JP4879288B2 - ビーム電流キャリブレーションシステム - Google Patents
ビーム電流キャリブレーションシステム Download PDFInfo
- Publication number
- JP4879288B2 JP4879288B2 JP2009027373A JP2009027373A JP4879288B2 JP 4879288 B2 JP4879288 B2 JP 4879288B2 JP 2009027373 A JP2009027373 A JP 2009027373A JP 2009027373 A JP2009027373 A JP 2009027373A JP 4879288 B2 JP4879288 B2 JP 4879288B2
- Authority
- JP
- Japan
- Prior art keywords
- charged particle
- particle beam
- detection unit
- primary
- primary charged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002245 particle Substances 0.000 claims description 236
- 238000001514 detection method Methods 0.000 claims description 104
- 238000005259 measurement Methods 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 35
- 239000011163 secondary particle Substances 0.000 claims description 13
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000011156 evaluation Methods 0.000 claims description 6
- 230000000875 corresponding effect Effects 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000011010 flushing procedure Methods 0.000 description 5
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000012935 Averaging Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000003795 desorption Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2443—Scintillation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
- H01J2237/24535—Beam current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/282—Determination of microscope properties
- H01J2237/2826—Calibration
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measurement Of Radiation (AREA)
- Electron Sources, Ion Sources (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2733508P | 2008-02-08 | 2008-02-08 | |
| US61/027,335 | 2008-02-08 | ||
| EP08101448A EP2088614B1 (en) | 2008-02-08 | 2008-02-08 | Beam current calibration system |
| EP08101448.2 | 2008-02-08 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009187949A JP2009187949A (ja) | 2009-08-20 |
| JP2009187949A5 JP2009187949A5 (https=) | 2011-12-08 |
| JP4879288B2 true JP4879288B2 (ja) | 2012-02-22 |
Family
ID=39590844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009027373A Expired - Fee Related JP4879288B2 (ja) | 2008-02-08 | 2009-02-09 | ビーム電流キャリブレーションシステム |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7982179B2 (https=) |
| EP (1) | EP2088614B1 (https=) |
| JP (1) | JP4879288B2 (https=) |
| DE (1) | DE602008003970D1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009052392A1 (de) * | 2009-11-09 | 2011-12-15 | Carl Zeiss Nts Gmbh | SACP-Verfahren und teilchenoptisches System zur Ausführung eines solchen Verfahrens |
| EP2365511B1 (en) | 2010-03-10 | 2013-05-08 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Feedback loop for emitter flash cleaning |
| WO2012086419A1 (ja) * | 2010-12-22 | 2012-06-28 | 株式会社日立ハイテクノロジーズ | 荷電粒子放出銃及び荷電粒子線装置 |
| US10049852B2 (en) | 2014-11-05 | 2018-08-14 | Howmedica Osteonics Corp. | Assessment and calibration of a high energy beam |
| US9620331B1 (en) * | 2015-11-19 | 2017-04-11 | Carl Zeiss Microscopy Ltd. | Method for analyzing an object and charged particle beam device for carrying out the method |
| AU2018273352B2 (en) | 2017-05-22 | 2023-07-27 | Howmedica Osteonics Corp. | Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process |
| US10245448B2 (en) * | 2017-07-21 | 2019-04-02 | Varian Medical Systems Particle Therapy Gmbh | Particle beam monitoring systems and methods |
| US10504687B2 (en) * | 2018-02-20 | 2019-12-10 | Technische Universiteit Delft | Signal separator for a multi-beam charged particle inspection apparatus |
| US10395887B1 (en) * | 2018-02-20 | 2019-08-27 | Technische Universiteit Delft | Apparatus and method for inspecting a surface of a sample, using a multi-beam charged particle column |
| US11117195B2 (en) | 2018-07-19 | 2021-09-14 | The University Of Liverpool | System and process for in-process electron beam profile and location analyses |
| EP3716313A1 (en) * | 2019-03-28 | 2020-09-30 | ASML Netherlands B.V. | Aperture array with integrated current measurement |
| US11239048B2 (en) * | 2020-03-09 | 2022-02-01 | Kla Corporation | Arrayed column detector |
| JP7076021B1 (ja) * | 2021-03-10 | 2022-05-26 | 浜松ホトニクス株式会社 | ライトガイド、電子線検出器、及び荷電粒子装置 |
| DE102021118561B4 (de) | 2021-07-19 | 2023-03-30 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskopes mit schneller Strahlstromregelung, Computerprogrammprodukt und Vielstrahl-Teilchenmikroskop |
| US12237142B2 (en) | 2022-06-16 | 2025-02-25 | Fei Company | Methods for determining the virtual source location of a liquid metal ion source |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3842271A (en) * | 1973-04-24 | 1974-10-15 | American Optical Corp | Scanning electron microscope |
| JPH0487244A (ja) * | 1990-07-27 | 1992-03-19 | Hitachi Ltd | 走査型電子顕微鏡 |
| US5345085A (en) * | 1993-03-26 | 1994-09-06 | Etec Systems, Inc. | Method and structure for electronically measuring beam parameters |
| JPH07105888A (ja) * | 1993-10-05 | 1995-04-21 | Jeol Ltd | 走査電子顕微鏡 |
| JP2001202912A (ja) * | 2000-01-21 | 2001-07-27 | Nikon Corp | 荷電粒子線装置の開口と光軸の軸合わせ方法 |
| US6545277B1 (en) * | 2000-08-15 | 2003-04-08 | Applied Materials, Inc. | High efficiency, enhanced detecting in-lens light guide scintillator detector for SEM |
| EP1255278B1 (en) * | 2001-04-24 | 2005-06-15 | Advantest Corporation | Scanning particle mirror microscope |
| EP1768162A3 (en) * | 2001-10-05 | 2007-05-09 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik Mbh | Multiple electron beam device |
| US6639219B2 (en) * | 2001-11-09 | 2003-10-28 | International Business Machines Corporation | Electron scatter in a thin membrane to eliminate detector saturation |
-
2008
- 2008-02-08 DE DE602008003970T patent/DE602008003970D1/de active Active
- 2008-02-08 EP EP08101448A patent/EP2088614B1/en not_active Not-in-force
-
2009
- 2009-02-05 US US12/366,465 patent/US7982179B2/en active Active
- 2009-02-09 JP JP2009027373A patent/JP4879288B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2088614A1 (en) | 2009-08-12 |
| US7982179B2 (en) | 2011-07-19 |
| JP2009187949A (ja) | 2009-08-20 |
| EP2088614B1 (en) | 2010-12-15 |
| DE602008003970D1 (de) | 2011-01-27 |
| US20090200497A1 (en) | 2009-08-13 |
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