DE10345381B4 - Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers - Google Patents

Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers Download PDF

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Publication number
DE10345381B4
DE10345381B4 DE10345381A DE10345381A DE10345381B4 DE 10345381 B4 DE10345381 B4 DE 10345381B4 DE 10345381 A DE10345381 A DE 10345381A DE 10345381 A DE10345381 A DE 10345381A DE 10345381 B4 DE10345381 B4 DE 10345381B4
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DE
Germany
Prior art keywords
polishing
substrate
sensor signal
polishing pad
electric motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE10345381A
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German (de)
English (en)
Other versions
DE10345381A1 (de
Inventor
Gerd Marxsen
Jens Kramer
Uwe Gunter Stoeckgen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to DE10345381A priority Critical patent/DE10345381B4/de
Priority to US10/859,336 priority patent/US6957997B2/en
Priority to KR1020067006277A priority patent/KR101141255B1/ko
Priority to CNB2004800285424A priority patent/CN100475445C/zh
Priority to GB0605607A priority patent/GB2420302B/en
Priority to PCT/US2004/030410 priority patent/WO2005032763A1/en
Priority to JP2006533931A priority patent/JP4815351B2/ja
Priority to TW093129187A priority patent/TWI335853B/zh
Publication of DE10345381A1 publication Critical patent/DE10345381A1/de
Application granted granted Critical
Publication of DE10345381B4 publication Critical patent/DE10345381B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE10345381A 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers Expired - Lifetime DE10345381B4 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE10345381A DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
US10/859,336 US6957997B2 (en) 2003-09-30 2004-06-02 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
CNB2004800285424A CN100475445C (zh) 2003-09-30 2004-09-17 通过使用垫调节器的传感器信号控制化学机械抛光的方法及系统
GB0605607A GB2420302B (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
KR1020067006277A KR101141255B1 (ko) 2003-09-30 2004-09-17 패드 컨디셔너의 센서신호를 사용함으로써 화학적 기계적연마를 제어하는 방법 및 시스템
PCT/US2004/030410 WO2005032763A1 (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
JP2006533931A JP4815351B2 (ja) 2003-09-30 2004-09-17 パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム
TW093129187A TWI335853B (en) 2003-09-30 2004-09-27 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10345381A DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers

Publications (2)

Publication Number Publication Date
DE10345381A1 DE10345381A1 (de) 2005-05-04
DE10345381B4 true DE10345381B4 (de) 2013-04-11

Family

ID=34353214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10345381A Expired - Lifetime DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers

Country Status (5)

Country Link
US (1) US6957997B2 (https=)
JP (1) JP4815351B2 (https=)
CN (1) CN100475445C (https=)
DE (1) DE10345381B4 (https=)
TW (1) TWI335853B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
US8323078B2 (en) * 2008-05-05 2012-12-04 Qualcomm Incorporated Apparatus for polishing semi-conductor dice
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
CN102782814A (zh) * 2010-04-30 2012-11-14 应用材料公司 垫片状态化刮扫力矩模式化以达成恒定移除率
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5750877B2 (ja) * 2010-12-09 2015-07-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法およびウェーハの片面研磨装置
US9862070B2 (en) 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
WO2019152222A1 (en) * 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
US11577362B2 (en) * 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
JP7465498B2 (ja) * 2020-03-24 2024-04-11 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
CN117620880A (zh) * 2023-11-27 2024-03-01 浙江大学 一种集成电路化学机械研磨机台的健康状况预测评估方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5860847A (en) * 1995-09-06 1999-01-19 Ebara Corporation Polishing apparatus
US5904608A (en) * 1996-05-30 1999-05-18 Ebara Corporation Polishing apparatus having interlock function
US6416617B2 (en) * 1997-09-02 2002-07-09 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3632500B2 (ja) * 1999-05-21 2005-03-23 株式会社日立製作所 回転加工装置
US6288648B1 (en) * 1999-08-27 2001-09-11 Lucent Technologies Inc. Apparatus and method for determining a need to change a polishing pad conditioning wheel
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP2002126998A (ja) * 2000-10-26 2002-05-08 Hitachi Ltd 研磨方法および研磨装置
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
EP1247616B1 (en) * 2001-04-02 2006-07-05 Infineon Technologies AG Method for conditioning a polishing pad surface
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003200342A (ja) * 2001-12-28 2003-07-15 Tokyo Seimitsu Co Ltd ウェーハ加工装置用コンディショナー装置
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5860847A (en) * 1995-09-06 1999-01-19 Ebara Corporation Polishing apparatus
US5904608A (en) * 1996-05-30 1999-05-18 Ebara Corporation Polishing apparatus having interlock function
US6416617B2 (en) * 1997-09-02 2002-07-09 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing

Also Published As

Publication number Publication date
CN1859998A (zh) 2006-11-08
US6957997B2 (en) 2005-10-25
JP2007524518A (ja) 2007-08-30
DE10345381A1 (de) 2005-05-04
CN100475445C (zh) 2009-04-08
US20050070209A1 (en) 2005-03-31
TWI335853B (en) 2011-01-11
TW200526358A (en) 2005-08-16
JP4815351B2 (ja) 2011-11-16

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