JP4825003B2 - 窒化物半導体発光素子及び窒化物半導体発光素子製造方法 - Google Patents
窒化物半導体発光素子及び窒化物半導体発光素子製造方法 Download PDFInfo
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- JP4825003B2 JP4825003B2 JP2005377762A JP2005377762A JP4825003B2 JP 4825003 B2 JP4825003 B2 JP 4825003B2 JP 2005377762 A JP2005377762 A JP 2005377762A JP 2005377762 A JP2005377762 A JP 2005377762A JP 4825003 B2 JP4825003 B2 JP 4825003B2
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- nitride semiconductor
- light emitting
- emitting device
- stress relaxation
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Description
10 n電極
11 n−GaNコンタクト層
12 n型超格子層
13 MQW活性層
14 p−AlGaN電子バリア層
15 p−GaNコンタクト層
16 透明電極
17 絶縁膜
18 反射膜
19 パッド電極
20 応力緩和接合層
Claims (4)
- 少なくともn側電極、n型窒化物半導体層、発光領域、p型窒化物半導体層、p側電極とを順に備えた半導体積層体が応力緩和接合層を介して支持基板上に接合された窒化物半導体発光素子において、
前記応力緩和接合層は、光の波長550nmでの反射率が60%以下の特性を有する非光沢Auメッキ層を含むことを特徴とする窒化物半導体発光素子。 - 前記非光沢Auメッキ層は、厚さ1μm以上で構成されていることを特徴とする請求項1記載の窒化物半導体発光素子。
- 少なくともn型窒化物半導体層、発光領域、p型窒化物半導体層、p側電極とを順に備えた半導体積層体を支持基板上に接合する窒化物半導体発光素子製造方法において、
前記半導体積層体の接合面には非光沢Auメッキ層を含む第1応力緩和接合層が形成され、前記支持基板の接合面には非光沢Auメッキ層を含む第2応力緩和接合層が形成されており、前記非光沢Auメッキ層は光の波長550nmでの反射率が60%以下の特性を有するものであって、前記第1応力緩和接合層と第2応力緩和接合層とを熱圧着で接合することを特徴とする窒化物半導体発光素子製造方法。 - 前記第1応力緩和接合層及び第2応力緩和接合層に含まれる非光沢Auメッキ層は、いずれも厚さ1μm以上で構成されていることを特徴とする請求項3記載の窒化物半導体発光素子製造方法。
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JP2005377762A JP4825003B2 (ja) | 2005-12-28 | 2005-12-28 | 窒化物半導体発光素子及び窒化物半導体発光素子製造方法 |
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JP2005377762A JP4825003B2 (ja) | 2005-12-28 | 2005-12-28 | 窒化物半導体発光素子及び窒化物半導体発光素子製造方法 |
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JP2007180302A JP2007180302A (ja) | 2007-07-12 |
JP4825003B2 true JP4825003B2 (ja) | 2011-11-30 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5334158B2 (ja) * | 2008-07-15 | 2013-11-06 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
JP5057398B2 (ja) | 2008-08-05 | 2012-10-24 | シャープ株式会社 | 窒化物半導体発光素子およびその製造方法 |
JP5075165B2 (ja) * | 2009-05-29 | 2012-11-14 | 古河電気工業株式会社 | 半導体装置 |
JP5725927B2 (ja) * | 2010-05-18 | 2015-05-27 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 高効率発光ダイオード及びその製造方法 |
TWI449210B (zh) * | 2010-06-01 | 2014-08-11 | Huga Optotech Inc | 發光元件 |
JP2012227383A (ja) * | 2011-04-20 | 2012-11-15 | Showa Denko Kk | 半導体発光素子、電極構造および発光装置 |
KR20140002014U (ko) * | 2011-06-17 | 2014-04-04 | 아이피지 포토닉스 코포레이션 | 반도체 장치를 위한 서브 마운트를 구비한 반도체 유닛 |
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JPH08115928A (ja) * | 1994-10-17 | 1996-05-07 | Hitachi Ltd | 半導体装置およびその製造方法 |
DE10051465A1 (de) * | 2000-10-17 | 2002-05-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements auf GaN-Basis |
EP2894678A1 (de) * | 2003-01-31 | 2015-07-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements |
JP4451683B2 (ja) * | 2003-03-13 | 2010-04-14 | 昭和電工株式会社 | 半導体発光素子、その製造方法および発光ダイオード |
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