JP4882091B2 - 有機elパネルの製造方法 - Google Patents
有機elパネルの製造方法 Download PDFInfo
- Publication number
- JP4882091B2 JP4882091B2 JP2004128558A JP2004128558A JP4882091B2 JP 4882091 B2 JP4882091 B2 JP 4882091B2 JP 2004128558 A JP2004128558 A JP 2004128558A JP 2004128558 A JP2004128558 A JP 2004128558A JP 4882091 B2 JP4882091 B2 JP 4882091B2
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- Prior art keywords
- organic
- reverse bias
- leakage current
- panel
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000007689 inspection Methods 0.000 claims description 46
- 230000035882 stress Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 35
- 230000032683 aging Effects 0.000 claims description 31
- 239000012044 organic layer Substances 0.000 claims description 26
- 230000002950 deficient Effects 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 23
- 238000012360 testing method Methods 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 description 13
- 238000001514 detection method Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004128558A JP4882091B2 (ja) | 2004-04-23 | 2004-04-23 | 有機elパネルの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004128558A JP4882091B2 (ja) | 2004-04-23 | 2004-04-23 | 有機elパネルの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005310659A JP2005310659A (ja) | 2005-11-04 |
| JP2005310659A5 JP2005310659A5 (enExample) | 2007-03-29 |
| JP4882091B2 true JP4882091B2 (ja) | 2012-02-22 |
Family
ID=35439168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004128558A Expired - Fee Related JP4882091B2 (ja) | 2004-04-23 | 2004-04-23 | 有機elパネルの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4882091B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4853072B2 (ja) * | 2006-03-27 | 2012-01-11 | 株式会社デンソー | 有機el素子の製造方法 |
| JP2008066003A (ja) * | 2006-09-04 | 2008-03-21 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置の欠陥検査方法及び欠陥修正方法及びエレクトロルミネッセンス表示装置の製造方法 |
| JP4650505B2 (ja) * | 2008-03-05 | 2011-03-16 | 株式会社デンソー | 有機el素子の検査方法 |
| KR101839292B1 (ko) * | 2009-07-28 | 2018-03-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치의 검사 방법 및 제조 방법 |
| WO2011155159A1 (ja) * | 2010-06-07 | 2011-12-15 | パナソニック株式会社 | 有機el表示装置の製造方法 |
| WO2013186961A1 (ja) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | 欠陥検出方法、有機el素子のリペア方法、および有機el表示パネル |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2818255B2 (ja) * | 1990-05-08 | 1998-10-30 | 出光興産株式会社 | 有機エレクトロルミネッセンス素子の製造方法 |
| JP3958501B2 (ja) * | 1999-07-14 | 2007-08-15 | 三星エスディアイ株式会社 | 有機エレクトロルミネッセンス素子及びパネルの製造方法と製造装置 |
| JP2001313168A (ja) * | 2000-04-28 | 2001-11-09 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
| US20040164939A1 (en) * | 2001-05-15 | 2004-08-26 | Johnson Mark Thomas | Display device comprising a plurality of leds |
| JP4067875B2 (ja) * | 2001-06-01 | 2008-03-26 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型発光装置の修理方法及び作製方法 |
| JP4892795B2 (ja) * | 2001-07-11 | 2012-03-07 | Tdk株式会社 | 有機el素子およびその製造方法 |
| JP3835688B2 (ja) * | 2001-12-06 | 2006-10-18 | 富士電機ホールディングス株式会社 | パッシブマトリクス有機薄膜発光ディスプレイおよびその修復方法 |
| JP3562522B2 (ja) * | 2002-01-15 | 2004-09-08 | 株式会社デンソー | 有機el素子の製造方法 |
| JP4342827B2 (ja) * | 2002-04-30 | 2009-10-14 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型発光装置の作製方法 |
-
2004
- 2004-04-23 JP JP2004128558A patent/JP4882091B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005310659A (ja) | 2005-11-04 |
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