JP4825607B2 - Polishing apparatus and polishing method using the same - Google Patents

Description

  The present invention relates to a polishing apparatus and a polishing method using the same, and more particularly to a polishing apparatus for chamfering and polishing a tip portion of a spiral wire and a polishing method using the same.

  An example of an end processing apparatus for chamfering an edge of a wire and polishing the end surface is disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-127010. The end processing apparatus of this publication is composed of a transport apparatus that sequentially transports the rod-shaped body while rotating it, and a rotary polishing apparatus that chamfers the end of the rod-shaped body that is transported by the transport apparatus.

It is described in the above publication that according to this end processing apparatus, even if the lengths of the rod-like bodies to be sequentially conveyed are not uniform, chamfering processing of the end can be smoothly performed continuously.
JP 2000-127010 A

  However, the end portion processing apparatus disclosed in the above publication is for processing a rod-like body and not for processing a spiral wire. In the case of a spiral wire, the tip of the spiral wire rotates circumferentially around the spiral axis as it rotates. Therefore, the end portion processing apparatus for the rod-shaped body cannot chamfer the entire periphery of the end edge of the spiral wire rod.

  Also, when the polishing of the spiral wire is performed manually, for example, the operator grasps a workpiece bundle made of about 50 spiral wires, presses the workpiece against the grinder, and then polishes the workpiece while rotating the workpiece manually. According to this method, it is possible to planarize the end face of the tip of each spiral wire, but it is not possible to chamfer the edge of the tip of each spiral wire.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a polishing apparatus and a polishing method using the same that can efficiently polish the entire periphery of the edge of the tip of the helical wire without manual operation. And

The polishing apparatus of the present invention chamfers and polishes the tip end portion while rotating the spiral wire rod around its spiral axis and rotating the tip end portion of the spiral wire rod around the spiral axis. The polishing apparatus includes a polishing member, and the polishing member is configured to move relative to the spiral wire following the rotation of the tip around the spiral axis while contacting the tip of the spiral wire. ing.

  According to the polishing apparatus of the present invention, the polishing member can move following the rotation of the tip of the helical wire. For this reason, it is possible to keep the polishing member in contact with the tip of the spiral wire that rotates circumferentially around the spiral axis. As a result, it is possible to chamfer the entire periphery of the edge of the tip of the spiral wire without manual intervention.

  In the above polishing apparatus, the angle of the polishing surface of the polishing member with respect to the helical axis is preferably adjustable. Thereby, the angle which a grinding | polishing surface contact | abuts to the front-end | tip part of a spiral wire can be selected freely. For this reason, it becomes possible to select freely the angle of chamfering polishing of the front-end | tip part of a helical wire.

  Preferably, the above-described polishing apparatus is configured such that the above-described angle can be adjusted so that the polishing surface of the polishing member is perpendicular to the helical axis of the helical wire. Thereby, it can grind | polish by making a grinding | polishing surface perpendicular | vertical with respect to the helical axis | shaft of a helical wire. Therefore, not only the chamfering process but also the end face of the spiral wire can be polished. Therefore, by this polishing, the length of the spiral wire can be adjusted, or the end surface of the spiral wire can be smoothed.

  In the above polishing apparatus, the polishing member is preferably disposed on each of both sides of the spiral wire. Thereby, grinding | polishing of the front-end | tip part of the both ends of a spiral wire can be performed simultaneously. Therefore, it can polish efficiently.

  In the above polishing apparatus, preferably, the width of the polishing member is equal to or greater than the outermost circumference of the spiral wire. As a result, the polishing member can be kept in contact with the tip portion of the spiral wire while the spiral wire is rolled by one rotation, and the entire periphery of the edge of the tip of the spiral wire can be chamfered. .

  The above polishing apparatus is preferably configured so that the roughness of the polishing member changes stepwise. Thereby, it is possible to continuously perform the polishing with the polishing member whose roughness changes stepwise. Therefore, both rough polishing and final polishing can be performed by one polishing process.

  The above polishing apparatus is preferably configured so that the tension of the polishing surface of the polishing member can be adjusted. Thereby, the deflection amount of the polishing surface that is in contact with the tip of the helical wire can be adjusted. Therefore, it is possible to chamfer the curvature corresponding to the deflection amount of the polished surface.

  Preferably, in the above polishing apparatus, chamfering polishing is performed while moving the spiral wire so that its spiral axis is displaced in a direction perpendicular to the direction of the spiral axis. Thereby, it is possible to prevent the spiral wire from staying at a position where it comes into contact with the polishing member. Therefore, the helical wire can be continuously fed.

  The polishing method of the present invention is performed using the above-described polishing apparatus. At this time, a plurality of spiral wires are continuously fed into the polishing apparatus. According to the polishing method of the present invention, since the spiral wire is continuously charged, polishing can be performed efficiently.

  As described above, according to the present invention, the tip of the spiral wire that rotates circumferentially around the helical axis can be kept in contact with the polishing member of the polishing apparatus. Thus, the entire periphery of the end edge of the spiral wire can be chamfered.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the polishing apparatus 100 of the present embodiment will be described.

  FIG. 1 is a perspective view schematically showing an external structure of a polishing apparatus according to Embodiment 1 of the present invention. With reference to FIG. 1, the polishing apparatus 100 according to the present embodiment includes polishing units GL and GR, a lower conveyor C1, an upper pressing plate 21, a pressing spring 22, and a side guide 11.

  The lower conveyor C1 can transfer the spiral wire rod HW placed on the upper surface thereof from the upper left arrow IN to the lower right arrow OUT in the drawing. Side guides 11 for regulating the position of the spiral wire HW placed on the lower conveyor C1 are arranged on both sides of the lower conveyor C1 on the upstream side (arrow IN side).

  An upper pressing plate 21 is suspended by a pressing spring 22 above the downstream side (arrow OUT side) of the lower conveyor C1. A gap is provided between the lower conveyor C1 and the upper pressing plate 21. The upper end of the holding spring 22 is fixed to the structure (not shown). The lower conveyor C1 and the upper holding plate 21 sandwich the helical wire HW while pressing it, and the lower conveyor C1 is driven to rotate the helical wire HW around its spiral axis as indicated by a rotating arrow in the figure. It is possible to make it.

  Polishing parts GL and GR are respectively arranged on both sides of the place where the upper pressing plate 21 of the lower conveyor C1 is provided.

  FIG. 2 is a side view schematically showing the external structure of the polishing parts GL and GR shown in FIG. Referring to FIG. 2, each of the polishing portions GL and GR has a polishing belt BT as a polishing member, and the polishing belt BT is attached to the tip of the spiral wire HW that rotates circumferentially around the spiral axis. It is configured to move relative to the spiral wire HW following the rotation of the tip while abutting. The configuration will be specifically described below.

  With reference to FIG. 2, the polishing belt BT is fixed to the polishing member mounting plate 44. The upper part of the polishing member mounting plate 44 is rotatably supported by one of the tilting air cylinders 31 by the joint J2, and the lower part of the polishing member mounting plate 44 is rotatably supported by the slider 43 by the joint J3. The other side of the tilting air cylinder 31 is rotatably supported by the slider 43 by a joint J1. The slider 43 is supported by the frame 42 via the slide rail 36 and can slide with respect to the frame 42. This sliding direction (direction of arrow A2 in FIG. 2) is a direction in which the slider 43 approaches or moves away from the spiral wire HW. With this configuration, the polishing belt BT can move relative to the spiral wire HW as the slide rail 36 slides.

  Further, the polishing belt BT is configured to be urged in a direction toward the spiral wire HW. That is, a pressure spring 35 is provided between the frame 42 and the slider 43, and the polishing belt BT is urged by the pressure spring 35.

  Here, the spiral wire HW is a wire that spirally extends along the spiral axis AX, as shown in FIG. 5 which is an enlarged view of the broken line portion of FIGS. 4 and 4. That is, the spiral wire HW extends so as to be inscribed in a side surface of a virtual cylinder having a diameter D with the spiral axis AX as a central axis. Since the tip end of the spiral wire HW is usually deviated from the spiral axis AX, when the spiral wire HW is rotated, the tip end portion is rotated around the spiral axis AX.

  For this reason, in FIG. 2, when the position of the polishing belt BT is fixed, the polishing belt BT may not contact the spiral wire HW due to the rotation of the spiral wire HW. However, as described above, the polishing belt BT can move relative to the spiral wire HW and is biased toward the spiral wire HW by the pressure spring 35. For this reason, for example, as shown in FIG. 6, when the tip of the spiral wire HW rotates circumferentially and is positioned below the spiral axis AX, the polishing belt BT is advanced and slid to the spiral wire HW side. Thus, the biasing force of the pressure spring 35 can be brought into contact with the tip of the spiral wire HW. Further, as shown in FIG. 7, when the tip of the spiral wire HW rotates in a circumferential shape and is positioned above the spiral axis AX, the polishing belt BT slides backward with respect to the spiral wire HW. The urging force of the pressure spring 35 can contact the tip of the spiral wire HW.

  As shown in FIG. 2, the frame 42 is placed on the base 41 via the forward air cylinder 37. With this forward air cylinder 37, the relative position between the frame 42 and the spiral wire HW can be adjusted in the direction of the arrow A1 in the figure. Therefore, if the forward air cylinder 37 is adjusted so that the frame 42 is sufficiently close to the spiral wire HW, the pressure spring 35 is compressed even if the tip of the spiral wire HW moves within a certain range. The state is maintained. Therefore, the pressurizing spring 35 can continue to apply a biasing force that causes the polishing belt BT to abut on the tip of the spiral wire HW.

  The polishing belt BT is configured such that the angle of the polishing surface 50 with respect to the helical axis AX (angle θ in FIG. 2) can be adjusted. For example, when the shaft length L of the tilting air cylinder 31 is shortened, the distance between the joint J1 and the joint J2 is shortened, whereby the polishing member mounting plate 44 is centered on the joint J3 with respect to the slider 43 in the drawing. The angle θ can be increased by rotating clockwise. The angle θ can also be made vertical. Conversely, when the shaft length of the tilting air cylinder 31 is increased, the distance between the joint J1 and the joint J2 is increased, whereby the polishing member mounting plate 44 is centered on the joint J3 with respect to the slider 43. The angle θ can be reduced by rotating counterclockwise.

  Further, the polishing portions GL and GR of the present embodiment can prevent the slider 43 described above from sliding as necessary. For this purpose, the frame 42 is provided with a stopper 33 and a stopper air cylinder 32, and the slider 43 is provided with a stopper receiving portion 34. The stopper 33 can be protruded toward the slider 43 by the stopper air cylinder 32 and fitted into the stopper receiving portion 34. When the stopper 33 is engaged with the stopper receiving portion 34, the slider 43 cannot slide with respect to the frame 42, and the relative position between the slider 43 and the frame 42 is fixed.

  Further, the polishing belt BT has a polishing surface 50 for contacting the tip of the spiral wire HW, and the polishing surface 50 has an abrasive. Further, the polishing belt BT is configured to be driven by a belt so that the tip of the spiral wire HW can be polished by friction. In addition, it is preferable that the roughness of the polishing surface 50 of the polishing belt BT changes stepwise. Specifically, as shown in FIG. 3, the polishing belt BT has a rough polishing belt BT1 having a width W1 on the upstream side in the flow direction (arrow in the drawing) of the lower conveyor C1, and a finishing polishing belt BT2 having a width W2 on the downstream side. It is preferable to have.

  Further, the polishing belt BT has a width W (FIG. 1) equal to or greater than the outermost circumference of the spiral wire HW. Here, the outermost circumference dimension of the spiral wire HW is the circumference dimension of a virtual cylinder having a diameter D indicated by a broken line in FIG. Further, when the polishing belt BT includes the rough polishing belt BT1 and the finish polishing belt BT2 as shown in FIG. 3, each of the rough polishing belt BT1 and the finish polishing belt BT2 is equal to or larger than the outermost circumference of the spiral wire HW. It preferably has widths W1 and W2.

  Further, the tension of the polishing surface 50 of the polishing belt BT can be adjusted. The tension can be adjusted, for example, by changing the belt length or the belt material.

  Moreover, as shown in FIG. 1, the conveyance mechanism of the helical wire HW has a lower conveyor C1 that flows from the IN side to the OUT side in the drawing. The direction of this flow is perpendicular to the direction of the spiral axis AX of the spiral wire HW. Therefore, the spiral axis AX is moved by the lower conveyor C1 so as to be displaced in a direction perpendicular to the spiral axis AX (a direction from the IN side to the OUT side in the figure), and chamfering polishing or the like is performed during this movement.

Next, an end surface polishing method using the polishing apparatus 100 of the present embodiment will be described.
FIG. 8 is a perspective view schematically showing a state in which the helical wire rod is put into the polishing apparatus in the first embodiment of the present invention. Referring to FIG. 8, a plurality of spiral wires HW are continuously charged on the upstream side of lower conveyor C1. The direction of the spiral wire HW at this time is such that the spiral axis AX is perpendicular to the traveling direction of the lower conveyor C1 (the arrow direction in the figure).

  As the lower conveyor C1 moves (in the direction of the arrow in the figure), the spiral wire HW reaches the side guide 11 portion. The side guide 11 corrects the positional deviation of the spiral wire HW.

  Thereafter, the spiral wire HW is further conveyed downstream, and is put into a gap between the lower conveyor C1 and the upper pressing plate 21. In the state where the spiral wire HW is not contained, the gap is narrower than the outermost diameter D of the spiral wire HW, but the gap is expanded to the outermost diameter D by entering the spiral wire HW. The upper pressing spring 22 is compressed and the spiral wire HW is sandwiched between the upper pressing plate 21 and the lower conveyor C1 by the spring force.

  When the spiral wire HW is sandwiched, the upper holding plate 21 does not move, and the lower conveyor C1 moves in a direction perpendicular to the spiral axis AX. Therefore, the spiral wire HW sandwiched between the two is centered on the spiral axis AX. It is conveyed on the lower conveyor C1 while rotating. In connection with this, the front-end | tip part of the helical wire HW rotates in the periphery shape centering around the helical axis AX. With this rotational movement, the spiral wire HW passes through the area where the polishing parts GL and GR are installed, and is polished at that time.

  FIG. 9 is a front view schematically showing the state of end face polishing in the first embodiment of the present invention. Referring to FIG. 9, the polishing surface of each of the polishing belts BT of the polishing portions GL and GR is perpendicular to the spiral axis AX. Further, the interval between the polishing surface 50 of the polishing part GL and the polishing surface 50 of the polishing part GR is set to a desired finished length WL of the spiral wire HW. In this state, the spiral wire HW is sandwiched between the polishing surface 50 of the polishing part GL and the polishing surface 50 of the polishing part GR, and the end surface of the spiral wire HW is polished by the polishing belt BT.

  Referring to FIG. 3, the polishing is first performed by rough polishing belt BT1. Then, as the spiral wire HW progresses in the direction of the arrow in the drawing, the process shifts from polishing with the rough polishing belt BT1 to polishing with the finish polishing belt BT2.

  FIG. 10 is a side view schematically showing how the polishing apparatus in Embodiment 1 of the present invention performs end surface polishing. Referring to FIG. 10, polishing parts GL and GR take a posture for end face polishing. Specifically, first, the stopper 33 is pushed down by the stopper air cylinder 32 and fitted into the stopper receiving portion 34. Further, the tilting air cylinder 31 is contracted, the joint J2 is drawn toward the tilting air cylinder 31, and the polishing surface 50 of the polishing belt BT is made perpendicular to the spiral axis AX. Further, the frame 42 is advanced in the direction of the arrow by the forward air cylinder 37 so that the polishing surface 50 comes to a position where it comes into contact with the tip of the spiral wire HW.

  With reference to FIG. 1, the spiral wire HW subjected to end surface polishing is taken out from the downstream side OUT of the lower conveyor C1. As described above, the spiral wire HW subjected to end face polishing is obtained. By this end surface polishing, the portion of the end surface SD of the spiral wire HW shown in FIG. 5 is scraped, so that the overall length of the spiral wire HW can be adjusted or the smoothness of the end surface SD can be increased.

Next, a chamfering polishing method using the polishing apparatus 100 of the present embodiment will be described.
Referring to FIG. 8, the spiral wire HW that has been subjected to the end face polishing is put into the polishing apparatus 100 as in the case of the end face polishing method described above. The spiral wire HW is transported to the downstream side by the lower conveyor C <b> 1 and is put in the gap between the lower conveyor C <b> 1 and the upper pressing plate 21. Since the movement of the spiral wire HW sandwiched between the lower conveyor C1 and the upper pressing plate 21 is the same as in the case of the end surface polishing method described above, the description thereof is omitted.

  FIG. 11 is a front view schematically showing a state of chamfering polishing in the first embodiment of the present invention. Referring to FIG. 11, the polishing surface 50 of each of the polishing belts BT of the polishing portions GL and GR has an angle θ with respect to the spiral axis AX. The spiral wire HW is sandwiched between the polishing belts BT of each of the polishing portions GL and GR, and the edge EG portions at both ends of the spiral wire HW shown in FIG. 5 are scraped by the polishing belt BT. Thereby, the edge EG of the spiral wire HW is chamfered.

  Referring to FIG. 6, during chamfering polishing, polishing parts GL and GR take a posture for chamfering polishing. Specifically, first, the stopper air cylinder 32 contracts, the stopper 33 is pulled up, and is removed from the stopper receiving portion 34. Further, the tilting air cylinder 31 is extended, the joint J2 is separated from the tilting air cylinder 31, and the polishing surface 50 of the polishing belt BT is at an angle θ with respect to the spiral axis AX. Further, the position of the frame 42 is determined by the forward air cylinder 37 so that the pressure spring 35 is kept in a compressed state by the force accompanying the contact between the polishing surface 50 and the tip of the spiral wire HW. It is adjusted in the direction of the middle arrow.

  Referring to FIG. 7, when the tip end portion is displaced from the lower side to the upper side in the drawing as the spiral wire HW rotates, a force for pushing the polishing belt BT to the right side in the drawing is applied. As a result, the slider 43 slides on the slide rail 36 to the right in the drawing, and the pressure spring 35 is further compressed as compared with the state of FIG. Thereafter, when the tip of the spiral wire HW is displaced again from above to below, the state of FIG. 6 is restored. Therefore, following the rotation of the spiral wire HW, the polishing belt BT moves between the position state of FIG. 6 and the position state of FIG. 7, and the state where the polishing belt BT and the spiral wire HW are in contact with each other is maintained. Is done.

  FIG. 12 is a side view schematically illustrating the position where the spiral wire is rotated once and the chamfered polishing is performed by the polishing apparatus according to Embodiment 1 of the present invention. Referring to FIG. 12, a time t1, which is the moment when the tip of the spiral wire HW descends, is set as an initial state, and then after time t2 to t4, a time t5 at which the spiral wire HW completes one rotation is reached. The movement of one spiral wire HW is shown. During time t1 to t5, the lower conveyor C1 advances relative to the spiral wire HW in the right direction in the drawing by the outermost circumference dimension πD of the spiral wire HW, and the spiral wire HW is 1 around the spiral axis AX. Rotate. At this time, since the upper edge portions P1 to P5 of the front end portion of the spiral wire HW are polished by the polishing belt BT, the entire circumference of the end edge EG of the front end portion is chamfered. During this time, the spiral axis AX of the spiral wire HW moves by the outermost circumference dimension πD of the spiral wire HW in the direction perpendicular to the spiral axis AX (the direction of the broken line arrow in the figure).

  Referring to FIG. 3, chamfering polishing is first performed by a rough polishing belt BT1 having a width W1. The width W1 is equal to or greater than the outermost circumference dimension πD, and the entire circumference of the edge of the spiral wire HW is chamfered by the rough polishing belt BT1 at least once. Then, as the spiral wire HW advances in the direction of the arrow in the drawing, the polishing shifts from the polishing with the rough polishing belt BT1 to the polishing with the finish polishing belt BT2 having the width W2. The width W2 is also equal to or greater than the outermost peripheral dimension πD, and the entire periphery of the edge of the spiral wire HW is chamfered by the finish polishing belt BT2 at least once.

  Referring to FIG. 1, the spiral wire HW that has been chamfered and polished is taken out from the downstream side OUT of the lower conveyor C1. In this way, the spiral wire HW that has been chamfered and polished is obtained.

  FIG. 13 is a side view schematically showing a front end portion of spiral wire HW subjected to end surface polishing and chamfering polishing in Embodiment 1 of the present invention. Referring to FIG. 13, a smooth surface FP perpendicular to the spiral axis AX is formed by end face polishing. Further, the chamfering CP performed at the angle θ is applied to the end edge portion of the tip portion by the chamfering polishing performed after the end surface polishing.

  FIG. 14 is a side view schematically showing a front end portion of spiral wire HW that has been subjected to end surface polishing and chamfering polishing in a modification of the first embodiment of the present invention. Referring to FIG. 14, the difference from Embodiment 1 is that chamfering is performed in a state where the tension of polishing surface 50 of polishing belt BT is low. When the tension is low, the polishing surface is likely to bend due to the contact of the tip of the spiral wire HW. In accordance with the curvature of this deflection, in the first embodiment, the flat portion such as the chamfer CP becomes a curved chamfer RP. By adjusting the tension of the polishing surface 50, chamfering can be performed with a desired curvature.

  According to the polishing apparatus 100 of the present embodiment, as shown in FIGS. 6 and 7, the polishing apparatus 100 chamfers the tip portion while rotating the helical wire HW around the helical axis AX. The polishing apparatus 100 includes a polishing belt BT that is a polishing member, and the polishing belt BT moves relative to the spiral wire HW following the rotation of the tip while contacting the tip of the spiral wire HW. It is configured to be possible. As a result, the polishing belt BT can continue to contact the tip of the spiral wire HW while chamfering. Therefore, it is possible to chamfer the entire circumference of the edge EG of the tip end portion of the spiral wire material without manual intervention.

  Further, according to the polishing apparatus 100 of the present embodiment, the angle θ of the polishing surface 50 shown in FIG. 6 can be adjusted by adjusting the expansion / contraction state of the tilting air cylinder 31. Thereby, the chamfering angle θ of the helical wire HW shown in FIG. 13 can be arbitrarily selected.

  Further, according to the present embodiment, the angle of the polishing surface 50 can be made perpendicular to the helical axis AX by sufficiently contracting the tilting air cylinder 31 as shown in FIG. Further, the distance WL between the polished surfaces at both ends of the spiral wire HW shown in FIG. 9 can be adjusted by the forward air cylinder 37 shown in FIG. Thereby, the length of the spiral wire HW can be adjusted, and the end surface of the spiral wire HW can be made into the smooth surface FP shown in FIG.

  Further, according to the polishing apparatus 100 of the present embodiment, as shown in FIGS. 9 and 11, the polishing belt BT which is a polishing member is disposed on each of both sides of the spiral wire HW. Thereby, the front-end | tip part of the both ends of the helical wire HW can be grind | polished simultaneously, and it can grind | polish efficiently.

  Further, according to the polishing apparatus 100 of the present embodiment, the width W of the polishing belt BT shown in FIG. 1 or the widths W1 and W2 of the polishing belts BT1 and BT2 shown in FIG. It is said above. As a result, as shown in FIG. 12, even if the spiral axis AX moves by the outermost circumference dimension πD while the spiral wire HW rotates once, the tip of the spiral wire HW continues to contact the polishing belts BT, BT1, BT2. be able to. Therefore, it is possible to chamfer the entire circumference of the end edge of the spiral wire HW while moving the spiral axis AX by the outermost circumference dimension πD of the spiral wire HW.

  Further, according to the polishing apparatus 100 of the present embodiment, as shown in FIG. 3, the polishing belt BT is separated from the upstream rough polishing belt BT1 and the downstream finish polishing belt BT2 in the traveling direction of the lower conveyor C1. It is configured. As a result, the roughness of the polishing member is one step smaller on the downstream side than on the upstream side. For this reason, it is possible to continuously perform the polishing with the polishing member whose roughness changes stepwise. Therefore, both rough polishing and finish polishing can be performed by one polishing process.

  Further, according to the polishing apparatus 100 of the present embodiment, the tension of the polishing surface 50 of the polishing belt BT shown in FIG. 3 can be adjusted. Thereby, the deflection amount of the polishing surface when the polishing surface 50 polishes the spiral wire HW can be adjusted. Therefore, as shown in FIG. 14, chamfering can be performed with a curvature corresponding to the amount of deflection.

  Further, according to the polishing apparatus 100 of the present embodiment, as shown in FIG. 12, the spiral axis AX of the spiral wire HW moves perpendicularly to the spiral axis AX as the spiral wire HW rotates. For this reason, the spiral wire HW moves toward the polishing parts GL and GR at the fixed position, is polished by the polishing parts GL and GR, and can then move away from the polishing parts GL and GR. Thereby, it is possible to prevent the spiral wire HW from staying in one place.

  Further, according to the polishing method of the present embodiment, the helical wire HW is continuously fed into the polishing apparatus 100 described above. For this reason, a plurality of spiral wires HW are simultaneously processed, and polishing can be performed efficiently.

  In the present embodiment, the spiral wire HW that has undergone end surface polishing is once taken out from the polishing apparatus 100 and then re-entered into the polishing apparatus 100 to perform chamfering polishing. It is not limited. If the lower conveyor C1 and the upper holding plate 21 are extended to the downstream side of the process and another set of polishing parts GL and GR are installed on both sides of the extension part, the end face is formed by the upstream set of polishing parts GL and GR. Polishing can be performed, and chamfering polishing can be performed by a set of polishing parts GL and GR on the downstream side. In this case, both the end face polishing and the chamfering polishing can be performed by one time insertion of the spiral wire HW.

  In the present embodiment, the pressure spring 35 is used as the urging means for urging the polishing belt BT toward the spiral wire HW. However, the present invention is not limited to this.

  Further, in the present embodiment, the slide rail 36 is used as the moving means that enables the polishing belt BT to move toward the spiral wire HW, but the present invention is not limited to this.

(Embodiment 2)
In the first embodiment, the configuration in which the spiral wire HW is sandwiched between the lower conveyor C1 and the upper presser plate 21 has been described. It is good also as a structure pinched | interposed by C1 and the upper conveyor C2. Hereinafter, the configuration will be described. Since the configuration other than this is almost the same as that of the first embodiment, the same elements are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 15 is a perspective view schematically showing an external structure of a polishing apparatus according to Embodiment 2 of the present invention. Referring to FIG. 15, an upper pressing plate 21 is suspended by a pressing spring 22 above the lower conveyor C <b> 1. On the lower surface side of the upper pressing plate 21, an upper conveyor C2 is provided. A gap narrower than the outermost diameter D of the spiral wire HW is provided between the lower conveyor C1 and the upper conveyor C2. The upper end of the presser spring 22 is fixed to the structure (not shown).

  Next, the movement of the spiral wire HW in the chamfering process of the spiral wire HW using the polishing apparatus 100 of the present embodiment will be described.

  Referring to FIG. 15, a plurality of spiral wires HW are continuously charged on the upstream side of the lower conveyor C1 (upper left side in the figure). With the movement of the lower conveyor C1, the spiral wire HW is put into the gap between the lower conveyor C1 and the upper conveyor C2.

  FIG. 16 is a front view schematically showing how the spiral wire moves in the second embodiment of the present invention. Referring to FIG. 16, the spiral wire rod HW placed between the upper conveyor C2 and the lower conveyor C1 pushes the gap between the upper conveyor C2 and the lower conveyor C1, It is sandwiched between the upper conveyor C2 and the lower conveyor C1 by the spring force. The sandwiched spiral wire HW rotates around the spiral axis AX at a speed corresponding to the speed difference between the speed of the lower conveyor C1 and the speed of the upper conveyor C2.

  FIG. 17 is a side view schematically illustrating a movement in which the spiral wire is rotated once by the polishing apparatus according to Embodiment 2 of the present invention and a position at which chamfering is performed. Referring to FIG. 17, time t1, which is the moment when the tip of spiral wire HW has been lowered, is set as an initial state, and thereafter time t2 to t4 are sequentially passed until time t5 at which spiral wire HW completes one rotation. The movement of one spiral wire HW is shown.

  While the spiral wire HW rotates once around the spiral axis AX from time t1 to t5, the upper edge portions P1 to P5 of the tip of the spiral wire HW are polished by the polishing belt BT. Chamfering is performed.

  While the spiral wire HW makes one rotation, the lower conveyor C1 advances in the right direction in the figure, and at this time, the upper conveyor C2 also advances at the same time. The moving distance of the upper conveyor C2 is a distance α in the direction opposite to the lower conveyor C1 (left direction in the figure). Then, the spiral axis AX of the spiral wire HW advances in the right direction in the drawing by πD−α. That is, the movement distance of the spiral axis AX of the present embodiment is shorter by the distance α than the movement distance πD of the spiral axis AX in the case of the first embodiment shown in FIG.

  According to the polishing apparatus 100 of the present embodiment, as shown in FIG. 17, the moving distance of the spiral axis AX during one rotation of the spiral wire HW is πD−α. For this reason, the movement distance of the spiral axis AX per one rotation of the spiral wire HW can be adjusted by adjusting the movement distance α of the upper conveyor C2. Therefore, even if the width W of the polishing belt BT shown in FIG. 1 or the widths W1 and W2 of the polishing belts BT1 and BT2 shown in FIG. 3 is smaller than πD, by selecting an appropriate value of α, the spiral wire HW It is possible to polish the entire periphery of the edge of the tip.

  For example, when α = πD / 2, the moving distance of the spiral axis AX during one rotation of the spiral wire HW is πD−α = πD / 2. Therefore, if the widths W, W1, and W2 of the polishing belts BT, BT1, and BT2 are πD / 2 or more, it is possible to polish the entire periphery of the end edge of the spiral wire HW. In the case of this α, if the widths W, W1, and W2 of the polishing belts BT, BT1, and BT2 are πD or more, the entire periphery of the end edge of the spiral wire HW can be polished two or more times. In addition, the polishing can be performed more uniformly than when polishing only one round.

  Each embodiment disclosed this time must be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied particularly advantageously to a polishing apparatus for polishing a tip portion of a helical wire and a polishing method using the same.

It is a perspective view which shows roughly the external appearance structure of the grinding | polishing apparatus in Embodiment 1 of this invention. It is a side view which shows roughly the external appearance structure of the grinding | polishing part of the grinding | polishing apparatus in Embodiment 1 of this invention. It is a perspective view which shows roughly the external appearance structure of the grinding | polishing member of the grinding | polishing apparatus in Embodiment 1 of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external view schematically showing a helical wire that is polished by a polishing apparatus according to a first embodiment of the present invention. FIG. 5 is an overview diagram schematically showing a region surrounded by a broken line in FIG. 4. It is a side view which shows roughly the structure which enables a grinding | polishing member to be moved when the grinding | polishing apparatus in Embodiment 1 of this invention performs chamfering grinding | polishing. It is a side view which shows roughly the structure which enables a grinding | polishing member to be moved when the grinding | polishing apparatus in Embodiment 1 of this invention performs chamfering grinding | polishing. It is a perspective view which shows roughly the mode of the injection | throwing-in to the grinding | polishing apparatus of the helical wire in Embodiment 1 of this invention. It is a front view which shows roughly the mode of the end surface grinding | polishing in Embodiment 1 of this invention. It is a side view which shows roughly a mode that the grinding | polishing apparatus in Embodiment 1 of this invention performs end surface grinding | polishing. It is a front view which shows roughly the mode of the chamfering grinding | polishing in Embodiment 1 of this invention. It is a side view which illustrates roughly the position where a spiral wire rod is rotated once by the polishing apparatus according to Embodiment 1 of the present invention, and the position where chamfering is performed. It is a side view which shows roughly the front-end | tip part of the spiral wire HW in which the end surface grinding | polishing and the chamfering grinding | polishing in Embodiment 1 of this invention were given. It is a side view which shows roughly the front-end | tip part of the helical wire HW in which the end surface grinding | polishing and the chamfering grinding | polishing in the modification of Embodiment 1 of this invention were performed. It is a perspective view which shows roughly the external appearance structure of the grinding | polishing apparatus in Embodiment 2 of this invention. It is a front view which shows roughly the mode of the movement of the spiral wire in Embodiment 2 of this invention. It is a side view which illustrates roughly the position where a spiral wire rod is rotated once by a polishing apparatus in Embodiment 2 of the present invention and chamfering is performed.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 Side guide, 21 Upper pressing plate, 22 Pressing spring, 31 Inclination air cylinder, 35 Pressure spring, 36 Slide rail, 42 Frame, 43 Slider, 50 Polishing surface, 100 Polishing device, AX Spiral shaft, BT Polishing belt, BT1 coarse polishing belt, BT2 finishing polishing belt, C1 lower conveyor, C2 upper conveyor, GL, GR polishing section, HW spiral wire.

Claims (9)

A polishing apparatus that chamfers and polishes the tip while rotating the spiral wire around the spiral axis and rotating the tip of the spiral wire around the spiral axis,
A polishing apparatus comprising: a polishing member configured to move relative to the spiral wire following the rotation of the tip around the spiral axis while contacting the tip of the spiral wire.   The polishing apparatus according to claim 1, wherein an angle of the polishing surface of the polishing member with respect to the spiral axis is adjustable.   The polishing apparatus according to claim 2, wherein the angle is adjustable so that the polishing surface is perpendicular to the spiral axis.   The polishing apparatus according to claim 1, wherein the polishing member is disposed on each of both sides of the spiral wire.   The polishing apparatus according to claim 1, wherein a width of the polishing member is equal to or greater than an outermost peripheral dimension of the spiral wire.   The polishing apparatus according to claim 1, wherein the roughness of the polishing member changes stepwise.   The polishing apparatus according to claim 1, wherein a tension of a polishing surface of the polishing member is adjustable.   The polishing apparatus according to any one of claims 1 to 7, wherein the chamfering polishing is performed while moving the spiral wire so that the spiral axis is displaced in a direction perpendicular to the direction of the spiral axis. A polishing method using the polishing apparatus according to claim 1,
A polishing method, wherein a plurality of the helical wires are continuously fed into the polishing apparatus.

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