer Wa having a small diameter da, the wafer Wb having a large diameter db is positioned between the two members 22a and 22b of the detection dog 22. It can be handled by adjusting the relative position. As a result, the adjustment using the wafer may be performed once.

(Fourth embodiment)
FIG. 17 is an explanatory diagram illustrating a case where the detection dog according to the fourth embodiment is adjusted for wafers having different diameters. FIG. 18 is an explanatory diagram for explaining the principle of wafer gripping detection by the detection dog according to the fourth embodiment.

In the above embodiment, when the wafer is gripped, the optical path 21c enters the range of the slits 25 and 52 (light is transmitted), and the optical sensor 21 detects the light, thereby detecting the grip of the wafer. On the other hand, gripping of the wafer may be detected by blocking the optical path 21c when the wafer is gripped and not detecting the light by the optical sensor 21. For example, as shown in FIG. 17, a protrusion 53 may be provided on the first member 22a so that the protrusion 53 shields the optical path 21c at the time of wafer gripping. As shown in FIG. 18A, when the gripper 10 properly grips the wafer, the protrusion 53 of the detection dog blocks the optical path, and the optical sensor 21 does not detect light. As shown in FIG. 18B, when there is no wafer or fails to grip and the gripping part 10 moves in the closing direction X beyond a predetermined gripping position, the protrusion 53 does not block the optical path 21c, and the optical The sensor 21 detects light. As shown in FIG. 18C, even when a foreign object or the like is sandwiched between the wafer and the gripping portion 10 and the gripping portion 10 does not close to a predetermined gripping position (when it is displaced and stopped in the opening direction). The protrusion 53 does not block the optical path 21c, and the optical sensor 21 detects light. In other words, unless the gripper 10 stops at a predetermined gripping position, the optical sensor 21 detects light, and when the gripper 10 stops at a predetermined gripping position, the optical sensor 21 does not detect light (light It is detected that the wafer is gripped by shielding.

  For a wafer Wa having a small diameter d = da, as shown in FIG. 17 (a), the first member 22a is relative to the second member 22b at the first relative position where the reference surfaces 41a and 41b coincide. The correct position. For a wafer Wb having a large diameter d = db, as shown in FIG. 17B, the first member 22a with respect to the second member 22b is positioned at the second relative position where the reference surfaces 42a and 42b coincide. Adjust the relative position. The distance between the position of the protrusion 53 at the first relative position (reference surfaces 41a and 41b coincide) and the position of the protrusion 53 at the second relative position (reference surfaces 42a and 42b coincide) is The distance f (da, db) determined by the diameters da and db of the wafers having different diameters (see (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), and (Expression 4 ′)) is there. This is a difference Xa1-Xb1 (= Xa-Xb) in the position of the gripping part 10 (chuck 11) or the detection dog 22 at the time of gripping the wafer due to the difference between the wafer diameters da, db. f (da, db) is the above-described (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), (Expression), depending on the diameters da, db of the wafer and the configuration of the substrate gripping device. 4 ′).

  As in the first embodiment, the adjustment using the detection dog 22 is performed at the position of the protrusion 53 at the first relative position where the reference surfaces 41a and 41b coincide (see FIG. 17A), and the small diameter d. = Da wafer (or a jig of a corresponding size) is actually used to observe the output signal of the optical sensor 21, and the output signal of the optical sensor 21 indicates non-detection of light at the wafer gripping position (or output). The position of the detection dog 22 relative to the movable portion 13a is adjusted so that no signal is output. Thereafter, when a wafer having a large diameter d = db is used, the reference surfaces 42a and 42b of the detection dog 22 coincide with each other as shown in FIG. 17B while the position of the detection dog 22 with respect to the movable portion 13a is fixed. The relative position of the first member 22a with respect to the second member 22b is adjusted to the second relative position.

  A wafer having a large diameter d = db (or a jig having a corresponding size) is placed at the position of the protruding portion 53 at the second relative position where the reference surfaces 42a and 42b coincide (see FIG. 17B). While actually using the output signal of the optical sensor 21 in actual use, the movable portion 13a of the detection dog 22 is set so that the output signal of the optical sensor 21 indicates non-detection of light (or no detection signal is output) at the wafer gripping position. The position relative to may be adjusted. In this case, when using a wafer having a small diameter d = da, the first position where the reference surfaces 41a and 41b coincide with each other as shown in FIG. 17A while the position of the detection dog 22 with respect to the movable portion 13a is fixed. The relative position of the first member 22a with respect to the second member 22b is adjusted to the relative position. That is, a wafer (or a jig of a corresponding size) of the diameter is actually used at a position corresponding to a combination of reference parts (reference plane, reference line, reference hole) corresponding to a wafer of one type of diameter. If the adjustment to the gripping portion of the detection dog is performed, the substrate gripping detection device can be changed by changing the combination of the reference parts in the detection dog without adjusting the gripping portion of the detection dog for wafers of other diameters. It is possible to adjust 20 appropriately.

(Fifth embodiment)
FIG. 19 is an exploded perspective view of the detection dog according to the fifth embodiment. FIG. 20 is an explanatory diagram for explaining a case where the detection dog according to the fifth embodiment is adjusted for wafers having different diameters. FIG. 21 is an explanatory diagram for explaining the principle of wafer gripping detection by the detection dog according to the fifth embodiment.

  In the above embodiment, the case where the protruding portion 53 is provided only on the first member 22a has been described. However, as shown in FIGS. 19 and 20, the protruding portion 54a is provided on each of the first member 22a and the second member 22b. , 54b may be provided, and the optical path 21c of the optical sensor 21 may be shielded at the wafer gripping position by utilizing the overlap of the protrusions 54a, 54b. For a wafer having a small diameter d = da, as shown in FIG. 20 (a), the first member 22a is relative to the second member 22b at the first relative position where the reference surfaces 41a and 41b coincide. Adjust the position. At this time, the protrusions 54a and 54b almost completely overlap the protrusion 54a on the protrusion 54b. For a wafer having a large diameter d = db, as shown in FIG. 20 (b), the first member 22a relative to the second member 22b is in the second relative position where the reference surfaces 42a and 42b coincide. The correct position. At this time, the portion of the protruding portion 54a that does not overlap the protruding portion 54b spreads in the closing direction X, and the protruding portion 54b is exposed by that amount, and the shielding area or shielding distance of the protruding portions 54a and 54b is expanded in the closing direction X. To do. The enlargement of the shielding distance in the closing direction X is equal to the moving distance of the protrusion 54a in the closing direction X and the exposed distance of the protrusion 54b along the closing direction X, and is determined by the diameters da and db of different diameter wafers. This corresponds to the distance f (da, db) (see (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), (Expression 4 ′)). f (da, db) is the difference Xa−Xb (= Xa1−Xb1) of the position of the gripping part 10 (chuck 11) or the detection dog 22 at the time of gripping the wafer due to the difference between the wafer diameters da and db. f (da, db) is the above-described (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), (Expression) depending on the diameters da and db of the wafer and the configuration of the substrate gripping device. 4 ′).

  As in the first embodiment, the adjustment using the detection dog 22 is performed at the positions of the protrusions 54a and 54b (see FIG. 20A) at the first relative positions where the reference surfaces 41a and 41b coincide. While actually using a wafer with a small diameter d = da (or a jig of a corresponding size) and viewing the output signal of the optical sensor 21, the output signal of the optical sensor 21 indicates non-detection of light at the wafer gripping position ( Alternatively, the position of the detection dog 22 relative to the movable portion 13a is adjusted so that no output signal is output. Thereafter, when a wafer having a large diameter d = db is used, the detection dog reference surfaces 42a and 42b coincide with each other as shown in FIG. 20B while the position of the detection dog 22 with respect to the movable portion 13a is fixed. The relative position of the first member 22a with respect to the second member 22b is adjusted to the second relative position.

FIG. 21A corresponds to FIG. 20A, and shows the relationship between the optical path 21c and the protrusions 54a and 54b when the gripper 10 grips the wafer Wa having a small diameter d = da. The position of the detection dog 22 with respect to the movable portion 13a is adjusted corresponding to the wafer Wa having a small diameter d = da, and when the wafer Wa is gripped, the optical path 21c is within the range of the protrusions 54a and 54b. Proper gripping of the wafer is detected. FIG. 20B shows the relationship between the detection dog 22 and the optical sensor 21 when the detection dog 22 adjusted corresponding to the wafer with the small diameter d = da is used to hold the wafer with the large diameter d = db. Show. In this case, when the gripper 10 grips the wafer with the large diameter d = db, it is not closed compared to when the gripper 10 grips the wafer with the small diameter d = da (on the side opposite to the closing direction X (opening direction)). Therefore, the optical path 21c is not within the range of the protrusions 54a and 54b, and is not shielded by the protrusions 54a and 54b, resulting in a clamp abnormality. In order to correct this error and appropriately detect the time when a wafer having a large diameter d = db is gripped, as shown in FIG. 20B, the second relative position where the reference planes 42a and 42b coincide with each other, The relative position of the first member 22a with respect to the second member 22b is adjusted. That is, by moving the protrusion 54a in the closing direction X by a distance f (da, db) determined according to the diameters da, db of wafers having different diameters, the shielding range or shielding distance is expanded. f (da, db) is the difference Xa−Xb (= Xa1−Xb1) of the position of the gripping part 10 (chuck 11) or the detection dog 22 at the time of gripping the wafer due to the difference between the wafer diameters da and db. f (da, db) is the above-described (Expression 2) to (Expression 5) or (Expression 1 ′), (Expression 3 ′), (Expression) depending on the diameters da and db of the wafer and the configuration of the substrate gripping device. 4 ′). As a result, as shown in FIG. 21 (c), even if the detection dog 22 stops at the same position as in FIG. 21 (b), the optical path 21c becomes within the shielding range of the protrusions 54a and 54b. When the wafer of diameter d = db is gripped, the optical sensor 21 stops detecting light, and the gripping of the wafer can be detected appropriately.

  In the present embodiment, similarly to the third embodiment, if the position adjustment of the detection dog 22 is performed only on the wafer Wa having a small diameter da, the two members 22a of the detection dog 22 on the wafer Wb having a large diameter db, This can be dealt with by adjusting the relative position between 22b. As a result, the adjustment using the wafer may be performed once.

  In the first to fifth embodiments, it has been described that the displacement amount Xa-Xb of the grip portion 10 and the displacement amount Xa1-Xb1 of the detection dog 22 are equal. However, when a speed reduction mechanism exists between the gripping portion 10 and the detection dog 22, the displacement amount of the detection dog 22 is obtained by multiplying or dividing the speed reduction ratio of the speed reduction mechanism by the displacement amount Xa-Xb of the gripping portion 10. What is necessary is just to calculate Xa1-Xb1.

(Sixth embodiment)
FIG. 22 is a perspective view of the robot hand provided with the detection dog of the sixth embodiment. FIG. 23 is a side view of the robot hand provided with the detection dog of the sixth embodiment. FIG. 24 is a top view (a) and side views (b) and (c) of the detection dog of the sixth embodiment.

  The robot hand 60 is an example of a substrate gripping device, and is used in, for example, a semiconductor manufacturing apparatus such as a plating apparatus or a polishing apparatus. The robot hand 60 includes a hand main body 61 serving as a mounting surface for the wafer W, a crank pin 62 provided on the proximal end side of the hand main body 61 and movable in the front-rear direction with respect to the hand main body 61, Two claws 63 are provided on the front end side and hold the wafer on the front end side. As shown in FIG. 23, the wafer W is placed on the inclined surface on the inner side of the claw 63 and then pressed against the claw 63 by the crank pin 62 as the crank pin 62 moves forward. And is clamped (clamped).

  As shown in FIG. 24, the crank pin 62 is connected to the shaft 64 on the proximal end side of the robot hand 60. The shaft 64 is connected to a movable portion of an air cylinder (not shown) of the drive mechanism 68. In this case, the shaft 64 moves with the movement of the movable part of the air cylinder. The drive mechanism 68 may be configured such that a motor is connected to the shaft 64 via a rotation / linear motion conversion mechanism (such as a ball screw mechanism). In this case, the rotation / linear motion conversion mechanism reciprocates by the rotation of the motor, and the shaft 64 and the crank pin 62 are moved in the front-rear direction by the rotation / linear motion conversion mechanism.

  The shaft 64 includes a first member 64a and a second member 64b. The second member 64b has a large-diameter portion 66a integrally formed with or connected to the shaft 64, and a small-diameter portion 66b made of an elongated member having a smaller diameter than the large-diameter portion. The second member 64b is connected to the movable portion of the air cylinder on the proximal side of the robot hand on the small diameter portion 66b. The first member 64a has a lumen 67 extending in the axial direction. The first member 64a has a slit 65 formed by a portion having a smaller diameter than other portions on the outer peripheral surface thereof. Further, the first member 64a is provided with a screw hole penetrating from the outer peripheral surface to the inner cavity 67, and has a set screw 69 screwed into the screw hole. The first member 64a has a reference surface 71a constituted by an end surface on the proximal end side and a reference surface 72a constituted by an end surface on the distal end side. The second member 64b includes a reference line 71b on the proximal end side of the robot hand of the small diameter portion 66b, and a reference surface 72b configured by an end surface on the proximal end side of the large diameter portion 66a (step surface with the small diameter portion 66b). Have. These reference planes are used to set the relative position of the first member 64a to the second member 64b as a plurality of relative positions, as shown in FIGS.

  The small diameter portion 66b of the second member 64b is inserted into the lumen 67 of the first member 64a. In other words, the first member 64a receives the small-diameter portion 66b of the second member 64b in the inner cavity 67 thereof. The tightened set screw 69 contacts the small diameter portion 66b, whereby the first member 64a is fixed to the second member 64b. The set screw 69 can be loosened or removed to move the first member 64a relative to the second member 64b. Further, the light emitting element 21a and the light receiving element 21b of the optical sensor 21 are arranged in the drive mechanism 68 so as to sandwich the shaft 64 (first member 64a). More specifically, as shown in FIGS. 24B and 24C, the light emitting element 21a and the light receiving element 21b of the optical sensor 21 so that the optical path 21c passes through the slit 65 below the first member 64a. Are arranged opposite to each other.

  The optical path 21c of the optical sensor 21 passes through the slit 65 of the first member 64a at a position where the crank pin 62 appropriately grips the wafer W, and the optical path 21c of the optical sensor 21 at other positions of the crank pin 62. Is configured to be shielded by the first member 64a. In the present embodiment, the shaft 64 (the first member 64a and the second member 64b) constitutes a detection dog.

  When gripping a wafer Wa having a small diameter d = da, as shown in FIG. 24B, the set screw 69 is tightened at the first relative position where the reference surface 71a and the reference line 71b coincide with each other, The member 64a is fixed to the second member 64b. In this state, a wafer having a small diameter d = da (or a jig having a corresponding size) is actually used, so that the optical path 21c is within the range of the slit 65 when the wafer is gripped. Adjust the mounting position of the air cylinder to the movable part. When using a wafer having a large diameter d = db, as shown in FIG. 24C, the set screw 69 is tightened at the second relative position where the reference surfaces 72a and 72b coincide with each other, and the first member 64a. Is fixed to the second member 64b. As a result, even when the second member 64b is retracted to the proximal end side of the robot hand from the time of gripping the wafer with the small diameter d = da when the wafer with the large diameter d = db is gripped. Since the slit 65 is displaced in the tip direction with respect to the second member 64b by (db−da), the optical path 21c enters the range of the slit 65 when a wafer having a large diameter d = db is gripped. In this embodiment, the amount of displacement of the detection dog (the first member 64a of the shaft 64) due to the wafer diameters da and db is equal to db-da. This corresponds to the case of (Formula 3).

  In this embodiment, the set screw 69 is brought into contact with the second member 64b through the screw hole of the first member 64a to fix the relative positions of the two members. However, as in the first embodiment, Even if a long hole penetrating from the outer peripheral surface to the inner cavity 67 is provided in the first member 64a and a screw hole into which the set screw 69 is screwed is provided at a predetermined position on the outer peripheral surface of the small diameter portion 66b of the second member 64b. Good.

  In the present embodiment, the example in which the relative position between the first member 64a and the second member 64b is adjusted between two relative positions has been described. However, as in the second embodiment, three or more relative positions are used. You may enable it to adjust to a position.

  In the present embodiment, the reference plane is used as the reference portion for setting the relative positions of the first member 64a and the second member 64b. However, as described above for the third embodiment, the reference hole and the reference line are used. May be used, or a reference plane and a reference line may be used in combination.

FIG. 25 is a top view (a) and side views (b) and (c) of a detection dog in which a slit is formed between the first and second members. In the present embodiment, the slit 65 is provided on the outer peripheral surface of the first member 64a. However, as in the third embodiment, a slit is formed between the first member 64a and the second member 64b. May be. For example, as shown in FIG. 25, the small-diameter portion 66b of the second member 64b is protruded from the proximal end side of the first member 64a, and the large-diameter portion 66c is provided at the protruding portion of the small-diameter portion 66b. A slit 65 may be formed between the end surface 66d on the distal end side of the robot hand of the diameter portion 66c and the end surface (reference surface 71a) of the first member 64a on the proximal end side of the robot hand. In this case, for example, a reference line or a reference graphic 73b is provided on the outer peripheral surface of the small diameter portion 66b of the second member 64b, and the reference surface 72a of the first member 64a and the second member 64b reference graphic 73b are aligned with each other. The position is defined as a first relative position, and the relative position where the reference surface 72a of the first member 64a and the reference surface 72b of the second member 64b coincide with each other is defined as a second relative position. Between the first relative position and the second relative position, the first member 64a is moved toward the crank pin 62 by db-da with respect to the second member 64b. 25B and 25C, it can be seen that the distance between the reference surface 72b of the second member 64b and the reference figure 73b is db-da.

  In the example of FIG. 25, when gripping a wafer Wa having a small diameter d = da, the set screw 69 is tightened at the first relative position where the reference surface 72a and the reference figure 73 coincide as shown in FIG. Then, the first member 64a is fixed to the second member 64b. In this state, a wafer having a small diameter d = da (or a jig having a corresponding size) is actually used, so that the optical path 21c is within the range of the slit 65 when the wafer is gripped. Adjust the mounting position of the air cylinder to the movable part. When a wafer having a large diameter d = db is used, as shown in FIG. 25C, the set screw 69 is tightened at the second relative position where the reference surfaces 72a and 72b coincide with each other, and the first member 64a. Is fixed to the second member 64b. As a result, even when the second member 64b is retracted to the proximal end side of the robot hand from the time of gripping the wafer with the small diameter d = da when the wafer with the large diameter d = db is gripped. Since the slit 65 is enlarged in the direction of the robot hand tip with respect to the second member 64b by (db−da), the optical path 21c enters the range of the slit 65 when a wafer having a large diameter d = db is gripped. .

  FIG. 26 is a top view (a) and side views (b) and (c) of a detection dog according to a modification of the sixth embodiment. In the present embodiment, the optical path 21c is aligned with the slit 65 when the wafer is gripped. However, similarly to the fourth embodiment, the optical path 21c may be shielded when the wafer is gripped. Good. For example, as shown in FIG. 26, the first member 64a may have a small diameter as a whole, and a portion corresponding to the slit 65 may be a large diameter portion (shielding portion) 65a.

  When gripping a wafer Wa having a small diameter d = da, as shown in FIG. 26B, the set screw 69 is tightened at the first relative position where the reference surface 71a and the reference line 71b coincide with each other, The member 64a is fixed to the second member 64b. In this state, a wafer having a small diameter d = da (or a jig having a corresponding size) is actually used so that the optical path 21c falls within the range of the large diameter portion (shielding portion) 65a at the time of gripping the wafer. The attachment position of the second member 64b to the movable portion of the air cylinder is adjusted. When a wafer having a large diameter d = db is used, as shown in FIG. 26C, the set screw 69 is tightened at the second relative position where the reference surfaces 72a and 72b coincide with each other, and the first member 64a. Is fixed to the second member 64b. As a result, even when the second member 64b is retracted to the proximal end side of the robot hand from the time of gripping the wafer with the small diameter d = da when the wafer with the large diameter d = db is gripped. Since the large diameter portion (shielding portion) 65a is displaced in the distal direction relative to the second member 64b by (db−da), the optical path 21c has a large diameter when a wafer having a large diameter d = db is gripped. Part (shielding part) 65a.

  The embodiments of the present invention have been described above based on some examples. However, the above-described embodiments of the present invention are for facilitating understanding of the present invention and do not limit the present invention. . The present invention can be changed and improved without departing from the gist thereof, and the present invention naturally includes equivalents thereof. In addition, any combination or omission of each constituent element described in the claims and the specification is possible within a range where at least a part of the above-described problems can be solved or a range where at least a part of the effect is achieved. It is.

W, Wa, Wb ... Wafer 1 ... Reversing machine 10 ... Gripping part 11 ... Chuck part 12 ... Opening / closing mechanism 13 ... Air cylinder 13a ... Movable part 14 ... Shaft 16 ... Rotating shaft 17 ... Mechanical stopper 20 ... Substrate gripping detection device 21 ... Optical Sensor 21a ... Light emitting element 21b ... Light receiving element 21c ... Optical path 22 ... Detection dog 22a ... First member 22b ... Second member 23 ... First part 24 ... Second part 25 ... Slit 26 ... Slot 27 ... Bolt 28 ... Screw hole 29 ... Long hole 30 ... Bolt 41a ... Reference surface 41b ... Reference surface 42a ... Reference surface 42b ... Reference surface 43a ... Reference surface 44a ... Reference surface 45a ... Reference hole 45b ... Reference hole 46b ... Reference hole 51a ... Projection 51b ... Projection 54a ... Projection 54b ... Projection 52 ... Slit 53 ... Projection 60 ... Robot hand 61 ... Hand body 62 ... Crank Pin 63 ... Claw 64 ... Shaft 64a ... First member 64b ... Second member 65 ... Slit 65a ... Large diameter part (shielding part)
66a ... large diameter portion 66b ... small diameter portion 66c ... large diameter portion 66d ... end surface 67 ... lumen 68 ... drive mechanism 71a ... reference surface 71b ... reference line 72a ... reference surface 72b ... reference surface 73b ... reference figure

Claims (20)

A substrate gripping detection device for detecting that a substrate is gripped by a movable gripping member,
A transmissive optical sensor whose relative position changes with the movement of the movable gripping member and a detection body;
The optical sensor has a light emitting element and a light receiving element,
The detector is
A first member and a second member that are adjustable in relative position;
When the substrate is gripped by the gripping member, the optical sensor is a transmission part that transmits light from the light emitting element to the light receiving element or a shielding part that blocks the light, the first member and The transmission part or the shielding part formed by at least one of the second members,
By adjusting the relative positions of the first member and the second member, the position or size of the transmission part or the shielding part when the substrate is gripped by the gripping member can be adjusted.
Substrate gripping detection device. In the board | substrate holding | grip detection apparatus of Claim 1,
The first member has one first reference portion or a plurality of first reference portions at different positions along the first direction;
The second member has one second reference portion or a plurality of second reference portions at different positions along the first direction;
A plurality of at least one of the first reference portion and the second reference portion are provided;
The relative positions of the first member and the second member can be adjusted and matched so that any one of the first reference parts and any one of the second reference parts match. A substrate gripping detection apparatus configured to be able to adjust a position or a dimension of the transmission part or the shielding part according to a combination of the first reference part and the second reference part. In the board | substrate holding | grip detection apparatus of Claim 2,
Substrate gripping detection in which the first and second reference parts are configured by at least one of a reference surface for alignment, a reference line, a reference hole, and a reference graphic provided on the first and second members. apparatus. In the board | substrate holding | grip detection apparatus of Claim 2 or 3,
The first member has an elongated hole along the first direction;
The second member is fixed to the first member with a fastening member that has passed through the elongated hole,
The board | substrate holding | grip detection apparatus by which the relative position of a said 1st member and a said 2nd member is adjusted by changing the position in the said elongate hole of the said fastening member. In the board | substrate holding | grip detection apparatus in any one of Claim 1 thru | or 4,
The first and second members each include a plate-shaped first portion and a plate-shaped second portion substantially orthogonal to the first portion. In the board | substrate holding | grip detection apparatus of Claim 4,
The first and second members have a plate-like first part and a plate-like second part substantially orthogonal to the first part,
The transmission part or the shielding part is formed in the first part,
The long-hole is a substrate gripping detection device formed in the second portion. In the board | substrate holding | grip detection apparatus in any one of Claim 1 thru | or 6,
A substrate gripping detection apparatus in which the dimension of the transmission part or the shielding part of the detection body is configured to be variable in accordance with adjustment of the relative positions of the first member and the second member. In the board | substrate holding | grip detection apparatus of Claim 7,
The transmission part is a slit or an opening formed between the protruding part of the first member and the protruding part of the second member, and the relative part of the first member and the second member A substrate gripping detection device in which the dimension of the transmission part can be adjusted with the adjustment of the general position. In the board | substrate holding | grip detection apparatus of Claim 7,
The shielding portion is formed by an overlap between the protruding portion of the first member and the protruding portion of the second member, and adjustment of the relative position of the first member and the second member. Accordingly, the substrate gripping detection device is capable of adjusting the dimension of the shielding portion. In the board | substrate holding | grip detection apparatus of Claim 1 or 2,
The first member has a lumen along the first direction;
The second member is disposed in the lumen and is fixed to the first member by a set screw, and the set screw is loosened so that the first member and the second member are relative to each other. Substrate gripping detection device capable of adjusting various positions. In the board | substrate holding | grip detection apparatus of Claim 10,
A substrate gripping detection device, wherein a small-diameter portion is provided on an outer peripheral surface of the first member, and the small-diameter portion constitutes the transmission portion. In the board | substrate holding | grip detection apparatus of Claim 10,
A substrate gripping detection device having a large-diameter portion projecting radially outward on an outer peripheral surface of the first member, and the large-diameter portion constituting the shielding portion. A substrate gripping device,
A movable gripping member that contacts the substrate and grips the substrate;
A substrate gripping detection device according to any one of claims 1 to 12,
A substrate gripping device comprising: The substrate holding apparatus according to claim 13, wherein
The gripping member has a pair of arms,
The substrate gripping device, wherein the pair of arms sandwich and fix the substrate from both sides. The substrate holding apparatus according to claim 14,
A substrate holding apparatus, further comprising a mechanism for rotating the pair of arms to invert the fixed substrate. The substrate holding apparatus according to claim 13, wherein
The gripping member has a clamp pin;
A substrate gripping device in which the clamp pin presses and fixes the substrate. The substrate holding apparatus according to claim 16, wherein
The substrate gripping device further includes a claw provided in a robot hand and provided at a position facing the clamp pin. A method of adjusting a substrate gripping detection device that detects that a substrate is gripped by a movable gripping member,
The substrate gripping detection device includes a detection body for providing a transmission part or a shielding part to a transmissive optical sensor when the substrate is gripped by the gripping member, and the detection body includes a first member and a first member. The adjustment method includes:
Adjusting the relative position between the first member and the second member to adjust the position or size of the transmitting portion or the shielding portion when the substrate is gripped by the gripping member. including,
Method for adjusting substrate gripping detection device. The method of claim 18, wherein
The first member has one first reference portion or a plurality of first reference portions at different positions along the first direction, and the second member has one second reference portion. Or having a plurality of second reference parts at different positions along the first direction, wherein a plurality of at least one of the first reference part and the second reference part are provided,
The relative positions of the first member and the second member are adjusted and matched so that any one of the first first reference parts and any one of the second reference parts match. A method of adjusting a relative position between the first member and the second member in accordance with a combination of one reference portion and the second reference portion. 20. A method according to claim 18 or 19,
The method in which the first and second reference parts are at least one of a reference surface, a reference line, a reference hole, and a reference graphic for alignment provided in the first and second members.

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