KR101356774B1 - Calibration device - Google Patents

Abstract

The calibration jig device of the present invention includes a wafer and a distance measuring unit for measuring a distance to a cassette on which a tray on which a wafer is loaded is formed at a predetermined interval, and a distance to a wafer and a manipulator that accommodates the wafer in the tray. The position information of the manipulator can be obtained while minimizing the impact on the manipulator.

Description

Calibration jig device {CALIBRATION DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a calibration jig device and a calibration method, and more particularly, to a jig device and a method for correcting an operation position of a manipulator for accommodating a wafer into a cassette.

In general, robots are used in the semiconductor industry to perform various tasks, such as automated handling of substrate media or other objects. In the semiconductor industry, typical media and other objects include individual silicon wafers or wafer carriers, flat panel displays, and hard disk media.

The robot can, for example, deliver media in wafer processing cluster tools, wafer inspection equipment, metrology equipment, and equipment for hard disk thin film deposition, and in media transfer between automated material handling systems and production equipment in semiconductor factories. Used to handle The robot can be used in both atmospheric and vacuum environments.

One class of robots is known as articulated arm robots, or more specifically articulated cylindrical coordinate robots. Cylindrical coordinate robots include a configuration consisting of an arm having a limb attached to a rotating joint while being movable in a horizontal plane. The rotary joint is mounted on the carriage, which is provided with a reciprocating vertical movement along the axis of the vertical column. The rim can move in and out in the radial or R-direction. The arm can also rotate as a unit on the carriage in theta direction. The arm design is based on a multi-link open kinematic chain.

In general, the basic components of a robotic system are manipulators, power conversion modules, sensor devices and controllers. Manipulators consist of links and joints (including gears, couplings, pulleys, belts, etc.). The manipulator can be described as a system of solid links connected by joints. Links and joints together form a kinematic chain. Kinematic pairs comprising joints and adjacent links may also be referred to as linkages.

Two types of joints are used in the manipulator mechanism, which are rotating and straight joints. Rotating or rotary joints allow rotation of one link around the articulation axis of the preceding link. Straight joints allow translation between the links.

Movement of the joints is achieved by an actuator mechanism. The movement of a particular joint causes the subsequent link attached thereto to move relative to the link containing the actuator of the joint. The actuator can be connected to the link directly or via a mechanical transmission when the desired output characteristics of the actuator (force, torque, speed, resolution, etc.) need to be changed according to the required performance.

The manipulator generally terminates at a link that can support the tool. In semiconductor wafer processing equipment, this tool is generally referred to as an end effector. The interface between the final link and the end effector is called the end effector mounting flange. The links connected to the actuators through the joints move relative to each other to position the end effectors within the X-Y-Z coordinate system.

The commercially available construction of a single arm robot has three parallel rotating joints, which allow for arm movement and in-plane orientation. Often, the first rotating joint is called a shoulder, the second rotating joint is called an elbow, and the third rotating joint is called a wrist. The fourth, straight joint is used to move the end effector perpendicular to the plane in the vertical or Z direction. An actuator (eg, closed loop control servomotor) and a motion conversion mechanism are included in this mechanism to enable movement of the joints. Controlled movement of each link, ie placement and orientation of the end effector in the X-Y-θ-Z coordinate system, can only be achieved when the actuator controls each joint of the manipulator. The actuator can control the joint directly or via a motion conversion mechanism when a reduction in force and torque is needed.

For serial kinematic link clauses, the number of joints is equal to the required number of degrees of freedom. Thus, to move and orient the end effector of a single arm, four joints (three rotations and one vertical straight) are required per set of X-Y-θ-Z coordinates required. In some multi-link articulated robotic robots, often the end effector needs to be drawn along the end effector and oriented so that the centerline projected towards the column of the robot always intersects the axis of rotation of the first rotating joint (shoulder joint). In this case, the manipulator needs only three degrees of freedom (R-θ-Z). The individual actuators do not control the joints of the end effector, only three actuators are needed.

This type of known dual arm robot for handling substrate media has two shoulder joints, two elbow joints and two wrist joints. The arm can also move a predetermined distance in the vertical direction along the translational axis of the straight joint of the carriage supporting the first rotating joint (the shoulder joint of the arm). The individual links of both arms are at the same level, the shoulder joints are adjacent to each other, and it is necessary to use a C-shaped bracket between one of the arms and its end effector so that both end effectors can pass through each other. However, the robot cannot be used in vacuum transfer modules constructed in accordance with SEMI MESC standards, because the isolation valves of these vacuum transfer modules are equipped with C-shaped brackets according to SEMI resources, which form wafer transfer planes in process modules and cassettes. This is because it is too narrow to allow passage of the containing arm. Also, the arm cannot rotate independently in cylindrical coordinates. The angular relationship between the vectors of the linear radial translation of the individual end effectors of each arm (in a currently commercially available robot) is permanent and is formed during the assembly of the robot. Often, the individual arms of a dual arm robot are directed along the same vector.

Korean Utility Model Registration No. 0436002 discloses that the control unit reads the center position of the wafer on the end effector so that the wafer center and end effector can be When there is a deviation in the center position, a technique for correcting this is disclosed. However, a method of acquiring input information used for deviation correction is not disclosed.

Korean Utility Model Registration No. 0438002

The present invention provides a correction jig device and a correction method for reliably acquiring an operating position of a manipulator for accommodating a wafer into a cassette.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise forms disclosed. Other objects, which will be apparent to those skilled in the art, It will be possible.

The calibration jig device of the present invention may include a cassette in which a tray on which a wafer is loaded is formed at a predetermined interval, and a distance measuring unit for measuring the distance to the wafer and a manipulator that accommodates the wafer in the tray in a non-contact manner.

On the other hand, in the calibration method of the present invention, the wafer is stored in a cassette in which the trays on which the wafers are stacked are formed at predetermined intervals, and the reference distance between the wafer and the distance measuring unit is measured, and the wafer is removed from the cassette. The method may include measuring a manipulator distance between the manipulator entered between each tray and the distance measuring unit, and outputting a result of subtracting the reference distance from the manipulator distance.

As described above, the correction jig device of the present invention can provide not only the distance of the manipulator as the position correction target but also the distance of the wafer, thereby providing position correction data based on the wafer as the target of the manipulator.

For example, the distance between the wafer and the manipulator can be reliably obtained by measuring the distance to the wafer in the state where the wafer is stored in the cassette and measuring the distance of the manipulator in the state where the wafer is removed. The distance thus obtained is used for manipulator correction.

In addition, by obtaining the distance from the manipulator and the distance from the wafer in a non-contact manner, the wafer is not damaged and the position of the manipulator is not changed in the distance measurement process.

1 is a schematic view showing a correction jig device of the present invention.
2 is a front view showing a correction jig device according to an embodiment of the present invention.
3 is a rear perspective view of the correction jig device according to an embodiment of the present invention.
4 is a schematic view showing another correction jig device of the present invention.
5 is a front view of another correction jig device of the present invention.
6 is a flowchart illustrating a correction method of the present invention.
7 is a schematic view showing a distance measuring unit of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, the correction jig apparatus and method of this invention are demonstrated in detail with reference to drawings.

1 is a schematic view showing a correction jig device of the present invention.

The calibration jig apparatus shown in FIG. 1 includes a cassette 110 having a tray 111 on which a wafer 190 is loaded, and a manipulator 180 for storing the wafer in the tray and a distance to the wafer. It may include a distance measuring unit 130 for measuring the distance to the non-contact.

The tray 111 is a pedestal in which the wafer is accommodated and may be formed in various shapes and materials.

For example, the tray 111 may be formed in pairs of rib-shaped support parts having a width corresponding to the diameter of the wafer. In FIG. 1, two wall surfaces are formed to have a width smaller than the width of the wafer, and trays are formed by forming recesses on the wall surfaces to allow the wafer to enter and exit.

When the tray is configured as described above, since the portion of the wafer contacting the tray is limited to the edge, damage to the wafer or adhesion of foreign matters can be minimized.

Since one wafer is accommodated in one tray, a plurality of trays may be formed in the cassette 110 in order to load a plurality of wafers.

The opposite side 113 of the doorway opened to allow the wafer 190 to enter and exit the cassette 110 may be formed as a curved surface corresponding to the curvature of the wafer.

When a plurality of trays are formed in the cassette, each tray may be formed at regular intervals for convenience such as a wafer loading process. The wafer may be unloaded into the tray via a robot, such as a carefully controlled manipulator 180.

The manipulator 180 is a mechanism for unloading the wafer 190 onto the tray 111. In order to improve space utilization, it is necessary to close the gap between the trays formed in the cassette. The tighter the gap between trays, the more precisely the manipulator must transport the wafer. This is because if an error occurs in the position control of the manipulator, the conveying wafer may hit the tray entry path and be damaged, or the already loaded wafer may be damaged by the manipulator or the conveying wafer.

Factors that reduce the control accuracy of the manipulator include microscopic errors due to thermal expansion due to temperature changes and play / tolerance due to manipulator use. The distance measuring unit 130 is used to calibrate such fine error in an initial state or periodically.

The distance measuring unit 130 measures the distance between the distance measuring unit and the wafer 190 as a reference point, measures the distance between the distance measuring unit and the manipulator in a non-contact manner, and calibrates the manipulator using the same.

The distance measuring unit 130 measures the distance from the wafer or the manipulator in a non-contact manner. To this end, the distance measuring unit may be a laser range finder. Since the distance is measured in a non-contact manner, the distance measuring unit does not damage the wafer or impact the manipulator during the distance measurement process.

7 shows a laser range finder as a distance measurer.

The distance measuring unit includes an emission unit 136 to which a laser is radiated, an incident unit 137 to receive a laser reflected from a measurement object, and a display unit 138 which displays a distance measured by the reflected laser. The display portion may be formed in the cassette or the battery.

The position of the manipulator may be calibrated using the distance from the wafer and the distance from the manipulator obtained through the distance measuring unit.

The method of correcting the operation position of the manipulator through the distance measuring unit will be described.

2 is a front view showing a correction jig device according to an embodiment of the present invention.

Two wafers are loaded into the cassette 110 of the correction jig device shown in FIG. 2 including the first wafer 191 and the second wafer 193. Since one wafer is loaded per tray 111 formed in the cassette, the first wafer 191 and the second wafer 193 are the first tray 118 and the second tray 119 selected from a plurality of trays formed in the cassette. Are loaded on each.

The first tray 118 and the second tray 119 may be variously selected. For example, in FIG. 2, the upper tray is selected as the first tray 118 and the lower tray is selected as the second tray 119 as two continuous trays, but the present invention is not limited thereto. The tray may be selected as the first tray 118 and the second tray 119.

The manipulator 180 may enter and exit between the first wafer 191 and the second wafer 193 to accommodate the first wafer 191 or the second wafer 193. At this time, in order to minimize the probability that the manipulator 180 collides with the first wafer 191 or the second wafer 193, the manipulator 180 adjusts the exact center position between the first wafer 191 and the second wafer 193. It needs to be moved as a path. The distance measuring unit 130 is provided for the motion control calibration of the manipulator 180. The distance measurer 130 may include a first distance measurer 131 and a second distance measurer 133.

The first distance measuring unit 131 measures the first reference distance L1 from the first distance measuring unit to the first wafer 191 and the first manipulator distance M1 from the first distance measuring unit to the manipulator 180.

The second distance measuring unit 133 measures the second reference distance L2 from the second distance measuring unit to the second wafer 193 and the second manipulator distance M2 from the second distance measuring unit to the manipulator 180.

According to the first distance measuring unit and the second distance measuring unit, the correction jig device obtains a first reference distance L1, a first manipulator distance M1, a second reference distance L2, and a second manipulator distance M2. Location information).

For reference, the first reference distance L1, the first manipulator distance M1, the second reference distance L2, and the second manipulator distance M2 shown in FIG. 2 are assumed to be a case where the distance measuring unit measures the distance in a reflective manner like a laser distance meter. It is shown.

The position information of the manipulator may be used to correct the position of the manipulator entering and exiting between the trays.

The manipulator must be drawn in and drawn out through the target path between the first wafer and the second wafer without being in contact with the first wafer and the second wafer. In addition, without being in contact with the first wafer and the second wafer, the loaded wafer must be lowered to be loaded on the target tray or raised to take out the wafer loaded on the target tray.

Accordingly, the position information of the manipulator may include at least one of a position of a manipulator that is drawn in or drawn out between each tray, and a position of a manipulator that moves up or down to put or remove a wafer into a target tray.

The position at this time becomes an up-down position except the left-right position of a manipulator. The upper and lower positions of the manipulators are determined at least between wafers stacked adjacent to each other, which may lower the collision probability. In FIG. 2, a 1st distance measuring part is arrange | positioned above a 1st wafer, and a 2nd distance measuring part is arrange | positioned below a 2nd wafer, and is comprised so that the up-down position of a manipulator may be measured.

Regardless of the installation position of the distance measuring unit, an origin is required to obtain reliable position information. As such origin, the first reference distance L1 and the second reference distance L2 are used.

The first reference distance L1 is the distance between the first distance measuring unit and the first wafer, and the second reference distance L2 is the distance between the second distance measuring unit and the second wafer. In FIG. 1, the first distance measuring unit 131 displays the distance between the first distance measuring unit and the first wafer as +29.0, and the second distance measuring unit 132 reaches the second distance measuring unit and the second wafer. Mark the distance as -15.0. Since these values are display values with respect to the reference distance, the display value displayed on the display portion is simplified to zero using the offset function of the distance measuring portion. 2, +29.0 is simplified to 0.0 using the offset function of the first distance measuring unit 131, and -15.0 is simplified to 0.0 using the offset function of the second distance measuring unit 132. Next, when the first wafer and the second wafer are removed from the tray and the manipulator is inserted into the cassette, the first distance measuring unit 131 determines the distance from the first distance measuring unit 131 to the upper surface of the manipulator. The second distance measuring unit 132 displays the distance from the second distance measuring unit 132 to the lower surface of the manipulator on the display unit of the second distance measuring unit.

For example, the first distance measuring unit 131 and the second distance measuring unit 132 set to zero to display the first wafer and the second wafer loading positions as the origin by the offset function are the first distance measuring unit 131. The first manipulator distance M1, which is the distance from the top of the manipulator, is displayed on the display unit of the first distance measuring unit at +5.8, and the second manipulator distance M2, which is the distance from the second distance measuring unit 132 to the manipulator bottom surface, is +5.2. On the display of the second distance measuring unit.

From this state, the manipulator is raised or lowered until the first manipulator distance M1 and the second manipulator distance M2 are displayed at the same value (for example, +5.5). The position of the manipulator, in which the first manipulator distance M1 and the second manipulator distance M2 are represented by the same value, is taught to a manipulator control unit that controls the operation of the manipulator with the arrangement intervals of the trays. The manipulator control section ends the calibration process by storing the center position of the taught manipulator and the arrangement interval of the tray. Before the next calibration is performed, the manipulator controller controls the manipulators to enter and exit the wafers, for example, at the centers of the wafers adjacent to each other, based on the center position of the taught manipulator and the arrangement interval of the trays. . The entrance and exit position away from the center position of the taught manipulator by k trays is (the center position of the taught manipulator) ± (disposition interval * k of the tray).

In other words, D1, which is the result of subtracting the first manipulator distance M1 and the first reference distance L1, and D2, which is the result of subtracting the second manipulator distance M2 and the second reference distance L2, is determined by the installation position and tolerance of the distance measuring unit. It is constant regardless.

D1 may be expressed in various ways, such as expressing a + value or a − value by setting the height of the first wafer to zero. The same is true for D2. This representation can be described as the manipulator position information including information indicating the distance from the origin to the manipulator as the origin of the measurement point of the wafer on which the reference distance is measured.

This makes it possible to reliably obtain the position of the manipulator entering and exiting the cassette without contacting the wafer in the loaded state. The position of the manipulator at this time becomes a position with respect to the wafer loaded in the tray.

If a plurality of trays formed in the cassette are formed at regular intervals, the position of the manipulators with respect to all trays can be corrected if only the positions of the manipulators entering and exiting any one tray are known.

The distance measuring unit 130 may be mounted on the cassette 110. In this case, the guides 134 and 135 stacked on the tray may be provided, and the distance measuring unit may be installed in each of the guides 134 and 135.

On the other hand, if the first wafer and the second wafer cover the manipulator, the distance measuring unit cannot measure the manipulator distance. Therefore, the first wafer and the second wafer may be loaded in the first tray and the second tray only at the reference distance measurement. The first wafer and the second wafer may be removed from the cassette to measure the manipulator distance after the reference distance measurement.

In summary, the position information of the manipulator includes at least one of a first reference distance L1 and a first distance D1 obtained by subtracting the first manipulator distance M1, a second reference distance L2, and a second distance D2 obtained by subtracting the second manipulator distance M2. It may include one.

The position correction of the manipulator can be completed by previously storing the canonical position of the manipulator with respect to the wafer loaded in the tray in advance in a database of the manipulator control unit and correcting an error by comparing the position information of the manipulator obtained by the distance measuring unit. .

According to the above distance measuring unit, positional information including the reference distance and the distance of the manipulator is secured. In addition, the correction jig device includes a communication unit 139 for transmitting the position information to the position correction means of the manipulator, a display unit 138 for displaying the position information, and a correction unit for correcting the position of the manipulator using the position information. It may include at least one of.

The communication unit 139 may include an interface for communicating with a position correcting means (not shown) of an external manipulator, as shown in FIG. 3 showing a rear perspective view of the correction jig device of the present invention.

The display unit 138 displays the position information of the manipulator. The user who checks the position information through the display unit checks the position of the manipulator and corrects the manipulator. The cassette equipped with the distance measuring unit is used as a calibration jig and can be used interchangeably for manipulator position correction of a very large number of process chambers. That is, the manipulator calibration is periodically performed by removing the existing general cassette and mounting the cassette equipped with the distance measuring unit of the present invention in the process chamber.

In order to increase the usefulness as a calibration jig, a means for independently supplying a distance measuring unit may be necessary. To this end, a distance measuring unit and a battery 140 for supplying power to the distance measuring unit may be mounted in a cassette. This state is shown in FIGS. 4 and 5.

The position of the manipulator is directly corrected using the manipulator position information. As a means for driving the manipulator, a communication unit 139 may be provided to transmit a correction signal.

In the above, two wafers are used to obtain a reference distance. However, the present invention is not limited thereto, and the number of wafers used for obtaining the reference distance may be one or more.

4 is a schematic view showing another correction jig device of the present invention.

The correction jig device shown in FIG. 4 includes a cassette 110 having a tray 111, a distance measuring unit measuring a reference distance with a wafer accommodated in the tray and a manipulator distance with a manipulator. At this time, the correction jig device generates the position information of the manipulator using the reference distance and the manipulator distance.

The position information of the manipulator may be a reference distance and the manipulator distance itself or a result of the subtraction of the reference distance and the manipulator distance.

The distance measurer may set the reference distance point to zero by using the offset function. According to this, the distance measurer may directly obtain a distance from the wafer corresponding to the reference distance point to the manipulator. In other words, the distance measuring unit may directly obtain a subtraction result of the reference distance and the manipulator distance.

In FIG. 4, only one first wafer 191 is loaded into the cassette, the first distance measuring unit 131 is disposed above the first wafer, and the second distance measuring unit 133 is disposed below the first wafer. Is placed. Further, each distance measuring unit is provided, and guides 134 and 135 mounted on the cassette are provided.

The shape and dimensions of the manipulator may vary depending on the use environment. Regardless of this change, each distance measurer may be mounted in a cassette and moved within the cassette to obtain a manipulator position. At this time, the moving direction may include a direction in which the wafer is accommodated. When the distance measuring unit is installed in the guide, the movement path 137 to which the distance measuring unit is moved may be formed. When the distance measuring unit moves in the cassette, if the display unit is formed in the distance measuring unit, it may be difficult to identify the display unit. In order to prevent such a phenomenon, the display unit 141 may be formed on the outer surface of the cassette or the battery.

In FIG. 5, the first wafer 191 is accommodated in the thirteenth tray from the bottom and the manipulator enters and exits from the twelfth tray.

In this case, the first distance measuring unit 131 positioned on the upper side of the first wafer acquires the first manipulator distance M1 and the first reference distance L1, and the second distance measuring unit 133 is the second manipulator distance M2, 2 Obtain the reference distance L2. In the case of a distance measuring unit capable of setting one distance point to 0, that is, the origin, it is possible to directly obtain D1 and D2 corresponding to a result of the subtraction of the manipulator and the reference distance.

The order of obtaining the manipulator distance and the reference distance is irrelevant. However, when measuring the manipulator distance, the distance measurement may be limited due to the wafer, so it is preferable to proceed with the wafer removed. Similarly, when the reference distance is measured, it is preferable to proceed with the manipulator removed.

The distance measurer may be configured of only the distance measurer of either the first distance measurer or the second distance measurer.

On the other hand, even if the manipulator enters and exits the center position between the wafers, there is a possibility that the manipulator collides with the wafer depending on the inclination. In order to prevent this, it is preferable to calibrate the inclination of the manipulator as well as the entrance position of the manipulator. To this end, the distance measurer may measure manipulator distances for a plurality of viewpoints continuously or intermittently when the manipulator enters or exits the cassette. According to this configuration, it is possible to grasp the inclined state of the manipulator, that is, the inclination. For example, when the manipulator is inserted into a cassette, if the manipulator distances collected continuously or intermittently in the time interval range measured by the distance measuring unit are all the same, it means that the manipulator is not tilted at all. Analyzing the variation profile of the manipulator distance measured at a plurality of points of time while the manipulator is entering and exiting, it is possible to know whether the manipulator is inclined as well as the inclination direction of the manipulator.

In order to determine the inclination of the manipulator, the distance measurer must measure the manipulator distance at a plurality of viewpoints, and therefore, the distance measurer measures the manipulator distance from the front end to the rear end of the manipulator. That is, the distance measuring unit is preferably located at the entrance and exit of the cassette and measures the manipulator distance at the entrance and exit position of the cassette. At this time, the cassette entrance and exit refers to a surface on which an opening through which the wafer or manipulator enters and exits is formed.

According to such a structure, a manipulator distance from the entry part of a manipulator which enters a cassette to an inner part can be measured in multiple viewpoints. If the distance measuring unit is installed on the opposite side of the cassette entrance, the distance measurement is performed only at the entrance part of the manipulator, that is, the end portion of the arm constituting the manipulator, and the distance measurement is not made at the inner part of the arm. It is not possible to measure the distance of multiple viewpoints.

6 is a flowchart illustrating a correction method of the present invention.

First, the wafer is accommodated in a cassette in which trays on which the wafers are loaded are formed at predetermined intervals, and a reference distance between the wafer and the distance measuring unit is measured (S 510).

The wafer is removed from the cassette, and the manipulator distance between the manipulator entering the cassette and the distance measuring unit is measured (S 530).

The measurement of the reference distance and the measurement of the manipulator distance are performed in the distance measuring unit, and the measurement order may be reversed. In other words, the reference distance between the wafer loaded on the tray and the distance measuring unit in the state where the manipulator is removed may be measured, or the manipulator distance between the manipulator and the distance measuring unit may be measured when the wafer is removed.

Next, the result of the subtraction of the reference distance and the manipulator distance is output (S550). The above subtraction result may be directly performed by the distance measuring unit. Alternatively, a separate operation unit may be provided and performed.

Meanwhile, while the first tray in which the first wafer is accommodated and the second tray in which the second wafer is accommodated are adjacent to each other, the first tray and the second tray may be spaced apart so that another tray is positioned therebetween. have.

Also, the position at which the manipulator enters and exits from the cassette may be a tray position not adjacent to the wafer used for the reference distance measurement.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

It is applicable to the position correction jig apparatus of the manipulator which loads a wafer in a cassette.

In particular, it is advantageous to apply to the correction jig apparatus which needs to reliably acquire the position of the manipulator required for position correction.

110 Cassette 111 Tray
118 ... first tray 119 ... second tray
130 ... Distance measuring unit 131 ... First distance measuring unit
133 ... 2nd distance measuring unit 134, 135 ... guide
136 ... laser entry 138, 141 ...
139 Communications ... 140 Batteries
180 Manipulator 191 First wafer
193 ... second wafer

Claims (11)

A cassette in which trays on which wafers are loaded are formed at regular intervals; And
And a distance measuring unit measuring a distance between the wafer and a manipulator that accommodates the wafer in the tray in a non-contact manner.
The cassette is loaded with a first wafer and a second wafer,
The manipulator enters and exits between the first wafer and the second wafer,
The distance measuring unit may measure,
A first distance measuring unit measuring a first reference distance to the first wafer and a first manipulator distance to the manipulator; And
And a second distance measuring unit measuring a second reference distance to the second wafer and a second manipulator distance to the manipulator.
A correction jig for generating position information of the manipulator with respect to the first wafer or the second wafer using at least one of the first reference distance, the first manipulator distance, the second reference distance, and the second manipulator distance. Device.
delete The method of claim 1,
Position information of the manipulator,
A first distance obtained by subtracting the first reference distance and the first manipulator distance; and
And a second distance obtained by subtracting the second reference distance and the second manipulator distance.
delete delete delete delete The method of claim 1,
And the distance measuring unit measures the manipulator distance at a plurality of points in time when the manipulator enters and exits the cassette to measure the inclination of the manipulator.
The method of claim 1,
And the distance measuring part is mounted on a guide, and the distance measuring part is movable in the guide or the cassette.
The method of claim 1,
A battery mounted on the cassette,
And the distance measuring unit is mounted in the cassette and receives power from the battery.
delete

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