JP2007137943A - Resin composition for sealing and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing having high flame retardancy, excellent high temperature preserving properties and environmental safety, and advantageous high temperature reflow resistance and other properties; and a high reliable semiconductor device sealed with the resin composition for sealing. <P>SOLUTION: This resin composition for sealing comprises: (A) an epoxy resin; (B) a nitrogen modified phenol resin-based curing agent; (C) aluminum hydroxide; and (D) an inorganic filler, wherein aluminum hydroxide of the component (C) has a Na<SB>2</SB>O content of 0.1% by weight and an inorganic filler of the component (D) has an average particle diameter of 1 to 60 μm and a maximum particle diameter of 200 μm or less, and contains substantially no halogen-based flame retardant and no antimony-based flame retardant, and this semiconductor device is a semiconductor device in which a semiconductor element is sealed with a cured form of the resin composition for sealing. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sealing resin composition used as a sealing material for electronic components such as semiconductor elements, and a semiconductor device using the same.

  Conventionally, electronic parts such as semiconductor elements have been widely sealed using a thermosetting resin. As a sealing resin, an epoxy resin is generally used among thermosetting resins. In particular, an epoxy resin using a phenol resin as a curing agent uses other curing agents such as acid anhydrides and aromatic amines. Compared to these, it is widely used because it is excellent in moldability and moisture resistance, has no toxicity, and is inexpensive.

  By the way, this type of sealing resin is required to impart flame retardancy according to UL standards from the viewpoint of safety. Conventionally, compounds containing halogen elements such as chlorine and bromine and antimony compounds (usually normal) , Antimony trioxide) is generally used for flame retardancy.

  However, such a halogen-based flame retardant has a problem that the high-temperature storage property of electronic parts such as semiconductors is lowered. That is, for example, when a semiconductor device sealed with a sealing resin composition containing a halogen-based flame retardant is stored at a high temperature, a part of the halogen-based flame retardant is thermally decomposed to produce a compound containing a halogen element. There is a possibility that it may be liberated and corrode the joint of the semiconductor device. In addition, some halogen-based flame retardants may generate dioxin compounds that are highly toxic during combustion, and antimony compounds are themselves environmentally toxic.

For this reason, there is a strong demand for the development of flame retarding technology that has good flame retardancy, can improve high-temperature storage properties of semiconductor devices and the like, and is highly safe for the environment. As such a flame retarding technique, for example, a method of adding a specific aluminum hydroxide has been proposed (for example, see Patent Document 1). However, although the use of aluminum hydroxide can improve the high-temperature storage stability, there is a problem that the high-temperature reflow resistance is lowered due to the high water absorption rate of aluminum hydroxide. Further, the combined use of a benzoguanamine-modified phenolic resin and a metal hydroxide has been proposed, but the high-temperature reflow resistance was not sufficient (see, for example, Patent Document 2).
JP 2002-212397 A JP 10-152547 A

  As described above, a conventional sealing resin composition using a halogen-based flame retardant is excellent in flame retardancy, but is poor in high-temperature storage, and has problems in terms of environmental safety. Although new flame-retarding technology has been demanded to solve this problem, it is still difficult to solve high-temperature storage and environmental problems without deteriorating other properties, such as reduced high-temperature reflow resistance. No combustion technology has been found yet.

  The present invention has been made to solve such problems of the prior art, has high flame retardancy, is excellent in high-temperature storage and environmental safety, and has excellent high-temperature reflow resistance and other characteristics. An object of the present invention is to provide a sealing resin composition and a highly reliable semiconductor device sealed with such a sealing resin composition.

As a result of intensive studies to achieve the above object, the present inventors have determined that the epoxy resin has a nitrogen-modified phenol resin-based curing agent, aluminum hydroxide with a low Na ₂ O content, and a specific particle size. By using a combination of inorganic fillers, it is possible to give excellent flame retardancy without deteriorating high-temperature reflow resistance and other characteristics, and improve high-temperature storage and environmental safety. As a result, the present invention has been completed.

That is, the sealing resin composition according to claim 1 of the present application includes (A) an epoxy resin, (B) a nitrogen-modified phenol resin-based curing agent, (C) aluminum hydroxide, and (D) an inorganic filler. The aluminum hydroxide as the component (C) has a Na ₂ O content of 0.1% by weight or less, and the inorganic filler as the component (D) has an average particle size of 1 to 60 μm. The maximum particle size is 200 μm or less, and is substantially free of halogen-based flame retardant and antimony-based flame retardant.

  The invention according to claim 2 is the sealing resin composition according to claim 1, wherein the (C) component aluminum hydroxide has an average particle size of 1 to 20 μm and a maximum particle size of 75 μm or less. And the surface is processed with the liquid precursor for glass matrix formation, It is characterized by the above-mentioned.

  The invention according to claim 3 is the sealing resin composition according to claim 1 or 2, wherein the content of the aluminum hydroxide of the component (C) is 4 to 40% by weight of the whole composition. Features.

  Invention of Claim 4 is resin composition for sealing of any one of Claims 1 thru | or 3. Inclusion of the aluminum hydroxide of said (C) component, and the inorganic filler of said (D) component The total amount is 65 to 90% by weight of the total composition.

  The invention according to claim 5 is the sealing resin composition according to any one of claims 1 to 4, wherein the nitrogen-modified phenol resin-based curing agent of the component (B) is a benzoguanamine-modified phenol resin and / or Or it is a melamine modified phenol resin.

  A semiconductor device according to claim 6 of the present application is formed by sealing a semiconductor element with a cured product of the sealing resin composition according to any one of claims 1 to 5. And

  According to the present invention, a sealing resin composition having high flame retardancy, excellent high-temperature storage stability and environmental safety, high-temperature reflow resistance and other characteristics, and such sealing A highly reliable semiconductor device sealed with the resin composition for use can be obtained.

  Hereinafter, the present invention will be described in detail.

  The sealing resin composition of the present invention contains (A) an epoxy resin, (B) a nitrogen-modified phenolic resin-based curing agent, (C) aluminum hydroxide and (D) an inorganic filler as essential components, and Halogen flame retardants and antimony flame retardants are not substantially contained.

  As the epoxy resin of the component (A), as long as it has two or more epoxy groups in one molecule, those generally used can be widely used without being limited by the molecular structure, molecular weight and the like. (However, halogenated epoxy resin is excluded). Specifically, phenol novolac type epoxy resin, cresol novolac type epoxy resin, biphenyl novolac type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, triphenolmethane type epoxy resin, heterocyclic type epoxy resin, bisphenol A Type epoxy resin, bisphenol F type epoxy resin, stilbene type epoxy resin, condensed ring aromatic hydrocarbon modified epoxy resin and the like. These epoxy resins may be used individually by 1 type, and 2 or more types may be mixed and used for them.

  In the present invention, the use of a cresol novolac type epoxy resin is particularly preferable, and the use of an o-cresol novolak type epoxy resin represented by the following general formula (1) is particularly preferable. Such a cresol novolac type epoxy resin is preferably 60% by weight or more, and more preferably 80% by weight or more of the entire epoxy resin. Moreover, as a preferable combination component in the case of using other epoxy resins in combination with the cresol novolac type epoxy resin, epoxy resins represented by the following formulas (2) and (3) are exemplified, and in particular, represented by the following formula (2). It is preferable to use a biphenyl novolac type epoxy resin.

（式中、ｎは０以上の整数を表す）

（式中、ｎは０以上の整数を表す）

（式中、ｎは０以上の整数を表す）

(In the formula, n represents an integer of 0 or more)

(In the formula, n represents an integer of 0 or more)

(In the formula, n represents an integer of 0 or more)

  The (B) component nitrogen-modified phenolic resin curing agent is particularly limited as long as it has two or more phenolic hydroxyl groups in the molecule that can react with the epoxy group of the (A) component epoxy resin. Used without. Specific examples include novolak-type phenol resins obtained by reacting phenols such as phenol and alkylphenol with benzoguanamine, melamine and the like with formaldehyde or paraformaldehyde, such as modified resins such as phenol novolac resins and cresol novolac resins. . These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

（式中、ｎは０〜４の整数を表す）

（式中、ｎは０〜４の整数を表す） In the present invention, a melamine-modified phenol novolak resin represented by the following general formula (4) and a benzoguanamine-modified phenol aralkyl resin represented by the following general formula (5) are particularly preferable.

(In the formula, n represents an integer of 0 to 4)

(In the formula, n represents an integer of 0 to 4)

  The blending amount of the nitrogen-modified phenolic resin curing agent of component (B) is the number of epoxy groups (a) possessed by the epoxy resin of component (A) and the number of phenolic hydroxyl groups possessed by the phenolic resin curing agent of component (B) (b ) Ratio (a) / (b) is preferably in the range of 0.5 to 2.0, more preferably in the range of 0.7 to 1.5. When (a) / (b) is less than 0.5, the strength of the cured product is lowered. Conversely, when it exceeds 2.0, the moisture resistance reliability of the cured product is lowered.

Component (C), aluminum hydroxide, has a Na ₂ O content of 0.1% by weight or less, preferably 0.05% by weight or less. In general, aluminum hydroxide has an excellent flame retardant effect due to the endothermic effect of dehydration and decomposition during combustion and the action of forming a layer that blocks the oxygen on the cured product surface by promoting carbonization of the cured resin component. are believed to exert, on the other hand, aluminum hydroxide is near the decomposition initiation temperature of 300 ° C., a decomposition starting temperature Adulteration of Na 2 _O, etc. is lowered further, as a result, the composition The high temperature reflow resistance of the object is reduced. By using aluminum hydroxide having a Na ₂ O content of 0.1% by weight or less, it is possible to prevent deterioration in high-temperature reflow resistance while imparting excellent flame retardancy to the composition.

The aluminum hydroxide as component (C) preferably has an average particle size of 1 to 20 μm and a maximum particle size of 75 μm or less. When the average particle diameter is less than 1 μm, Na ⁺ is likely to be eluted and the reliability is lowered. On the other hand, if the average particle size exceeds 20 μm or the maximum particle size exceeds 75 μm, the dispersibility becomes poor and the flame retardancy decreases.

  The component (C), aluminum hydroxide, is preferably surface-treated with a liquid precursor for forming a glass matrix. Aluminum hydroxide treated with a liquid precursor for glass matrix formation in this way forms a coating of inorganic glass on the surface by subsequent heat treatment, so moisture resistance, high temperature reflow resistance, curability, moldability, etc. The flame retardancy which was excellent in the composition can be provided, without reducing the characteristic of this.

  The liquid precursor for forming a glass matrix is a method conventionally known as a method for forming an inorganic glass, for example, a mixture containing silicon alkoxide and a volatile organic acid is heated at, for example, 100 to 160 ° C. for 20 to 1000 minutes. Then, it can be prepared by a method of making a highly viscous liquid (liquid precursor for forming a glass matrix). In the present invention, it is particularly preferable to use a liquid precursor for forming a glass matrix that becomes an inorganic glass by heat treatment at 200 ° C. or lower.

  (C) It is preferable to mix | blend 4-40 weight% of aluminum hydroxide of a component, and it is more preferable to mix | blend 8-20 weight% in the whole composition. If the blending amount is less than 4% by weight of the total composition, the flame retardancy is insufficient, and if it exceeds 40% by weight, the strength of the cured product is significantly reduced.

  (D) Component inorganic fillers include fused silica, crystalline silica, alumina, talc, calcium carbonate, titanium white, bengara, silicon carbide, boron nitride, etc., spherical beads of these, single crystal fibers, glass Examples thereof include fibers. These can be used alone or in admixture of two or more. In the present invention, among these, use of silica powder and alumina powder is preferable, and silica powder is particularly preferable. In order to obtain the effect of the present invention, the inorganic filler of the component (D) needs to have an average particle diameter of 1 to 60 μm and a maximum particle diameter of 200 μm or less. When the average particle diameter is less than 1 μm, The fluidity is significantly reduced. On the other hand, when the average particle size exceeds 60 μm or the maximum particle size exceeds 200 μm, the filling property to the package or the like is greatly lowered, and unfilled defects are likely to occur. Preferably, the average particle size is 15-30 μm and the maximum particle size is 150 μm or less.

  The blending amount of the inorganic filler of the component (D) is 65 to 90% by weight of the total composition with the aluminum hydroxide of the component (C) from the viewpoint of balancing the moldability and the high temperature reflow resistance. The range is preferably 70 to 85% by weight. When the total amount of the component (C) with aluminum hydroxide is less than 65% by weight, the absorption rate increases and the solder crack resistance decreases. On the other hand, if it exceeds 90% by weight, the fluidity of the composition is lowered, the moldability becomes poor and practical use becomes difficult.

  In the sealing resin composition of the present invention, in addition to the components described above, a curing accelerator, a coupling agent, and a synthetic wax that are generally blended in this type of composition as long as the effects of the present invention are not impaired. , Natural wax, linear aliphatic metal salts, release agents such as acid amides and esters, colorants such as carbon black and cobalt blue, and low stress imparting agents such as silicone oil and silicone rubber. it can.

  Curing accelerators include trimethylphosphine, triethylphosphine, tributylphosphine, triphenylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, methyldiphenylphosphine, dibutylphenylphosphine, tricyclohexylphosphine, bis (diphenyl). Organic phosphine compounds such as phosphino) methane, 1,2-bis (diphenylphosphino) ethane, tetraphenylphosphonium tetraphenylborate, triphenylphosphinetetraphenylborate, triphenylphosphinetriphenylborane, 1,8-diazabicyclo [5 , 4,0] undecene-7 (DBU), 1,5-diazabicyclo (4,3,0) nonene-5, triethylamine, triethylenediamine, benzine Tertiary amine compounds such as dimethylamine, α-methylbenzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, 2-heptadecylimidazole, 2-methylimidazole, 2-ethylimidazole, 2- Phenylimidazole, 2-phenyl-4-methylimidazole, 4-methylimidazole, 4-ethylimidazole, 2-phenyl-4-hydroxymethylimidazole, 2-enyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, Examples thereof include imidazole compounds such as 2-phenyl-4-methyl-5-hydroxymethylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole. These can be used alone or in admixture of two or more.

  As the coupling agent, a silane coupling agent is preferable, for example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (methacrylopropyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyl Dimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ -Mercaptopropylmethyldimethoxysila , Bis (3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazole silane, and the like. These can be used alone or in admixture of two or more.

  In preparing the sealing resin composition of the present invention as a molding material, the above-described (A) epoxy resin, (B) nitrogen-modified phenol resin-based curing agent, (C) aluminum hydroxide, (D) inorganic After thoroughly mixing the filler and the various components blended as necessary with a mixer, etc., melt and knead them with a hot roll, kneader, etc., and cool them to an appropriate size after cooling. That's fine.

  The semiconductor device of this invention can be manufactured by sealing a semiconductor element using said sealing resin composition. Examples of the semiconductor element for sealing include an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, and a diode, but are not particularly limited thereto. As a sealing method, a low-pressure transfer method is generally used, but sealing by injection molding, compression molding or the like is also possible. After sealing with the sealing resin composition, the semiconductor device is finally heated and cured, and finally sealed with the cured product. The heating temperature for post-curing is preferably 150 ° C. or higher.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all. In the following description, “part” means “part by weight”.

Production Example 1
After adding 80 parts of liquid tetraethoxysilane to a glass heating synthesis vessel equipped with a reflux condenser, 100 parts of special grade acetic acid (manufactured by Wako Pure Chemical Industries, Ltd.) is slowly added dropwise, and at 125 ° C. for 1 hour. The chemical reaction was advanced by heating under forced stirring.

  Next, after the reaction product was rapidly cooled to room temperature in a heating synthesis vessel, 100 parts of hexane was added dropwise and heated at 125 ° C. for 1 hour, and hexane was removed by heating under reduced pressure at the final stage. Furthermore, in order to complete the reaction, the reaction product is again cooled to room temperature in a heating and synthesis vessel, and then 100 parts of hexane is added dropwise, heated at 125 ° C. for 1 hour, and hexane is heated and distilled at a final stage. Removed. Thereafter, the liquid residue was filtered to obtain a colorless and transparent liquid precursor for forming a glass matrix (X).

  On an alumina ball mill placed in a low temperature environment of 5 ° C., 5 parts of the above liquid matrix forming liquid precursor (X), aluminum hydroxide having an average particle size of 1.0 μm (trade name H-42M, manufactured by Showa Denko KK) 90 parts and 2 parts of a silicone surfactant (trade name KF-640, manufactured by Shin-Etsu Chemical Co., Ltd.) were added and stirred for 1 hour, followed by washing with water and drying to prepare a liquid precursor-treated aluminum hydroxide for glass matrix formation ( I) (denoted as glass precursor-treated aluminum hydroxide (I)) was obtained.

Production Example 2
After adding 80 parts of liquid tetramethoxysilane into a glass heating synthesis vessel equipped with a reflux condenser, 100 parts of special grade acetic acid (manufactured by Wako Pure Chemical Industries, Ltd.) is slowly added dropwise, and at 125 ° C. for 1 hour. The chemical reaction was advanced by heating under forced stirring.

  Next, after the reaction product was rapidly cooled to room temperature in a heating synthesis vessel, 100 parts of hexane was added dropwise and heated at 125 ° C. for 1 hour, and hexane was removed by heating under reduced pressure at the final stage. Furthermore, in order to complete the reaction, the reaction product is again cooled to room temperature in a heating and synthesis vessel, and then 100 parts of hexane is added dropwise, heated at 125 ° C. for 1 hour, and hexane is heated and distilled at a final stage. Removed. Thereafter, the liquid residue was filtered to obtain a colorless and transparent liquid precursor for forming a glass matrix (Y).

  Alumina ball mill placed in a low temperature environment of 5 ° C., 5 parts of the above liquid precursor for glass matrix formation (Y), magnesium hydroxide having an average particle size of 1.0 μm (trade name, Kisuma 5A, manufactured by Kyowa Chemical Industry Co., Ltd.) 90 parts and 2 parts of a silicone surfactant (trade name KF-640, manufactured by Shin-Etsu Chemical Co., Ltd.) were added and stirred for 1 hour, followed by washing with water and drying to prepare a liquid precursor-treated aluminum hydroxide for glass matrix formation ( II) (shown as glass precursor-treated aluminum hydroxide (II)).

  The preparation of the liquid precursors (X) and (Y) for forming the glass matrix in Production Examples 1 and 2 is based on a non-aqueous preparation method. Further, from the measurement results of the infrared spectral spectra of the liquid precursors (X) and (Y) for forming the glass matrix and the EDX analysis after the heat treatment of the liquid precursors (X) and (Y) for forming the glass matrix, It was confirmed that the liquid precursors (X) and (Y) for use can form inorganic glass.

Examples 1-7, Comparative Examples 1-6
After mixing (dry blending) each component at a blending ratio shown in Table 1 and Table 2, the mixture is heated and kneaded using a heating roll of 90 to 95 ° C., cooled and pulverized to obtain a sealing resin composition. Manufactured.

The materials other than the glass precursor treated aluminum hydroxide (I) and (II) shown in Tables 1 and 2 are as follows.
Epoxy resin A-1:
O-cresol novolac epoxy resin represented by the general formula (1) (trade name ESCN-190 manufactured by Sumitomo Chemical Co., Ltd.)
Epoxy resin A-2: biphenyl novolac type epoxy resin represented by the general formula (2) (trade name: Epicoat YX-4000, manufactured by Japan Epoxy Resin Co., Ltd.)
Epoxy resin A-3: Brominated bisphenol A type epoxy resin (trade name YDB-400 manufactured by Toto Kasei Co., Ltd.)
Phenolic resin curing agent B-1:
Melamine-modified phenol novolak resin represented by general formula (4)
(Nitrogen content 4% by weight)
Phenolic resin curing agent B-2:
Benzoguanamine-modified phenol aralkyl resin represented by the general formula (5)
(Nitrogen content 4% by weight)
Phenol resin curing agent B-3: Phenol novolac resin
(Product name H-4, manufactured by Meiwa Kasei Co., Ltd.)
Curing accelerator: Triphenylphosphine Inorganic filler: Fused silica powder (average particle size 20μm, maximum particle size 105μm)
Aluminum hydroxide: Na ₂ O content 0.04% by weight, average particle size 9 μm
Flame retardant aid: Antimony trioxide Silane coupling agent: γ-glycidoxypropyltrimethoxysilane Colorant: Carbon black Mold release agent: Carnauba wax

  About the resin composition for sealing obtained by each said Example and each comparative example, various characteristics were evaluated by the method shown below.

[Spiral flow]
Measurement was performed under the conditions of a temperature of 175 ° C. and a pressure of 10 MPa using a spiral flow measurement mold according to EMMI-I-66.

[Flame retardance]
The encapsulating resin composition was transfer molded under the conditions of a temperature of 175 ° C. and a pressure of 10 MPa for 120 seconds, and then post-cured for 8 hours at a temperature of 175 ° C., and 127 mm × 12.7 mm × 1/8 inch (about 3.2 mm) and 127 mm × 12.7 mm × 1/16 inch (about 1.6 mm) test cured products were obtained, and a vertical combustion test based on the UL-94 standard was performed.

[High temperature reflow resistance]
Using the sealing resin composition, a SOP16p package (chip size: 1.5 mm × 2.0 mm) is manufactured by transfer molding at a temperature of 175 ° C., a pressure of 10 MPa, 120 seconds, and a post-curing of 175 ° C. for 8 hours. The package was subjected to moisture absorption treatment at 60 ° C., 60% RH and 168 hours, followed by IR reflow treatment at 260 ° C. After cooling, the occurrence of cracks inside the package was observed with an ultrasonic flaw detector and the rate of occurrence was examined.

[High temperature storage]
Using the sealing resin composition, a SOP16p package (chip size: 1.5 mm × 2.0 mm) was produced by transfer molding at a temperature of 175 ° C., a pressure of 10 MPa, 120 seconds, and post-curing at a temperature of 175 ° C. for 8 hours. Thereafter, the package was subjected to a high-temperature storage test (190 ° C., 1000 hours), and the occurrence rate was examined by determining that the electrical resistance between the pins increased by 20% or more from the initial value as a failure.

These results are shown in the lower column of Tables 1 and 2.

  As is clear from Tables 1 and 2, the sealing resin compositions of the examples both have good high-temperature storage properties and high-temperature reflow resistance, and are excellent in flame retardancy.

Claims (6)

(A) an epoxy resin, (B) a nitrogen-modified phenol resin-based curing agent, (C) aluminum hydroxide and (D) an inorganic filler,
The aluminum hydroxide as the component (C) has a Na ₂ O content of 0.1% by weight or less, and
The inorganic filler of the component (D) has an average particle size of 1 to 60 μm and a maximum particle size of 200 μm or less,
A sealing resin composition characterized by being substantially free of a halogen-based flame retardant and an antimony-based flame retardant.   The aluminum hydroxide as the component (C) has an average particle size of 1 to 20 μm, a maximum particle size of 75 μm or less, and the surface is treated with a liquid precursor for forming a glass matrix. The resin composition for sealing according to claim 1.   The resin composition for sealing according to claim 1 or 2, wherein the content of the aluminum hydroxide as the component (C) is 4 to 40% by weight of the whole composition.   The total content of the aluminum hydroxide as the component (C) and the inorganic filler as the component (D) is 65 to 90% by weight of the entire composition. The sealing resin composition according to Item.   The resin composition for sealing according to any one of claims 1 to 4, wherein the nitrogen-modified phenolic resin-based curing agent (B) is a benzoguanamine-modified phenol resin and / or a melamine-modified phenol resin. object.   6. A semiconductor device, wherein a semiconductor element is encapsulated with a cured product of the encapsulating resin composition according to claim 1.