CN100475445C - 通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统 - Google Patents

通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统 Download PDF

Info

Publication number
CN100475445C
CN100475445C CNB2004800285424A CN200480028542A CN100475445C CN 100475445 C CN100475445 C CN 100475445C CN B2004800285424 A CNB2004800285424 A CN B2004800285424A CN 200480028542 A CN200480028542 A CN 200480028542A CN 100475445 C CN100475445 C CN 100475445C
Authority
CN
China
Prior art keywords
sensor signal
polishing
pad
electric motor
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004800285424A
Other languages
English (en)
Chinese (zh)
Other versions
CN1859998A (zh
Inventor
G·马克森
J·克拉默
U·G·施特克根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of CN1859998A publication Critical patent/CN1859998A/zh
Application granted granted Critical
Publication of CN100475445C publication Critical patent/CN100475445C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CNB2004800285424A 2003-09-30 2004-09-17 通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统 Expired - Lifetime CN100475445C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10345381.4 2003-09-30
DE10345381A DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
US10/859,336 2004-06-02

Publications (2)

Publication Number Publication Date
CN1859998A CN1859998A (zh) 2006-11-08
CN100475445C true CN100475445C (zh) 2009-04-08

Family

ID=34353214

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800285424A Expired - Lifetime CN100475445C (zh) 2003-09-30 2004-09-17 通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统

Country Status (5)

Country Link
US (1) US6957997B2 (https=)
JP (1) JP4815351B2 (https=)
CN (1) CN100475445C (https=)
DE (1) DE10345381B4 (https=)
TW (1) TWI335853B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
US8323078B2 (en) * 2008-05-05 2012-12-04 Qualcomm Incorporated Apparatus for polishing semi-conductor dice
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
CN102782814A (zh) * 2010-04-30 2012-11-14 应用材料公司 垫片状态化刮扫力矩模式化以达成恒定移除率
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5750877B2 (ja) * 2010-12-09 2015-07-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法およびウェーハの片面研磨装置
US9862070B2 (en) 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
WO2019152222A1 (en) * 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11577362B2 (en) * 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
JP7465498B2 (ja) * 2020-03-24 2024-04-11 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
CN117620880A (zh) * 2023-11-27 2024-03-01 浙江大学 一种集成电路化学机械研磨机台的健康状况预测评估方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055486A2 (en) * 1999-05-17 2000-11-29 Ebara Corporation Dressing apparatus and polishing apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6336842B1 (en) * 1999-05-21 2002-01-08 Hitachi, Ltd. Rotary machining apparatus
US20020052166A1 (en) * 2000-10-26 2002-05-02 Hiroyuki Kojima Polishing system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970751A (ja) * 1995-09-06 1997-03-18 Ebara Corp ポリッシング装置
EP0810064B1 (en) * 1996-05-30 2002-09-25 Ebara Corporation Polishing apparatus having interlock function
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
US6288648B1 (en) * 1999-08-27 2001-09-11 Lucent Technologies Inc. Apparatus and method for determining a need to change a polishing pad conditioning wheel
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
EP1247616B1 (en) * 2001-04-02 2006-07-05 Infineon Technologies AG Method for conditioning a polishing pad surface
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003200342A (ja) * 2001-12-28 2003-07-15 Tokyo Seimitsu Co Ltd ウェーハ加工装置用コンディショナー装置
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055486A2 (en) * 1999-05-17 2000-11-29 Ebara Corporation Dressing apparatus and polishing apparatus
US6336842B1 (en) * 1999-05-21 2002-01-08 Hitachi, Ltd. Rotary machining apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US20020052166A1 (en) * 2000-10-26 2002-05-02 Hiroyuki Kojima Polishing system

Also Published As

Publication number Publication date
CN1859998A (zh) 2006-11-08
US6957997B2 (en) 2005-10-25
JP2007524518A (ja) 2007-08-30
DE10345381A1 (de) 2005-05-04
DE10345381B4 (de) 2013-04-11
US20050070209A1 (en) 2005-03-31
TWI335853B (en) 2011-01-11
TW200526358A (en) 2005-08-16
JP4815351B2 (ja) 2011-11-16

Similar Documents

Publication Publication Date Title
US7150675B2 (en) Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
CN100475445C (zh) 通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统
JP4880512B2 (ja) モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置
KR100906133B1 (ko) 제거율 프로파일의 조작을 제공하는 화학적 기계적 연마장치의 피드백 제어
US8096852B2 (en) In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
JP2005518285A (ja) 化学機械研磨パッドをコンディショニングするためのフィードフォワードおよびフィードバック制御
JP2005509531A (ja) パッド寿命を向上させるための化学機械研磨パッドコンディショナの方向速度の制御
CN111263683A (zh) 垫调节器的切割速率监控
US7037172B1 (en) Advanced wafer planarizing
US7175505B1 (en) Method for adjusting substrate processing times in a substrate polishing system
US6986698B1 (en) Wafer refining
US20080242196A1 (en) Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into account
US7086927B2 (en) Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7198542B2 (en) Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
KR101192418B1 (ko) 패드 컨디셔너의 센서 신호를 사용하여 화학적 기계적연마를 제어하기 위한 방법 및 시스템
US6514861B1 (en) Manufacturing a semiconductor wafer according to the process time by process tool
KR101141255B1 (ko) 패드 컨디셔너의 센서신호를 사용함으로써 화학적 기계적연마를 제어하는 방법 및 시스템
JP2000288915A (ja) 研磨装置及び研磨方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090408

CX01 Expiry of patent term