JP4815351B2 - パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム - Google Patents

パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム Download PDF

Info

Publication number
JP4815351B2
JP4815351B2 JP2006533931A JP2006533931A JP4815351B2 JP 4815351 B2 JP4815351 B2 JP 4815351B2 JP 2006533931 A JP2006533931 A JP 2006533931A JP 2006533931 A JP2006533931 A JP 2006533931A JP 4815351 B2 JP4815351 B2 JP 4815351B2
Authority
JP
Japan
Prior art keywords
sensor signal
cmp system
polishing
electric motor
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006533931A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007524518A (ja
JP2007524518A5 (https=
Inventor
マルクスゼン ゲルト
クラマー イェンズ
ギュンター シュトックゲン ウベ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority claimed from PCT/US2004/030410 external-priority patent/WO2005032763A1/en
Publication of JP2007524518A publication Critical patent/JP2007524518A/ja
Publication of JP2007524518A5 publication Critical patent/JP2007524518A5/ja
Application granted granted Critical
Publication of JP4815351B2 publication Critical patent/JP4815351B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2006533931A 2003-09-30 2004-09-17 パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム Expired - Lifetime JP4815351B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10345381.4 2003-09-30
DE10345381A DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
US10/859,336 US6957997B2 (en) 2003-09-30 2004-06-02 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
US10/859,336 2004-06-02
PCT/US2004/030410 WO2005032763A1 (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Publications (3)

Publication Number Publication Date
JP2007524518A JP2007524518A (ja) 2007-08-30
JP2007524518A5 JP2007524518A5 (https=) 2007-11-08
JP4815351B2 true JP4815351B2 (ja) 2011-11-16

Family

ID=34353214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006533931A Expired - Lifetime JP4815351B2 (ja) 2003-09-30 2004-09-17 パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム

Country Status (5)

Country Link
US (1) US6957997B2 (https=)
JP (1) JP4815351B2 (https=)
CN (1) CN100475445C (https=)
DE (1) DE10345381B4 (https=)
TW (1) TWI335853B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
US8323078B2 (en) * 2008-05-05 2012-12-04 Qualcomm Incorporated Apparatus for polishing semi-conductor dice
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
CN102782814A (zh) * 2010-04-30 2012-11-14 应用材料公司 垫片状态化刮扫力矩模式化以达成恒定移除率
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5750877B2 (ja) * 2010-12-09 2015-07-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法およびウェーハの片面研磨装置
US9862070B2 (en) 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
WO2019152222A1 (en) * 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11577362B2 (en) * 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
JP7465498B2 (ja) * 2020-03-24 2024-04-11 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
CN117620880A (zh) * 2023-11-27 2024-03-01 浙江大学 一种集成电路化学机械研磨机台的健康状况预测评估方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP2002126998A (ja) * 2000-10-26 2002-05-08 Hitachi Ltd 研磨方法および研磨装置
JP2002353174A (ja) * 2001-04-02 2002-12-06 Infineon Technologies Ag 研磨パッド表面を調整する方法およびそのための装置
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003200342A (ja) * 2001-12-28 2003-07-15 Tokyo Seimitsu Co Ltd ウェーハ加工装置用コンディショナー装置
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970751A (ja) * 1995-09-06 1997-03-18 Ebara Corp ポリッシング装置
EP0810064B1 (en) * 1996-05-30 2002-09-25 Ebara Corporation Polishing apparatus having interlock function
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3632500B2 (ja) * 1999-05-21 2005-03-23 株式会社日立製作所 回転加工装置
US6288648B1 (en) * 1999-08-27 2001-09-11 Lucent Technologies Inc. Apparatus and method for determining a need to change a polishing pad conditioning wheel
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP2002126998A (ja) * 2000-10-26 2002-05-08 Hitachi Ltd 研磨方法および研磨装置
JP2002353174A (ja) * 2001-04-02 2002-12-06 Infineon Technologies Ag 研磨パッド表面を調整する方法およびそのための装置
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003200342A (ja) * 2001-12-28 2003-07-15 Tokyo Seimitsu Co Ltd ウェーハ加工装置用コンディショナー装置
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置

Also Published As

Publication number Publication date
CN1859998A (zh) 2006-11-08
US6957997B2 (en) 2005-10-25
JP2007524518A (ja) 2007-08-30
DE10345381A1 (de) 2005-05-04
CN100475445C (zh) 2009-04-08
DE10345381B4 (de) 2013-04-11
US20050070209A1 (en) 2005-03-31
TWI335853B (en) 2011-01-11
TW200526358A (en) 2005-08-16

Similar Documents

Publication Publication Date Title
JP4699371B2 (ja) パッドコンディショナーのセンサー信号を用いて化学機械研磨をコントロールするための方法とシステム
JP4815351B2 (ja) パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム
JP4880512B2 (ja) モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置
KR100904866B1 (ko) 컨디셔닝을 위한 컴퓨터 구현 방법, 컨디셔닝 장치 및 컴퓨터 판독가능 매체
US8622783B2 (en) Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
KR100904867B1 (ko) 패드 웨어 및 패드 컨디셔닝 모델을 전개하는 컴퓨터 실행 방법, 컴퓨터 판독가능 매체, 및 컨디셔닝 시스템
JP4799817B2 (ja) 半導体ウェハの表面平坦化装置
TWI848851B (zh) 墊調節器的切割速率監控
US20210379724A1 (en) Switching control algorithms on detection of exposure of underlying layer during polishing
US20080242196A1 (en) Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into account
US7198542B2 (en) Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
KR101192418B1 (ko) 패드 컨디셔너의 센서 신호를 사용하여 화학적 기계적연마를 제어하기 위한 방법 및 시스템
CN117412835A (zh) 对垫磨损进行建模和控制的方法
KR101141255B1 (ko) 패드 컨디셔너의 센서신호를 사용함으로써 화학적 기계적연마를 제어하는 방법 및 시스템

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070918

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070918

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20100421

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100519

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100818

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100825

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20100902

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100921

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110223

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110523

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110530

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110623

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110630

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110817

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110829

R150 Certificate of patent or registration of utility model

Ref document number: 4815351

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140902

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term