TWI268429B - Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus - Google Patents

Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus

Info

Publication number
TWI268429B
TWI268429B TW093136293A TW93136293A TWI268429B TW I268429 B TWI268429 B TW I268429B TW 093136293 A TW093136293 A TW 093136293A TW 93136293 A TW93136293 A TW 93136293A TW I268429 B TWI268429 B TW I268429B
Authority
TW
Taiwan
Prior art keywords
sensor apparatus
communicating
wirelessly
maintenance unit
systems
Prior art date
Application number
TW093136293A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532465A (en
Inventor
Mason L Freed
Costas J Spanos
Randall S Mundt
Original Assignee
Onwafer Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/888,526 external-priority patent/US7282889B2/en
Application filed by Onwafer Technologies Inc filed Critical Onwafer Technologies Inc
Publication of TW200532465A publication Critical patent/TW200532465A/zh
Application granted granted Critical
Publication of TWI268429B publication Critical patent/TWI268429B/zh

Links

Landscapes

  • Arrangements For Transmission Of Measured Signals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
TW093136293A 2003-11-29 2004-11-25 Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus TWI268429B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52571003P 2003-11-29 2003-11-29
US10/888,526 US7282889B2 (en) 2001-04-19 2004-07-10 Maintenance unit for a sensor apparatus

Publications (2)

Publication Number Publication Date
TW200532465A TW200532465A (en) 2005-10-01
TWI268429B true TWI268429B (en) 2006-12-11

Family

ID=34830427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136293A TWI268429B (en) 2003-11-29 2004-11-25 Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus

Country Status (2)

Country Link
JP (1) JP4874540B2 (enExample)
TW (1) TWI268429B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411193B (zh) * 2006-09-29 2013-10-01 Semiconductor Energy Lab 無線電力儲存裝置，包括該無線電力儲存裝置的半導體裝置，和其操作方法
US8853995B2 (en) 2009-06-12 2014-10-07 Qualcomm Incorporated Devices for conveying wireless power and methods of operation thereof
TWI488402B (zh) * 2009-11-17 2015-06-11 Qualcomm Inc 用於電力管理之方法、裝置及非暫態電腦可讀媒體
TWI586067B (zh) * 2012-12-28 2017-06-01 精工半導體有限公司 電子零件、受電裝置及供電系統

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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KR101356623B1 (ko) * 2011-11-10 2014-02-03 주식회사 스파콘 전력전송코일 및 무선 전력전송장치
WO2013179639A1 (ja) * 2012-05-28 2013-12-05 パナソニック株式会社 無接点コネクタシステム
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
JP2014029860A (ja) * 2013-08-27 2014-02-13 Advantest Corp 電源装置および測定用デバイス
JP6855774B2 (ja) 2016-12-13 2021-04-07 Tdk株式会社 ウエハ搬送容器内雰囲気計測装置、ウエハ搬送容器、ウエハ搬送容器内清浄化装置及びウエハ搬送容器内清浄化方法
US20180366354A1 (en) * 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
US12341040B2 (en) 2019-07-26 2025-06-24 Lam Research Corporation Integrated adaptive positioning systems and routines for automated wafer-handling robot teach and health check
JP7467152B2 (ja) 2020-02-13 2024-04-15 東京エレクトロン株式会社 収容容器及び基板状センサの充電方法
KR102584512B1 (ko) * 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
KR102650610B1 (ko) * 2021-05-31 2024-03-26 세메스 주식회사 기판 처리 장치 및 기판 처리 시스템
KR102594075B1 (ko) * 2021-05-31 2023-10-24 세메스 주식회사 용기 및 기판 처리 시스템
KR102858235B1 (ko) * 2021-07-15 2025-09-09 삼성전자주식회사 웨이퍼 이송 시스템 및 이를 이용한 반도체 소자 제조 방법
JP7370503B2 (ja) * 2021-11-22 2023-10-27 三菱電機株式会社 送電装置、無線電力伝送システム及び電圧制御装置
US11817724B2 (en) * 2022-03-02 2023-11-14 Applied Materials, Inc. Enclosure system with charging assembly
KR20250142391A (ko) * 2023-02-09 2025-09-30 도쿄엘렉트론가부시키가이샤 기판 처리 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466614A (en) * 1993-09-20 1995-11-14 At&T Global Information Solutions Company Structure and method for remotely measuring process data
JPH10142068A (ja) * 1996-11-14 1998-05-29 Sony Corp 温度測定装置及びこれを用いた温度測定方法
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411193B (zh) * 2006-09-29 2013-10-01 Semiconductor Energy Lab 無線電力儲存裝置，包括該無線電力儲存裝置的半導體裝置，和其操作方法
US8853995B2 (en) 2009-06-12 2014-10-07 Qualcomm Incorporated Devices for conveying wireless power and methods of operation thereof
TWI488402B (zh) * 2009-11-17 2015-06-11 Qualcomm Inc 用於電力管理之方法、裝置及非暫態電腦可讀媒體
TWI552479B (zh) * 2009-11-17 2016-10-01 高通公司 用於電力管理之方法、裝置及非暫態電腦可讀媒體
US9680313B2 (en) 2009-11-17 2017-06-13 Qualcomm Incorporated Authorized based receipt of wireless power
TWI586067B (zh) * 2012-12-28 2017-06-01 精工半導體有限公司 電子零件、受電裝置及供電系統

Also Published As

Publication number Publication date
JP4874540B2 (ja) 2012-02-15
JP2005202933A (ja) 2005-07-28
TW200532465A (en) 2005-10-01

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