JP4850510B2 - Resin composition for sealing and semiconductor device - Google Patents

Description

  The present invention relates to a sealing resin composition used as a sealing material for electronic components such as semiconductor elements, and a semiconductor device using the same, and more particularly, a non-halogen compound that does not contain a halogen compound from the viewpoint of environmental conservation. The present invention relates to an encapsulating resin composition and a semiconductor device using the same.

  2. Description of the Related Art Conventionally, electronic parts such as semiconductor elements have been widely sealed with an epoxy resin composition. In particular, epoxy resin compositions that use novolac epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins as the main agent and phenol resin as a curing agent are inexpensive, moldability, moisture resistance, etc. It is often used because of its superiority.

  However, the epoxy resin composition using such a novolak type epoxy resin is inexpensive and excellent in moldability, moisture resistance, etc., but on the other hand, it is made flame retardant by a non-halogen flame retardant which is increasingly demanded from the viewpoint of environmental protection. There was a problem that was difficult.

  In other words, conventionally, flame retarding of epoxy resin compositions has been accomplished by using a halogen-based flame retardant (usually brominated epoxy resin) containing elements such as chlorine and bromine, and an antimony compound (usually antimony trioxide) as a flame retardant aid. ) Has been commonly used.

  However, halogen-based flame retardants may generate highly toxic compounds such as dioxins and gases during combustion. In addition, antimony compounds have been pointed out to be toxic in themselves, and have a problem of having a great influence on the water quality environment because they are easily eluted in water.

  Therefore, a flame retarding technique that does not use a halogen-based flame retardant or an antimony compound is required. For example, a method of adding a red phosphorus flame retardant, a metal hydroxide, a metal oxide, or the like has been proposed (for example, patents). Reference 1).

  However, red phosphorus flame retardants have problems in terms of safety, such as the possibility of ignition. On the other hand, although metal hydroxides and metal oxides have no safety problems, they have a small effect of imparting flame retardancy, so it is difficult to obtain flame retardancy comparable to conventional compositions using halogen-based flame retardants. Met. It is possible to increase the flame retardancy even if it is a flame retardant having a small effect of imparting flame retardancy, but it can be added to a high viscosity resin such as a novolac type epoxy resin. There was a limit and it was difficult to mix a large amount of flame retardant.

Recently, there has been an increasing demand for improving the long-term storage stability of sealing resin materials from the viewpoint of product yield, quality, and production control.
Japanese Patent Laid-Open No. 11-35651

  As described above, no technology has yet been found for imparting good flame retardancy to a sealing resin composition containing a novolac type epoxy resin as a main component without using a halogen-based flame retardant. Recently, there is an increasing demand for improving the long-term storage stability of encapsulating resin materials.

  The present invention has been made to solve such problems of the prior art. It is a non-halogen, excellent flame retardancy, and has a good storage stability and is mainly composed of a novolac type epoxy resin. It is an object of the present invention to provide a stopping resin composition and a semiconductor device that is sealed with such a sealing resin composition and that has high quality, flame retardancy, and environmental safety.

  As a result of intensive studies to achieve the above object, the present inventors have found that a combination of a metal hydrate and a specific urea compound has resulted in a halogen-based difficulty in a composition based on a novolac-type epoxy resin. It has been found that good flame retardancy can be imparted without using a flame retardant and that excellent storage stability can be provided, and the present invention has been completed.

That is, the sealing resin composition according to the first aspect of the present invention comprises (A) a novolac type epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler (however, the following (D) ( Excluding components) , (D) a metal hydrate and (E) a urea compound having a melting point of 100 ° C. or higher, having two or more ureido groups in the molecule, and a nitrogen content of 10% by weight or more It is characterized by doing.

The invention according to claim 2 is the sealing resin composition according to claim 1 , wherein the urea compound as the component (E) is N, N- (4-methyl-1,3-phenylene)-(N ', N'-dimethylurea) and / or N, N-phenylene-bis (N', N'-dimethylurea).

The invention according to claim 3 is the sealing resin composition according to claim 1 or 2 , wherein the metal hydrate of the component (D) is aluminum hydroxide and / or magnesium hydroxide. And

Invention of Claim 4 is the resin composition for sealing of any one of Claims 1 thru | or 3 , Content of the urea compound of the said (E) component is 0.1-0.1 of the whole composition. It is characterized by being 10% by weight.

The invention according to claim 5 is the sealing resin composition according to any one of claims 1 to 4 , wherein the content of the inorganic filler of the component (C) is 70 to 95 of the entire composition. It is characterized by weight percent.

The invention according to claim 6 is the sealing resin composition according to any one of claims 1 to 5 , wherein the content of the metal hydrate of the component (D) is that of the component (C). It is characterized by being 0.1 to 30% by weight of the inorganic filler.

A semiconductor device according to a seventh aspect of the present invention is obtained by sealing a semiconductor element with a cured product of the sealing resin composition according to any one of the first to sixth aspects. And

  INDUSTRIAL APPLICABILITY According to the present invention, a non-halogen, excellent flame retardancy and good storage stability, and a sealing resin composition based on a novolac epoxy resin, and such sealing It is possible to obtain a high-quality semiconductor device that is sealed with the resin composition for use and has excellent flame retardancy and environmental safety.

  Hereinafter, the present invention will be described in detail.

  The sealing resin composition of the present invention has (A) novolak type epoxy resin, (B) phenol resin curing agent, (C) inorganic filler, (D) metal hydrate, and (E) nitrogen content of 10. It contains a urea compound that is at least% by weight.

（式中、Ｒ^１は水素原子またはアルキル基であり、ｎは０以上の整数を表す） The (A) component novolak type epoxy resin is obtained by epoxidizing a novolak resin obtained by condensing phenols and formaldehyde with epichlorohydrin, and is usually represented by the following general formula (1).

(Wherein R ¹ represents a hydrogen atom or an alkyl group, and n represents an integer of 0 or more)

（式中、ｎは０以上の整数を表す） Examples of the alkyl group represented by R ¹ in the general formula (1) include a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, an iso-butyl group, a sec-butyl group, Examples thereof include a tert-butyl group. As the novolak type epoxy resin of component (A), a phenol novolak type epoxy resin in which R ¹ in the general formula (1) is a hydrogen atom, and a cresol novolak type epoxy resin in which R ¹ is a methyl group are used. It is particularly preferable to use an o-cresol novolac type epoxy resin represented by the following general formula (2).

(In the formula, n represents an integer of 0 or more)

  In the present invention, an epoxy resin other than the above-mentioned novolak type epoxy resin can be used in combination as the epoxy resin component (except for an epoxy resin containing a halogen element such as a brominated epoxy resin). Specifically, biphenyl type epoxy resin, phenol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin, heterocyclic type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilbene type An epoxy resin, a condensed ring aromatic hydrocarbon-modified epoxy resin, an alicyclic epoxy resin, and the like can be given. Among them, a biphenyl type epoxy resin and a phenol aralkyl type epoxy resin are preferable. The ratio of the novolak type epoxy resin to the entire epoxy resin component in such a combined system is preferably at least 50% by weight. A more desirable ratio is 60% by weight or more, and particularly preferably 70% by weight or more.

  As the epoxy resin component in the present invention, the above-mentioned novolak type epoxy resin alone and the combined use of the novolak type epoxy resin and the biphenyl type epoxy resin are particularly preferable.

  (B) As a phenol resin hardening | curing agent of a component, if it has two or more phenolic hydroxyl groups in a molecule | numerator which can react with the epoxy group of the said epoxy resin component, it will be used, without being restrict | limited especially. Specifically, novolak-type phenol resins obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, such as phenol novolak resins and cresol novolak resins, these modified resins such as epoxidized or butylated. Novolak-type phenol resin, dicyclopentadiene-modified phenol resin, para-xylene-modified phenol resin, condensates of phenols with benzaldehyde, naphthyl aldehyde, etc., such as phenol aralkyl resin, naphthol aralkyl resin, triphenol methane compound, multifunctional A phenol resin etc. are mentioned. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

（式中、ｎは０以上の整数を表す）

（式中、ｎは０以上の整数を表す） In the present invention, a phenol novolak resin represented by the following general formula (3), a phenol aralkyl resin represented by the following general formula (4) are preferable, and a phenol novolak resin is more preferable.

(In the formula, n represents an integer of 0 or more)

(In the formula, n represents an integer of 0 or more)

  The blending amount of this (B) component phenolic resin curing agent is the number of epoxy groups (a) that the epoxy resin component in the composition of the present invention has and the number of phenolic hydroxyl groups (b) that the phenolic resin curing agent (B) has. The ratio (a) / (b) is preferably in the range of 0.5 to 1.5, more preferably in the range of 0.8 to 1.2. When (a) / (b) is less than 0.5, the moisture resistance reliability of the cured product is lowered. Conversely, when it exceeds 1.5, the strength of the cured product is lowered.

  (C) Component inorganic fillers include fused silica, crystalline silica, alumina, zircon, calcium silicate talc, calcium carbonate, titanium white, bengara, silicon carbide, boron nitride, beryllia, zirconia, etc. Single crystal fibers such as beads, potassium titanate, silicon carbide, silicon nitride, and alumina, and glass fibers. In addition, zinc borate having a flame retardant effect can also be used. These inorganic fillers can be used alone or in combination of two or more. In the present invention, among these, silica powder is preferable, and fused silica powder is particularly preferable. Moreover, it is preferable that the shape is spherical, and it is preferable that a particle diameter is 1-60 micrometers in average particle diameter, and a maximum particle diameter is 100 micrometers or less. In the present invention, it is preferable that at least 60% by weight in the inorganic filler of the component (C) is spherical particles having an average particle diameter of 1 to 40 μm.

  The blending amount of the inorganic filler of component (C) is preferably in the range of 70 to 95% by weight of the whole composition, and more preferably in the range of 75 to 90% by weight. When the blending amount is less than 70% by weight of the entire composition, flame retardancy, heat resistance, moisture resistance, mechanical strength, moldability and the like are lowered. On the other hand, if it exceeds 95% by weight, the fluidity of the composition is lowered, the moldability becomes poor and practical use becomes difficult.

  The metal hydrate (D) is a component that acts as a flame retardant, and hydrates such as aluminum, magnesium, calcium, nickel, iron, copper, and hydrates of composite metals such as zinc borate and zinc stannate. Such as things. These may be used individually by 1 type, and 2 or more types may be mixed and used for them. In the present invention, among these, aluminum hydroxide and magnesium hydroxide are preferable from the viewpoint of flame retardancy and heat resistance. The average particle size of the metal hydrate is preferably 0.1 to 20 μm, and more preferably 0.5 to 15 μm. The maximum particle size is preferably 50 μm or less. If the average particle size is less than 0.1 μm, the composition thickens due to aggregation of the particles, and the fluidity is impaired. Moreover, fluidity | liquidity falls also when an average particle diameter exceeds 20 micrometers or a maximum particle diameter exceeds 50 micrometers.

  The metal hydrate of component (D) is preferably blended in an amount of 0.1 to 30% by weight of the inorganic filler of component (C) from the viewpoint of improving flame retardancy and reliability. It is more preferable to blend by weight%.

  The urea compound as component (E) has a nitrogen atom content of 10% by weight or more, preferably 15% by weight or more, and acts as a flame retardant aid for the metal hydrate. When the nitrogen atom content is less than 10% by weight, the flame retardancy is lowered.

  Further, the urea compound as the component (E) preferably has a melting point of 100 ° C. or higher in order to obtain good storage stability, and the melting point is higher than the kneading temperature when preparing the composition. More preferably. That is, when a urea compound having a melting point of less than 100 ° C. is used, the curing of the composition proceeds during kneading, and long-term storage becomes difficult.

  These urea compounds may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  In the present invention, it is preferable to use a urea compound having two or more ureido groups in the molecule from the viewpoint of flame retardancy and storage stability. Specific examples thereof include N, N- (4-methyl-1,3-phenylene) -bis (N ', N'-dimethylurea), N, N-phenylene-bis (N', N'-dimethylurea). ), 2,4-tolylene diisocyanate dimethylamine adduct, 4,4 '-(diphenylpropane) diisocyanate dimethylamine adduct, triphenylmethane triisocyanate trimethylamine adduct, and the like. Of these, N, N- (4-methyl-1,3-phenylene) -bis (N ', N'-dimethylurea) and N, N-phenylene-bis (N', N'-dimethylurea) are preferable. In particular, N, N- (4-methyl-1,3-phenylene) -bis (N ′, N′-dimethylurea) is preferred.

  The urea compound as component (E) is preferably blended in the total composition in an amount of 0.1 to 10% by weight, more preferably 0.3 to 5% by weight, and 0.5 to 3% by weight. It is particularly preferable to do this. If the blending amount is less than 0.1% by weight of the whole composition, the reactivity of the resin becomes insufficient, and the flame retardancy becomes insufficient. Conversely, if it exceeds 10% by weight, the reactivity of the resin increases and the storage stability decreases.

  In the sealing resin composition of the present invention, in addition to the above components, a coupling agent, a synthetic wax, a natural wax, which are generally blended in this type of composition, as long as the effects of the present invention are not impaired. Release agents such as higher fatty acids and metal salts of higher fatty acids, colorants such as carbon black and cobalt blue, modifiers such as silicone oil and silicone rubber, hydrotalcites, ion scavengers such as antimony-bismuth Can be blended.

  As the coupling agent, an epoxy silane, amino silane, ureido silane, vinyl silane, alkyl silane, organic titanate, aluminum alcoholate, or the like is used. These can be used alone or in admixture of two or more. From the viewpoints of flame retardancy and curability, aminosilane coupling agents are preferred, and in particular, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, and γ-anilinopropylmethyldimethoxysilane. Γ-anilinopropylmethyldiethoxysilane is preferred.

  In addition, generally known hardening accelerators can also be mix | blended with the composition of this invention.

  In preparing the sealing resin composition of the present invention as a molding material, the above-described (A) novolac type epoxy resin, (B) phenol resin curing agent, (C) inorganic filler, (D) metallic water After thoroughly mixing the Japanese product, (E) the specific urea compound, and the various components blended as necessary with a mixer or the like, it is preferably 100 ° C. with a hot roll, a kneader, an extruder or the like. What is necessary is just to melt-knead at the temperature below, and to grind | pulverize to a suitable magnitude | size after cooling.

  The semiconductor device of this invention can be manufactured by sealing a semiconductor element using said sealing resin composition. Examples of the semiconductor element for sealing include an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, and a diode, but are not particularly limited thereto. As a sealing method, a low-pressure transfer method is generally used, but sealing by injection molding, compression molding, casting, or the like is also possible. After sealing with the sealing resin composition, the semiconductor device is finally heated and cured, and finally sealed with the cured product. The heating temperature for post-curing is preferably 150 ° C. or higher.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all. In the following description, “part” means “part by weight”.

Example 1
100 parts of o-cresol novolac type epoxy resin (trade name ESCN-190 manufactured by Sumitomo Chemical Co., Ltd .; epoxy equivalent 195), 55 parts novolak type phenol resin (trade name H-1 manufactured by Meiwa Kasei Co., Ltd. 106), N, N -(4-Methyl-1,3-phenylene) -bis (N ', N'-dimethylurea) (melting point 143 ° C., nitrogen content 21% by weight) 8 parts, aluminum hydroxide (trade name H manufactured by Showa Denko KK) -42) 140 parts, 1000 parts of spherical silica powder (average particle size 20 μm), 3 parts of carnauba wax, 1 part of carbon black (trade name MA-600 manufactured by Mitsubishi Chemical Corporation) and 1 part of γ-anilinopropyltrimethoxysilane The mixture was mixed at room temperature and then kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Example 2
60 parts of o-cresol novolac type epoxy resin (ESCN-190), biphenyl type epoxy resin (product name YX-4000H; epoxy equivalent 196) manufactured by Japan Epoxy Resin Co., Ltd., 55 parts of novolac type phenol resin (H-1), N, N- (4-methyl-1,3-phenylene) -bis (N ′, N′-dimethylurea) (melting point 143 ° C., nitrogen content 21% by weight), 8 parts, aluminum hydroxide (H-42) 140 parts, 1000 parts of spherical silica powder (average particle size 20 μm), 3 parts of carnauba wax, 1 part of carbon black (MA-600) and 1 part of γ-anilinopropyltrimethoxysilane were mixed at room temperature, Heat kneading was performed at 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Example 3
100 parts of o-cresol novolac type epoxy resin (ESCN-190), 55 parts of novolak type phenol resin (H-1), N, N- (4-methyl-1,3-phenylene) -bis (N ', N' -Dimethylurea (melting point 143 ° C., nitrogen content 21% by weight) 8 parts, magnesium hydroxide (trade name Kisuma 5A, manufactured by Kyowa Chemical Co., Ltd.) 140 parts, spherical silica powder (average particle size 20 μm) 1000 parts, carnauba wax 3 Part, carbon black (MA-600) 1 part and γ-anilinopropyltrimethoxysilane 1 part were mixed at room temperature and then heated and kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Example 4
100 parts of o-cresol novolac type epoxy resin (ESCN-190), 55 parts of novolak type phenol resin (H-1), N, N- (4-methyl-1,3-phenylene) -bis (N ', N' -Dimethylurea (melting point 143 ° C., nitrogen content 21% by weight) 16 parts, aluminum hydroxide (H-42) 140 parts, spherical silica powder (average particle size 20 μm) 1000 parts, carnauba wax 3 parts, carbon black ( 1 part of MA-600) and 1 part of γ-anilinopropyltrimethoxysilane were mixed at room temperature and then kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Reference Example o-cresol novolac type epoxy resin (ESCN-190) 100 parts, novolac type phenol resin (H-1) 55 parts, 3-phenyl-1,1-dimethylurea (melting point 65 ° C., nitrogen content 17% by weight) ) 4 parts, aluminum hydroxide (H-42) 140 parts, spherical silica powder (average particle size 20 μm) 1000 parts, carnauba wax 3 parts, carbon black (MA-600) 1 part and γ-anilinopropyltrimethoxysilane One part was mixed at room temperature, and then heat-kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Comparative Example 1
100 parts of o-cresol novolac type epoxy resin (ESCN-190), 55 parts of novolac type phenol resin (H-1), 4 parts of triphenylphosphine, 140 parts of aluminum hydroxide (H-42), spherical silica powder (average particle size) 1000 parts of diameter (20 μm), 3 parts of carnauba wax, 1 part of carbon black (MA-600) and 1 part of γ-anilinopropyltrimethoxysilane were mixed at room temperature and then kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Comparative Example 2
100 parts of o-cresol novolac type epoxy resin (ESCN-190), 55 parts of novolak type phenol resin (H-1), N, N- (4-methyl-1,3-phenylene) -bis (N ', N' -Dimethylurea (melting point 143 ° C., nitrogen content 21% by weight) 8 parts, spherical silica powder (average particle size 20 μm) 1000 parts, carnauba wax 3 parts, carbon black (MA-600) 1 part and γ-anilino 1 part of propyltrimethoxysilane was mixed at room temperature and then heated and kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

Comparative Example 3
70 parts of o-cresol novolac type epoxy resin (ESCN-190), 30 parts of brominated epoxy resin (trade name YDB-400; epoxy equivalent 400 manufactured by Tohto Kasei Co., Ltd.), 55 parts of novolac type phenol resin (H-1), tri 4 parts of phenylphosphine, 3 parts of antimony trioxide, 1000 parts of spherical fused silica powder (average particle size 20 μm), 3 parts of carnauba wax, 1 part of carbon black (MA-600) and 1 part of γ-anilinopropyltrimethoxysilane The mixture was mixed at room temperature and then kneaded at 90 to 95 ° C. After cooling, it was pulverized to obtain a sealing resin composition.

About the resin composition for sealing obtained by each said Example , reference example, and each comparative example, various characteristics were evaluated by the method shown below.
The sealing resin composition was molded by a transfer molding machine at a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 2 minutes, and then post-cured at 175 ° C. for 4 hours. It was.

[Geltime]
A certain amount of the sealing resin composition is spread in a circle of 4-5 cm in diameter on a hot plate maintained at 175 ° C. and kneaded at a constant speed, and the time until the sample thickens and finally loses its viscosity is measured. did.
[Storage stability]
The sealing resin composition was sealed in a container and stored at 30 ° C. for 5 days. Then, the gel time was measured by the same method as described above, and the storage rate relative to the initial value was calculated.
[Flame retardance]
Using the sealing resin composition, molding and post-curing were performed under the above conditions to produce a test piece of 127 mm × 12.7 mm × 1.6 mm, and a vertical combustion test based on the UL-94 standard was performed.
[Heat hardness]
Using the sealing resin composition, molding and post-curing were performed under the above conditions to prepare a test piece having a thickness of 6.4 mm, and measurement was performed using a Shore D type hardness meter immediately after molding.
[Bending strength]
Using a sealing resin composition, molding and post-curing were performed under the above conditions to prepare a test piece having a thickness of 6.0 mm, and measurement was performed according to JIS K 6911.
[Humidity and heat resistance]
Using the sealing resin composition, molding and post-curing were performed under the above conditions to produce a SOP28p package. This package was subjected to moisture absorption treatment at 85 ° C., 85% RH, 72 hours, and reflow at 220 ° C. for 90 seconds. After processing, perform a moisture resistance test (PCT) in saturated steam at 121 ° C and 2 atmospheres, and measure the time until the disconnection rate (number of defects / number of samples) of aluminum wiring on the chip reaches 50% did.
[High temperature storage]
A silicon chip (8 mm × 10 mm) having aluminum wiring is bonded to a 42 alloy frame, and then molded and post-cured using the sealing resin composition under the above conditions to form a QFP80p package (20 mm × 14 mm × 2. 0 mm), this package was placed in a thermostatic chamber at 175 ° C., taken out every predetermined time and subjected to a continuity test, and the time until a continuity failure occurred was measured.
[Environmental safety]
Evaluation was made based on the presence or absence of harmful elements and harmful compounds in the sealing resin composition.

These results are shown in Table 1 and Table 2 together with the composition.

As is clear from Tables 1 and 2, the sealing resin compositions of Examples and Reference Examples are flame retardant, moldability, curability, mechanical properties, electrical properties, moisture resistance, long-term reliability, etc. The sealing resin compositions of Examples 1 to 4 using a urea compound having a melting point of 100 ° C. or higher were particularly excellent in storage stability.

Claims (7)

(A) Novolac type epoxy resin, (B) phenol resin curing agent, (C) inorganic filler (except the following component (D)) , (D) metal hydrate and (E) melting point of 100 ° C A sealing resin composition comprising a urea compound having two or more ureido groups in the molecule and a nitrogen content of 10% by weight or more. The urea compound as component (E) is N, N- (4-methyl-1,3-phenylene)-(N ′, N′-dimethylurea) and / or N, N-phenylene-bis (N ′, sealing resin composition according to claim 1, characterized in that the N'- dimethylurea). The sealing resin composition according to claim 1 or 2, wherein the metal hydrate of the component (D) is aluminum hydroxide and / or magnesium hydroxide. The resin composition for sealing according to any one of claims 1 to 3 , wherein the content of the urea compound as the component (E) is 0.1 to 10% by weight of the whole composition. The content of the component (C) inorganic filler, characterized in that 70 to 95% by weight of the total composition according to claim 1 or any one encapsulating resin composition according to 4. Wherein (D) the content of the metal hydrate component, the (C) according to any one of claims 1 to 5, characterized in that 0.1 to 30% by weight of an inorganic filler of component Sealing resin composition. The cured product of claim 1 or encapsulating resin composition according to any one of 6, wherein a obtained by encapsulating a semiconductor element.