TWI335853B - Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner - Google Patents
Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner Download PDFInfo
- Publication number
- TWI335853B TWI335853B TW093129187A TW93129187A TWI335853B TW I335853 B TWI335853 B TW I335853B TW 093129187 A TW093129187 A TW 093129187A TW 93129187 A TW93129187 A TW 93129187A TW I335853 B TWI335853 B TW I335853B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor signal
- electric motor
- cmp system
- signal
- cmp
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 54
- 238000000034 method Methods 0.000 title claims description 52
- 239000000126 substance Substances 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 49
- 230000008569 process Effects 0.000 claims description 34
- 238000000227 grinding Methods 0.000 claims description 27
- 230000000694 effects Effects 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 7
- 239000003607 modifier Substances 0.000 claims description 7
- 239000012925 reference material Substances 0.000 claims description 5
- 230000008901 benefit Effects 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 23
- 230000008439 repair process Effects 0.000 description 17
- 239000002002 slurry Substances 0.000 description 14
- 230000000875 corresponding effect Effects 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000011217 control strategy Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 1
- 241000545744 Hirudinea Species 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009118 appropriate response Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10345381A DE10345381B4 (de) | 2003-09-30 | 2003-09-30 | Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers |
| US10/859,336 US6957997B2 (en) | 2003-09-30 | 2004-06-02 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200526358A TW200526358A (en) | 2005-08-16 |
| TWI335853B true TWI335853B (en) | 2011-01-11 |
Family
ID=34353214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093129187A TWI335853B (en) | 2003-09-30 | 2004-09-27 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6957997B2 (https=) |
| JP (1) | JP4815351B2 (https=) |
| CN (1) | CN100475445C (https=) |
| DE (1) | DE10345381B4 (https=) |
| TW (1) | TWI335853B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678259B (zh) * | 2014-09-02 | 2019-12-01 | 日商荏原製作所股份有限公司 | 終點檢測方法、研磨裝置、及研磨方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8870625B2 (en) * | 2007-11-28 | 2014-10-28 | Ebara Corporation | Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method |
| US8323078B2 (en) * | 2008-05-05 | 2012-12-04 | Qualcomm Incorporated | Apparatus for polishing semi-conductor dice |
| TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| CN102782814A (zh) * | 2010-04-30 | 2012-11-14 | 应用材料公司 | 垫片状态化刮扫力矩模式化以达成恒定移除率 |
| JP5511600B2 (ja) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| US8758085B2 (en) * | 2010-10-21 | 2014-06-24 | Applied Materials, Inc. | Method for compensation of variability in chemical mechanical polishing consumables |
| JP5750877B2 (ja) * | 2010-12-09 | 2015-07-22 | 株式会社Sumco | ウェーハの片面研磨方法、ウェーハの製造方法およびウェーハの片面研磨装置 |
| US9862070B2 (en) | 2011-11-16 | 2018-01-09 | Applied Materials, Inc. | Systems and methods for substrate polishing end point detection using improved friction measurement |
| KR102591906B1 (ko) * | 2017-10-31 | 2023-10-20 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
| US11389928B2 (en) * | 2017-11-30 | 2022-07-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for conditioning polishing pad |
| WO2019152222A1 (en) * | 2018-02-05 | 2019-08-08 | Applied Materials, Inc. | Piezo-electric end-pointing for 3d printed cmp pads |
| US11577362B2 (en) * | 2018-03-14 | 2023-02-14 | Applied Materials, Inc. | Pad conditioner cut rate monitoring |
| US11806833B2 (en) * | 2018-08-31 | 2023-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical planarization system and a method of using the same |
| CN111421462B (zh) * | 2019-01-08 | 2022-03-22 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法 |
| JP7465498B2 (ja) * | 2020-03-24 | 2024-04-11 | 株式会社荏原製作所 | ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法 |
| CN117620880A (zh) * | 2023-11-27 | 2024-03-01 | 浙江大学 | 一种集成电路化学机械研磨机台的健康状况预测评估方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0970751A (ja) * | 1995-09-06 | 1997-03-18 | Ebara Corp | ポリッシング装置 |
| EP0810064B1 (en) * | 1996-05-30 | 2002-09-25 | Ebara Corporation | Polishing apparatus having interlock function |
| US6191038B1 (en) * | 1997-09-02 | 2001-02-20 | Matsushita Electronics Corporation | Apparatus and method for chemical/mechanical polishing |
| JP4030247B2 (ja) | 1999-05-17 | 2008-01-09 | 株式会社荏原製作所 | ドレッシング装置及びポリッシング装置 |
| JP3632500B2 (ja) * | 1999-05-21 | 2005-03-23 | 株式会社日立製作所 | 回転加工装置 |
| US6288648B1 (en) * | 1999-08-27 | 2001-09-11 | Lucent Technologies Inc. | Apparatus and method for determining a need to change a polishing pad conditioning wheel |
| US6306008B1 (en) * | 1999-08-31 | 2001-10-23 | Micron Technology, Inc. | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| JP2001260001A (ja) * | 2000-03-13 | 2001-09-25 | Hitachi Ltd | 半導体装置の平坦化方法及びその装置 |
| JP2002126998A (ja) * | 2000-10-26 | 2002-05-08 | Hitachi Ltd | 研磨方法および研磨装置 |
| US6896583B2 (en) * | 2001-02-06 | 2005-05-24 | Agere Systems, Inc. | Method and apparatus for conditioning a polishing pad |
| EP1247616B1 (en) * | 2001-04-02 | 2006-07-05 | Infineon Technologies AG | Method for conditioning a polishing pad surface |
| JP2003117816A (ja) * | 2001-10-03 | 2003-04-23 | Hitachi Ltd | 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法 |
| JP2003200342A (ja) * | 2001-12-28 | 2003-07-15 | Tokyo Seimitsu Co Ltd | ウェーハ加工装置用コンディショナー装置 |
| DE10324429B4 (de) * | 2003-05-28 | 2010-08-19 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers |
| JP2005022028A (ja) * | 2003-07-02 | 2005-01-27 | Tokyo Seimitsu Co Ltd | 研磨パッドのドレッシング装置及び該装置を有する加工装置 |
-
2003
- 2003-09-30 DE DE10345381A patent/DE10345381B4/de not_active Expired - Lifetime
-
2004
- 2004-06-02 US US10/859,336 patent/US6957997B2/en not_active Expired - Lifetime
- 2004-09-17 JP JP2006533931A patent/JP4815351B2/ja not_active Expired - Lifetime
- 2004-09-17 CN CNB2004800285424A patent/CN100475445C/zh not_active Expired - Lifetime
- 2004-09-27 TW TW093129187A patent/TWI335853B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678259B (zh) * | 2014-09-02 | 2019-12-01 | 日商荏原製作所股份有限公司 | 終點檢測方法、研磨裝置、及研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1859998A (zh) | 2006-11-08 |
| US6957997B2 (en) | 2005-10-25 |
| JP2007524518A (ja) | 2007-08-30 |
| DE10345381A1 (de) | 2005-05-04 |
| CN100475445C (zh) | 2009-04-08 |
| DE10345381B4 (de) | 2013-04-11 |
| US20050070209A1 (en) | 2005-03-31 |
| TW200526358A (en) | 2005-08-16 |
| JP4815351B2 (ja) | 2011-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI335853B (en) | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner | |
| US7150675B2 (en) | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner | |
| KR100701356B1 (ko) | Ｃｍｐ 공정 최적화 방법 | |
| US8096852B2 (en) | In-situ performance prediction of pad conditioning disk by closed loop torque monitoring | |
| US7278901B2 (en) | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film | |
| US6896583B2 (en) | Method and apparatus for conditioning a polishing pad | |
| JP7475462B2 (ja) | 隣接する導電層のスタックの研磨中のプロファイル制御 | |
| JP2013525126A (ja) | 改善された研磨パッドプロファイルのための閉ループ制御 | |
| US20080242196A1 (en) | Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into account | |
| JP2002353174A (ja) | 研磨パッド表面を調整する方法およびそのための装置 | |
| US7086927B2 (en) | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces | |
| US20050142987A1 (en) | Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor | |
| US7153182B1 (en) | System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing | |
| KR101192418B1 (ko) | 패드 컨디셔너의 센서 신호를 사용하여 화학적 기계적연마를 제어하기 위한 방법 및 시스템 | |
| KR100789842B1 (ko) | 연마 패드의 형상을 측정하는 장치와, 이를 이용한 연마패드 형상 보정 방법 및 이를 이용한 화학적 기계적 연마장치 | |
| KR101141255B1 (ko) | 패드 컨디셔너의 센서신호를 사용함으로써 화학적 기계적연마를 제어하는 방법 및 시스템 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |