JP4824079B2 - プリント基板ユニット - Google Patents
プリント基板ユニット Download PDFInfo
- Publication number
- JP4824079B2 JP4824079B2 JP2008501557A JP2008501557A JP4824079B2 JP 4824079 B2 JP4824079 B2 JP 4824079B2 JP 2008501557 A JP2008501557 A JP 2008501557A JP 2008501557 A JP2008501557 A JP 2008501557A JP 4824079 B2 JP4824079 B2 JP 4824079B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connector
- board unit
- back panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
Description
Claims (5)
- バックパネルに装着されるプリント基板ユニットであって、
第1プリント基板と、
前記第1プリント基板の表面に向き合わせられる第2プリント基板と、
前記第1プリント基板および前記第2プリント基板を支持するフロントパネルと、
前記第1プリント基板に実装され、前記第1プリント基板を前記バックパネルに接続するために前記フロントパネルに設けられた第1の開口から部分的に突き出る第1コネクタと、
前記第2プリント基板に実装され、前記第2プリント基板を前記バックパネルに接続するために前記フロントパネルに設けられた第2の開口から部分的に突き出る第2コネクタと、
前記第1プリント基板および前記第2プリント基板を相互に接続する配線と
を備えることを特徴とするプリント基板ユニット。 - 請求項1に記載のプリント基板ユニットにおいて、前記第2コネクタは、前記第1プリント基板に動作電圧を供給する電源用コネクタであることを特徴とするプリント基板ユニット。
- 請求項2に記載のプリント基板ユニットにおいて、前記第2プリント基板に実装され、突入電流を防止する突入電流防止回路をさらに備えることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記支持部材および前記第2プリント基板の間には、前記第1プリント基板の表面に直交する仮想平面に沿って前記第2プリント基板の変位を許容する遊びが規定されることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記配線はケーブルから構成されることを特徴とするプリント基板ユニット。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/303494 WO2007097005A1 (ja) | 2006-02-24 | 2006-02-24 | プリント基板ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007097005A1 JPWO2007097005A1 (ja) | 2009-07-09 |
JP4824079B2 true JP4824079B2 (ja) | 2011-11-24 |
Family
ID=38437065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008501557A Expired - Fee Related JP4824079B2 (ja) | 2006-02-24 | 2006-02-24 | プリント基板ユニット |
Country Status (3)
Country | Link |
---|---|
US (1) | US7782630B2 (ja) |
JP (1) | JP4824079B2 (ja) |
WO (1) | WO2007097005A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8274181B2 (en) * | 2009-04-06 | 2012-09-25 | Fsp Technology Inc. | Structure for transmission in power supply |
CN102207751A (zh) * | 2010-03-29 | 2011-10-05 | 鸿富锦精密工业(深圳)有限公司 | 电脑系统 |
US20110304968A1 (en) * | 2010-06-15 | 2011-12-15 | Apple Inc. | Internal electronics of a small form factor desk top computer |
JP2012223032A (ja) * | 2011-04-13 | 2012-11-12 | Yaskawa Electric Corp | 電力変換装置 |
US8687350B2 (en) * | 2011-05-11 | 2014-04-01 | Ez-Tech Corp | Motherboard and case with hidden internal connectors |
TW201336376A (zh) * | 2012-02-29 | 2013-09-01 | Hon Hai Prec Ind Co Ltd | 伺服器機殼 |
US20150062789A1 (en) * | 2012-04-26 | 2015-03-05 | Felix L. Eralses | Server adapter |
US9420715B2 (en) * | 2012-06-07 | 2016-08-16 | Intal Tech Ltd. | Electrononic equipment building blocks for rack mounting |
US9924609B2 (en) * | 2015-07-24 | 2018-03-20 | Transtector Systems, Inc. | Modular protection cabinet with flexible backplane |
US10356928B2 (en) | 2015-07-24 | 2019-07-16 | Transtector Systems, Inc. | Modular protection cabinet with flexible backplane |
US10588236B2 (en) * | 2015-07-24 | 2020-03-10 | Transtector Systems, Inc. | Modular protection cabinet with flexible backplane |
CN209298384U (zh) * | 2019-03-04 | 2019-08-23 | 台达电子企业管理(上海)有限公司 | 通用型电源输入组件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58102599A (ja) * | 1981-12-14 | 1983-06-18 | 三菱電機株式会社 | プリント基板への電源供給方法 |
JP2004227577A (ja) * | 2003-01-17 | 2004-08-12 | Hewlett-Packard Development Co Lp | ホット・スワップ電力供給回路 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01173698A (ja) | 1987-12-26 | 1989-07-10 | Fujitsu Ltd | プラグインプリント板ユニットの遮蔽接地構造 |
JPH05335058A (ja) | 1992-05-29 | 1993-12-17 | Matsushita Electric Ind Co Ltd | 多ピン面実装コネクタ装置 |
CA2225235A1 (en) * | 1997-12-19 | 1999-06-19 | Northern Telecom Limited | A line interface module |
US5963431A (en) * | 1998-04-14 | 1999-10-05 | Compaq Computer Corporation | Desktop computer having enhanced motherboard/riser card assembly configuration |
US6351719B1 (en) * | 1999-05-28 | 2002-02-26 | 3Com Corporation | Shared slot PCI/ISA bus extender |
US6910897B2 (en) * | 2001-01-12 | 2005-06-28 | Litton Systems, Inc. | Interconnection system |
US6843657B2 (en) * | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
US7148428B2 (en) * | 2004-09-27 | 2006-12-12 | Intel Corporation | Flexible cable for high-speed interconnect |
-
2006
- 2006-02-24 JP JP2008501557A patent/JP4824079B2/ja not_active Expired - Fee Related
- 2006-02-24 WO PCT/JP2006/303494 patent/WO2007097005A1/ja active Application Filing
-
2008
- 2008-08-05 US US12/222,232 patent/US7782630B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58102599A (ja) * | 1981-12-14 | 1983-06-18 | 三菱電機株式会社 | プリント基板への電源供給方法 |
JP2004227577A (ja) * | 2003-01-17 | 2004-08-12 | Hewlett-Packard Development Co Lp | ホット・スワップ電力供給回路 |
Also Published As
Publication number | Publication date |
---|---|
WO2007097005A1 (ja) | 2007-08-30 |
US20080298035A1 (en) | 2008-12-04 |
JPWO2007097005A1 (ja) | 2009-07-09 |
US7782630B2 (en) | 2010-08-24 |
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