JP4874540B2 - センサー装置を制御する方法及び装置 - Google Patents

センサー装置を制御する方法及び装置 Download PDF

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Publication number
JP4874540B2
JP4874540B2 JP2004344135A JP2004344135A JP4874540B2 JP 4874540 B2 JP4874540 B2 JP 4874540B2 JP 2004344135 A JP2004344135 A JP 2004344135A JP 2004344135 A JP2004344135 A JP 2004344135A JP 4874540 B2 JP4874540 B2 JP 4874540B2
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sensor device
maintenance unit
primary coil
power
coil
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Expired - Fee Related
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JP2004344135A
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Japanese (ja)
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JP2005202933A5 (enExample
JP2005202933A (ja
Inventor
メイソン エル フリード
コスタス ジェイ スパノス
ランダール エス ムント
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Onwafer Technologies Inc
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Onwafer Technologies Inc
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Priority claimed from US10/888,526 external-priority patent/US7282889B2/en
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Publication of JP2005202933A5 publication Critical patent/JP2005202933A5/ja
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  • Arrangements For Transmission Of Measured Signals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004344135A 2003-11-29 2004-11-29 センサー装置を制御する方法及び装置 Expired - Fee Related JP4874540B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US52571003P 2003-11-29 2003-11-29
US60/525,710 2003-11-29
US10/888,526 US7282889B2 (en) 2001-04-19 2004-07-10 Maintenance unit for a sensor apparatus
US10/888,526 2004-07-10

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JP2005202933A JP2005202933A (ja) 2005-07-28
JP2005202933A5 JP2005202933A5 (enExample) 2011-08-11
JP4874540B2 true JP4874540B2 (ja) 2012-02-15

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JP (1) JP4874540B2 (enExample)
TW (1) TWI268429B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220096733A (ko) * 2020-12-31 2022-07-07 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
KR20220161808A (ko) * 2021-05-31 2022-12-07 세메스 주식회사 용기 및 기판 처리 시스템

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7839124B2 (en) * 2006-09-29 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device
US8853995B2 (en) 2009-06-12 2014-10-07 Qualcomm Incorporated Devices for conveying wireless power and methods of operation thereof
US8547057B2 (en) * 2009-11-17 2013-10-01 Qualcomm Incorporated Systems and methods for selective wireless power transfer
KR101356623B1 (ko) * 2011-11-10 2014-02-03 주식회사 스파콘 전력전송코일 및 무선 전력전송장치
JP6083652B2 (ja) * 2012-05-28 2017-02-22 パナソニックＩｐマネジメント株式会社 無接点コネクタシステム
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
JP5954788B2 (ja) * 2012-12-28 2016-07-20 セイコーインスツル株式会社 電子部品、受電装置、及び給電システム
JP2014029860A (ja) * 2013-08-27 2014-02-13 Advantest Corp 電源装置および測定用デバイス
JP6855774B2 (ja) * 2016-12-13 2021-04-07 Tdk株式会社 ウエハ搬送容器内雰囲気計測装置、ウエハ搬送容器、ウエハ搬送容器内清浄化装置及びウエハ搬送容器内清浄化方法
US20180366354A1 (en) * 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
CN120663299A (zh) * 2019-07-26 2025-09-19 朗姆研究公司 用于自动化晶片搬运机械手教导与健康检查的整合适应性定位系统及例程
JP7467152B2 (ja) 2020-02-13 2024-04-15 東京エレクトロン株式会社 収容容器及び基板状センサの充電方法
KR102650610B1 (ko) * 2021-05-31 2024-03-26 세메스 주식회사 기판 처리 장치 및 기판 처리 시스템
KR102858235B1 (ko) * 2021-07-15 2025-09-09 삼성전자주식회사 웨이퍼 이송 시스템 및 이를 이용한 반도체 소자 제조 방법
WO2023089795A1 (ja) * 2021-11-22 2023-05-25 三菱電機株式会社 送電装置、無線電力伝送システム及び電圧制御装置
US11817724B2 (en) * 2022-03-02 2023-11-14 Applied Materials, Inc. Enclosure system with charging assembly
CN120642042A (zh) * 2023-02-09 2025-09-12 东京毅力科创株式会社 基片处理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466614A (en) * 1993-09-20 1995-11-14 At&T Global Information Solutions Company Structure and method for remotely measuring process data
JPH10142068A (ja) * 1996-11-14 1998-05-29 Sony Corp 温度測定装置及びこれを用いた温度測定方法
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220096733A (ko) * 2020-12-31 2022-07-07 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
KR102584512B1 (ko) * 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
US11933808B2 (en) 2020-12-31 2024-03-19 Semes Co., Ltd. Buffer unit and method for storaging substrate type sensor for measuring of horizontality of a substrate support member provided on a temperature varying atmosphere
KR20220161808A (ko) * 2021-05-31 2022-12-07 세메스 주식회사 용기 및 기판 처리 시스템
KR102594075B1 (ko) 2021-05-31 2023-10-24 세메스 주식회사 용기 및 기판 처리 시스템

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TWI268429B (en) 2006-12-11
JP2005202933A (ja) 2005-07-28
TW200532465A (en) 2005-10-01

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